JPH01277311A - Thin-film magnetic head - Google Patents
Thin-film magnetic headInfo
- Publication number
- JPH01277311A JPH01277311A JP10394588A JP10394588A JPH01277311A JP H01277311 A JPH01277311 A JP H01277311A JP 10394588 A JP10394588 A JP 10394588A JP 10394588 A JP10394588 A JP 10394588A JP H01277311 A JPH01277311 A JP H01277311A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyimide resin
- magnetic head
- nickel
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 16
- 239000010408 film Substances 0.000 claims abstract description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229920001721 polyimide Polymers 0.000 claims abstract description 20
- 239000009719 polyimide resin Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000004642 Polyimide Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 13
- 230000006866 deterioration Effects 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 11
- 239000007769 metal material Substances 0.000 abstract description 9
- 238000007772 electroless plating Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000003054 catalyst Substances 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 description 8
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は薄膜磁気ヘッドに係り、特に、ポリイミド系樹
脂の劣化を防ぐのに好適な、導体コイルと樹脂との間に
金属膜を具備した薄膜磁気ヘッドの構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thin film magnetic head, and particularly to a thin film magnetic head having a metal film between a conductive coil and a resin, which is suitable for preventing deterioration of polyimide resin. This article relates to the structure of a thin film magnetic head.
今日、ＬＳＩに対する高密度化、高集積化、高信頼度化
の要求を満足する配線方式の一つとして樹脂絶縁法多層
配線技術の開発が盛んであり、絶縁材料としてポリイミ
ド系樹脂が使われる傾向にある。このポリイミド系樹脂
は耐熱性に優れているため、スパッタリング法等、比較
的高温で磁性膜を成膜して形成している薄膜磁気ヘッド
の絶縁材にも適している。薄膜磁気ヘッドの導体コイル
は特願昭５９−２１７０３号に記載のように、めっき法
あるいはりフトオフ法によって成膜された銅が一般に用
いられているが、昭和５０年度電子通信学会全国大会要
旨集３７８に記載のように、ポリイミド系樹脂は、銀、
銅を配線金属材料として用いた場合、金属と樹脂の接す
る界面で劣化する。この劣化を防ぐ方法として、特開昭
６０−２４０３７号公報に記載のように、熱処理を高真
空中で行なう方法が提案されている。Today, resin insulation multilayer wiring technology is being actively developed as a wiring method that satisfies the demands for higher density, higher integration, and higher reliability for LSIs, and there is a tendency for polyimide resin to be used as an insulating material. It is in. Since this polyimide resin has excellent heat resistance, it is also suitable as an insulating material for a thin film magnetic head in which a magnetic film is formed at a relatively high temperature using a sputtering method or the like. As described in Japanese Patent Application No. 59-21703, the conductor coil of a thin-film magnetic head is generally made of copper formed by a plating method or a lift-off method. As described in 378, the polyimide resin contains silver,
When copper is used as a wiring metal material, it deteriorates at the interface where the metal and resin come into contact. As a method for preventing this deterioration, a method has been proposed in which heat treatment is performed in a high vacuum, as described in Japanese Patent Application Laid-Open No. 60-24037.
上記従来技術は、ポリイミド系樹脂と配線金属材料との
間で起こる劣化反応において、金属酸化物が触媒の働き
をしていることに着目し、真空中で処理することによっ
て金属を酸化しに＜＜シた点が特徴であった。しかし、
この方法では、排気設備をもった加熱炉が必要であり、
処理する真空度も１０−２〜１０−’Ｐａと範囲がある
ことから、完全に金属の酸化を防げる手段とは言えない
。The above-mentioned conventional technology focuses on the fact that metal oxides act as catalysts in the deterioration reaction that occurs between polyimide resin and wiring metal materials, and oxidizes metals by treating them in vacuum. It was characterized by the following points. but,
This method requires a heating furnace with exhaust equipment,
Since the degree of vacuum used for processing also ranges from 10-2 to 10-'Pa, it cannot be said that this is a means to completely prevent metal oxidation.
本発明の目的は、完全に配線金属材料の酸化を防ぎ、ポ
リイミド系樹脂の劣化反応が完全に防止される薄膜磁気
ヘッドを提供することにある。An object of the present invention is to provide a thin film magnetic head that completely prevents oxidation of the wiring metal material and completely prevents the deterioration reaction of the polyimide resin.
上記目的は、配線金属材料とポリイミド系樹脂との界面
に、ニッケルの金属膜を無電解めっき法を用いて形成す
ることにより達成される。The above object is achieved by forming a nickel metal film on the interface between the wiring metal material and the polyimide resin using electroless plating.
