JP3405632B2 - Epoxy resin, epoxy resin composition, photo solder resist ink, printed wiring board, and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a chain-extended epoxy resin, an epoxy resin composition used for a protective film of a photo solder resist ink or a color filter or an image device, and an ultraviolet curable composition using the epoxy resin. Photo solder resist ink developable with dilute alkaline solution having thermosetting property, printed wiring board having solder resist formed by this photo solder resist ink, and production of printed wiring board using the above photo solder resist ink It is about the method.

[0002]

2. Description of the Related Art In recent years, as a method for forming a solder resist pattern in the production of various printed wiring boards for consumer and industrial use, in order to cope with higher wiring densities of printed wiring boards, the screen printing method has been replaced by resolution. A method that uses a dry film or a liquid photoresist ink having excellent properties and dimensional accuracy has occupy a large position.

Among the above photoresist inks, a liquid photosolder resist ink (generally referred to as a liquid photosolder resist ink) is disclosed in Japanese Examined Patent Publication No. Sho 56.
No. 40329 discloses a composition containing an ultraviolet curable resin as an essential component, which is obtained by reacting an unsaturated monocarboxylic acid with an epoxy resin and adding a polybasic acid anhydride. Further, JP-A-61-243869 discloses an ultraviolet curable resin soluble in a dilute alkaline solution, which is obtained by adding a polybasic acid anhydride to a novolac type epoxy acrylate,
A liquid photo solder resist ink developable with a dilute alkaline solution containing a thermosetting component composed of a photopolymerization initiator, a diluent and an epoxy compound is disclosed.

The resist ink containing these UV-curable resin and epoxy compound is finally cured by UV rays and then heat-cured to obtain a solder resist having good physical properties. However, it is used in the manufacture of printed wiring boards that require high quality. In the case of this resist ink, the UV-curable resin used has a sufficient amount of carboxyl groups introduced so that the solder resist ink can be developed with a dilute alkaline solution by using a polybasic acid anhydride as described above. The thermosetting epoxy compound that is mixed in the ink at the same time causes the epoxy group to polymerize by heating, and also blocks the carboxyl group that comes from the UV curable resin in the solder resist, and also improves the crosslink density of the solder resist. The solder resist that is finally formed by
It has the effect of chemically stabilizing and improving solder heat resistance, chemical resistance, electrolytic corrosion resistance, gold plating resistance, and the like.

In order to form a solder resist pattern on a printed wiring board manufacturing substrate using the above resist ink, the following method is usually adopted. For example, a resist ink is applied onto a printed wiring board manufacturing substrate on which a conductor pattern has been formed by a dipping method, a spray coater, a roll coater, a curtain coater, screen printing or the like, and then an organic solvent as a diluent is evaporated. For this purpose, precure is performed at 60 to 120 ° C., for example. Next, apply a negative mask with a pattern directly or indirectly to the surface of the dried coating, and use a chemical lamp, low-pressure mercury lamp, medium-pressure mercury lamp, high-pressure mercury lamp, ultra-high-pressure mercury lamp, xenon lamp, or metal halide lamp to irradiate ultraviolet rays. After irradiation, a pattern of a dry coating film which is exposed and cured by development is formed, and further, for example, at 120 to 180 ° C. for 30 minutes.
By curing the epoxy compound by heating for about a minute, the film strength, hardness and chemical resistance of the resist are improved.

In this method, the pre-cure is a useful step for making the applied resist ink layer non-adhesive, allowing the negative mask to be attached and detached, and for preventing its contamination. However, when an epoxy compound is added to the resist ink, thermal curing due to the reaction between the epoxy compound and the carboxyl group present in the ultraviolet curable resin occurs even under pre-cure conditions, so that development failure and resolution in the developing step occur. Poor property is likely to occur. This tendency is particularly remarkable when a general-purpose solvent-soluble epoxy compound is used as the epoxy compound, and the acceptable precure conditions are within a mild range in both temperature and time.
It was 20 minutes or less at 0 ° C., and about 30 minutes or less at 80 ° C. even in a special case (hereinafter, the range of permissible pre-cure conditions is referred to as “pre-cure permissible range”).

This phenomenon occurs because in the above resist ink, the ultraviolet curable resin and the solvent-soluble epoxy resin have a good compatibility, and both are in a homogeneous mixed state in the process of forming a dry coating film and in the formed dry coating film. Therefore, it is presumed that the reaction between the carboxyl group and the epoxy group easily occurs. Further, due to the homogeneity of such a mixed state, when the compounding amount of the solvent-soluble epoxy resin is increased, the component having ultraviolet curability is diluted, and as a result, poor sensitivity tends to occur. Furthermore, when the mild precure conditions are adopted as described above, the diluting solvent is likely to remain in the dry coating film, and thus the pattern mask is contaminated, or the pattern mask is difficult to peel off from the dry coating film surface. There is a risk of This is because the non-adhesiveness of the resist ink layer after pre-cure is the drying property of the resist ink and the resist ink component remaining on the substrate after drying, that is, a coating film composed of a mixture of an ultraviolet curable resin and an epoxy compound. This is because it depends on the dryness to the touch (surface tackiness when touching the coating film with a finger).

In the actual production of a printed wiring board, a printed wiring board manufacturing substrate is temporarily stored in a state of being coated and pre-cured with a liquid photosolder resist ink for the purpose of work, and the next day or a few days later. Although it may be subjected to an exposure step after a day, in the case of using the above resist ink, the curing by the epoxy compound proceeds to some extent even at room temperature, so that storage failure for a long time tends to cause poor development and resolution.

To solve the above problems, bisphenol A is disclosed in JP-A-1-141904, JP-A-3-250012 and JP-A-4-217252.
UV-curable resin made by adding acid anhydride to epoxy epoxy acrylate, UV-curable resin made by adding acid anhydride to novolac epoxy acrylate, etc. as an epoxy compound difficult to dissolve in diluents such as triglycidyl isocyanurate A liquid photo solder resist ink which can be developed with a dilute alkaline solution containing various fine powders is disclosed.

In this resist ink, the finely powdered epoxy compound having poor solubility in the diluent is nonuniformly present as a solid in the coating film during precure, and there is little entanglement with the ultraviolet curable resin, and it is present in the resin. The curing reaction does not proceed easily because the contact with the carboxyl group is small. In addition, since the UV-curable component in the coating film is kept at a high concentration in the portion other than the fine particles of the epoxy compound which are nonuniformly present after the pre-cure, there is little problem of deterioration in sensitivity during UV exposure. Meanwhile, post bake (final heat curing)
At times, when the temperature is higher than the melting point of the epoxy compound, there is an advantage that the film strength, hardness and chemical resistance of the solder resist can be improved.

From the above advantages, a finely powdered epoxy compound which is hardly soluble in a diluent is used. In this case, the thermosetting property of the coating film after precure is governed by the particle size of the finely powdered epoxy compound. Even if the finely powdered epoxy compound is melted by heating, it is difficult to be in a completely uniform state with the UV-curable resin in the dry coating film, and the interface between the epoxy compound and the UV-curable resin, etc. There are problems such as being inevitable. Therefore, various methods have been adopted in order to make the particle diameter of the finely powdered epoxy compound insoluble in the diluent as small as possible, but the particle diameter of the fine powder obtained by these physical pulverizations is limited.

For example, Japanese Patent Laid-Open No. 6-95384 discloses that
An ultraviolet curable resin and triglycidyl isocyanurate as a diluent-insoluble epoxy compound which is solid at room temperature are disclosed. Here, in order to improve the sensitivity at the time of exposure and the thermosetting reaction more quickly at the time of post-baking to improve the resistance and reliability of the resist film, a specific dispersion method is adopted and an epoxy compound which is hardly soluble in a diluent is used. Is required to be extremely fine, and it is pointed out in the Examples that the effect is insufficient only by pulverizing triglycidyl isocyanurate with a roll mill or the like. Therefore, as long as the finely powdered epoxy compound having poor diluent solubility is used, there is a certain limit in improving the resist coating physical properties such as heat resistance and galvanic corrosion resistance even though the precure tolerance range can be secured.

