JPH01267905A - Extruded type semiconductive resin compound for electric power cable - Google Patents
Extruded type semiconductive resin compound for electric power cableInfo
- Publication number
- JPH01267905A JPH01267905A JP9726988A JP9726988A JPH01267905A JP H01267905 A JPH01267905 A JP H01267905A JP 9726988 A JP9726988 A JP 9726988A JP 9726988 A JP9726988 A JP 9726988A JP H01267905 A JPH01267905 A JP H01267905A
- Authority
- JP
- Japan
- Prior art keywords
- weight part
- ethylene
- copolymer
- added
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 title abstract description 7
- 229920005989 resin Polymers 0.000 title description 2
- 239000011347 resin Substances 0.000 title description 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 6
- 229930195729 fatty acid Natural products 0.000 claims abstract description 6
- 239000000194 fatty acid Substances 0.000 claims abstract description 6
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- 229920000573 polyethylene Polymers 0.000 claims abstract description 6
- 150000003839 salts Chemical class 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- 239000011342 resin composition Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 2
- 240000005572 Syzygium cordatum Species 0.000 abstract description 9
- 235000006650 Syzygium cordatum Nutrition 0.000 abstract description 9
- 229920001577 copolymer Polymers 0.000 abstract description 4
- -1 polyethylene Polymers 0.000 abstract description 3
- 229920000642 polymer Polymers 0.000 abstract description 3
- 239000004698 Polyethylene Substances 0.000 abstract description 2
- 229920001038 ethylene copolymer Polymers 0.000 abstract description 2
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 abstract description 2
- 229920001083 polybutene Polymers 0.000 abstract description 2
- 229920000098 polyolefin Polymers 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 abstract 1
- 230000005764 inhibitory process Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229920003020 cross-linked polyethylene Polymers 0.000 description 3
- 239000004703 cross-linked polyethylene Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical group C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- CXKWCBBOMKCUKX-UHFFFAOYSA-M methylene blue Chemical compound [Cl-].C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 CXKWCBBOMKCUKX-UHFFFAOYSA-M 0.000 description 1
- 229960000907 methylthioninium chloride Drugs 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- XJKVPKYVPCWHFO-UHFFFAOYSA-N silicon;hydrate Chemical compound O.[Si] XJKVPKYVPCWHFO-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明は電力ケーブルの導体や絶縁体の外周に設けるの
に適した半導電性樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a semiconductive resin composition suitable for being provided on the outer periphery of a conductor or insulator of a power cable.
[従来の技術]
架橋ポリエヂレン絶縁電力ケーブルの半導電層と絶縁体
界面の平滑性、密着性はケーブルの信頼性向上の上から
重要であり、界面不整が存在すると局部的に高電界が形
成され、コロナ放電や浸水時に水トリー劣化が生じ、ケ
ーブルの電気特性の低下につながる。[Prior art] The smoothness and adhesion of the interface between the semiconducting layer and the insulator in a cross-linked polyethylene insulated power cable are important for improving the reliability of the cable, and the presence of irregularities at the interface can result in the formation of a locally high electric field. , water tree deterioration occurs during corona discharge or flooding, leading to a decline in the electrical properties of the cable.
この問題に対し、従来から半導電層の構造面と材料面の
双方からの検討がなされており、ケバ立ちの多い半導電
性布テープに代えて押出型半導電層が開発されるに至っ
た。押出型半導電層の材料としては極性を有するエチレ
ン−酢酸ビニル共重合体やエチレン−エチルアクリレー
ト共重合体をベースとしたものが主に用いられている。To address this issue, studies have been conducted from both the structural and material aspects of semiconducting layers, and extruded semiconducting layers have been developed to replace semiconductive cloth tapes, which tend to have a lot of fuzz. . As the material for the extruded semiconductive layer, materials based on polar ethylene-vinyl acetate copolymer or ethylene-ethyl acrylate copolymer are mainly used.
し発明が解決しようとする課題1
しかしながら、このような半導電性層を有ツる架橋ポリ
エヂレン電力ケーブルでは、破壊電jFが大幅に向上す
るものの、ケーブル内に浸水が起きるような厳しい条件
下では、長期課電を行うと水トリーが多発し、破Vi電
圧が低十づるという問題が生ずる。Problem to be Solved by the Invention 1 However, although the cross-linked polyethylene power cable with such a semiconductive layer has a significantly improved breakdown current, If long-term energization is performed, water trees occur frequently and the breakdown voltage becomes low.
本発明は上記に基づいてなされたものであり、耐水トリ
ー性を向上することができる電力ケーブル用押出型半導
電性樹脂組成物の提供をLl的とするものである。The present invention has been made based on the above, and its main purpose is to provide an extruded semiconductive resin composition for power cables that can improve water resistance.
