JPH01272797A - Apparatus for loading base plate to plating jig fitted with frame - Google Patents

Apparatus for loading base plate to plating jig fitted with frame

Info

Publication number
JPH01272797A
JPH01272797A JP9932788A JP9932788A JPH01272797A JP H01272797 A JPH01272797 A JP H01272797A JP 9932788 A JP9932788 A JP 9932788A JP 9932788 A JP9932788 A JP 9932788A JP H01272797 A JPH01272797 A JP H01272797A
Authority
JP
Japan
Prior art keywords
substrate
base plate
stopper
frame
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9932788A
Other languages
Japanese (ja)
Other versions
JPH0723556B2 (en
Inventor
Toyomitsu Amada
天田 豊光
Hitoshi Ogawa
均 小川
Minoru Kikuchi
菊地 實
Kenji Mimura
三村 賢次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Toyo Giken Kogyo KK
Original Assignee
Fujitsu Ltd
Toyo Giken Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Toyo Giken Kogyo KK filed Critical Fujitsu Ltd
Priority to JP9932788A priority Critical patent/JPH0723556B2/en
Publication of JPH01272797A publication Critical patent/JPH01272797A/en
Publication of JPH0723556B2 publication Critical patent/JPH0723556B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Discharge By Other Means (AREA)

Abstract

PURPOSE:To automatically load a base plate with a simple mechanism by enabling a stopper supporting the lower end of a base plate to be taken out and introduced for the base plate supporting face of a reversing table in a process wherein the base plate is contrarotated with the reversing table and provided to an auxiliary electrode frame. CONSTITUTION:A base plate 1 is placed on the base plate supporting face 2a of a reversing table 2 in a horizontal state and the stopper 3 fitted to the table 2 is projected on the face 2a with a cylinder 4 and the lower end of the base plate 1 is allowed to abut thereon. In this state, the table 2 is rotated at about 90 deg. with a cylinder 5 around an axis 6a in the direction A and the base plate 1 is regulated to a vertical state and made adjacent to the inside of an auxiliary electrode frame 20 in the case of plating and the lower end of the base plate is fitted to plural groove members 24 on the lower frame part 23 of the frame 20 and the base plate is set to a jig. In this case, the base plate 1 is supported with a back receiving bracket 9 which is progressed in the direction B and furthermore the upper end of the base plate 1 is clamped with a mechanism 10. When the table 2 is returned to the original position, the stopper 3 is pulled to the inside of the face 2a. Thereby the stopper 3 does not interface with the base plate 1 and the frame 20, etc.

Description

【発明の詳細な説明】 〔概 要〕 プリント配線板にスルーホールめっきを施す場合のよう
に、基板を均一にめっきすることを必要とする時に枠付
きめっき治具が補助極として使用されるが、このような
枠付きめっき治具に基板を供給するローディング装置に
関し、 基板の周囲に補助極を付けためっき治具に対しても、簡
単な機構でかつ自動的にこれらの補助極を避けて基板を
ローディングすることを可能ならしめることを目的とし
、 反転テーブルは、基板支持面を有すると共に該基板支持
面に出し入れ可能なストッパを有し、基板の下端を該ス
トッパで支持しながら該基板を水平又は傾斜状態から垂
直状態とし、該垂直状態で基板の補助極枠の内側にセッ
トし、この反転テ−プルをもとの位置へ復帰するときは
、前記ストッパを反転テーブルの基板支持面より引きこ
めておくことのできる、基板の枠付めっき治具へのロー
ディング装置を構成する。
[Detailed Description of the Invention] [Summary] A framed plating jig is used as an auxiliary pole when it is necessary to plate the board uniformly, such as when plating through holes on a printed wiring board. Regarding the loading device that supplies substrates to such framed plating jigs, it has a simple mechanism that automatically avoids these auxiliary poles even for plating jigs with auxiliary poles around the substrate. The purpose of the inversion table is to make it possible to load a substrate, and the inversion table has a substrate support surface and a stopper that can be inserted into and taken out from the substrate support surface, and the substrate is loaded while the lower end of the substrate is supported by the stopper. When changing from a horizontal or tilted state to a vertical state, setting the board inside the auxiliary pole frame in the vertical state, and returning the reversing table to its original position, move the stopper away from the substrate support surface of the reversing table. To configure a loading device for a substrate onto a frame-equipped plating jig that can be retracted.

