JPH01274352A - Ion implantation device - Google Patents
Ion implantation deviceInfo
- Publication number
- JPH01274352A JPH01274352A JP10520688A JP10520688A JPH01274352A JP H01274352 A JPH01274352 A JP H01274352A JP 10520688 A JP10520688 A JP 10520688A JP 10520688 A JP10520688 A JP 10520688A JP H01274352 A JPH01274352 A JP H01274352A
- Authority
- JP
- Japan
- Prior art keywords
- ion beam
- accelerating
- electrode
- ion
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005468 ion implantation Methods 0.000 title claims abstract description 9
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 34
- 230000001133 acceleration Effects 0.000 claims description 14
- 230000000694 effects Effects 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract 2
- 230000002411 adverse Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electron Sources, Ion Sources (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の製造工程において、半導体ウェ
ハーに不純物イオンを入射させて、該ウェハー内に所望
の不純物拡散を行う場合に用いるイオン注入装置に関す
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an ion implantation method used for injecting impurity ions into a semiconductor wafer to diffuse desired impurities into the wafer in the manufacturing process of semiconductor devices. Regarding equipment.
第3図に一般的なイオン注入装置の概略側面図を示す。 FIG. 3 shows a schematic side view of a general ion implantation device.
図において、加速管1内には5個の加速電極2a〜2e
が配置され、電極2a〜2eは加速電麓7から直列分圧
抵抗Rにより分圧されたそれぞれ異なる値の加速電圧が
加えられており、加速管1の左側から入射したイオンビ
ーム8は、各電極2a〜2eによって加速され、それぞ
れの電極の中心孔を通り、さらに、アパーチャー5を通
って成形された後、Qレンズ6に入射する。In the figure, there are five accelerating electrodes 2a to 2e in the accelerating tube 1.
are arranged, and the electrodes 2a to 2e are applied with accelerating voltages of different values divided by the series voltage dividing resistor R from the accelerating voltage foot 7, and the ion beam 8 incident from the left side of the accelerating tube 1 is The light is accelerated by the electrodes 2a to 2e, passes through the center hole of each electrode, and is shaped through the aperture 5, and then enters the Q lens 6.
上述した従来の加速管は、電極の形状が第4図の平面図
に示すような円形のリング4となっているので、イオン
ビームの持つ発散する性質のために、加速管入口に比べ
加速管出口のイオンビーム径が拡大することにより、加
速管出口とQレンズの間にあるアパーチャーにイオンビ
ームが衝突し、その面積比分のイオンビームの損失を引
き起こすことになる。また、その衝突により、ビームラ
インに2次電子等の粒子を放出してイオンビームに悪影
響を及ぼす等によりイオン注入機能を損うという欠点を
有していた。In the conventional acceleration tube described above, the shape of the electrode is a circular ring 4 as shown in the plan view of FIG. 4, so due to the diverging nature of the ion beam, the acceleration tube As the diameter of the ion beam at the exit increases, the ion beam collides with the aperture located between the exit of the accelerating tube and the Q lens, causing a loss of the ion beam corresponding to the area ratio. In addition, the collision has the disadvantage that particles such as secondary electrons are emitted into the beam line, adversely affecting the ion beam and impairing the ion implantation function.
本発明のイオン注入装置の加速管は、収束すべきイオン
ビームの断面形状に対応した、相似形のビーム通過用の
中心孔を有する電極を具備するものである。The accelerating tube of the ion implantation apparatus of the present invention is provided with an electrode having a central hole for beam passage that has a similar shape to the cross-sectional shape of the ion beam to be focused.
つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第1図(a)は本発明の第1の実施例に係る加速管内に
配置している加速電極2の一つを示す平面図、同図(b
)は、同図(a)の加速電極のビーム通過用中心孔を通
るイオンビーム10の断面図である。FIG. 1(a) is a plan view showing one of the acceleration electrodes 2 arranged in the acceleration tube according to the first embodiment of the present invention, and FIG.
) is a cross-sectional view of the ion beam 10 passing through the beam passage center hole of the accelerating electrode in FIG.
第1図(a)、 (b)において、イオンビーム10は
、第3図に示すように加速管に入射後、加速電極間の電
位差により加速される。このイオンビーム10の断面形
状が第1図(b)に示すように長円形であるので、この
ビーム形状に対応して、加速電極2の中心孔2Hの形も
同じように長円形で、かつビームが容易に通り得る大き
さを有するのである。In FIGS. 1A and 1B, the ion beam 10 is accelerated by the potential difference between the acceleration electrodes after entering the acceleration tube as shown in FIG. Since the ion beam 10 has an oval cross-sectional shape as shown in FIG. It has a size that allows the beam to pass through it easily.
そのため、ビーム10の外周の全べての位置で加速電極
2との距離が等しく、加速作用に悪影響な及ぼすことな
く、イオンビームが発散してビーム径が拡大することを
防ぐことができる。Therefore, the distance to the accelerating electrode 2 is equal at all positions on the outer periphery of the beam 10, and it is possible to prevent the ion beam from diverging and expanding the beam diameter without adversely affecting the acceleration effect.
