JPH01277233A - Production of printed circuit board formed with solder resist - Google Patents

Abstract

PURPOSE:To eliminate the remaining of development by rear fogging and to obtain a solder resist having a sharp edge shape by forming photosensitive compsn. layers contg. a compd. having an ethylenic unsatd. group, sensitizer or sensitizer system which form free radicals by active light, and a specific rear fogging preventive agent on both faces of a printed circuit board. CONSTITUTION:The layers of the photosensitive compsn. contg. the compd. having at least one ethylenic unsatd. group, the sensitizer and/or sensitizer system which form the free radicals by active light and the compd. expressed by formula I and/or the compd. expressed by formula II as the rear fogging preventive agent are formed on both faces of the printed circuit board on which conductor patterns are formed; thereafter, both faces are irradiated by imagewise active rays and are thereby developed. (In formula, R1, R2 signify a hydrogen atom, alkyl group or alkoxy group.) The remaining of the development by the rear fogging is thereby eliminated and the printed circuit board having the solder resist which is sharp in the edge shape is obtd.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board, and more specifically,
The present invention relates to a method for manufacturing a printed wiring board in which a photosensitive composition is used to form a solder resist on both sides.

[Conventional technology]

Printed wiring boards have insulating layers and conductor pattern layers alternately laminated, and the outermost conductor pattern layer is usually used to prevent solder bridging between conductors during soldering or to permanently protect the conductor patterns. A solder resist is formed on top. In recent years, the formation of this solder resist has improved in precision,
Photo printing (photo printing) using photosensitive resin instead of screen printing for the purpose of improving workability, etc.
It is becoming mandatory by law.

FIG. 1 is a process schematic diagram of a method for manufacturing a printed wiring board having a solder resist using a photosensitive composition. A board is manufactured. FIG. 2 is a schematic explanatory diagram of the solder resist forming process in FIG. 1. Second
In the figure, first, a photosensitive composition IA is applied to both surfaces of a printed wiring board having a conductor pattern 3 on an insulation layer (or inner layer) 2.
is applied (Step A), and then selectively exposed to light in the direction of the arrow through the negative 4 (Step B), and the unexposed areas of the photosensitive composition IA are developed to form a pattern corresponding to the exposure, that is, solder resist IB. are formed on both sides of the printed wiring board (
Step C).

If the edge shape of the solder resist IB is shaped, the adhesion of solder to the conductor may be insufficient during soldering, or the edge shape may not require solder adhesion as shown in Figure 4. Solder adhesion occurs in some areas. In FIG. 4, 5 is attached solder and 6 is solder. In order to make the edge shape of solder resist IB good, it is necessary to use a photosensitive composition with good resolution, to bring the negative and the photosensitive resin into close contact with each other during exposure, and to irradiate the exposure light at right angles. However, since the printed wiring board allows the exposure light to pass through, when exposed from both sides, the photosensitive compositions on the opposite sides will also be exposed, causing a photoreaction to occur in areas that are not desired to be exposed. As a result, development remains due to back fogging or the edge shape is insufficiently sharp. In order to avoid this phenomenon, a method can be considered in which the photosensitive composition is coated, exposed, and developed on the other side, but compared to simultaneous exposure on both sides, the work is doubled, the manufacturing cost increases, and the initial The solder resist on the side that has been developed is coated on one side again.
There is a problem that various quality deteriorations such as peeling of solder resist occur due to exposure to unnecessary steps during exposure and development.

(Problems to be Solved by the Invention) An object of the present invention is to solve the problems of the prior art described above, and simultaneously form a solder resist with sharp edges on both sides of a printed wiring board without any development residue due to back-fogging. The object of the present invention is to provide a method for manufacturing printed wiring boards that can be used to produce printed wiring boards.