〔産業上の利用分野〕[Industrial application field]

本発明は、基板をめっき処理部へ供給するローディング
装置に関する。特に、プリント配線板にスルーホールめ
っきを施す場合のように、基板を均一にめっきすること
を必要とする時に枠付きめっき治具が補助極として使用
されるが、本発明はこのような枠付きめっき治具に基板
を供給するローディング装置に関する。
The present invention relates to a loading device that supplies a substrate to a plating processing section. In particular, a framed plating jig is used as an auxiliary pole when it is necessary to plate the board uniformly, such as when performing through-hole plating on a printed wiring board. The present invention relates to a loading device that supplies a substrate to a plating jig.

〔従来の技術〕[Conventional technology]

プリント板基板のように平板状の部材にめっきを施す場
合、基板の表面の周囲部では中心部に比べてめっき厚さ
が厚くなる傾向にある。めっき厚さに精度を要求されな
い場合は、めっき治具は補助極を必要とせず、従ってめ
っき治具の周囲に枠等の障害物がないため、比較的自動
ローディングが容易であった。
When plating a flat member such as a printed circuit board, the thickness of the plating tends to be thicker at the periphery of the surface of the board than at the center. When precision in plating thickness is not required, the plating jig does not require an auxiliary pole, and therefore there are no obstacles such as frames around the plating jig, making automatic loading relatively easy.

しかしながら、かかる補助極のない従来のめつき装置で
は、プリント板表面のめっき厚さに変動が生じ、スルー
ホールめっきを施す場合のように、高密度化に対応する
べくめっき厚さの精度が要求される場合には使用するこ
とができなかった。補助極を使用するめっき装置の場合
、この補助極を避けて基板をめっき治具にローディング
しなければならないが、このような場合、従来は自動化
が困難であった。
However, with conventional plating equipment without such auxiliary electrodes, the plating thickness on the surface of the printed board varies, and as in the case of through-hole plating, precision in plating thickness is required to cope with higher density. could not be used if In the case of a plating apparatus that uses an auxiliary electrode, the substrate must be loaded onto the plating jig while avoiding the auxiliary electrode, but automation in such cases has been difficult in the past.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

そこで、本発明は基板の周囲に補助極の付いためっき治
具に対しても、簡単な機構でかつ自動的にこれらの補助
極を避けて基板をローディングすることのできる、基板
の枠付めっき治具へのローディング装置を提供すること
を目的とする。
Therefore, the present invention provides a frame-mounted plating method for substrates that can be loaded with a simple mechanism and automatically avoiding these auxiliary poles, even for plating jigs with auxiliary poles around the substrate. The purpose is to provide a loading device for a jig.

〔課題を解決するための手段〕[Means to solve the problem]

この課題を解決するために、本発明では、基板をめっき
する際の補助極を垂直平面内で規定する枠を有し、該枠
の下枠部に基板の下端を受け入れる溝部材を間隔を置い
て複数取付けためっき治具に基板をセットするローディ
ング装置において、基板支持面と、該基板支持面に出し
入れ可能なストッパとを有し、基板の下端を該ストッパ
で支持しながら該基板を水平又は傾斜状態から垂直状態
とし、該垂直状態で基板の下端が前記溝部材に嵌まり、
かつ該基板が前記補助極枠の内側の前記垂直平面内で該
補助極枠に隣接して位置するように設定された、所定の
軸を中心に回転する反転テーブルと、垂直状態となった
基板の前記反転テーブルの反対面を支承する背受けブラ
ケットと、垂直状態の基板の上端をクランプするクラン
プ機構と、クランプ後前記ストッパを反転テーブルの基
板支持面より内方へ引きこめるストッパ駆動手段とを具
備する、基板の枠付めっき治具へのローディング装置が
提供される。
In order to solve this problem, the present invention has a frame that defines an auxiliary pole in a vertical plane when plating a substrate, and groove members that receive the lower end of the substrate are placed at intervals in the lower frame part of the frame. A loading device that sets a substrate on a plating jig that can be attached to a plurality of substrates, has a substrate support surface and a stopper that can be inserted into and taken out from the substrate support surface, and supports the substrate horizontally or horizontally while supporting the lower end of the substrate with the stopper. from the inclined state to the vertical state, and in the vertical state, the lower end of the substrate fits into the groove member,
and an inversion table that rotates around a predetermined axis and is set such that the substrate is located adjacent to the auxiliary pole frame in the vertical plane inside the auxiliary pole frame, and the substrate is in a vertical state. a back support bracket for supporting the opposite surface of the reversing table; a clamping mechanism for clamping the upper end of the vertical substrate; and a stopper driving means for retracting the stopper inward from the substrate supporting surface of the reversing table after clamping. A device for loading a substrate onto a framed plating jig is provided.