ポリイミド系樹脂と配線金属材料との間で起こる劣化反
応は、配線金属材料の酸化物による触媒作用により促進
される。従って、樹脂の劣化反応を防止する最も有効な
方法は、昭和５０年度電子通信学会全国大会要旨集３７
８に記載されているように、配線金属材料として酸化さ
れにくい金属。The deterioration reaction that occurs between the polyimide resin and the wiring metal material is promoted by the catalytic action of the oxide of the wiring metal material. Therefore, the most effective way to prevent resin deterioration reactions is to
8, a metal that is difficult to oxidize as a wiring metal material.
すなわち、金属酸化物の生成ギブスエネルギの大きなも
のを選定すればよい、また、膜形成の容易さという観点
から無電解メツキ法により成膜できる金属であることが
望ましい、これらの要求を満たす金属としてニッケルを
選定した。In other words, it is sufficient to select a metal that has a large Gibbs energy for producing metal oxides, and from the viewpoint of ease of film formation, it is desirable to use a metal that can be formed into a film by electroless plating. Nickel was selected.
以下、本発明の実施例を第１図から第２図により説明す
る。薄膜磁気ヘッドの主要部の断面図が第１図である。Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of the main parts of the thin film magnetic head.
基板１の上には、上部磁性膜４と下部磁性膜２，３によ
って構成される磁気コアがあり、導体コイル７がコア中
央を貫通している。On the substrate 1, there is a magnetic core composed of an upper magnetic film 4 and lower magnetic films 2 and 3, and a conductor coil 7 passes through the center of the core.
絶縁膜５，６は薄膜磁気ヘッドの骨格を決めるように特
開昭６０−２４０３７号公報に記載されている方法によ
り所定の形状にパターニングされている。The insulating films 5 and 6 are patterned into a predetermined shape by the method described in Japanese Patent Application Laid-Open No. 60-24037 so as to determine the skeleton of the thin film magnetic head.
導体コイル７は、この絶縁膜５，６に包み込まれ。The conductor coil 7 is wrapped in the insulating films 5 and 6.
磁性膜２，３．４と電気的に絶縁されている。薄膜磁気
ヘッドの導体コイル７は、記録再生時の信号の雑音を少
なくする点から、低抵抗であることが望ましく、一般に
は銅が使用されている。ところが、銅は絶縁膜に用いら
れるポリイミド系樹脂の劣化反応の触媒として作用する
。この劣化反応の原因は、ポリイミド系樹脂の分子構造
内に含まれるカルボニル基の数が、金属との反応によっ
て減少することにより、樹脂の熱分解が促進されること
にある。金属は、樹脂との反応によって金属酸化物とな
る。従って、樹脂の劣化反応を阻むためには、酸化され
にくい金属、すなわち、酸化物の生成ギブスエネルギの
大きな金属で導体コイル表面を覆ってやればよいｅ Ｃ
ｕ ｘ Ｏの生成ギブスエネルギは３０．４ＫｃａＱ／
飄ｏＱであり、この値よりも大きな生成ギブスエネルギ
をもつ金属酸化物にはＣｒａｂｓ、Ｃｏｏ、ＮｉＯ，５
ｎＯｚ、５ｉｆｔｓＡｎｚＯａ等がある。これらの金属
の内、成膜手段として比較的容易な無電解めっき法で成
膜できる金属という観点から、金属膜８の材質としてニ
ッケルを選定した。導体コイル７の周囲に金属膜８を形
成する工程を示したのが第２図である。まず、下部絶縁
膜５の上にクロム、銅をスパッタ法で順次堆積し、めっ
き下地膜９とする。このめっき下地膜９の上に、コイル
を形成したい領域以外の所をホトレジストで覆った後、
めっき下地膜９を導電膜としてめっきを行ない導体コイ
ル７を形成する。ホトレジストを除去し、コイル以外の
領域にあるめっき下地膜９をミリング法、又は、スパッ
タエツチング法等により除去することによって、コイル
間を分離する０次に、この導体コイル７の表面にニッケ
ル金属膜８を無電解めっき法により成膜する。ニッケル
をめっきするためのめつき浴は、酸性浴、中性浴、水酸
化アルカリ浴、アンモニアアルカリ浴など多くの浴組成
が開発されているが、ポリイミド系樹脂５はアルカリ性
浴中では侵食されるので、中性、又は、酸性浴がよい、
この無電解めっきにより、導体コイル７の表面に均一な
ニッケル金属膜８が形成できる。その後、上部絶縁膜６
を塗布し導体コイル７を樹脂で包み込む。It is electrically insulated from the magnetic films 2, 3.4. The conductor coil 7 of the thin-film magnetic head preferably has low resistance in order to reduce signal noise during recording and reproduction, and copper is generally used. However, copper acts as a catalyst for the deterioration reaction of the polyimide resin used in the insulating film. The cause of this deterioration reaction is that the number of carbonyl groups contained in the molecular structure of the polyimide resin is reduced by reaction with metal, thereby promoting thermal decomposition of the resin. The metal becomes a metal oxide by reaction with the resin. Therefore, in order to prevent the deterioration reaction of the resin, the surface of the conductor coil should be covered with a metal that is difficult to oxidize, that is, a metal that has a large Gibbs energy for oxide formation.