[Means to solve the problem]

As a result of various studies, the present inventors found that 405 nm and 4
A layer of a photosensitive composition containing a compound that absorbs an emission spectrum of 35 nm and causes a photocrosslinking reaction is formed on both sides of the printed wiring board, and then exposed and developed, so that there is no development residue due to back fogging. The present inventors have discovered that a solder resist with sharp edges can be formed, and the present invention has been achieved.

That is, the present invention provides (A) a compound having at least one ethylenically unsaturated group, (B) a sensitizer and/or a sensitizer system that generates free radicals upon activation of actinic light, and (C) an anti-backfogging agent. , a compound represented by the general formula (1) (wherein R8 means a hydrogen atom, an alkyl group, or an alkoxy group) and/or a compound represented by the general formula ([1) (wherein R2 means a hydrogen atom, an alkyl group, or an alkyl group). After forming a layer of a photosensitive composition containing a compound represented by (representing an alkoxy group) on both sides of a printed wiring board on which a conductive pattern has been formed, both sides are irradiated with imagewise actinic rays and developed. The present invention relates to a method for manufacturing a printed wiring board on which a solder resist is formed, characterized by:

In addition, as the sensitizer and/or sensitizer system that generates free radicals by actinic light in the present invention, 2-methyl-1-(4-(methylthio)phenyl]-2-morpholinopropanone-1 and 4° The combination of 41-bis(diethylamino)benzophenone is preferred.

Further, as the backfogging inhibitor in the present invention, it is preferable to use 2-benzoylmethylene-3-methylnut (1°2-d) thiazoline.

The photosensitive composition used in the present invention contains a compound having at least one ethylenically unsaturated group as an essential component (A). Examples of such compounds include compounds obtained by adding α,β-unsaturated carboxylic acids to polyhydric alcohols, such as trimethylolpropane di(meth)acrylate (methacrylate or acrylate, the same hereinafter), trimethylolpropane tri( meth)acrylate, tetramethylolmethanetri(meth)acrylate, tetramethylolmethanetetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc., α,β- Compounds obtained by adding unsaturated carboxylic acids, such as trimethylolpropane triglycidyl ether triacrylate, bisphenol A diglycidyl ether di(meth)acrylate, and polyhydric carboxylic acids, such as fuculic anhydride, with hydroxyl groups and ethylenic unsaturated acids. Esterified products with substances having saturated groups, such as β-hydroxyethyl (meth)acrylate, alkyl esters of acrylic acid or methacrylic acid, such as (meth)acrylic acid methyl ester, (meth)
Acrylic acid ethyl ester, (meth)acrylic acid butyl ester, (meth)acrylic acid 2-ethylhexyl ester, etc., trimethylhexamethylene diisocyanate,
Urethane di(
A urethane di(meth)acrylate compound obtained by reacting a meth)acrylate compound, trimethylhexamethylene diisocyanate, a dihydric alcohol, and 2-hydroxyethyl(meth)acrylate, etc. can also be used. Two or more of these compounds may be used in combination.

The photosensitive composition used in the present invention contains as an essential component (B) a sensitizer and/or a sensitizer system that generates free radicals by actinic light.

Examples of the sensitizer include 2-ethylanthraquinone,
Substituted or unsubstituted polynuclear bosonones such as 2-t-butylanthraquinone, octamelanthraquinone, 1,2-benzanthraquinone, and 2,3-diphenylanthraquinone, ketoaldonyl compounds such as diacetyl and benzyl,
α-ketaldonyl alcohols and ethers such as benzoin and pivalone, α-phenyl-benzoin, α,
α-hydrocarbon substituted aromatic acyloins such as α-jethoxyacetophenyl, aromatic ketones such as benzophenone, 4,49-bisdialkylaminobenzophenone,
Thioxanthone such as -methylthioxanthone, 2<4>-diethylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, and 2-ethylthioxanthone are used. These compounds may be used alone or in combination of two or more.