[0013]

The object of the present invention is to have a wide pre-cure allowance range, which enables long-term storage, has a good dry-to-touch property of the coating film after pre-cure, and has excellent resolution and sensitivity. Another object of the present invention is to provide an epoxy resin capable of obtaining a photo solder resist ink having the same. Further, another object of the present invention is that when used, it has a wide pre-cure allowance and can be stored for a long period of time, and the touch-drying property of the coating film after pre-cure is good, and also has excellent resolution and sensitivity. A dilute alkali capable of forming a solder resist which has excellent chemical resistance, electrolytic corrosion resistance and electrical characteristics, and particularly excellent solder heat resistance and gold plating resistance, as well as having excellent adhesion to the substrate. It is to provide a photo solder resist ink that can be developed with a solution.

Still another object of the present invention is to provide a printed wiring board having excellent physical properties produced by using the above photo solder resist ink, that is, excellent adhesion between the solder resist and the substrate, and excellent chemical resistance. To provide a printed wiring board having excellent heat resistance, electrolytic corrosion resistance and electrical characteristics, and particularly excellent solder heat resistance and gold plating resistance, and a method for manufacturing the same.

[0015]

The epoxy resin according to claim 1 of the present invention comprises a novolak type epoxy resin chain-extended with a compound having two or more isocyanate groups in one molecule. It is what As the novolac type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin or a bisphenol A-novolac type epoxy resin can be used.

The epoxy resin composition according to claim 3 of the present invention comprises: A chain-extended epoxy resin according to claim 1 or 2, B. A polymer comprising (a) 40 to 100 mol% of an ethylenically unsaturated monomer having an epoxy group and (b) 0 to 60 mol% of another ethylenically unsaturated monomer copolymerizable therewith, Obtained by reacting an ethylenically unsaturated monomer having only one carboxyl group of 0.7 to 1.2 chemical equivalents per epoxy equivalent of the polymer with a saturated or unsaturated polybasic acid anhydride. It is characterized in that it comprises an ultraviolet curable resin.

The photo solder resist ink according to claim 4 of the present invention comprises the epoxy resin composition according to claim 3 and C.I. A photopolymerization initiator and D.I. It is characterized by being mixed with a diluent.

The above B. (A) in UV curable resin
As the ethylenically unsaturated monomer having an epoxy group,
The thing containing glycidyl (meth) acrylate can be used. The printed wiring board according to claim 6 of the present invention is formed by curing the photo solder resist ink according to claim 4 or 5 to form the solder resist 6 on the surface of the printed wiring board manufacturing substrate 1. It is a feature.

According to a seventh aspect of the present invention, there is provided a method for producing a printed wiring board, wherein the photo solder resist ink according to the fourth or fifth aspect is applied to the surface of the printed wiring board producing substrate 1, and the photo solder resist is used. The resist ink is dried by precure, exposed to a desired pattern and developed, and then the photo solder resist ink is cured to form the solder resist 6.

[0020]

DETAILED DESCRIPTION OF THE INVENTION

<A. Regarding the chain-extended epoxy resin> The chain-extended epoxy resin of the present invention is a novolac type epoxy resin,
It is chain-extended with a compound having two or more isocyanate groups in one molecule. Examples of the compound having two or more isocyanate groups in one molecule include 2,4
-Tolylene diisocyanate, 2,6-tolylene diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate,
4,4'-diphenylmethane diisocyanate, toluidine diisocyanate, lysine diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, triphenylmethane triisocyanate, polymethylene polyphenyl polyisocyanate and the like, and these are listed. Among them, at least one kind can be selected and used. In particular,
Tolylene diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate and the like are preferable.

Further, examples of the novolac type epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, and bisphenol A.
-Novolak type epoxy resin and the like can be mentioned, and at least one kind can be selected and used from these. The above novolac type epoxy resin is the obtained chain-extended epoxy resin A.A. Since it has a low epoxy equivalent and a large molecular weight, it is suitable because it can be sufficiently cured during post-baking.

The chain-extended epoxy resin of the present invention can be obtained by reacting the above-mentioned compound having two or more isocyanate groups in one molecule with the above novolac type epoxy resin to extend the chain. Specifically, for example, 0.1 to 15% by weight of a compound having two or more isocyanate groups in one molecule with respect to a novolac type epoxy resin,
Preferably, 0.2 to 10% by weight is reacted at 20 to 120 ° C. by a conventional method with or without addition of an organic tin compound such as dibutyltin dilaurate or a tertiary amine such as benzyldimethylamine as a catalyst. Obtained by reacting at temperature.

Here, when the above-mentioned isocyanate compound is 0.
If it is 1% by weight or less, the effect of chain extension cannot be obtained, and if it is 15% by weight or more, the molecular weight becomes too large and the storage stability of the ink is deteriorated due to residual isocyanate groups, which is not preferable. Regarding these reactions,
It can be presumed that the functional group in the novolac type epoxy resin, which is capable of reacting with an isocyanate group, for example, a product was obtained by reacting an isocyanate compound with a hydroxyl group or the like. Examples of the hydroxyl group contained in the raw material novolac type epoxy resin include a by-product glycol group derived from the epoxy group, a secondary hydroxyl group, and the like, but are not limited thereto, and an isocyanate group and If it has a reactive group, it can be used as a raw material for a chain-extended epoxy resin. Incidentally, generally speaking, the industrial grade novolac type epoxy resin has a group such as the above-mentioned by-product glycol group or secondary hydroxyl group.

These reactions are preferably carried out in a ratio of 0.05 to 1.5 chemical equivalents of isocyanate groups, more preferably 1.0 chemical equivalents or less, based on the functional groups such as hydroxyl groups of the novolac type epoxy resin. Let's do it. When the isocyanate group is excessive, it is preferable to consume the unreacted isocyanate group with a hydroxyl group-containing compound such as a solvent after the reaction.

The weight average molecular weight of the epoxy resin cross-linked and chain-extended with an isocyanate compound as described above can be freely adjusted by the ratio of the novolac type epoxy resin and the isocyanate compound. By selecting these conditions, at room temperature It can be a non-sticky solid.
Further, in this case, at least one kind of novolac type epoxy resin may be selected and used, and at least one kind of isocyanate compound may be selected and used.

In the resist ink of the present invention, the above chain-extended epoxy resin is used as component A. When used as such, it is possible to obtain excellent film characteristics such as dryness to the touch after pre-cure and to obtain a good pre-cure allowance range. Chain-extended epoxy resin A. Usually has a partially crosslinked structure in advance, but in the post-baking step, the epoxy group is further polymerized, or the epoxy group blocks the carboxyl group in the resist ink (UV curable resin) component. By increasing the cross-linking density of the solder resist, the finally formed solder resist is thermally and chemically stable, and the solder heat resistance, chemical resistance, electrolytic corrosion resistance, gold plating resistance, etc. are improved. Have an effect.

By the way, conventionally, as described above, when the conventional epoxy compound is blended in the resist ink, the thermal curing by the reaction between it and the carboxyl group present in the ultraviolet curable resin is carried out under the precure condition. Therefore, this problem is considered to be great when a diluent-soluble epoxy compound having good compatibility with an ultraviolet-curable resin and a diluent is used, because development failure and resolution failure are likely to occur in the developing step. Therefore, the reason for using this is to use a finely powdered epoxy compound having poor solubility in the diluent.

However, in the resist ink of the present invention, a chain-extended epoxy resin A. Is compatible with the UV-curable resin and the diluent in the ink, and has good compatibility with the UV-curable resin component having a carboxyl group in the dry coating film, but the heat The problem of poor developability and resolution due to curing does not occur, and on the contrary, good developability, resolution and precure allowance range are exhibited. Although the detailed reason for this is not clear, in the dried coating film of the above resist ink, the UV-curable resin component having a carboxyl group and the epoxy resin A. Is a compatible state that is apparently good in compatibility or causes a slight turbidity, but exhibits incompatibility at a fine level, and is difficult to react with each other under pre-cure conditions. It can be tentatively estimated that each component is in a clear phase separation state.