〔作 用〕[For production]

本発明では、基板が反転テーブルにより反転され補助極
枠に設置される過程では、ス)、、、#<が基板支持面
へ突出していて基板下端を支承し、基板をクランプした
後はストッパが基板支持面の内側へ引き込むので、反転
テーブルが元の位置へ戻る際、ストッパが基板及び補助
極枠の溝部材と干渉することがなく、従って補助極枠の
付いためつき治具であっても自動的にローディングする
ことが可能となる。
In the present invention, in the process of inverting the board by the reversing table and installing it in the auxiliary pole frame, the stoppers protrude toward the board support surface and support the bottom edge of the board, and after the board is clamped, the stoppers Since the stopper is pulled into the inside of the substrate support surface, when the reversing table returns to its original position, the stopper does not interfere with the groove member of the substrate and auxiliary pole frame. Automatic loading is possible.

〔実施例〕〔Example〕

以下、添付図面を参照して本発明の実施例について詳細
に説明する。
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

第1図は本発明のローディング装置の原理図、第2図は
同本発明のローディング装置の実施例の構成図、第3図
は補助極及びストッパの斜視図、第4図は第2図■部を
拡大したストッパの詳細図、第5図は第1図矢印■から
見たローディング後の基板の状態を示す図である。
Fig. 1 is a principle diagram of the loading device of the present invention, Fig. 2 is a configuration diagram of an embodiment of the loading device of the present invention, Fig. 3 is a perspective view of an auxiliary pole and a stopper, and Fig. 4 is a diagram of Fig. 2 FIG. 5 is an enlarged detailed view of the stopper, showing the state of the substrate after loading as seen from the arrow (■) in FIG. 1.

これらの図において、プリント板等の基板1は図示しな
い手段により順次、水平状態にある反転テーブル2(第
1図に想像線)の基板支持面2a上に載せられる。この
反転テーブル2には、シリンダ4で駆動されるストッパ
3が基板支持面2aに対して出し入れ可能に取付けられ
る。このとき、ストッパ3は反転テーブル2の基板支持
面2a上に突出していて基板1の下端(右端)に当接し
ている。反転テーブル2自体は、シリンダ5により軸6
aを中心に回動されるシリンダアーム6に前後に摺動可
能に取付けられる。パワーシリンダ7(第2図)は反転
テーブル2をシリンダアーム6に対して摺動させるもの
である。
In these figures, substrates 1 such as printed boards are sequentially placed on a substrate support surface 2a of a horizontal inversion table 2 (phantom line in FIG. 1) by means not shown. A stopper 3 driven by a cylinder 4 is attached to the reversing table 2 so that it can be moved in and out of the substrate support surface 2a. At this time, the stopper 3 protrudes above the substrate support surface 2a of the reversing table 2 and is in contact with the lower end (right end) of the substrate 1. The reversing table 2 itself is connected to the shaft 6 by the cylinder 5.
It is attached to the cylinder arm 6, which is rotated around a, so as to be slidable back and forth. The power cylinder 7 (FIG. 2) is for sliding the reversing table 2 with respect to the cylinder arm 6.

反転テーブル2は基板1を水平に支持している状態で後
方(図の右方)に引き込んだ後、シリンダアーム6と共
にシリンダ5により軸6aを中心に矢印六方向に約90
度回転され、基板1を垂直状態とする。この間、基板1
の下端はストッパ3に支持されている。
After the reversing table 2 is pulled backwards (to the right in the figure) while horizontally supporting the substrate 1, it is rotated approximately 90 degrees in the direction of the arrow 6 about the shaft 6a by the cylinder 5 together with the cylinder arm 6.
The substrate 1 is rotated once to bring the substrate 1 into a vertical position. During this time, board 1
The lower end of is supported by a stopper 3.