In addition, as a sensitizer system, 2,4.5-triarylimidazole dimer and 2-methylcaptobenzoquinazole,
A combination with leuco crystal violet, tris(4-diethylamino-2-methylphenyl)methane, etc. is used. Additionally, additives such as triethanolamine for benzophenyl, which do not have photoinitiating properties by themselves, but which, when used in combination with the above-mentioned compounds, result in a sensitizer system with better photoinitiating performance as a whole. Tertiary amines and the like can also be used.

Preferred as the sensitizer and/or sensitizer system are 2-methyl-1-(4-(methylthio)phenylcou 2-morpholinopropanone-1 and 4 It is a combination of .41-bis(diethylamino)benzophenone.

The photosensitive composition used in the present invention contains, as an essential component (C), a compound represented by the general formula (1) and/or a compound represented by the general formula (II), which is a backfogging inhibitor. .

Examples of the compound represented by general formula (1) include 2-
Benzoylmethylene-3-methylnaphtho(2,1-d)
Thiazoline, 2-benzoylmethylene-3-ethylnaphtho(2,1-d) thiazoline, 2-benzoylmethylene-3-propylnaphtho(2,1-d) thiazoline, 2-
Benzoylmethylene-3-methoxynaphtho (2,1-d
) thiazoline, 2-benzoylmethylene-3-ethylnaphtho(2,1-d) thiazoline, and the like.

-C Compounds represented by formula (II) include, for example, 2
-benzoylmethylene-3-methylnaphtho(1,2-d
) thiazoline, 2-benzoylmethylene-3-ethylnaphtho(1,2-d) thiazoline, 2-benzoylmethylene-3-propylnaphtho(1,2-d) thiazoline, 2
-benzoylmethylene-3-methoxynaphtho (1,,2
-d) thiazoline, 2-benzoylmethylene-3-ethoxynaphtho(1,2-d)thiazoline, and the like.

These compounds are compounds that absorb the emission spectrum of 405 nn+ and 435 nm in the emission spectrum of a high-pressure mercury lamp and cause a photocrosslinking reaction, and these compounds can be used alone or in combination of two or more. Among these compounds, 2-benzoylmethylene-3-methylnaphtho(1,2-d)thiazoline is preferred from the viewpoint of the properties of the solder resist formed.

In the present invention, essential components (A
) 0.1 to 30 of essential component (B) per 100 parts by weight
It is preferable to use parts by weight and essential component (C) in a range of 0.01 to 30 parts by weight.

A linear polymer compound can be used in the photosensitive composition used in the present invention. As the linear polymer compound, for example, a thermoplastic polymer described in Japanese Patent Publication No. 15932/1984 can be used. Preferred linear polymer compounds include polymerized vinyl monomers such as methyl methacrylate, ethyl acrylate, acrylic acid, styrene, 2-hydroxyethyl methacrylate, L-butylaminoethyl methacrylate, acrylamide, acrylonitrile, and vinyl acetate. Alternatively, there are vinyl polymer compounds obtained by copolymerization, synthetic rubbers such as butadiene/acrylonitrile copolymers, butadiene/acrylonitrile/styrene copolymers, linear polyurethane compounds, alcohol-soluble nylons, and the like. Two or more of these linear polymer compounds may be used in combination.

Further, a thermosetting compound can be used in the photosensitive composition used in the present invention. Examples of the thermosetting compound include epoxy resins and melamine resins, and two or more of these may be used in combination, or may be used in combination with the linear polymer compound.

Furthermore, a compound having both a thermally crosslinkable functional group and a polymerizable vinyl group can be used in the photosensitive composition used in the present invention. Examples of such compounds include oligomers having an epoxy group and a polymerizable vinyl group in their side chains. The oligomers are disclosed in Japanese Patent Application Laid-Open No. 132947/1982, Japanese Patent Application No. 107785/1982, and Japanese Patent Application No. 10/1983.
No. 7786, etc., and preferably a compound having at least two epoxy groups and an unsaturated carboxylic acid have an acid equivalent/epoxy equivalent ratio of 0°1 to 0.9.
To the unsaturated compound obtained by addition reaction in the range of 8, isocyanate ethyl methacrylate is added to the hydroxyl group of the unsaturated compound, and the isocyanate equivalent/hydroxyl group equivalent ratio is 0.
．． It is an oligomer obtained by reacting in the range of 1 to 1,2.

