JPH01270296A - Electronic apparatus and its cooling method - Google Patents

Abstract

PURPOSE:To enable the cooling of semiconductor elements of large heating value, and realize the reduction of noise and the miniaturization of a cooling equipment, by air-cooling the semiconductor elements after the feeding air for the semiconductor elements is previously cooled. CONSTITUTION:As a cooling medium for an electronic apparatus provided with a plurality of semiconductor elements, air is used, which is previously cooled prior to the feeding of air to a semiconductor element circuit. As a result, high cooling capability is attained even by forced air-cooling, and semiconductor elements of large heating value can be effectively cooled. In the case where a refrigeration equipment is used as a cooling means of feeding air, a refrigeration cycle is repeated by a condenser 11, a compressor 14, an expansion valve 12 and an evaporator 13. The air fed to the electronic apparatus is cooled by the evaporator 13, and the semiconductor elements are cooled by said cooled air. Thereby, in the case of an electronic apparatus whose heating value is comparatively large, necessary cooling effect is attained, and the reduction of noise and the miniaturization of a cooling equipment can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device and a method for cooling the same, and particularly to an electronic device having a large number of semiconductor elements and a method for cooling the same.

[Prior Art] Conventionally, electronic devices, especially electronic devices having a large number of semiconductor elements, such as computers, have been cooled by air cooling, water cooling, or other refrigerants in order to remove heat generated from the elements. .

Examples of conventional electronic equipment cooling include, for example, Nikkei Electronics, 1987.7, 27 (no, 4
26), pp. 167-192, Nikkei Electronics, June 2, 1986 (no.
396), pp. 179-209, and a heat pipe method using a liquid refrigerant described in JP-A-62-140498, etc.

[Problem to be solved by the invention] Among the electronic device cooling methods described above, the air cooling method has the following problems:
It has the advantages of easy installation and low cost, and is the most commonly used. However, since a fan is used for forced air cooling, if the amount of heat generated by the semiconductor element increases, the air volume must be increased, which can lead to serious noise problems. On the other hand, the air cooling system naturally has a limit to its cooling capacity, and conventional forced air cooling may not be able to adequately cope with semiconductor elements that generate a large amount of heat.

For this reason, for semiconductor elements that generate a large amount of heat, a water cooling method as described above or a cooling method using another refrigerant is used.

However, in the case of cooling using a water cooling method or other types of cold storage, there is a problem in that the equipment necessary for cooling, such as a device for circulating water and a refrigeration device for cooling water, becomes large. There is also the risk of water leakage.

By the way, electronic devices having a large number of semiconductor elements, which are the object of the present invention, are, for example, electronic computers, which have not only high performance but also low power consumption, small installation area, and installation conditions (inlet air temperature, humidity). An important issue is that there is no need for permanent installation of air conditioners.

In order to improve the performance of these electronic computers, it is necessary to increase the integration and speed of the semiconductor elements, and the amount of heat generated on the printed circuit board on which these semiconductor elements are mounted also increases. For this reason, an increasingly large cooling capacity is required, and the required cooling may not be achieved only by conventional forced air cooling.

When adopting a water cooling method to obtain the desired cooling capacity, as mentioned above, the cooling device becomes larger and the power required for cooling also increases, which is disadvantageous in terms of installation space and low power consumption. It is.

Of course, it is also possible to improve the cooling capacity by changing the installation conditions and lowering the temperature of the air entering the electronic device. However, this method forces users who do not have existing air conditioning equipment to install new air conditioning equipment, which may not be possible in all cases.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic device and a method for cooling the electronic device that can achieve required cooling by forced air cooling even in an electronic device that generates a relatively large amount of heat.

Another object of the present invention is to provide an electronic device and a cooling method thereof that are advantageous in terms of power consumption, installation area, installation conditions, etc.

