JPH01277791A - Resonant tag and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain a resonant tag enabling the simple and easy execution of the dielectric breakdown of a dielectric and the short circuit of an electrode, by sticking release paper on a surface on the resonance frequency circuit side through an adhesive and by opening a through hole in an electrode plate of a capacitor element in the circuit from the surface of said release paper. CONSTITUTION:Metal leaves 1 and 3 made of aluminum or the like are stuck on both surfaces of a dielectric 2 formed of a polyolefin resin film, and a resonance frequency circuit is printed on both surfaces of the leaves by using etching-resistive ink 4 and then subjected to an etching processing. Next, after circuit terminal parts 5 and 6 of the metal leaves 1 and 3 are put in continuity by short-circuiting them mechanically, a sticking agent 7 is applied thereon and release paper 8 such as silicon paper are stuck thereon. Then, from the release paper 8 side, a through hole 9 of a length from 0.5mm to 3mm and a diameter 1mm approx. reaching an electrode plate of a capacitor element of the metal leaf 3 on the opposite side is opened in an electrode plate of a capacitor element in the metal leaf 1 by using a punching die jig. Paper 11 is stuck by using an adhesive 10.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention destroys an electrically insulating thin film layer, which is a dielectric, in a high-power electric field to short-circuit both electrodes, thereby reducing the pre-formed resonance frequency. This invention relates to a resonant tag whose characteristics can be easily destroyed and a method for manufacturing the same.

(Prior Art) In order to protect products from theft due to shoplifting, etc., stores, supermarkets, general retail stores, etc. adopt various types of product protection methods, but when electronic detection devices are used. The protected item has certain resonant frequency characteristics made of flexible material so that the presence of the item can be electronically verified within the controlled area. Tags are used either by tags having a thin-film planar printed circuit, by being attached and fixed using an adhesive or the like, or by being hung with a "string"-like material that does not break easily. Within the area controlled by the detection device, the existence of the product is detected by a tag or sensor reacting to the resonant frequency emitted by the device, and it is possible to protect it from theft or confirm whether the product is bought or sold. In order to prevent it from sensing and reacting to the resonant frequency emitted by the tag or detection device within the control area, either destroy the printed circuit by ``tearing the tag'' or cover the coil surface of the tag with aluminum foil, etc. Either ``shield'' the radio waves by pasting metal foil, or use some kind of jig to mechanically make the dielectric thin film layer that exists in the capacitor part of the tag extremely thin. By this,
A method has been adopted in which when a high output limit is applied, the picture electrodes are easily short-circuited and the resonance frequency characteristic disappears.

(Invention or problem to be solved) Either destroy the printed circuit by tearing the tag, or artificially cause the tag to resonate by affixing metal foil such as aluminum foil to the tag. When erasing frequency characteristics, it is time-consuming because it is done for each item individually, and it is not suitable for processing a large amount of erasure.

On the other hand, the method of mechanically thinning the dielectric thin film layer to make it easier to short-circuit both electrodes is to crush the tag's constituent materials in the thickness direction. If the thickness of the dielectric thin film layer is not determined, problems such as dielectric breakdown or failure to occur are likely to occur when the thickness of the dielectric thin film layer becomes thick. SUMMARY OF THE INVENTION The present invention aims to solve these problems and provide a resonant tag that can reliably and easily perform dielectric breakdown of the dielectric and short circuit of the electrodes, and a method for manufacturing the same.

[Means to solve the problem]

The present invention forms a resonant frequency circuit having a certain frequency made of metal foil such as aluminum foil on both sides of a dielectric material made of a thin film layer of a synthetic resin film such as polyethylene, and connects the circuit terminals of both resonant frequency circuits. Short-circuit and conduct the parts, and attach a release paper such as silicone paper to the surface of one resonant frequency circuit side with an adhesive, and connect the circuit on the opposite side from this release paper side into the electrode plate of the capacitor part within the circuit surface. A through-hole with a diameter of 0.5 mm or more and 3 mm or less is made to reach the electrode plate of the capacitor part in the plane, and the through-hole part is heated and pressed with a suitable jig to obtain a predetermined dimension between the two electrode plates. This invention relates to a resonant tag and its manufacturing method.