第2図(a)、 (b)は本発明の第2の実施例に係る
加速電極の平面図およびイオンビームの断面図である。FIGS. 2(a) and 2(b) are a plan view of an accelerating electrode and a cross-sectional view of an ion beam according to a second embodiment of the present invention.
第2図(a)、 (b)において、イオンビーム20の
断面形状は長方形となっており、それに対応して、電極
3のビーム通過用中心孔3Hも、ビーム20を容易に通
す大きさでかつ相似の長方形となっている。よって、本
例においても、加速作用は悪影響を与えず、イオンビー
ムが発散してビーム径が拡大するのを防ぐことができる
。In FIGS. 2(a) and 2(b), the cross-sectional shape of the ion beam 20 is rectangular, and correspondingly, the beam passage center hole 3H of the electrode 3 is also large enough to allow the beam 20 to pass through easily. And they are similar rectangles. Therefore, in this example as well, the acceleration effect does not have any adverse effects, and it is possible to prevent the ion beam from divergent and the beam diameter from expanding.
以上説明したように本発明は、電極の形状をイオンビー
ムの形状に対応したものとすることにより、加速管本来
のイオンビームの加速に影響を与えることなく、イオン
ビームが電極を通過する際にイオンビームの収束力を高
めてイオンビームの発散を抑制するため、イオンビーム
が7パーチヤーに衝突してビームラインに2次電子等の
粒子を放出することによりイオンビームに悪影響な及ぼ
すことを防止し、イオンビームを有効に利用し、イオン
注入機能を充分に発揮させ得るという多大なる効果を有
する。As explained above, the present invention makes the shape of the electrode correspond to the shape of the ion beam, so that when the ion beam passes through the electrode, the ion beam is In order to increase the focusing power of the ion beam and suppress the divergence of the ion beam, it is possible to prevent the ion beam from colliding with the seven perchers and emitting particles such as secondary electrons into the beam line, which would have a negative impact on the ion beam. This has the great effect of making effective use of the ion beam and fully demonstrating the ion implantation function.
第1図(a)および第2図(a)はそれぞれ本発明の第
1の実施例および第2の実施例における加速管の一つの
加速電極の平面図、第1図(b)および第2図(b)は
それぞれ同図(a)の電極の中心孔を通るイオンビーム
の断面図、第3図は一般的なイオン注入装置の概略構成
を示すブロック図、第4図は第3図における一つの加速
電極の平面図である。
1・・・・・・加速管、2,2a〜2e、3,4・・団
・加速型it、5・・・・・・アパーチャー、6・・・
・・・Qレンズ、7・・・・・・加速電源、8,10,
20・川・・イオンビーム。
代理人 弁理士 内 原 音
第3図1(a) and 2(a) are plan views of one accelerating electrode of an accelerating tube in a first embodiment and a second embodiment of the present invention, respectively, and FIG. 1(b) and FIG. Figure (b) is a cross-sectional view of the ion beam passing through the center hole of the electrode in figure (a), Figure 3 is a block diagram showing the schematic configuration of a general ion implantation device, and Figure 4 is the same as that shown in Figure 3. FIG. 3 is a plan view of one accelerating electrode. 1...Acceleration tube, 2,2a-2e, 3,4...Group/acceleration type IT, 5...Aperture, 6...
...Q lens, 7... Acceleration power supply, 8, 10,
20. River...Ion beam. Agent Patent Attorney Oto Uchihara Figure 3
Claims (1)
置において、前記加速管の加速電極の前記イオンビーム
を通す中心孔の形が前記イオンビームの断面外形に相似
な形とされていることを特徴とするイオン注入装置。An ion implantation apparatus having an acceleration tube for accelerating an ion beam, characterized in that a central hole of an acceleration electrode of the acceleration tube through which the ion beam passes has a shape similar to a cross-sectional outline of the ion beam. Ion implanter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10520688A JPH01274352A (en) | 1988-04-26 | 1988-04-26 | Ion implantation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10520688A JPH01274352A (en) | 1988-04-26 | 1988-04-26 | Ion implantation device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01274352A true JPH01274352A (en) | 1989-11-02 |
Family
ID=14401194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10520688A Pending JPH01274352A (en) | 1988-04-26 | 1988-04-26 | Ion implantation device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01274352A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7087913B2 (en) | 2003-10-17 | 2006-08-08 | Applied Materials, Inc. | Ion implanter electrodes |
JP2018110088A (en) * | 2017-01-06 | 2018-07-12 | 住友重機械イオンテクノロジー株式会社 | Ion implantation method and ion implantation device |
-
1988
- 1988-04-26 JP JP10520688A patent/JPH01274352A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7087913B2 (en) | 2003-10-17 | 2006-08-08 | Applied Materials, Inc. | Ion implanter electrodes |
JP2018110088A (en) * | 2017-01-06 | 2018-07-12 | 住友重機械イオンテクノロジー株式会社 | Ion implantation method and ion implantation device |
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