[Means for Solving the Problem] The above object is to use air as a cooling medium in an electronic device having a plurality of semiconductor elements, and to cool the incoming air in advance before forcing air into the semiconductor elements. This is achieved by placing

In addition, the above object is to provide a blowing means for supplying air to the semiconductor elements, and a means for pre-cooling the inlet air before the air is introduced into the semiconductor elements, in an electronic device having a plurality of semiconductor elements. This is achieved by having the following.

In this case, preferably, the means for pre-cooling the inlet air is provided within the electronic device.

The means for pre-cooling the inlet air are constituted, by way of example, in particular by a refrigeration system consisting of a condenser, a compressor, an expansion valve and an evaporator.

In this case, preferably, the evaporator of the refrigeration device is disposed between the blowing means and the semiconductor element. Alternatively, the evaporator of the refrigeration device may be placed in front of the air intake of the electronic device housing, and the condenser of the refrigeration device is preferably disposed in the exhaust path after cooling the semiconductor element. Ru.

Furthermore, the means for pre-cooling the inlet air may have its operation controlled by the ambient air temperature.

Further, the refrigeration device is preferably removably provided within the electronic device.

Further, in a preferred embodiment, the refrigeration device is supported in a casing separate from the electronic device casing, and the refrigeration device is configured to be able to be connected to the casings as necessary. Therefore, before entering the semiconductor device,
It is also possible to pre-cool the incoming air.

In the above, "air intake" refers to the intake or blowing of air into a semiconductor integrated circuit or the like. For example, in the case of an electronic computer, it refers to the intake or blowing of air into a frame within a housing.

Moreover, "before the intake of air" means directly related to and substantially immediately before the intake of air into the semiconductor element.

However, this does not exclude the presence of something that does not substantially impede air inflow into the semiconductor element.

[Function] In the present invention, it is possible to achieve a high cooling capacity even by using a forced air cooling method by cooling the incoming air to the semiconductor device in advance before it enters the semiconductor device. Effective cooling can also be provided to heat-generating semiconductor elements.

In the present invention, when a refrigeration device is used as a means for cooling incoming air, a refrigeration cycle is repeated using a condenser, a compressor, an expansion valve, and an evaporator, and the evaporator cools the air taken into the electronic equipment. Then, the semiconductor element is cooled by this cooled air.

[Example] An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, IO is a housing of an electronic device such as an electronic computer having a plurality of semiconductor elements, 11 is a condenser, 12 is an expansion valve, 13 is an evaporator, 14 is a compressor, 15 is a fan,
Reference numeral 16 denotes a circuit portion consisting of a semiconductor element.

The refrigeration system includes the above-mentioned condenser 11, expansion valve 12, evaporator 13. It consists of a compressor 14, each element of which is connected by a pipe, and a refrigerant is sealed inside.

Freon or the like is generally used as a refrigerant.

The compressor 14 serves to circulate the refrigerant and converts the refrigerant into a high-temperature, high-pressure gas. This refrigerant is transferred to the condenser 1
1, the refrigerant condenses from gas to liquid while releasing heat to the outside. The liquefied refrigerant passes through the expansion valve 12, and part of the refrigerant becomes gas, lowering the temperature of the refrigerant. This expansion valve 12 controls the flow of refrigerant. The refrigerant is further transferred to evaporator 1
3, and while absorbing heat from the outside, it emits from the liquid to gas.

The refrigerant that has become a gas is sent to the compressor 14 again.

It becomes a high-temperature, high-pressure gas. In this way, a refrigeration cycle is formed by the refrigeration device. The air around the electronic device is drawn into the housing 10 by the fan 15, and the air is drawn into the evaporator 1.
3, the air temperature is lowered. This air is used to cool the circuit 16 of the semiconductor device. Further, this air passes through a condenser 11 on the way to being exhausted, which promotes the effect of the refrigerant dissipating heat.