More specifically, the method for manufacturing the resonant tag of the present invention includes using a thin film layer of a synthetic resin film such as polyethylene as a dielectric material, pasting gold foil such as aluminum foil on both sides of the dielectric film, and gravure printing etc. on both sides of the metal foil. Using the printing method described above, a resonant frequency circuit that generates a certain frequency is printed, chemically etched to form a circuit, and the circuit terminals made of metal foil on both sides are short-circuited and conductive to form one circuit. A female pattern paper such as silicone paper is pasted on the side using an adhesive, and a diameter of 0.5 mm is reached from this release paper side to the capacitor part electrode plate in the circuit surface on the opposite side. Drill a through hole with a diameter of 3 mm or less, and heat the area around the through hole mouth of the opposite capacitor electrode plate to a surface temperature of 200°C or higher.
Press with a jig heated to below ℃ to set the distance between the two city electrode plates to the specified size, paste paper such as high-quality paper with adhesive to the electrode plate side of the capacitor part, and kiss-cut to the specified size. The goal is to obtain a resonant tag whose resonant frequency characteristics can be easily destroyed.

In this type of resonant tag, in order to easily short-circuit both poles of the capacitor part in a high-power R field, the distance between the metal foils of both electrodes must be 0, I1l10O3
Does this 0.0003m need to be maintained below +?
In order to reduce the distance of m or more by 11, the present invention uses, for example, 5
A diameter of 0 that reaches the capacitor electrode plate in the circuit plane on the opposite side from the circuit side using metal foil with a thickness of 0 g.
, make a through hole of 5 mm or more and 3 mm or less, or
When making a through hole, apply an adhesive such as adhesive directly to the metal foil surface and laminate a female pattern paper such as silicone paper, then make a hole at a stable distance from the # pattern surface. or can be obtained. When a through hole is made directly from the metal foil surface, the "hari" generated around the hole causes the metal foils on both sides to come into contact, resulting in frequent short-circuiting, which is the purpose of the present invention. I can't get the interval. Furthermore, 0,00611+* or more 0.01 used for the capacitor part electrode plate
Even when a through hole is made from a metal foil of 0 + ia + or less, or when a through hole is made from the surface of the paper after laminating paper such as high-quality paper to the metal foil, the metal foil generated around the through hole is Due to the "brightness", the metal foils on both sides come into contact and a circular phenomenon occurs, which does not meet the purpose of the present invention.

In the present invention, the dielectric material may be polyethylene, polypropylene, etc., or a plastic film such as polyester may be used, or a polyolefin material such as polyethylene, polypropylene, etc. is preferable from the viewpoint of cost and processability. Is the thinner the better?
The thickness is limited due to the second constraint on its production, but in the present invention, a thickness of 3 mm or less can be used satisfactorily.

In the present invention, the metal foil is not particularly limited, but is preferably aluminum foil from the viewpoint of cost, workability, etc., and its thickness can be within the range generally used for this type of application, especially for resonant frequency circuits. On the side, it is about 50 pL, and on the non-resonant frequency circuit side, about 10 pL is used.

A diameter of 0.0 mm reaches from the release paper side to the capacitor part electrode plate in the circuit plane to the capacitor part electrode plate in the circuit plane on the opposite side.
To make a through hole of 5 mm or more and 3 a + m or less, it is recommended to use a needle with a thickness of J-, or in the case of a through hole of about 3 mm I11, use a hollow punch-like jig. You can.

As a female template, a plastic film is also conceivable, or one made of paper is advantageous for making holes. The thickness is not particularly limited, or it may be selected from a thickness that allows the tag-constituting base material to be easily handled when making a through hole, and allows for a hole of a predetermined size to be reliably made.