[課題を解決するための手段]
本発明の電力ケーブル用押出型半導電性樹脂組成物は、
エチレン系ポリマー100重量部に対して分子中に水H
Mを含む脂肪酸又はその金属塩0.01〜3.0重M部
を添加したものである。[Means for Solving the Problems] The extruded semiconductive resin composition for power cables of the present invention has the following features:
Water H in the molecule based on 100 parts by weight of ethylene polymer
0.01 to 3.0 parts by weight of a fatty acid containing M or a metal salt thereof is added.
本発明において、分子中に水amを含む脂肪酸又はその
金属塩としては、次のような構造をもつものが挙げられ
る。In the present invention, fatty acids or metal salts thereof containing water am in the molecule include those having the following structures.
R−(Coo ト1)、1! M(R
−Coo)nI 又は 1
(Of−1>k
(ON)m一
(式中、1 又はmは分子中に水酸基を含む(Oト
Ink
/:A綴炭化水素を示す、、尚、Rの構造中に一部酸素
、窒素、硫黄等の原子又はこれからなる原子団が入って
も支障はない。k、jは夫々3以下の整数である。Mは
金属を表す。これに該当するものとしテハ、Li、Na
等の周期率表第1族、Mq。R-(Coo to 1), 1! M(R
-Coo)nI or 1 (Of-1>k
(ON) m (in the formula, 1 or m contains a hydroxyl group in the molecule (O to Ink /: A indicates a hydrocarbon), and some atoms such as oxygen, nitrogen, and sulfur are present in the structure of R. Or, there is no problem even if an atomic group consisting of these is included. k and j are each an integer of 3 or less. M represents a metal.
Group 1 of the periodic table, such as Mq.
Ca、Ba、Cd、Zn等の第■族、A1等の第■族、
Sn、Pb等の第1V族、Mn等の第v1族、Co、N
i等の第1族等の金属があるが、特に限定するものでは
ない。nは金属の原子価によって変る4以下の整数であ
り、rTlは3以下の整数ぐある。)
具体的な例として、
CH(C1−1) −CH(C11,、) 1
o−,OH
OH0HOH
(CI−1) −CI−1(CH2)5−CI−1
−書
OH
CトI C1」 C−(CH2) 7
−一 、CH(CF+ 2 ) 5 Cl
−1cH,、=蓼
01+
CH(CH2) 7−
等を挙げることができる。Group Ⅰ such as Ca, Ba, Cd, Zn, Group Ⅰ such as A1,
Group 1V such as Sn, Pb, Group V1 such as Mn, Co, N
Examples include Group 1 metals such as i, but are not particularly limited. n is an integer of 4 or less that varies depending on the valence of the metal, and rTl is an integer of 3 or less. ) As a specific example, CH(C1-1) -CH(C11,,) 1
o-,OH OH0HOH (CI-1) -CI-1(CH2)5-CI-1
- OH C to I C1” C-(CH2) 7
-1, CH(CF+ 2 ) 5 Cl
-1cH, , = 01+ CH(CH2) 7-, etc. can be mentioned.
これらの化合物の添加量を0.01〜3.0重も)部と
規定したのは、0.01重量部未満では目的とする水ト
リー抑止効果が不十分であり、3.0重量部を越えると
相溶性の制限から半導電層表面に化合物が析出してくる
からである。The reason for specifying the amount of these compounds to be added is 0.01 to 3.0 parts by weight, because if it is less than 0.01 parts by weight, the desired water tree inhibiting effect is insufficient, so 3.0 parts by weight is specified. This is because if it exceeds the limit, the compound will precipitate on the surface of the semiconducting layer due to compatibility limitations.
これ、らの化合物が添加されるポリマーとしては、ポリ
エチレン、ポリプロ、ピレン、ポリブテン等のポリオレ
フィン、エチレン−酢酸ビニル共重合体、エチレン−エ
チルアクリレート共重合体、エチレン−メチルメタクリ
レート共重合体、エチレン−プロピレン共重合体等のエ
チレン共重合体が挙げられる。これらは単独で使用する
外、必要に応じてブレンドしてもよい。Polymers to which these compounds are added include polyolefins such as polyethylene, polypro, pyrene, and polybutene, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene-methyl methacrylate copolymers, and ethylene-vinyl acetate copolymers. Examples include ethylene copolymers such as propylene copolymers. These may be used alone or may be blended as necessary.
導電性付与剤としては導電性カーボンブラックが最適で
、アセチレンブラック、ファーネスブラックも使用でき
る。導電性付与剤は、樹脂100重間部に対して40重
8部以上配合することが導電性付与の点から好ましい。As the conductivity imparting agent, conductive carbon black is most suitable, and acetylene black and furnace black can also be used. From the viewpoint of imparting conductivity, it is preferable that the conductivity imparting agent is blended in an amount of 40 parts by weight or more, 8 parts or more per 100 parts by weight of the resin.