For the above reason, the resist ink of the present invention has a phase separation state at a much finer level than in the case of using a finely powdered epoxy compound having poor diluent solubility whose particle size is restricted by the physical pulverization method. Therefore, in the post-baking step after pre-cure, the epoxy resin A. Epoxy resin A having a chain-extended and sufficiently achieved purpose of improving the film strength, hardness, chemical resistance, gold plating resistance, electrolytic corrosion resistance, etc. of the solder resist by thermosetting ． In addition to having a part of the crosslinked structure in advance, the effect is particularly remarkable in gold plating resistance and solder heat resistance.

Chain-Extended Epoxy Resin in Resist Ink A. In order to more effectively bring about the above-mentioned effects, it is desirable that the compounding amount be 0.1 to 50% by weight with respect to the total amount of the ink components excluding the organic solvent in the diluent that is simultaneously compounded. The optimum effect can be obtained in the range of 0.1 to 30% by weight. If the amount of the chain-extended epoxy resin is less than 0.1% by weight with respect to the total amount of the ink components, the amount of the thermosetting epoxy compound decreases, and the film strength, hardness, chemical resistance, and resistance to solder resist are reduced. It is difficult to improve the gold plating property and the electrolytic corrosion resistance, and when the amount of the chain-extended epoxy resin is more than 50% by weight with respect to the total amount of the ink components, the amount of the ultraviolet curable resin becomes small. Therefore, it becomes difficult to obtain good developability and resolution of the solder resist ink.

In the range where the above effects can be maintained (50% by weight or less based on the total amount of the epoxy resin), the epoxy resin A. It is possible to use with. Examples of such epoxy compounds include solvent-insoluble epoxy compounds and general-purpose solvent-soluble epoxy compounds. Examples thereof include triglycidyl isocyanurate, YX 4000 (produced by Yuka Shell Epoxy Co., Ltd.), bisphenol A type epoxy resin, and bisphenol F. Type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A-novolac type epoxy resin, N-glycidyl type epoxy resin, alicyclic epoxy resin (for example, "EHPE-3150" manufactured by Daicel Chemical Industries, Ltd.), etc. Examples thereof include those having two or more epoxy groups in one molecule.

<B. About UV curable resin> The UV curable resin component used in the present invention is (a) 40 to 100 mol% of an ethylenically unsaturated monomer having an epoxy group, and (b) another ethylene copolymerizable therewith. Ethylenically unsaturated monomer having only one carboxyl group of 0.7 to 1.2 chemical equivalents per epoxy equivalent of the polymer in a polymer composed of 0 to 60 mol% of unsaturated unsaturated monomer And a saturated or unsaturated polybasic acid anhydride are reacted.

The ethylenically unsaturated monomer having an epoxy group as the component (a) has an epoxy group introduced into the above-mentioned polymer, and an ethylenically unsaturated monomer having only one carboxyl group added thereto. By doing so, the polymer is blended for the purpose of imparting photocurability by the ethylenically unsaturated double bond. Therefore, the photocurability of the UV-curable resin is directly controlled by the content of the ethylenically unsaturated monomer having an epoxy group in the total amount of the ethylenically unsaturated monomer which is the polymerized unit of the polymer. Become. The ethylenically unsaturated monomer having an epoxy group in the polymerized units of the above polymer is 40 to 1 with respect to the total amount of the ethylenically unsaturated monomer.
It is necessary to be in the range of 00 mol%. This is 40
When it is less than mol%, the photocurability is insufficient, resulting in insufficient sensitivity and poor resolution in the exposure and development steps, and in the finally formed solder resist, physical properties such as solder heat resistance are inferior. Will be enough.

Examples of the component (a) include epoxycyclohexyl derivatives of (meth) acrylic acid such as glycidyl (meth) acrylate and (3,4-epoxycyclohexyl) methyl (meth) acrylate, and (meth). Examples thereof include alicyclic epoxy derivatives of acrylic acid.
Among them, glycidyl (meth) acrylate is preferable because it is most widely used.

Further, the particularly preferable range of the compounding amount of the component (a) is 60 to 100 mol%, and in this range, particularly excellent solder heat resistance and electrolytic corrosion resistance are exhibited. The component (b) may be any ethylenically unsaturated monomer that is copolymerizable with the component (a), and is used in combination as necessary for the adjustment of photocurability and the physical properties of the cured film, and its blending. The amount is 0 to 60 mol%. Examples of this component include methyl (meth)
Acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate,
Isobutyl (meth) acrylate, tert-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, n-
Decyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate,
A straight-chain, branched or alicyclic (meth) acrylate such as stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, etc. (however, some unsaturated bonds may be present in the ring) Acrylic ester, hydroxyethyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, diethylene glycol mono (meth) acrylate, triethylene glycol mono (meth) acrylate, methoxydiethylene glycol mono (meth) acrylate, etc. Ethylene glycol ester-based (meth) acrylate, and similar propylene glycol-based (meth) acrylate, butylene glycol-based mono (meth)
Acrylate, glycerol mono (meth) acrylate, etc., and aromatic (meth) acrylates such as benzyl (meth) acrylate, and (meth) acrylamide,
(Meth) acrylamide compounds such as N-methyl (meth) acrylamide, N-propyl (meth) acrylamide, N-tert-butyl (meth) acrylamide, N-tert-octyl (meth) acrylamide, diacetone (meth) acrylamide, And vinylpyrrolidone,
(Meth) acrylonitrile, vinyl acetate, styrene, α
-Methylstyrene, vinyl ether and the like can be mentioned, and these can be used alone or in combination. Among them, linear or branched aliphatic or alicyclic (provided that a partially unsaturated bond may be present in the ring) (meth)
Acrylic acid ester, hydroxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate,
Glycerol mono (meth) acrylate is particularly preferable in that it is easy to control the hardness and oiliness of the coating film of the ultraviolet curable resin and the hardness of the resist finally formed.

The above polymer can be obtained by a known polymerization method such as solution polymerization or emulsion polymerization. The case of using solution polymerization will be described, for example, in the above (a).
A method of adding a polymerization initiator to a mixture of an ethylenically unsaturated monomer consisting of the component and, if necessary, the component (b) in a suitable organic solvent and heating and stirring under a nitrogen stream, an organic solvent and ethylene. Polymerization is carried out by a method of polymerizing a polymerizable unsaturated monomer or the like under reflux conditions.

Examples of the organic solvent include ketones such as methyl ethyl ketone and cyclohexanone, aromatic hydrocarbons such as toluene and xylene, and ethyl acetate.
Examples thereof include butyl acetate, cellosolve acetate, butyl cellosolve acetate, butyl carbitol acetate, acetic acid esters such as propylene glycol monomethyl ether acetate, and dialkyl glycol ethers. These can be used alone or in combination.

Examples of the polymerization initiator for the above-mentioned polymerization include hydroperoxides such as diisopropylbenzene hydroperoxide, cumene hydroperoxide, tert-butyl hydroperoxide,
And dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di- (tert-butylperoxy) -hexane, 1,3-bis- (ter
t-butylperoxyisopropyl) -benzene, te
rt-Butyl cumyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di-
(Tert-butylperoxy) -hexyne-3 and diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, lauroyl peroxide, benzoyl peroxide, acetyl peroxide, and ketone peroxides Methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, acetylacetone peroxide, and alkyl peresters of tert-butyl peroxybibalate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxy -3,5,5-trimethyl hexaate, tert-butyl peroxyacetate, tert-butyl peroxybenzoate,
And peroxydicarbonates diisopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, diisopropyl peroxydicarbonate, di-sec-butyl peroxydicarbonate, and azobisisobutyronitrile as azo compounds , Methyl 2,2'-azobisisobutyrate, azobiscyanovaleronitrile, 1,1'-azobis (cyclohexene-1-carbonitrile), 2,2'-azobis {2-
Methyl-N- (2-hydroxyethyl) -propionamide} and the like. A redox type initiator may be used as the polymerization initiator.