As the compound having at least two epoxy groups, for example, bisphenol A type epoxy resin obtained by reacting bisphenol A and shrimp chlorohydrin (
For example, manufactured by Shell Kagaku Co., Ltd., trade names Epicote 812, Epicote 828, Epicote 1001, etc.), brominated bisphenol A type epoxy resin (for example, manufactured by Tobu Kasei Co., Ltd., trade names Ebitoto YDB-340, YDB-400, etc.), bisphenol F type epoxy resin Resin (e.g. manufactured by Tobu Kasei Co., Ltd.,
Product Master Potato YDF-170, YDF-191),
An epoxy compound obtained by adding alkylene oxide to bisphenol A and then reacting it with epichlorohydrin (for example, Kyoeisha Yushi Co., Ltd., trade name Meiko Polite 3002)
etc.), hydrogenated bisphenol A type epoxy resin (for example, manufactured by Tobu Kasei Co., Ltd., trade name Santo-1-3T-1000, 5T
-3000, etc.) 1, Glyoxal type epoxy resin (e.g. manufactured by Tobu Kasei Co., Ltd., trade name Evo) -) YDG-414 etc.), Glycidylamine type epoxy resin (e.g. manufactured by Tobu Kasei Co., Ltd., trade name Evo) -) YDM-120 , YH-434
etc.), orthocresol novolak type epoxy resin (for example, manufactured by Nihon Tohoku Co., Ltd., trade name EOCN102, etc.), phenol novolac type epoxy resin (for example, manufactured by Tobu Kasei Co., Ltd.,
(trade name: YDPN-638, etc.), brominated phenol novolak type epoxy resin (for example, manufactured by Nippon Tohoku Co., Ltd., trade name: BR)
EN, etc.), alicyclic epoxy compounds (e.g., manufactured by Chisso Corporation,
(trade name Chissonox 221, Chissonox 201, etc.), glycidyl ether type epoxy resin obtained by the reaction of dicarboxylic acid such as phthalic acid with epichlorohydrin (for example, manufactured by Showa Denko K.K., trade name Shodyne 508,
Shodyne 540, Shodyne 550, etc.), glycidylamine type epoxy resins (manufactured by Shell Chemical Co., Ltd., trade name Epicote 604, etc.), trimethylolpropane polyglycidyl ether, and the like.

As the unsaturated carboxylic acid, acrylic acid, methacrylic acid, β-furylacrylic acid, β-styrylacrylic acid, etc. are used.

Two or more kinds of compounds having both a thermally crosslinkable functional group and a polymerizable vinyl group may be used in combination. It may also be used in combination with the flocculent polymer compound and thermosetting compound.

Furthermore, other subsidiary components may be used in the photosensitive composition used in the present invention. The secondary components include thermal polymerization inhibitors, dyes, pigments, fillers, coatability improvers, antifoaming agents, flame retardants, flame retardant aids, adhesion improvers, latent curing agents for epoxy resins, etc. can be mentioned.

When forming a photosensitive layer using the above-mentioned photosensitive composition, for example, the photosensitive composition is dissolved in an organic solvent such as methyl ethyl ketone, methyl cellosolve acetate, ethyl cellosolve acetate, cyclohexanone, etc., and this solution is applied by dip coating or flow coating. By applying the coating directly onto the substrate to be processed and protected using conventional methods such as coating, roll coating, and screen printing, and drying, the coating is applied to both sides of the substrate by inverting the substrate and performing the same process. Photosensitive layers each having a thickness of 10 to 150 μm can be easily formed.