垂直状態となった基板1は、めっきの際の補助極を形成
する枠20の内側に隣接して位置する。
The substrate 1 in the vertical state is located adjacent to the inside of the frame 20 that forms an auxiliary pole during plating.

この補助極枠20は、第5図に示すように、上部枠21
に吊り下げられた垂直な横枠部分22と、水平な下枠部
分23からなり、下枠部分23には基板1の下端を受け
る溝部材24が間隔を置いて複数取付けられている。従
って、前記垂直状態で基板1の下端が溝部材24のV形
溝内に入りかつ下枠部分23との間に僅かな間隔がある
。また、横に並んだ複数の基板1の横端は隣接する基板
1との間及び横棒部分22との間に僅かな間隔がある。
As shown in FIG. 5, this auxiliary pole frame 20 includes an upper frame 21
It consists of a vertical horizontal frame part 22 suspended from a horizontal frame part 22 and a horizontal lower frame part 23, and a plurality of groove members 24 for receiving the lower end of the board 1 are attached to the lower frame part 23 at intervals. Therefore, in the vertical state, the lower end of the substrate 1 enters the V-shaped groove of the groove member 24, and there is a slight gap between it and the lower frame portion 23. Further, there is a slight distance between the horizontal ends of the plurality of substrates 1 arranged horizontally with adjacent substrates 1 and between the horizontal bar portions 22.

前記垂直状態にある基板1の反転テーブル2と反対の面
は、シリンダ8により矢印B方向に前進(図の左方)さ
れている背受けブラケット9により支承される。基板1
の上方には、基板上端をクランプするべく左右のシリン
ダ11.12により開閉されるクランプ10がある。垂
直状態の基板1の上端は開状態で下降してくるクランプ
10によりクランプされ、基板1が反転テーブル2及び
背受けブラケット9から開放された後、補助極枠20と
共に昇降装置30により上昇されてめっき装置(図示せ
ず)へと搬送される。なお、クランプ10はめっき時に
基板1への給電する作用もする。
The surface of the substrate 1 in the vertical state opposite to the reversing table 2 is supported by a back support bracket 9 that is moved forward in the direction of arrow B (to the left in the figure) by a cylinder 8. Board 1
Above is a clamp 10 which is opened and closed by left and right cylinders 11, 12 to clamp the top edge of the substrate. The upper end of the substrate 1 in the vertical state is clamped by the clamp 10 that descends in the open state, and after the substrate 1 is released from the reversing table 2 and the back support bracket 9, it is lifted together with the auxiliary pole frame 20 by the lifting device 30. It is transported to a plating device (not shown). Note that the clamp 10 also functions to supply power to the substrate 1 during plating.

第2図において、符号7は反転テーブル2をシリンダア
ーム6に対して摺動させるパワーシリンダ、15は装置
の下部フレームである。その他は第1図と同様である。
In FIG. 2, reference numeral 7 is a power cylinder that slides the reversing table 2 with respect to the cylinder arm 6, and 15 is a lower frame of the apparatus. Other details are the same as in FIG.

第3図及び第4図において、ストッパ3を[1するシリ
ンダ4はブラケット4cを介して反転テーブル2に取付
けられ、シリンダ40ロツド4aの先端には横方に延び
た板4bが取付けられ、ストッパ3は補助極20の溝部
材24と干渉しないように板4bに間隔を置いて複数配
置される。ストッパ3はシリンダ4により第3図の矢印
C方向に移動されることにより反転テーブル20基板支
持面2a(第1図)上に突出して基板1の下端を支承す
ることができる(第4図実線位置)。また、矢印Cと反
対の方向に引き込められることにより反転テーブル2の
基板支持面2aの内側に入る(第4図想像線位置)。
In FIGS. 3 and 4, a cylinder 4 that holds a stopper 3 is attached to the reversing table 2 via a bracket 4c, and a plate 4b extending laterally is attached to the tip of the cylinder 40 rod 4a. 3 are arranged at intervals on the plate 4b so as not to interfere with the groove member 24 of the auxiliary pole 20. When the stopper 3 is moved by the cylinder 4 in the direction of arrow C in FIG. 3, it can protrude above the substrate support surface 2a of the reversing table 20 (FIG. 1) and support the lower end of the substrate 1 (as shown by the solid line in FIG. 4). position). Furthermore, by being pulled in the direction opposite to arrow C, it enters inside the substrate support surface 2a of the reversing table 2 (the imaginary line position in FIG. 4).