The molecular weight of the above polymer is required to be in the range corresponding to the required molecular weight of the ultraviolet curable resin obtained by using the polymer. Polymerization may be carried out using a known chain transfer agent or the like in order to control the molecular weight. The amount of the ethylenically unsaturated monomer having only one carboxyl group added to the above-mentioned polymer must be 0.7 to 1.2 chemical equivalents with respect to one epoxy equivalent of the polymer. Is. If the above-mentioned compounding amount is less than 0.7 chemical equivalent, too many epoxy groups remain in the ultraviolet curable resin, and the developability after exposure is likely to decrease due to curing during pre-cure, and this is 1.2 chemical equivalent. If it exceeds, there remains a problem that the ethylenically unsaturated monomer having only one unreacted carboxyl group remains. Examples of the ethylenically unsaturated monomer having only one carboxyl group include (meth) acrylic acid,
Crotonic acid, cinnamic acid and the like can be mentioned, and at least one of them can be selected and used, but in particular, it is excellent in photoreactivity of the ethylenically unsaturated group introduced by (meth) acrylic acid. It is preferable to use (meth) acrylic acid as the unsaturated monocarboxylic acid.

Examples of the saturated or unsaturated polybasic acid anhydrides include succinic anhydride, methylsuccinic anhydride, maleic anhydride, citraconic anhydride, glutaric anhydride, itaconic anhydride, phthalic anhydride and tetrahydrophthalic anhydride. Acid, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride, 3
-Propyltetrahydrophthalic anhydride, 4-propyltetrahydrophthalic anhydride, 3-butyltetrahydrophthalic anhydride, 4-butyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydro Phthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, 3-propylhexahydrophthalic anhydride, 4-propylhexahydrophthalic anhydride, 3-butylhexahydrophthalic anhydride and 4 -Butylhexahydrophthalic anhydride, dibasic acid anhydride such as methyl nadic acid anhydride, trimellitic anhydride, pyromellitic anhydride,
Examples thereof include tribasic acid or more acid anhydrides such as benzophenone tetracarboxylic acid anhydride and methylcyclohexene tetracarboxylic acid anhydride.

The acid anhydride gives an acid value to the UV-curable resin, and is an aqueous solution of an inorganic basic substance such as caustic soda, caustic potash, sodium metasilicate, or an organic basic substance such as alkylamine or alkanolamine. A hydrophilic solvent solution or a mixed solvent solution thereof, or the like, that is, an alkaline solution or a dilute alkaline solution is used for the main purpose of providing redispersion and resolubility. The blending amount is preferably selected so that the acid value of the ultraviolet curable resin is in the range of 25 to 150. Acid value is 25
If the amount is less than 150, the developability is poor. If the amount is more than 150, the residual carboxyl groups in the resist after heat curing cause a problem of deterioration in electrical properties, electrolytic corrosion resistance, water resistance and the like. Is a drawback that cannot be ignored. The optimum effect is obtained especially when the acid value is 40 to 100.

The addition reaction of the ethylenically unsaturated monomer having only one carboxyl group and the saturated or unsaturated polybasic acid anhydride can be carried out by a known method. For example, the addition reaction of (meth) acrylic acid is carried out by adding a thermal polymerization inhibitor such as hydroquinone or hydroquinone monomethyl ether, and a tertiary amine such as benzyldimethylamine or triethylamine to a solvent solution of the above polymer.
And a quaternary ammonium salt such as trimethylbenzylammonium chloride or methyltriethylammonium chloride, or a catalyst such as triphenylstibine, and according to a conventional method, preferably 60 to 150 ° C., particularly preferably 80 to 120 ° C. The reaction may be carried out at the reaction temperature. The addition reaction of the saturated or unsaturated polybasic acid anhydride can be performed in the same manner as above.

The UV-curable resin preferably has a weight average molecular weight of 3,000 to 100,000. That is, in order to achieve high sensitivity and high resolution, which is one of the objects of the present invention, it is necessary that the solubility of the ultraviolet curable resin in a dilute alkali solution is sharply changed by exposure. When a UV curable resin having an average molecular weight of more than 100,000 is used, the resist ink has low solubility in a dilute alkali solution even at an extremely low exposure amount, but has a margin of solubility in an alkali aqueous solution even in an unexposed state. However, the removability at the time of development is deteriorated even by curing due to slight light leakage at the boundary portion of the negative mask attached at the time of exposure. Therefore, in this case, the solubility change due to exposure is not sharp enough, and the resolution is likely to be insufficient although the sensitivity is apparently high. On the other hand, the weight average molecular weight is 30
If it is less than 00, the sensitivity tends to be insufficient. As for the combination with the above-mentioned amount of glycidyl (meth) acrylate, the UV-curable resin has a weight average molecular weight of 5,000 to 5,000.
30,000, and the glycidyl (meth) acrylate is 60 to 100 relative to the total amount of ethylenically unsaturated monomers.
When it is in the range of mol%, the optimum effect having both high sensitivity and high resolution can be obtained.

The epoxy resin composition of the present invention is prepared by mixing the chain-extended epoxy resin A and the ultraviolet curable resin B by a known method. In this case, the chain-extended epoxy resin A can be prepared in a proportion of 10 to 90% by weight, and the ultraviolet curable resin B can be prepared in a proportion of 10 to 90% by weight. The epoxy resin composition of the present invention can also be used as an etching resist ink by not applying a post-curing treatment by heat. Further, the epoxy resin composition of the present invention is used for forming a color filter protective film, for example, an azo lake-based, insoluble azo-based or phthalocyanine-based organic pigment, and miloli blue, iron oxide, a cobalt-based inorganic pigment and oil. By selecting an appropriate pigment or dye such as a soluble dye, a basic dye or a disperse dye as a colorant, it can be used as a composition for forming a color filter image element. further,
The epoxy resin composition of the present invention can also be used as a photosensitive resin composition for hologram production, optical three-dimensional modeling, flat coil production of micromotors, micromachine parts or micromachine production. .

Further, the ultraviolet curable resin B used in the present invention
Can be used alone or in combination, but when used as a resist ink, the total blending amount ensures good sensitivity and working characteristics of the ink and good physical properties of the resist finally formed. Therefore, it is desirable that the amount is 10 to 80% by weight with respect to the total amount of the resist ink components excluding the organic solvent in the diluent that is simultaneously mixed. When the compounding amount of the ultraviolet curable resin is less than 10% by weight with respect to the total amount of the resist ink components, the amount of the ultraviolet curable resin is too small, and good developability and resolution of the solder resist ink can be obtained. Further, when the compounding amount of the ultraviolet curable resin exceeds 80% by weight, the amount of the epoxy compound which is thermally cured becomes small, and the film strength, hardness, chemical resistance, gold plating resistance and electrolytic corrosion resistance of the solder resist are reduced. It becomes difficult to achieve improvement of the sex and the like.

<C. Photopolymerization Initiator> Examples of the photopolymerization initiator that initiates the reaction of the ultraviolet curable resin B include benzoin, benzoin methyl ether,
Benzoin and its alkyl ethers such as benzoin ethyl ether and benzoin isopropyl ether, and acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1- Acetophenones such as hydroxycyclohexyl phenyl ketone, anthraquinones such as 2-methylanthraquinone and 2-amylanthraquinone, and 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone , Thioxanthones such as 1-chloro-4-propoxythioxanthone, ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal, and benzophenone Non, 3,3-dimethyl-4-methoxybenzophenone, 3,3 ', 4,4'-tetra -
Benzophenones or xanthones such as (tert-butylperoxylcarbonyl) benzophenone and 4-benzoyl-4′-methyldiphenylsulfide, and 2
-Methyl-1- [4- (methylthio) phenyl] -2-
Morpholino-propan-1-one, 2-benzoyl-
Those containing a nitrogen atom such as 2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,4,4′-bis-diethylaminobenzophenone;
6-trimethylbenzoyldiphenylphosphine oxide and the like, which are benzoic acid-based or tertiary amine-based such as p-dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ester, 2-dimethylaminoethylbenzoate, etc. The known photopolymerization accelerator and sensitizer may be used in combination. These photopolymerization initiators are blended individually or in combination with each other as appropriate.