Further, the solution is placed on a support film such as a polyethylene terephthalate film or a polyimide film,
A photosensitive layer can also be formed by coating and drying a photosensitive element by a knife coat method, a roll coating method, or the like, and then simultaneously heating and pressurizing and laminating a photosensitive element on both sides of a substrate using a hot roll. At this time, if the board has irregularities of 10 μm or more, such as a printed wiring board on which conductor wiring lines are formed,
In order to prevent air from being entrained, it is preferable to laminate the layers under a vacuum of 200 mm11B or less. As an apparatus for this purpose, for example, a laminating apparatus described in Japanese Patent Publication No. 55-13341 is used. In addition, when using a support film that is opaque to actinic light, it is necessary to peel off the support film at the time of exposure.

Exposure and development of the formed photosensitive layer are carried out by conventional methods. That is, using an ultra-high-pressure mercury lamp, a high-pressure mercury lamp, or the like as a light source, the layer of the photosensitive resin composition is imagewise exposed directly or through a negative mask through a support film. If the support film remains after exposure, the support film is peeled off and then developed.

The type of developer used in the development process is not particularly limited as long as it does not damage the exposed areas and selectively dissolves the unexposed areas.

The image-like protective film obtained by the above method is a corrosion-resistant film for ordinary etching, plating, etc., but after development, it can be further exposed to active light and heated at 80 to 200°C. , a protective film with even better properties can be obtained. The order of exposure to active light and heat treatment may be in any order.

The printed wiring board on which the conductive pattern is formed in the present invention may be a multilayer printed wiring board.

〔Example〕

EXAMPLES The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples.

Note that parts in Examples and Comparative Examples indicate parts by weight.

Example 1 (a) Synthesis of urethane diacrylate compound Toluene (
solvent) 1200 parts toluene (solvent)
88 parts Add the above A to a reactor with a capacity of about 5 p that can be heated and cooled and equipped with a thermometer, a stirrer, a cooling tube, a nitrogen gas introduction tube, and a dropper, and heat to 60° while stirring.
The temperature was raised to C. B was uniformly added dropwise over about 3 hours while maintaining the reaction temperature at 55-65°C. 60° after finishing dropping B
The mixture was maintained at a temperature of C for about 2 hours, and then C was uniformly added dropwise at a temperature of 60° C. over a period of about 3 hours. After the dropwise addition of C was completed, the reaction temperature was gradually raised to 80°C over about 5 hours. Thereafter, the temperature was lowered to 60°C, D was added, and stirring was continued for about 1 hour. In this way, a solution of a urethane acrylate compound was obtained. Thereafter, it was dried under reduced pressure to obtain a viscous urethane acrylate compound.

(b) Preparation of photosensitive composition Urethane acrylate compound 40 parts Benzophenone 4 parts p-methoxyphenol 0.1 part Crystal violet
0.1 part methyl ethyl ketone 8
0 parts talc 10 parts A solution of a photosensitive composition was prepared using the above formulation.

(C) Formation of a cured film On both sides of the printed wiring board on which the conductor pattern is formed, (b)
The photosensitive composition prepared above was applied by dip coating and dried at 80"C for 20 minutes. The thickness after drying was approximately 3.
It was 0 μm. A negative film was adhered to both sides of a printed wiring board with a thickness of 0.6 mm on which a conductor pattern was formed and a layer of the photosensitive composition was formed, and using a Phoenix 3000 type exposure machine (manufactured by Oak Seisakusho Co., Ltd.), 200mJ/c
Exposure at ++t.

It was then spray developed using 1.1.1-trichloroethane at 20°C for 50 seconds.