第6図はこのようなストッパ3の動作を示したものであ
る。第6図(a)は反転テーブル20反転の過程を示し
、このとき基板1はシリンダアーム6(第1図)の軸6
aを中心に矢印り方向に移動し、その下端がストッパ3
に支持されたままの状態で補助極下枠23の溝部材24
に入る。第6図(b)は基板1の下端が溝部材24に入
った直後の状態を示している。第6図(C)は基板1の
下端が溝部材24に入った後、ストッパ3が矢印E方向
に引き込められる状態を示している。このようにストッ
パ3が引き込められた状態で反転テーブル2がストッパ
3と共に軸6aを中心に矢印りと反対の方向に戻される
ので、ストッパ3はもはや基板1と干渉することはない
FIG. 6 shows the operation of such a stopper 3. FIG. 6(a) shows the process of reversing the reversing table 20, at which time the substrate 1 is attached to the shaft 6 of the cylinder arm 6 (FIG. 1).
Move in the direction of the arrow with a as the center, and the bottom end will be at stopper 3.
The groove member 24 of the auxiliary bottom frame 23 remains supported by the
to go into. FIG. 6(b) shows the state immediately after the lower end of the substrate 1 enters the groove member 24. FIG. FIG. 6(C) shows a state in which the stopper 3 is retracted in the direction of arrow E after the lower end of the substrate 1 enters the groove member 24. With the stopper 3 retracted in this manner, the reversing table 2 is returned together with the stopper 3 in the opposite direction of the arrow around the shaft 6a, so the stopper 3 no longer interferes with the substrate 1.

第7図は本発明の自動ローディング装置の主要構成部の
動作を示すタイムチャートである。反転テーブル2が反
転動作をする前に、背受けブラケット9がシリンダ8よ
り第1図の矢印B方向に、基板裏面を支持する位置まで
前進する。背受けブラケット9の前進完了の指示を受け
て、反転テーブル2が反転の動作をし、基板1を垂直な
状態としてその両面から背受けブラケット9と反転テー
ブル2とで支承する。反転テーブル2の反転完了の指示
を受けて、昇降リフト30を下降させる。
FIG. 7 is a time chart showing the operation of the main components of the automatic loading device of the present invention. Before the reversing table 2 performs the reversing operation, the back support bracket 9 moves forward from the cylinder 8 in the direction of arrow B in FIG. 1 to a position where it supports the back surface of the substrate. Upon receiving an instruction to complete the forward movement of the back support bracket 9, the inversion table 2 performs an inversion operation, and the substrate 1 is held in a vertical state by the back support bracket 9 and the inversion table 2 from both sides. Upon receiving an instruction to complete the inversion of the inversion table 2, the elevating lift 30 is lowered.

この時、クランプ10は開の状態となっている。At this time, the clamp 10 is in an open state.

昇降リフト30が所定位置まで下降完了した指示を受け
てシリンダ11.12が互いに遠ざかる方向に移動して
クランプ10を閉じ、基板1の上端をクランプする。こ
れと同時に、ストッパ3の後進動作が開始される。スト
ッパ3が後進動作を完了し、反転テーブル20基板支持
面2aの内部に引き込んだことが確認され、かつクラン
プlOのクランプ動作が完了すると、背受けブラケット
9及び反転テーブル2のもとの位置への復帰動作が開始
され、かつ昇降リフ)30が上昇を開始する。
Upon receiving an instruction that the lifting lift 30 has completed its descent to a predetermined position, the cylinders 11 and 12 move away from each other to close the clamp 10 and clamp the upper end of the substrate 1. At the same time, the stopper 3 starts moving backward. When it is confirmed that the stopper 3 has completed its backward movement and has been retracted into the inside of the inversion table 20 substrate support surface 2a, and the clamping operation of the clamp 1O is completed, the back support bracket 9 and the inversion table 2 are returned to their original positions. 30 starts to return to its original position, and the elevating/lowering riff 30 starts to rise.

反転テーブル2がもとの位置へもどったことが確認され
たら、ストッパ3は反転テーブル2上へ前進し、新たな
基板1が反転テーブル2上に供給されて、次のサイ・タ
ルが開始される。
When it is confirmed that the reversing table 2 has returned to its original position, the stopper 3 moves forward onto the reversing table 2, a new substrate 1 is supplied onto the reversing table 2, and the next cycle is started. Ru.