Adhesive is used to fix the female pattern used when punching holes, and to attach tags to products. This adhesive seems to enter between the "bumps" of the metal foils of both electrodes that are created when the through-hole is opened, and also has the role of preventing the "bumps" from coming into direct contact with each other. Usually 40-8
Approximately 0AL is distributed.

The resonant tag is laminated with conventionally printed paper or the like.

(Example) Hereinafter, an example of the present invention will be described based on the drawings, but the present invention is not limited thereto.

The key to increasing the resonance frequency to 41 is to use the electromagnetic value ``:A electric dissipation tangent'' as the dielectric material 2, as shown in the first UA, or a polyolefin system such as polyethylene with a thickness as small as 0.03 mm1I11 or less. Among resin films or other synthetic resin films, this film (afi
'Metal foil such as aluminum foil 1.3 on both sides of the upper body 2)
The substrate material is manufactured by bonding the two together by extrusion, thermocompression bonding, or other methods.

Among the metal foils used, especially aluminum foil,
In view of electrical properties, suitability for processing such as bonding or etching, and physical properties of products, the purity of aluminum is desirably between 99.0% and 9967%.

Among the metal foils bonded to both sides of the resin film such as polyethylene as the dielectric 2, if the metal foil l on one side is
Used as LCR circuit and circuit terminal part, if metal foil or aluminum foil, Q, f15(]m* or more, Q, f
) S(law or less thick foil is preferable.The metal foil 3 on the opposite side to this metal foil is used as the capacitor electrode plate 13 and the circuit terminal part 5, and in the case of metal foil or aluminum foil, the thickness is 0.1106 mm. That's all, mouth, fllO+lIw
The following thicknesses of foil are used:

In order to obtain a certain resonant frequency, various printing methods such as gravure printing,
A "resonant frequency circuit" is printed using etching-resistant ink 4 (Figure 2) by silk screen printing, flexo printing, rotary letterpress printing, etc., and then chemically etched using a chemical solution such as acid or alkali. Processed,
A resonant frequency circuit as shown in FIG. 2 is formed.

Following the etching process, the circuit terminal portions 5.6 of the metal foils 1.3 on both sides of the polyethylene or other resin film (dielectric 2) are destroyed and crushed using a special jig. By mechanical operation, the short circuit is made conductive as shown in Fig. 3, and the resonant circuit is completed.

Next, on the surface of the circuit I (metal foil L), an adhesive 7 that has sufficient adhesive strength for paper, synthetic resin films, glass bottles, etc. is applied.
and paste release paper 8 such as silicone paper (
Figure 4).

In a high output electric field, the electrical insulation of the dielectric resin film thin layer (dielectric 2) such as Botethylene is destroyed,
In order to easily short-circuit the metal foils 1.3 that are both electrodes, the distance between the metal foils of both electrodes must be maintained at 000:law or less.

To obtain a constant electrode spacing of 0.0003 mm or less,
The present invention is based on the release paper 8 pasted on the circuit surface after edge puffing, and above all, using a punching die jig in the capacitor part's plate in the circuit I (metal foil 1), the opposite circuit side (
The diameter of the metal foil 3) reaching the capacitor part τ to the electrode plate is 0.5
Drill one hole 9 with a diameter of J13 mm to J13 is or less (see Fig. 5). After opening the through hole 9, when pulling out the punching die jig from the through hole 9, prevent the gap between the electrodes (between the metal foils 1 and 3) from becoming wider than 0, floo: 1eI1. Therefore, press the area around the through-hole opening on the capacitor electrode plate side of the metal foil 3 on the opposite side with a circular plate-shaped jig having a diameter of 4 m or more and 6 cm or less and heated to a surface temperature of 20 υ°C or more and 250°C or less. do.