When the cured film on the printed wiring board that had gone through the second step was observed, no development residue was observed. Furthermore, the printed wiring board was exposed to an ultraviolet irradiation device (manufactured by Toshiba Denzai Co., Ltd., rated voltage 200v).
, rated consumption type cuff, 2KW, compatible lamp H5600L/
2. Using one lamp), ultraviolet rays were irradiated at an amount of 2 J/ci, and then heat treatment was performed at 160° C. for 20 minutes.

After the printed wiring board thus obtained was subjected to flux treatment, it was immersed in a solder bath heated to 260° C. for 10 seconds to obtain a printed wiring board on which a sharp edge-shaped solder resist was formed.

Example 2 In Example 1, 4 parts of benzophenone contained in the photosensitive composition was replaced with 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1 (manufactured by Ciba Geigi, trade name Irgar Cure 907). ) 4 parts to adjust the photosensitive composition and perform the same treatment as in Example 1, a printed wiring board was obtained in which a solder resist with sharp edges and excellent surface gloss was formed. .

Comparative Example 1 The same photosensitive composition as in Example 1 was prepared except that 2-benzoylmethylene-3-methylnaphtho(1°2-d)thiazoline was not added to the photosensitive composition prepared in Example 1(b). After adjustment and the same treatment as in Example 1 (c), it was found that there was development residue on both sides of the printed wiring board. Further development was carried out, but the residual development did not disappear.

Example 3 (a) Synthesis of photopolymerizable unsaturated compound Methyl ethyl ketone 800 parts B Acrylic acid 69 parts p-methoxyphenol 3 parts Methyl ethyl ketone 1
00 parts dibutyltil dilaurate 0.5 parts Methyl ethyl ketone 100 parts The temperature was raised to °C to uniformly dissolve the mixture. While maintaining the reaction temperature at 60° C., B was added dropwise thereto over about 1 hour. After dropping B, the temperature was raised to 80°C over 2 hours, and the mixture was stirred at 80°C for about 15 hours to bring the acid value of the reaction system to 1 or less. The temperature was then lowered to 60°C, and C was uniformly added dropwise over about 3 hours while maintaining the reaction temperature at 60°C. After dropping C, about 5
After gradually raising the reaction temperature to 80°C over time,
The temperature was lowered to 60°C, D was added and stirring continued for about 1 hour. In this way, orthocresol novolak type epoxy resin with nonvolatile content of 57% by weight/acrylic acid/isocyanatoethyl methacrylate (acid equivalent/epoxy equivalent ratio = 0.2, isocyanate equivalent/hydroxyl group equivalent ratio = 1.
1) A solution of a photopolymerizable unsaturated compound was obtained.

(b) Adjustment of photosensitive resin composition Solution of photopolymerizable unsaturated compound 88 parts (non-volatile content 50 parts) Benzophenone 2.0 parts 4.41
-bis(diethylamino)benzo 0.2 parts 2-benzoylmethyl-3-methylna 1 part phto(1
, 2-d) Thiazoline Micro Ace P-4 (manufactured by Nippon Talc Co., Ltd. 30 parts ultrafine talc average particle size 1.5 μm) Phthalocyanine Green 0.1 part Modaflow 0.1 part The above formulation was mixed and dispersed with a roll mill. A solution of a photosensitive resin composition was prepared.

(c) Formation of a cured film The solution of the photosensitive resin composition obtained in (b) was applied onto a copper-clad printed wiring board, heated at room temperature for 20 minutes, and further heated to 80°C.
The printed wiring board was dried for 20 minutes, then the printed wiring board was reversed and the same process was performed to obtain a board with a thickness of 0.6 cm with conductor patterns formed.
A photosensitive layer with a thickness of 40 μm was formed on both sides of a printed wiring board with a thickness of 40 μm. Then Phoenix 3 through the negative mask.
Using a 000 type exposure machine, both sides were simultaneously exposed at 200 mJ/c+fl. After exposure, heat at 80°C for 5 minutes, then heat at room temperature for 3 minutes.
After standing for 0 minutes, spray development was performed using 1,1.1-1-lichloroethane at 2°C for 90 seconds.