FIG. 2 shows another embodiment of the invention. In the figure, l
O~16 is substantially the same as lθ~16 in FIG. 20 is a temperature sensor, and 21 is a circuit that controls the expansion valve 12 and the compressor 14 based on information from the temperature sensor 20. The temperature sensor 20 measures the temperature of the air taken into the housing 10, that is, the ambient air temperature, and the control circuit 2
1 controls the expansion valve 12 depending on the intake air temperature; for example, when the intake air temperature is low, the expansion valve 12 is controlled depending on the intake air temperature.
The refrigerating capacity is reduced by controlling the temperature of the air entering the semiconductor element circuit 16 so that it does not become lower than necessary. Further, when the intake air temperature becomes below a certain temperature, the compressor 14 is stopped and cooling is performed using pure air.

In the case of this embodiment, unnecessary power consumption can be prevented by controlling the refrigeration system based on the temperature of the air taken into the electronic equipment, that is, the ambient temperature at the location where the electronic equipment is installed, and the power consumption can be reduced by yJ. Something comes up.

FIG. 3 shows yet another embodiment of the invention.

In the figure, 11-16 are substantially the same as 11-16 in FIG. 30 is a main body side housing that houses the condenser 11, the evaporator 13, the fan 15, and the semiconductor element circuit 16;
31, as shown in FIG. 3(b), is the expansion valve 12. Contains a compressor 14, a condenser 11 and an evaporator 13
It is a casing that supports the

These two housings 30 and 31 are configured to be able to be coupled, for example, in a complementary manner, if necessary. For this reason, for example, when the main body side body 30 housing the semiconductor element circuit 16 is connected to the housing 31, the condenser 11 and the evaporator 1 are
3 and a support member (not shown) for these. FIG. 3(a) is an explanatory diagram showing a state in which two casings 30 and 31 are combined.

As is clear from this figure, in the combined state, it essentially constitutes a rotary cold air supply system as in the first and second embodiments, and functions in the same manner.

By the way, when considering the environment in which electronic equipment is installed, electronic computers may be installed in computer rooms with air conditioning equipment. In such cases, the room temperature or 22°C to 24°
If the temperature is adjusted to about C, a refrigeration system may not be necessary. In that case, as shown in FIG. 3(b), the casing 30 and the casing 31 may be separated, the refrigeration system may be removed, and the electronic equipment may be cooled using pure air cooling.

On the other hand, when the pure air cooling system is employed, if the room temperature becomes high due to a change in the installation location, the cooling system according to the present invention can be operated by connecting the housing 31.

If the refrigeration equipment can be added and removed as in this embodiment, it will not be shipped with the refrigeration equipment installed even to users who do not need the refrigeration equipment, thereby reducing manufacturing costs. When a refrigeration system becomes necessary, it is possible to connect the refrigeration system and eliminate the trouble of installing new air conditioning equipment.

Although it is not shown in the figure, it is also possible to use a combination of the method of controlling using a temperature sensor shown in Figure 2 and the method of making the refrigeration equipment detachable as shown in Figure 3. This is one of the preferred embodiments of the invention.

Now, when using a refrigeration system, there is generally a problem of condensation. FIGS. 4 and 5 show examples of countermeasures.

In FIG. 4, 10-16 are substantially the same as lO-16 in FIG. 40 is a train that collects condensed water, 4
1 is a heater. The heater 41 is for warming and evaporating the water accumulated in the train 40.
Prevent water from spilling onto other parts of the electronic device.

In addition, in FIG. 5, lO~16 is different from lO~1 in FIG.
6, 50 is a train, and 51 is a water reservoir connected to the condenser 1.1. The water accumulated in the train 50 is pumped up into a water reservoir 51 and evaporated by the heat of the condenser 11.

In each of the embodiments described above, the arrangement of each element of the refrigeration system and the element that cooperates with the refrigeration system to supply cold air to the semiconductor element circuit is not limited to the illustrated example. For example, in the example shown in Figure 1, fans,
An evaporator, a semiconductor element circuit, and a condenser may be arranged, or the direction of the flow path may be from top to bottom. Also, the cold air supply path is not straight, but at an angle.
For example, it may be formed into an L-shape. Alternatively, it may be in the horizontal direction. Further, for example, the generator may be disposed in front of an air intake port of the electronic device housing, and may be configured to draw air into the housing through the air intake port. In this case, preferably, the evaporator can be disposed in the space between the bottom surfaces of the casing. Furthermore, the condenser may also be configured to be attached outside the body.