For example, a combination of an imidazolyl dimer and a cyclic ketone having an aminophenyl group, a combination of a polycyclic quinone and a tertiary amine or a merocyanine and a triazine derivative, a photoinitiator such as a borate complex of a cationic dye, a sensitizer, etc. The resist ink of the present invention can be appropriately selected and made curable with visible light or near-infrared rays, but includes those using these as long as it has ultraviolet curability. The photoinitiator and the like are particularly useful for a laser exposure method using visible light and near infrared rays.

The amount of the photopolymerization initiator in the resist ink is the total amount of the ink components excluding the organic solvent in the diluent that is simultaneously added in order to obtain a good balance between the photocurability and the physical properties of the resulting resist. For 0.1-30
It is desirable that the content is wt%. If the blending amount of the photopolymerization initiator is less than 0.1% by weight, the ultraviolet curable resin cannot be sufficiently polymerized, leading to a decrease in chemical resistance and heat resistance,
On the other hand, if the amount of the photopolymerization initiator compounded exceeds 30% by weight, the amount of unnecessary photopolymerization initiators that do not contribute to the reaction increases and it becomes wasteful.

<D. About diluent> As a diluent,
The photopolymerizable monomer or the organic solvent can be used alone or in combination. As the photopolymerizable monomer, for example,
2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, N-vinylpyrrolidone, (meth) acryloylmorpholine, methoxytetraethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, polyethylene glycol di (Meth) acrylate, N, N
-Dimethyl (meth) acrylamide, N-methylol (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide, N, N-dimethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylate , Water-soluble or hydrophilic monomers such as melamine (meth) acrylate, and diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, tripropylene glycol di (meth) Acrylate, phenoxyethyl (meth)
Acrylate, tetrahydrofurfuryl (meth) acrylate, cyclohexyl (meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, Dipentaerythritol penta (meth) acrylate, Dipentaerythritol hexa (meth) acrylate, Isobornyl (meth)
Acrylate, cyclopentanyl (mono or di) (meth) acrylate, cyclopentenyl (mono or di)
(Meth) acrylate and water-insoluble monomers such as mono-, di-, tri- or higher polyesters of polybasic acid and hydroxyalkyl (meth) acrylate, and polyester (meth) acrylate, urethane (meth) Examples thereof include (meth) acrylate monomers such as acrylate. The above-mentioned monomers such as water-soluble and hydrophilic monomers and water-insoluble monomers can be used alone or in appropriate combination with each other.

Examples of the organic solvent include linear, branched, secondary or polyhydric alcohols such as ethanol, propyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl alcohol, 2-butyl alcohol, hexanol and ethylene glycol. , And ketones such as methyl ethyl ketone and cyclohexanone, and aromatic hydrocarbons such as toluene and xylene, and petroleum-based aromatic mixtures such as Swazol series (Maruzen Oil Co., Ltd.) and Solvesso series (Exxon Chemical Co.) Solvents and cellosolves such as cellosolve and butyl cellosolve, carbitols such as carbitol and butyl carbitol, and propylene glycol alkyl ethers such as propylene glycol methyl ether, and dipropylene glycol methyl Polypropylene glycol alkyl ethers such as ether, and ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, butyl carbitol acetate, acetic acid esters such as propylene glycol monomethyl ether acetate, and dialkyl glycol ethers, and the like.

The photopolymerizable monomer such as the hydrophilic monomer and the water-insoluble monomer is diluted with the polymer component and the like to make it easy to apply and adjust the acid value to adjust the photopolymerizable property. give. Further, the above organic solvent dissolves and dilutes the polymer component and the like to make it applicable as a liquid, and also forms a film by drying.
A component having photopolymerizability such as a photopolymerizable monomer as the diluent does not necessarily have to be blended in the resist ink, but the total amount in the case of blending is an organic solvent similarly blended as the diluent. It is desirable that the amount is 50% by weight or less with respect to the total amount of the ink components excluding. If it is blended in an amount of more than 50% by weight, the surface tackiness of the dry coating film becomes too strong, and the negative mask on which the pattern is drawn is directly applied to the surface of the dried coating film and exposed to light so that the negative mask is not stained. Prone to problems.

On the other hand, the organic solvent used as a diluent in the same manner as the above-mentioned photopolymerizable monomer is blended alone or in a mixture of two or more kinds, and this component is rapidly volatilized at the time of pre-cure to form a dry coating film. You need to choose not to survive. The amount of the organic solvent blended in the resist ink is preferably 5% or more with respect to the total amount of the ink components, and if it is less than this, it becomes difficult to apply the ink. In addition, since the suitable blending amount varies depending on the coating method, it is necessary to appropriately adjust it according to the coating method.

In addition to the above-mentioned components, the photosolder resist ink of the present invention contains, for example, tolylene diisocyanate, morpholine diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate-based blocked blocked with caprolactam, oxime, malonate, etc. Isocyanates, thermosetting components such as n-butylated melamine resins, isobutylated melamine resins, butylated urea resins, butylated melamine urea co-condensation resins, benzoguanamine-based co-condensation resins and other amino resins, and UV-curable epoxy acrylates. For example, bisphenol A type, phenol novolac type, cresol novolac type, alicyclic epoxy resin to which (meth) acrylic acid is added, or further maleic anhydride, succinic anhydride, or italic anhydride. Acid, phthalic anhydride, tetrahydrophthalic anhydride, and other saturated or unsaturated polybasic acid anhydrides added, and copolymers of maleic anhydride and other ethylenically unsaturated monomers with hydroxyalkyl (meth )
Ultraviolet curable polymer obtained by reacting (meth) acrylate having acrylate or epoxy group and copolymer of ethylenically unsaturated compound such as styrene- (meth) acrylic acid- (meth) acrylic acid ester copolymer Or a UV-curable polymer obtained by further reacting these with an ethylenically unsaturated monomer having an epoxy group, and vinyl having an ethylenically unsaturated monomer having an epoxy group as one of the monomer units A UV-curable polymer to which (meth) acrylic acid is added, and a polymer compound such as styrene-maleic acid resin, diallyl phthalate resin, phenoxy resin, melamine resin, urethane resin, or fluororesin may be added to the copolymer. it can.

The resist ink may contain an epoxy resin curing agent such as an imidazole derivative, a polyamine, a guanamine, a tertiary amine, a quaternary ammonium salt, a polyphenol, or a polybasic acid anhydride, if necessary. And curing accelerators, and fillers and colorants such as barium sulfate, silicon oxide, talc, clay, and calcium carbonate, leveling agents such as silicone and acrylate copolymers, fluorochemical surfactants, and silane coupling agents. Adhesion imparting agents such as Aerosil, thixotropic agents such as Aerosil, and polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butyl catechol, phenothiazine, antihalation agents, flame retardants, defoaming agents, antioxidants, etc. Interface for improving various additives and dispersion stability Sex polymeric dispersant or the like may be further added.

The resist ink of the present invention is prepared, for example, by a known kneading method in which each compounding component, additive and the like are used using a three-roll, ball mill, sand mill and the like. In that case, a part of the components A to D, for example, a part of the D component and the A component are mixed and dispersed in advance, and apart from this, a part of the B, C and D components are previously prepared. A method of mixing and dispersing, and mixing and preparing so that the composition of the resist ink of the present invention is obtained at the time of use, may be adopted.