When the printed wiring board was observed after development, there was no development residue. Furthermore, using Toshiba ultraviolet irradiation equipment,
After irradiation with J/cffl, heat treatment was performed at 150'C for 30 minutes to obtain a solder mask with excellent dimensional accuracy corresponding to a negative mask.

This solder mask was soldered at 260°C for 10 seconds using rosin-based flux A-226 (manufactured by Tamura Kaken Co., Ltd., trade name), and then at 25°C with Triclean for 10 seconds.
After purification for minutes, MIL-3TD-202E407
Condition D 13 (-65°C for 30 minutes, room temperature within 5 minutes, 1
A thermal shock test was conducted for 50 cycles at 25° C. for 30 minutes, but no cranking or peeling of the coating was observed.

These results show that the solder resist of the present invention has excellent cold and thermal shock resistance, and that printed wiring boards with excellent long-term reliability can be obtained.

Example 4 In Example 3, the photosensitive composition was prepared by changing 2 parts of benzophenone contained in the photosensitive composition to 12 parts of 2-methyl-1-(4-(methylthio)phenyl]-2-morpholinopropanone. When processed in the same process as in Example 3(c), a printed wiring board was obtained which exhibited the same characteristics as Example 3, had a sharp edge shape, and was formed with a solder resist with excellent surface gloss. These were obtained and had excellent cold shock resistance.

Comparative Example 2 A photosensitive composition was prepared in the same manner as in Example 3, except that 2-penzoylmethylene-3-methylnat(1°2-d)thiazoline was not added to the photosensitive composition prepared in Example 3(b). When the same processing as in Example 3(C) was carried out, there was development residue on both sides due to back fogging. Further development was carried out, but the residual development did not disappear.

[Effects of the Invention] As described above, by the manufacturing method of the present invention, it is possible to easily manufacture a printed wiring board which has no development residue due to back-fogging and which has solder resist in good shape with sharp edges on both sides.

[Brief explanation of the drawing]

Figure 1 is a schematic diagram of the process for manufacturing a printed wiring board with a solder resist using a photosensitive composition, Figure 4 is a schematic diagram of the edge shape of the solder resist, and Figure 4 is a case where the edge shape of the solder resist is inappropriate. FIG. 3 is an explanatory diagram of solder adhesion. IA...Photosensitive resin, IB...Solder resist, 2
...Insulating layer or inner layer, 3...Conductor pattern, 4.
...Negative, 5...Adhesive solder, 6...Solder. Agent Patent Attorney Kunihiko Wakabayashi Hitoshi] 7 Figure 2

Claims (3)

[Claims] 1. (A) a compound having at least one ethylenically unsaturated group; (B) a sensitizer and/or a sensitizer system that generates free radicals upon actinic light; and (C) an anti-backfogging agent of the general formula (I ) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ Compounds represented by (I) (in the formula, R_1 means a hydrogen atom, an alkyl group, or an alkoxy group) and/or general formula (II) ▲ Numerical formulas, chemical formulas, tables, etc. ▼ (II) (In the formula, R_2 means a hydrogen atom, an alkyl group, or an alkoxy group) A layer of a photosensitive composition containing a compound represented by 1. A method for manufacturing a printed wiring board on which a solder resist is formed, which comprises forming a printed wiring board on which a solder resist is formed, and then developing the solder resist by irradiating both surfaces with imagewise actinic rays. 2. Sensitizers and/or sensitizer systems that generate free radicals upon actinic light include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1 and 4,4^1-bis A method for producing a printed wiring board on which a solder resist according to claim 1 is formed, wherein the solder resist is (diethylamino)benzophenone. 3. The antifogging agent is 2-benzoylmethylene-3-
Claim 1: Methylnaphtho(1,2-d)thiazoline
A method for producing a printed wiring board on which the solder resist described above is formed.