The Gibbs energy of production of u x O is 30.4 KcaQ/
Metal oxides with a Gibbs energy of formation larger than this value include Crabs, Coo, NiO, 5
nOz, 5iftsAnzOa, etc. Among these metals, nickel was selected as the material for the metal film 8 from the viewpoint that it can be formed into a film by a relatively easy electroless plating method. FIG. 2 shows the process of forming the metal film 8 around the conductor coil 7. First, chromium and copper are sequentially deposited on the lower insulating film 5 by sputtering to form a plating base film 9. After covering the plating base film 9 with photoresist except for the area where the coil is to be formed,
Plating is performed using the plating base film 9 as a conductive film to form the conductor coil 7. The photoresist is removed and the plating base film 9 in areas other than the coils is removed by milling or sputter etching to separate the coils. Next, a nickel metal film is formed on the surface of the conductor coil 7. 8 is formed into a film by electroless plating. Many bath compositions have been developed for plating baths for nickel plating, such as acidic baths, neutral baths, alkaline hydroxide baths, and alkaline ammonia baths, but polyimide resins 5 are corroded in alkaline baths. Therefore, a neutral or acidic bath is better.
By this electroless plating, a uniform nickel metal film 8 can be formed on the surface of the conductor coil 7. After that, the upper insulating film 6
The conductor coil 7 is wrapped in resin.
本発明によれば、導体コイル表面にニッケル膜を形成す
ることにより、銅膜とポリイミド系樹脂とが直接接触し
ないため、樹脂の劣化反応が起こらない。According to the present invention, by forming a nickel film on the surface of the conductor coil, the copper film and the polyimide resin do not come into direct contact with each other, so that a deterioration reaction of the resin does not occur.
第１図は、本発明の一実施例の薄膜磁気ヘッドの主要部
分の断面図、第２図は、導体コイル表面にニッケル膜を
形成するときの工程図である。
１・・・基板、２・・・下部磁性膜、３・・・下部磁性
膜。
第１図FIG. 1 is a sectional view of the main parts of a thin film magnetic head according to an embodiment of the present invention, and FIG. 2 is a process diagram of forming a nickel film on the surface of a conductor coil. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Lower magnetic film, 3...Lower magnetic film. Figure 1
Claims (1)
形成されるコイルとの間を絶縁するための絶縁膜として
ポリイミド系樹脂を用いた薄膜磁気ヘッドにおいて、 前記導体膜と前記絶縁膜とが直接接触する界面に別の金
属膜を設けたことを特徴とする薄膜磁気ヘッド。 ２、特許請求の範囲第１項において、 前記導体膜として銅を用い、前記金属膜としてニッケル
を用いたことを特徴とする薄膜磁気ヘッド。 ３、特許請求の範囲第１項において、 前記ポリイミド系樹脂がポリイミド・イソ・インドロキ
ナゾリンジオン樹脂で構成されることを特徴とする薄膜
磁気ヘッド。[Claims] 1. A thin film magnetic head using a polyimide resin as an insulating film for insulating between upper and lower magnetic films and a coil formed of one or more conductor films, comprising: A thin film magnetic head characterized in that another metal film is provided at an interface where the conductor film and the insulating film are in direct contact with each other. 2. A thin film magnetic head according to claim 1, characterized in that the conductor film is made of copper, and the metal film is made of nickel. 3. The thin film magnetic head according to claim 1, wherein the polyimide resin is made of polyimide iso indoroquinazolinedione resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10394588A JPH01277311A (en) | 1988-04-28 | 1988-04-28 | Thin-film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10394588A JPH01277311A (en) | 1988-04-28 | 1988-04-28 | Thin-film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01277311A true JPH01277311A (en) | 1989-11-07 |
Family
ID=14367579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10394588A Pending JPH01277311A (en) | 1988-04-28 | 1988-04-28 | Thin-film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01277311A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0702379A1 (en) | 1994-09-16 | 1996-03-20 | Kabushiki Kaisha Toshiba | Electronic and/or magnetic devices |
| JP2005191408A (en) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | Coil conductor, method for manufacturing the same, and electronic component using the same |
-
1988
- 1988-04-28 JP JP10394588A patent/JPH01277311A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0702379A1 (en) | 1994-09-16 | 1996-03-20 | Kabushiki Kaisha Toshiba | Electronic and/or magnetic devices |
| US5738931A (en) * | 1994-09-16 | 1998-04-14 | Kabushiki Kaisha Toshiba | Electronic device and magnetic device |
| JP2005191408A (en) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | Coil conductor, method for manufacturing the same, and electronic component using the same |
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