In each of the above embodiments, the case where a refrigeration device is used has been described, but it is not limited to a refrigeration device, and any means for reducing air entering the semiconductor element can be used. For example, an electronic refrigeration device may be used. Further, in the embodiments described above, the condenser is cooled by the exhaust gas that has cooled the semiconductor element circuit, or the condenser may be provided with a separate fan for cooling.

Further, in the above embodiment, only one fan is provided at the bottom, or it may be provided anywhere in the flow path from the inlet to the outlet, or a plurality of fans may be provided.

Further, as a method for removably installing the refrigeration device in the electronic device, in addition to the method shown in the third embodiment, for example, a configuration in which the refrigeration device can be removed at the connecting portion of the vibration line can also be used.

[Effects of the Invention] As described above, according to the present invention, it is possible to cool a semiconductor element that generates a large amount of heat by cooling the semiconductor element with air after cooling the inlet air temperature to the semiconductor element part in advance, and cooling the semiconductor element with a large amount of heat. This has the effect of reducing noise compared to the case where cooling is carried out, and that the size of the cooling device can be made smaller compared to the case of water cooling. Additionally, by using air as the cooling medium, the cooling system can be removed more easily than water cooling systems, which has the effect of making it easier for users to select a cooling system depending on their usage environment. .

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing one embodiment of the present invention, FIG. 2 is a similar explanatory diagram showing another embodiment of the present invention, and FIG. 3 is a similar explanatory diagram showing still another embodiment of the present invention. 3A is an explanatory diagram showing a state in which the casings used in this embodiment are combined; FIG.
(b) is an explanatory view showing a separated state, and FIGS. 4 and 5 are explanatory views showing measures against condensation in the refrigeration system. lO... Housing, 11... Condenser, 12... Expansion valve, 13... Evaporator, 14... Compressor, 15... Fan. 16... Semiconductor element circuit, 20... Temperature sensor, 2
1... Control circuit, 30.31... Housing, 40.50
...Train, 41...Heater, 51...Water reservoir. Applicant Hitachi, Ltd. and one other person Figure 1 Figure 2 Figure 3 (b)

Claims (1)

[Claims] 1. In an electronic device having a plurality of semiconductor elements, air is used as a cooling medium, and the incoming air is pre-cooled before being forced into the semiconductor elements. How to cool the equipment. 2. A device for cooling an electronic device having a plurality of semiconductor elements, including a blowing means for supplying air to the semiconductor elements, and a means for pre-cooling the incoming air before it enters the semiconductor elements. Electronic equipment with 3. The electronic device according to claim 2, further comprising means for pre-cooling the inlet air within the electronic device. 4. The electronic device according to claim 2 or 3, wherein the means for pre-cooling the incoming air is constituted by a refrigeration device comprising a condenser, a compressor, an expansion valve, and an evaporator. 5. The operation of the means for pre-cooling the inlet air,
5. The electronic device according to claim 2, wherein the electronic device is controlled by ambient air temperature. 6. The electronic device according to claim 4 or 5, wherein the evaporator of the refrigeration device is disposed between the blowing means and the semiconductor element. 7. The electronic device according to claim 4 or 5, wherein the evaporator of the refrigeration device is placed in front of an air intake port of an electronic device housing. 8. The electronic device according to any one of claims 4 to 7, wherein the condenser of the refrigeration device is disposed in an exhaust path after cooling the semiconductor element. 9. The electronic device according to any one of claims 4 to 8, wherein the refrigeration device is removably provided within the electronic device. 10. The refrigeration device is supported in a casing separate from the casing of the electronic device, and the two casings are configured to be able to be combined as necessary, and in the combined state, the refrigeration device is capable of supporting semiconductor elements. The electronic device according to any one of claims 4 to 9, wherein the incoming air can be cooled in advance before being introduced into the electronic device.