By suppressing the periphery of the i-hole 9, it is possible to maintain a constant distance between the u poles of 0.000:l■■ or less, which allows dielectric breakdown. After suppressing the area around the opening of the through-hole, as shown in FIG. 6, paper 11 of page paper 7 is attached to the electrode side of the capacitor using adhesive IO, and the tag is cut to a predetermined size. complete. It goes without saying that the paper 11, such as high-quality paper, may be printed or the like.

〔Effect of the invention〕

In the present invention, as described above, a release paper is attached to one side with an adhesive, and a through hole is punched from above the release paper, so that the size of the hole is constant and uniform. In the present invention, the distance between the metal foils laminated on both sides of the dielectric is adjusted by the firmness of the metal foil that occurs when forming one through hole, so that uniform through holes can be drilled.
The effect is that constant dielectric breakdown performance can be obtained without any disturbance. According to the present invention, dielectric breakdown can easily occur even if the dielectric is thick.

4. Brief explanation of the UA surface Figures 1 to 6 are diagrams for explaining the manufacturing method of the resonant tough material of the present invention, and each figure shows a schematic cross-sectional view of the planting material obtained by the process. FIG. 7 is an exploded perspective view showing an example of the resonant tough.

In the figure, 1.3...Metal foil 2...? A dielectric Body: Etching-resistant ink 5.6...Circuit terminal section 7...Adhesive 8...Shadow pattern paper 9...Through hole 10...Adhesive １１・・・Paper 4th n

Claims (3)

[Claims] (1) A resonant frequency circuit having a certain frequency made of metal foil such as aluminum foil is formed on both sides of a dielectric material made of a thin film layer of a synthetic resin film such as polyethylene, and the circuit terminal portion of both resonant frequency circuits is formed. Short-circuit and conduct, and attach release paper such as silicone paper to the surface of one resonant frequency circuit side via adhesive, and from this release paper side into the electrode plate of the capacitor part within the circuit surface, connect the circuit surface on the opposite side. A through-hole with a diameter of 0.5 mm or more and 3 mm or less is made to reach the electrode plate of the capacitor part inside, and the through-hole part is heated and pressed with a suitable jig to obtain a predetermined dimension between the two electrode plates. resonant tag. (2) A thin layer of synthetic resin film such as polyethylene is used as a dielectric, and metal foil such as aluminum foil is laminated on both sides of the dielectric.
A resonant frequency circuit having a specific frequency is formed by a method of creating a printed wiring circuit using the metal foil, the circuit terminals of the resonant frequency circuit on both sides of the dielectric are short-circuited, and an adhesive is applied to one circuit side. A release paper such as silicone paper is pasted using the release paper, and a penetration with a diameter of 0.5 mm or more and 3 mm or less is made from the release paper side into the capacitor electrode plate in the circuit surface to reach the capacitor electrode plate in the circuit surface on the opposite side. 1. A method of manufacturing a resonant tag, which comprises making a hole and heating and pressing the through-hole portion with a suitable jig to obtain a predetermined dimension between both electrode plates. (3) A thin layer of synthetic resin film such as polyethylene is used as a dielectric, and metal foil such as aluminum foil is laminated on both sides.
A resonant frequency circuit having a certain frequency is printed on both sides of the metal foil using a printing method such as gravure printing, and a circuit is formed by chemically etching it, and the circuit is made up of metal foils on both sides. Short-circuit the terminal part and paste release paper such as silicone paper on the circuit side using adhesive.
From this release paper side, a through hole with a diameter of 0.5 mm or more and 3 mm or less is made in the capacitor electrode plate in the circuit surface to reach the capacitor electrode plate in the circuit surface on the opposite side, and a through hole in the opposite capacitor electrode plate is made. The surface temperature around the mouth is 200℃
Press with a jig heated to 250℃ or less to set the distance between the two electrode plates to the specified size, paste paper such as high-quality paper with adhesive to the electrode plate side of the capacitor part, and kiss-cut to the specified size. 4. The method for manufacturing a resonant tag according to claim 3, wherein the resonant frequency characteristic can be easily destroyed.