〔発明の効果〕〔Effect of the invention〕

以上に説明したように、本発明では、基板1が反転テー
ブル2により所定の軸6aを中心に反転され補助極枠2
0に設置される過程では、ストッパ3が基板支持面2a
上へ突出していて基板下端を支承し、反転テーブル2が
前記所定の軸6aを中心にもとの位置に復帰するときは
ストッパ2が基板支持面2aの内側へ引き込んでいるの
で、ストッパ3が基板1や補助極枠20等と干渉するこ
とがなく、従って、均一なめっき厚を得るために補助極
枠20を使用しためっき治具であっても、簡単な構造で
自動的なローディングが可能となる。
As explained above, in the present invention, the substrate 1 is inverted about the predetermined axis 6a by the inversion table 2, and the auxiliary pole frame 2
0, the stopper 3 is placed on the substrate support surface 2a.
The stopper 2 protrudes upward and supports the lower end of the substrate, and when the reversing table 2 returns to its original position around the predetermined axis 6a, the stopper 2 is retracted into the inside of the substrate support surface 2a. There is no interference with the substrate 1, the auxiliary pole frame 20, etc., and therefore automatic loading is possible with a simple structure even in a plating jig that uses the auxiliary pole frame 20 to obtain uniform plating thickness. becomes.

これにより、簡単な構造のめっき装置にてめっき厚の精
度を向上することができる。
Thereby, the accuracy of plating thickness can be improved using a plating apparatus with a simple structure.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のローディング装置の原理図、第2図は
同本発明のローディング装置の実施例の構成図、第3図
は補助極及びストッパの斜視図、第4図は第2図■部を
拡大したストッパの詳細図、第5図は第1図矢印■から
見たクランプ後の基板の状態を示す図、第6図(a)、
  (b)、 (c)はストッパの動作を示す図、第7
図は本発明の自動ローディング装置の主要構成部の動作
を示すタイムチャートである。 I・・・基板、      2・・・反転テーブル、3
・・・ストッパ、 4・・・ストッパ駆動シリンダ、 5.8.11.12・・・シリンダ、 6・・・シリンダアーム、 9・・・背受けブラケット、 10・・・クランプ、   20・・・補助極枠、21
・・・上部枠、    22・・・横枠部、23・・・
下枠部、   24・・・溝部材、30・・・昇降リフ
ト。 本発明の原理図 第1図 1・・・基板 2・・・反転テーブル 3・・・ストッパ 4・・・ストッパ駆動シリンダ 9・・・背受けブラケット 1o・・・クランプ 2o・・・補助極枠 23・・・下枠部 24・・・溝部材 30−−−昇降リフト 実施例の構成図 7・・・ ノぐワーシリンダ 15・・・下部フレーム 補助極及びストッパの斜視図 第3図 ストツ・ぐの詳細図(第2図■部) 1・・・基板 2・・・反転テーブル 3・・・ ストッ、せ 4・・・シリンダ 23・・・下枠部 24・・・溝部材 クーディング後の状態 21・・・上部枠 n・・・横枠部 23・・・下枠部 24・・・溝部材 各部動作のじ クイムチャート
Fig. 1 is a principle diagram of the loading device of the present invention, Fig. 2 is a configuration diagram of an embodiment of the loading device of the present invention, Fig. 3 is a perspective view of an auxiliary pole and a stopper, and Fig. 4 is a diagram of Fig. 2 5 is a detailed view of the stopper with the part enlarged, FIG. 5 is a diagram showing the state of the board after clamping as seen from the arrow ■ in FIG. 1, FIG.
(b) and (c) are diagrams showing the operation of the stopper.
The figure is a time chart showing the operation of the main components of the automatic loading device of the present invention. I...Substrate, 2...Inversion table, 3
... Stopper, 4... Stopper drive cylinder, 5.8.11.12... Cylinder, 6... Cylinder arm, 9... Back support bracket, 10... Clamp, 20... Auxiliary pole frame, 21
...Top frame, 22...Horizontal frame part, 23...
Lower frame portion, 24...Groove member, 30...Elevating lift. Principle diagram of the present invention Figure 1 1... Substrate 2... Inversion table 3... Stopper 4... Stopper drive cylinder 9... Back support bracket 1o... Clamp 2o... Auxiliary pole frame 23...Lower frame portion 24...Groove member 30---Configuration diagram of the example of the elevating lift 7...Nower cylinder 15...Perspective view of the lower frame auxiliary pole and stopper Fig. 3 Detailed view of (part ■ in Figure 2) 1... Board 2... Inversion table 3... Stop, set 4... Cylinder 23... Lower frame part 24... Groove member after cooling State 21...Top frame n...Horizontal frame part 23...Bottom frame part 24...Quim chart of the operation of each part of the groove member