A printed wiring board is prepared by forming a predetermined solder resist pattern on a printed wiring board manufacturing substrate by a conventional method using the photo solder resist ink developable with a dilute alkaline solution obtained as described above. It can be manufactured. The manufacturing method is, for example, as described above. (1) A photo solder resist ink is immersed in a printed wiring board manufacturing substrate 1 having a conductor pattern 5 formed on its surface in advance, a dipping method, a spray method, a spin coater, a roll coater, A coating process of applying a method such as a curtain coater or screen printing to form the photo solder resist ink layer 2 on the surface of the substrate; (see FIG. 7A). (2) Photo solder resist ink formed in the coating process A pre-cure step of forming a dry coating film 3 on the surface of the printed wiring board manufacturing substrate 1 by heating and pre-curing the layer 2 (see FIG. 7 (b)). (3) Pre-cure step for printed wiring board manufacturing Board 2
A mask 4 made of polyethylene terephthalate (PET) or the like is brought into close contact with the surface of the dry coating film 3 formed on the surface of the substrate by a method such as vacuum adhesion, and the dry coating film 3 is irradiated with ultraviolet rays from the mask 4 side, An exposure step of selectively exposing the dry coating film 3 in accordance with the pattern of the mask 4;
(See (c)) (4) After the mask 4 is peeled off from the dry coating film 3 and removed, in the dry coating film 3 after the exposure step, the selectively unexposed portion 8 is treated with an alkaline solution. Development step (see FIG. 7D) for forming a pattern of the dry coating film 3 that has been removed and cured by exposure, and (5) Dry coating film 3 on the surface of the printed wiring board manufacturing substrate 1 formed in the development step. Post-baking step of hardening the pattern of to form the solder resist 6 (FIG. 7E).
See)).

In the coating step (1), the coating amount of the photo solder resist ink is 10 to 200 g / m.
Can be set to ² . In the precure step (2), the heating temperature can be set to 40 to 120 ° C and the heating time can be set to 5 to 90 minutes. In addition, (3) above
In the exposure step, the preferable range of the exposure amount is 10 to 1000 mJ / cm ² on the surface of the resist ink.
When it is lower than 10 mJ / cm ^{2, the} resist pattern is likely to be insufficiently formed due to insufficient photocuring reaction. Further, even if it exceeds 1000 mJ / cm ² , it is often difficult to obtain a more effective photocuring reaction. That is, unnecessary curing is apt to occur in the fine pattern portion and a resolution defect is likely to occur, and a so-called back exposure problem is likely to occur in the production of a double-sided printed wiring board made of a glass epoxy substrate. The ink of the present invention shows good properties even when forming a thick film resist, but when forming a resist having an extremely large film thickness such that the resist film thickness exceeds 200 μm, the curing depth is particularly high. In some cases, it may be better for the exposure amount to exceed 1000 mJ / cm ² in order to secure
In such a case, it is preferable to select the exposure amount according to the resist film thickness.

Further, in the developing step (4), examples of the alkaline solution which can be used include sodium carbonate aqueous solution and potassium carbonate aqueous solution, and the concentration thereof is set to 0.1 to 5% by weight. You can In the post-baking step (5), the heating temperature is 12
The heating time can be set to 0 to 180 ° C. and the heating time can be set to 10 to 100 minutes.

Although FIG. 7 and (1) to (5) above describe the case of a single-sided printed wiring board, the above (1)
A double-sided printed wiring board can also be manufactured by simultaneously performing steps (5) to (5) on both surfaces of the printed wiring board manufacturing substrate 1 (using a double-sided simultaneous exposure machine in the exposure step (3) above). You can In addition, for example, when forming a thick film resist, the dry coating film 3 having a predetermined film thickness is formed by repeating the coating step (1) and the precure (drying) step (2) several times before forming the thick film resist. The steps (3) to (5) are performed.

[0060]

EXAMPLES The present invention will be described below based on examples, but the present invention is not limited thereto. In addition,
All "parts" and "%" used below are based on weight unless otherwise specified. Also, "weight average molecular weight"
Is measured by GPC based on the following measurement conditions.

A THF solution was prepared so that each sample had a solid content of 10 mg / ml, and each sample was measured with an injection amount of 100 μl. Measuring conditions GPC measuring device: Showa Denko's SHODEX SYSTEM 11 column: SHODEX KF-800P, KF-005, KF-003 and KF-001 four serially moving layers: THF flow rate: 1 ml / min Column temperature: 45 [Deg.] C. Detector: RI conversion: polystyrene [Example 1] In a four-necked flask equipped with a reflux condenser, a thermometer, and a stirrer, "Epiclon N-680" (trade name, manufactured by Dainippon Ink and Chemicals, Inc. Cresol novolac type epoxy resin Among the peaks of epoxy equivalent 214 / GPC, 300 parts of the peak having the largest molecular weight and the largest area, weight average molecular weight 3200) was dissolved in 100 parts of carbitol acetate by heating and stirred. Below, 8 parts of 2,4-tolylene diisocyanate, 0.04 parts of dibutyltin dilaurate For example, in a conventional manner 70-8
The reaction was carried out at 0 ° C for 5 hours. Add "Swasol 1" to this reaction mixture.
500 "(trade name, an aromatic solvent manufactured by Maruzen Petrochemical Co., Ltd.) and 22 parts of dipropylene glycol monomethyl ether were added, and the mixture was stirred and cooled to obtain an epoxy resin 70.
% Solution (70% epoxy resin (A-1) solution) was obtained.
The infrared absorption spectrum of this solution confirmed that absorption by the isocyanate group at 2270 cm ^-1 had disappeared and that 2,4-tolylene diisocyanate had reacted quantitatively.

The solvent of the above solution was removed to obtain a product (epoxy resin (A-1)). Epoxy resin (A-1)
Is shown in FIG. 1, and the infrared absorption spectrum of the epoxy resin (A-1) is shown in FIG. Epoxy resin (A
-1) GPC peak 1 has a weight average molecular weight of 16000
Met. In addition, the measurement of GPC was performed under the above conditions in all of the following synthesis examples, and the infrared absorption spectrum of the product was measured by the KBr method.

Example 2 Instead of the epoxy compound, Epiclon N-680, "Epiclone N-865" (trade name, within the peak of bisphenol A-novolac type epoxy resin / GPC manufactured by Dainippon Ink and Chemicals, Inc.) , The weight average molecular weight of the peak having the largest molecular weight and the maximum area of 7500) is 300 parts, and 10 parts of isophorone diisocyanate is used instead of 2,4-tolylene diisocyanate.
A 70% epoxy resin solution (70% epoxy resin (A-2) solution) was obtained in the same manner as in Synthesis Example 1 except that 1 part was used. The infrared absorption spectrum of this solution is 2260
It was confirmed that the absorption by the isocyanate group at cm ^-1 had disappeared and that isophorone diisocyanate had reacted quantitatively.

The solvent of the above solution was removed to obtain a product (epoxy resin (A-2)). Epoxy resin (A-2)
Is shown in FIG. 3, and the infrared absorption spectrum of the epoxy resin (A-2) is shown in FIG. Epoxy resin (A
-2) GPC peak 1 has a weight average molecular weight of 26000
Met. [Example 3] Instead of the epoxy compound, Epiclon N-680, "Epiclone N-770" (trade name, phenol novolac type epoxy resin manufactured by Dainippon Ink and Chemicals Incorporated / GPC, having the highest molecular weight) And the weight average molecular weight of the peak having the largest area 1000
0) A 70% epoxy resin solution (70% epoxy resin (A-3) solution) was obtained in the same manner as in Synthesis Example 1 except that 300 parts was used. The infrared absorption spectrum of this solution confirmed that absorption by the isocyanate group at 2270 cm ^-1 had disappeared and that 2,4-tolylene diisocyanate had reacted quantitatively.

The solvent of the above solution was removed to obtain a product (epoxy resin (A-3)). Epoxy resin (A-3)
Is shown in FIG. 5, and the infrared absorption spectrum of the epoxy resin (A-3) is shown in FIG. Epoxy resin (A
-3) GPC peak 1 has a weight average molecular weight of 27,000.
Met. [Synthesis Example 1] 70 parts of glycidyl methacrylate and 10 parts of methyl methacrylate were placed in a four-necked flask equipped with a reflux condenser, a thermometer, a glass tube for nitrogen substitution and a stirrer.
tert-butyl methacrylate 20 parts, carbitol acetate 100 parts, lauryl mercaptan 0.3 parts,
3 parts of azobisisobutyronitrile was added, and the mixture was heated under a nitrogen stream and polymerized at 75 ° C. for 5 hours to obtain a 50% copolymer solution.

Hydroquinone (0.05 parts), acrylic acid (37 parts) and dimethylbenzylamine (0.2 parts) were added to the above 50% copolymer solution, and addition reaction was carried out at 105 ° C. for 24 hours, followed by tetrahydrophthalic anhydride (38). Parts and 72 parts of carbitol acetate were added and reacted at 100 ° C. for 3 hours to obtain a 50% UV curable resin solution (B-1) having a weight average molecular weight of 22,000.

Reference Example 1 "Epiclon N-680"
(Trade name, cresol novolac type epoxy resin manufactured by Dainippon Ink and Chemicals, Inc., epoxy equivalent 214) 214
Parts dissolved in 60 parts of carbitol acetate by heating, 74 parts of acrylic acid and 0.1 parts of hydroquinone with stirring.
And benzyldimethylamine (0.7 part) were added, and the mixture was reacted at 90 to 100 ° C. for 24 hours by a conventional method. 95 parts of carbitol acetate was added to this reaction solution, and the mixture was stirred and cooled to obtain a 65% epoxy acrylate solution. [Example 4] 70% epoxy resin (A-
1) 12 parts of the solution and 50 parts of the 50% UV curable resin solution (B-1) of Synthesis Example 1 were mixed with stirring to obtain an epoxy resin composition. [Example 5] 70% epoxy resin (A-
2) 12 parts of the solution and 50 parts of the 50% UV curable resin solution (B-1) of Synthesis Example 1 were stirred and mixed to obtain an epoxy resin composition. [Example 6] 70% epoxy resin (A-
3) 12 parts of the solution and 50 parts of the 50% UV curable resin solution (B-1) of Synthesis Example 1 were mixed with stirring to obtain an epoxy resin composition.

[Examples 7 to 10 and Comparative Examples 1 to 3]
The compounding components of each compounding composition (units are parts by weight) shown in Table 1 were kneaded with a three-roll mill to obtain liquid photosolder resist inks developable with dilute alkaline solutions of Examples and Comparative Examples.

[0069]

[Table 1]

(Note 1) "YX 4000" (trade name)
Is an epoxy compound manufactured by Yuka Shell Epoxy Co., Ltd. having an epoxy equivalent of 195. (Note 2) "TEPIC-S" (trade name) is an epoxy resin with an epoxy equivalent of 100 manufactured by Nissan Chemical Industries, Ltd. (Note 3) "Irgacure 907" (trade name) is a photopolymerization initiator manufactured by Ciba Geigy. (Note 4) “Kayakyu DETX-S” (trade name) is a photopolymerization initiator manufactured by Nippon Kayaku Co., Ltd. (Note 5) “Modaflow” (trade name) is a leveling agent manufactured by Monsanto.

The performance of each resist ink and the printed wiring board on which a solder resist was finally formed by the resist ink was evaluated by the following test methods, and the test results are shown in Table 2. [Performance Evaluation of Resist Ink] -Surface Adhesiveness-The resist ink is applied by screen printing on the entire surface of a copper-clad laminate made of a glass epoxy base material of a copper foil having a thickness of 35 μm, and dried at 80 ° C. to volatilize the solvent. Time 1
Pre-cure under each drying condition for 0, 20 and 30 minutes,
Three types of test pieces having a dry coating film thickness of 20 μm were prepared for each ink. After that, ORCHMW201G
Apply a mask with a pattern drawn with X (vacuum contact type double-sided exposure machine manufactured by Oak Manufacturing Co., Ltd.) directly on the surface of the dry coating film and bring it into vacuum contact, irradiate with ultraviolet rays of 150 mJ / cm ² , and then under each drying condition. The degree of sticking when removing was observed.

The evaluation method is as follows. X: It was difficult to remove the mask, and the mask pattern was damaged when it was forcibly removed. (Triangle | delta): After the mask was removed, the sticking mark of the mask was recognized on the dry coating film. ◯: The mask could be easily removed, and there was no sticking mark. -Precure permissible width (precure time permissible width) -A resist ink is applied by screen printing on the entire surface of a copper-clad laminate made of a glass epoxy base material of a copper foil having a thickness of 35 µm, and a drying time at 80 ° C for volatilizing the solvent. 1
Precure was performed under each drying condition of 0, 20, 30, 40, 50, 60, 70, and 80 minutes, and eight kinds of test pieces having a dried coating film with a film thickness of 20 μm were prepared for each ink. After that, a patterned mask is directly applied to the surface of the dry coating film to bring it into close contact with the resist film, and the resist film is irradiated with ultraviolet rays of an optimum exposure amount, and then developed by developing a 1% sodium carbonate aqueous solution as a developing solution. And the state of pattern formation of the dry coating film cured by exposure and exposure was observed.

The evaluation method is as follows. X: The unexposed portion was also difficult to remove by development, and pattern formation was impossible. Δ: It took a long time to develop the unexposed area, and it was impossible to form a pattern in a fine pattern area. ◯: The unexposed area was easily developed, and a sharp pattern could be obtained. -Residual Step-The resist ink is applied by screen printing on the entire surface of a copper-clad laminate made of a glass-epoxy base material of copper foil having a thickness of 35 µm, and dried at 80 ° C for 20 hours to evaporate the solvent.
Precure was performed under a drying condition of a minute to prepare a test piece having a dry coating film with a film thickness of 20 μm for each ink. After that, with ORC HMW201GX (vacuum contact double-sided exposure machine manufactured by Oak Manufacturing Co., Ltd.), step tablet PHOT
EC21 step (exposure test mask manufactured by Hitachi Chemical Co., Ltd.)
Directly on the dry coating film and press-contacting under reduced pressure.
Irradiate with 0 and 150 mJ / cm ² of UV light, then 1%
By developing with an aqueous solution of sodium carbonate as a developing solution, the number of remaining steps after development was determined and used as a measure of exposure sensitivity.

[Evaluation of Performance of Printed Wiring Board] Next, in order to confirm the performance of the printed wiring board manufactured by each resist ink, test pieces were sequentially prepared by going through the following steps (1) to (5). did. (1) <Coating process> A printed wiring board manufacturing substrate 1 in which a liquid photosolder resist ink is preliminarily etched on a copper clad laminate made of a glass epoxy base material of a copper foil having a thickness of 35 μm to form a conductor pattern 5. Was applied by screen printing to form a resist ink layer 2 on the surface (upper surface) of the substrate 1. (2) <Precure process> After the coating process, 8 to evaporate the solvent in the resist ink layer 2 on the surface of the substrate 1
Precure was performed for 20 minutes at 0 ° C. to obtain a dry coating film 3 having a film thickness of 20 μm. (3) <Exposure step> After that, the patterned mask 4 is directly applied to the surface of the dry coating film 3, and each resist ink is irradiated with ultraviolet rays of 150 mJ / cm ^{2 to} expose the surface of the substrate 1. The dry coating film 3 of No. 3 was selectively exposed. (4) <Developing step> In the dry coating film 3 after the exposing step, the portion which is not exposed selectively has a concentration of 1% by weight.
Of the aqueous solution of sodium carbonate described above is removed by developing, and the exposed surface of the substrate 1 is dried and cured.
Pattern was formed. (5) <Post-baking step> The printed wiring board manufacturing substrate 1 on which the pattern of the exposure-cured dry coating film 3 obtained in the developing step is formed is heated at 150 ° C. for 30 minutes to dry the coating film 3. Was cured to form a solder resist 6 to obtain a test piece.