Claims (1)

【特許請求の範囲】[Claims] 1、基板(1)をめっきする際の補助極を垂直平面内で
規定する枠(20)を有し、該枠の下枠部(23)に基
板の下端を受け入れる溝部材(24)を間隔を置いて複
数取付けためっき治具に基板をセットするローディング
装置において、基板支持面(2a)と、該基板支持面に
出し入れ可能なストッパ(3)とを有し、基板の下端を
該ストッパで支持しながら該基板を水平又は傾斜状態か
ら垂直状態とし、該垂直状態で基板の下端が前記溝部材
に嵌まり、かつ該基板が前記補助極枠の内側の前記垂直
平面内で該補助極枠に隣接して位置するように設定され
た、所定の軸(6a)を中心に回転する反転テーブル(
2)と、垂直状態となった基板の前記反転テーブルの反
対面を支承する背受けブラケット(9)と、垂直状態の
基板の上端をクランプするクランプ機構(10)と、ク
ランプ後前記ストッパを反転テーブルの基板支持面より
内方へ引きこめるストッパ駆動手段(4)とを具備する
、基板の枠付めっき治具へのローディング装置。
1. It has a frame (20) that defines an auxiliary pole in a vertical plane when plating the substrate (1), and a groove member (24) for receiving the lower end of the substrate is provided at a lower frame part (23) of the frame at intervals. A loading device that sets a substrate on a plating jig with multiple attachments, which has a substrate support surface (2a) and a stopper (3) that can be inserted into and taken out from the substrate support surface, and the lower end of the substrate is held by the stopper. While supporting the substrate, the substrate is changed from a horizontal or inclined state to a vertical state, and in the vertical state, the lower end of the substrate is fitted into the groove member, and the substrate is placed in the auxiliary pole frame within the vertical plane inside the auxiliary pole frame. an inversion table (6a) that rotates around a predetermined axis (6a), and
2), a back support bracket (9) that supports the opposite side of the inversion table of the vertical board, a clamp mechanism (10) that clamps the upper end of the vertical board, and a clamp mechanism (10) that inverts the stopper after clamping. A device for loading a substrate onto a framed plating jig, comprising a stopper driving means (4) that can be retracted inward from the substrate support surface of the table.
JP9932788A 1988-04-23 1988-04-23 Loading device for plating jig with frame on board Expired - Lifetime JPH0723556B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9932788A JPH0723556B2 (en) 1988-04-23 1988-04-23 Loading device for plating jig with frame on board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9932788A JPH0723556B2 (en) 1988-04-23 1988-04-23 Loading device for plating jig with frame on board

Publications (2)

Publication Number Publication Date
JPH01272797A true JPH01272797A (en) 1989-10-31
JPH0723556B2 JPH0723556B2 (en) 1995-03-15

Family

ID=14244540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9932788A Expired - Lifetime JPH0723556B2 (en) 1988-04-23 1988-04-23 Loading device for plating jig with frame on board

Country Status (1)

Country Link
JP (1) JPH0723556B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012107311A (en) * 2010-10-21 2012-06-07 Ebara Corp Plating apparatus, plating method, and method for changing posture of substrate holder for plating apparatus
US9991145B2 (en) 2010-10-21 2018-06-05 Ebara Corporation Plating apparatus and plating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012107311A (en) * 2010-10-21 2012-06-07 Ebara Corp Plating apparatus, plating method, and method for changing posture of substrate holder for plating apparatus
CN106119919A (en) * 2010-10-21 2016-11-16 株式会社荏原制作所 Plating apparatus, method for plating and conversion are for the method removably keeping the posture of the substrate holder of substrate
US9991145B2 (en) 2010-10-21 2018-06-05 Ebara Corporation Plating apparatus and plating method

Also Published As

Publication number Publication date
JPH0723556B2 (en) 1995-03-15

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