The following evaluations were performed on the test pieces obtained in the above steps. —Resolution— The pattern formation state of the solder resist 6 formed by the mask pattern composed of concentric circles having a line width and a line interval of 40 μm was observed. The evaluation method is as follows. X: No pattern was formed. Δ: Although the pattern was formed for the time being, part of it was missing. ◯: A sharp pattern could be obtained. -Solder heat resistance-LONCO 3355-11 (water-soluble flux manufactured by London Chemical Co., Ltd.) is used as a flux, and the test piece is first coated with the flux, and then this is applied at 260 ° C.
After immersing in the molten solder bath for 10 seconds (the number of times of immersion is 1 and 5 times) and washing with water, the degree of surface whitening was observed. In addition, a cellophane adhesive tape peeling test by cross-cut was performed in accordance with JIS D 0202, and a change in adhesion state was observed.

The evaluation method of surface whitening is as follows. X: Remarkably whitened. B: Slight whitening was observed. ◯: No abnormality occurred. The evaluation method of adhesion is as follows. X: Blistering or peeling of the resist occurred without performing a cross-cut test. Δ: Partial peeling occurred in the cross-cut portion during tape peeling. ◯: Peeling of the cross cut portion did not occur. -Other test items-Pencil hardness was measured according to JIS K 5400, and the others were evaluated by a conventional method.

[0077]

[Table 2]

[0078]

As described above, in the invention according to claim 1 of the present invention, since the novolac type epoxy resin is chain-extended with the compound having two or more isocyanate groups in one molecule, the photo solder is used. UV-curable resin component having a carboxyl group in the resist ink, exhibit incompatibility at a fine level, to the extent that it is difficult to react with the UV-curable resin component under the precure conditions of the photo solder resist ink, It can be in a clear phase-separated state with the UV-curable resin component, has a wide range of pre-cure and can be stored for a long period of time, has good dryness to the touch after pre-cure, and has excellent resolution and It is possible to obtain a photo solder resist ink having sensitivity.

In the invention according to claim 2 of the present invention, the novolac type epoxy resin is a phenol novolac type epoxy resin, a cresol novolac type epoxy resin or a bisphenol A-novolac type epoxy resin, and therefore the chain extended epoxy resin is used. Since the epoxy compound in (1) is a novolac type epoxy resin, a chain-extended epoxy resin can be obtained with a low epoxy equivalent and a large molecular weight, and can be sufficiently cured during post-baking.

The invention according to claim 3 of the present invention comprises the chain-extended epoxy resin according to claim 1 or 2, 40 to 100 mol% of an ethylenically unsaturated monomer having an epoxy group, and the epoxy resin. A polymer comprising 0 to 60 mol% of another copolymerizable ethylenically unsaturated monomer has only one carboxyl group of 0.7 to 1.2 chemical equivalents per 1 epoxy equivalent of the polymer. It contains an ethylenically unsaturated monomer and a UV-curable resin obtained by reacting a saturated or unsaturated polybasic acid anhydride, so it has good dryability to the touch after pre-cure and a wide range of pre-cure. Therefore, it is possible to store the printed wiring board manufacturing substrate after pre-cure for a long period of time, and to prepare a photo solder resist ink having excellent resolution and sensitivity.

Further, in the invention described in claim 4 of the present invention, the epoxy resin composition according to claim 3 is mixed with a photopolymerization initiator and a diluent, so that the dryness to the touch after pre-cure is obtained. Since it is good and has a wide pre-cure allowance, it can be stored for a long period of time after the pre-cure, and has excellent resolution and sensitivity. In addition to having excellent adhesion to the substrate, excellent chemical resistance,
It is possible to form a solder resist having electrolytic corrosion resistance and electrical characteristics and particularly excellent solder heat resistance and gold plating resistance.

The invention according to claim 5 of the present invention is most widely used because it contains glycidyl (meth) acrylate as the ethylenically unsaturated monomer having an epoxy group in the ultraviolet curable resin. By using the glycidyl (meth) acrylate described above, the ultraviolet curable resin can be made inexpensive and easy to make.

In the invention according to claim 6 of the present invention, the solder resist is formed on the surface of the printed wiring board manufacturing substrate by curing the photo solder resist ink according to claim 4 or 5. It is possible to increase the adhesiveness between the substrate and the substrate, and to increase the chemical resistance, electrolytic corrosion resistance and electrical characteristics of the solder resist, solder heat resistance, gold plating resistance and the like.

According to a seventh aspect of the present invention, the photosolder resist ink according to the fourth or fifth aspect is applied to the surface of a printed wiring board manufacturing substrate, and the photosolder resist ink is dried by precure. After letting
The desired pattern is exposed and developed, and then the photo solder resist ink is cured to form the solder resist, so the dryness to the touch after pre-curing is good, and the pre-cure allowance range can be widened, and printing after pre-cure is possible. This allows long-term storage of wiring board manufacturing substrates. Further, the adhesiveness between the solder resist and the substrate can be enhanced, and the chemical resistance, electrolytic corrosion resistance and electrical characteristics of the solder resist, solder heat resistance, gold plating resistance and the like can be enhanced.

[Brief description of drawings]

FIG. 1 is a GPC chart of an epoxy resin (A-1) produced in Synthesis Example 1. The peak indicated by the arrow is peak 1, and the scale on the lower side indicates the retention time (unit: minutes).

FIG. 2 is a chart of an infrared absorption spectrum of an epoxy resin (A-1) produced in Synthesis Example 1.

FIG. 3 is a GPC chart of an epoxy resin (A-2) produced in Synthesis Example 2. The peak indicated by the arrow is peak 1, and the scale on the lower side indicates the retention time (unit: minutes).

FIG. 4 is a chart of an infrared absorption spectrum of an epoxy resin (A-2) produced in Synthesis Example 2.

5 is a GPC chart of the epoxy resin (A-3) produced in Synthesis Example 3. FIG. The peak indicated by the arrow is peak 1, and the scale on the lower side indicates the retention time (unit: minutes).

FIG. 6 is a chart of infrared absorption spectrum of an epoxy resin (A-3) produced in Synthesis Example 3.

7A to 7E are process drawings showing a method for manufacturing a printed wiring board according to the present invention.

[Explanation of symbols]

1 substrate 6 Solder resist

Continuation of front page (51) Int.Cl. ⁷ identification code FI C09D 163/10 C09D 163/10 H05K 3/28 H05K 3/28 (56) Reference JP-A-9-235356 (JP, A) JP-A 7-72624 (JP, A) JP-A-7-20631 (JP, A) JP-A-61-243869 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C08G 59/00 -59/72 C09D 11/02-11/14 C09D 135/00-135/08 C09D 163/00-163/10 H05K 3/28

Claims (7)

(57) [Claims] 1. An epoxy resin comprising a novolac type epoxy resin chain-extended with a compound having two or more isocyanate groups in one molecule. 2. The epoxy resin according to claim 1, wherein the novolac type epoxy resin is a phenol novolac type epoxy resin, a cresol novolac type epoxy resin or a bisphenol A-novolac type epoxy resin. 3. A. A chain-extended epoxy resin according to claim 1 or 2, B. A polymer comprising (a) 40 to 100 mol% of an ethylenically unsaturated monomer having an epoxy group and (b) 0 to 60 mol% of another ethylenically unsaturated monomer copolymerizable therewith, Obtained by reacting an ethylenically unsaturated monomer having only one carboxyl group of 0.7 to 1.2 chemical equivalents per epoxy equivalent of the polymer with a saturated or unsaturated polybasic acid anhydride. An epoxy resin composition comprising an ultraviolet curable resin. 4. The epoxy resin composition according to claim 3, wherein C.I. A photopolymerization initiator and D.I. A photo solder resist ink comprising a diluent. 5. B. The epoxy resin composition according to claim 3 or 4, wherein the (a) ethylenically unsaturated monomer having an epoxy group in the ultraviolet curable resin contains glycidyl (meth) acrylate. Photo solder resist ink. 6. A printed wiring board formed by applying the photo solder resist ink according to claim 4 or 5 onto a surface of a printed wiring board manufacturing substrate and curing the same to form a solder resist. 7. The photo solder resist ink according to claim 4 or 5 is applied to the surface of a printed wiring board manufacturing substrate, the photo solder resist ink is dried by pre-cure, and then exposed to a desired pattern. A method for manufacturing a printed wiring board, which comprises developing and then curing a photo solder resist ink to form a solder resist.