尚、本発明においては適宜酸化防止剤や伯の添加剤を配
合してもよい。In the present invention, antioxidants and other additives may be blended as appropriate.
本発明において、電力ケーブルの半導1’8 hlJは
非架橋の場合と架橋される場合とがある。架橋する場合
は、ジクミルパーオキサイド、2.5−ジメチル−2,
5−ジ(第三ブチルパーオキシ)ヘキシン−3に代表さ
れるパーオキサイドを用いて加熱架illるのが一般的
である。その外、ビニルトリメトキシシランのような有
機シランをポリマーにグラフト後、水分と接触させてシ
ラノール縮合触媒によりシランを結合させて架橋させる
いわゆるシラン水架橋、或いは゛市子線笠の電離性放射
線の照射による架橋でもよい。In the present invention, the semiconductor 1'8 hlJ of the power cable may be non-crosslinked or crosslinked. When crosslinking, dicumyl peroxide, 2,5-dimethyl-2,
It is common to heat the mixture using a peroxide such as 5-di(tert-butylperoxy)hexyne-3. In addition, so-called silane water cross-linking, in which an organic silane such as vinyltrimethoxysilane is grafted onto a polymer and then brought into contact with water to bond and cross-link the silane using a silanol condensation catalyst, or the ionizing radiation of Ichiko Line Kasa Crosslinking by irradiation may also be used.
[実 施 例]
表の各個に示すような配合の半導電性樹脂組成物を調整
した。[Example] Semiconductive resin compositions having the formulations shown in the table were prepared.
断面積80mm2の撚線銅導体上に上記半導電性樹脂組
成物を厚さ1Mに押出被覆して内部半導電層を形成し、
続いてこの外周に低密度ポリエチレン(密度0.920
1メルトインデックス1.0)100重吊8、ジクミル
パーオキナイド2.5重fd部、酸化防止剤0.25車
吊部からなる樹脂組成物を厚さ4 mmに押出被覆し、
さらにこの外周に上記半導電性樹脂組成物を押出被覆し
て外部半導電層を形成し、加熱架橋を行って架橋ポリエ
チレン絶縁雷カケープルを作製した。Forming an internal semiconductive layer by extrusion coating the above semiconductive resin composition to a thickness of 1M on a stranded copper conductor with a cross-sectional area of 80 mm2,
Next, low-density polyethylene (density 0.920
1 Melt index 1.0) A resin composition consisting of 8 parts of 100 parts, 2.5 parts of dicumyl peroxinide, and 0.25 parts of antioxidant was extruded and coated to a thickness of 4 mm.
Furthermore, the above-mentioned semiconductive resin composition was extrusion coated on the outer periphery to form an external semiconductive layer, and heat crosslinking was performed to produce a crosslinked polyethylene insulated lightning cable.
次に、電力ケーブルの導体内に注水を行い、ケーブルを
浸水させた後、5011z、15kVの交流電圧を導体
ど水電極との間に印加し、水diaを90℃に保持した
状態で18力月間課電した。Next, after injecting water into the conductor of the power cable to submerge the cable, an AC voltage of 5011z, 15kV was applied between the conductor and the water electrode, and the water dia was kept at 90°C and the cable was heated for 18 hours. I charged a monthly charge.
課電終了後、絶縁体をO,’5mm厚さにスパイラルカ
ットし、メチレンブルー水溶液で煮沸染色した後、顕微
鏡で・絶縁体と内部半導電層との界面に発生した水トリ
ー数をvM察した。その結果を表に示1゜
表から明らかな通り、実施例1〜5の水酸基を含む脂肪
酸又はその金属塩を添加したちの1ま水トリー数が少な
いことが分る。After the voltage application was completed, the insulator was spirally cut to a thickness of 0.5 mm, boiled and stained with a methylene blue aqueous solution, and the number of water trees generated at the interface between the insulator and the internal semiconducting layer was observed using a microscope. . The results are shown in Table 1. As is clear from the table, it can be seen that the number of water trees after adding the hydroxyl group-containing fatty acids or metal salts of Examples 1 to 5 was small.
一方、比較例1のようにこれを添加しない6のや、比較
例2のように添加量が規定範囲未満のものは発生数が多
いことが分る。又、比較例3のように添加1fiが規定
範囲を越えたものは半導電層表面への添加剤の析出が生
じている。ざらに、比較例4,5のように水酸基を含ま
ないものは水トリー抑止効果がないことが分る。On the other hand, it can be seen that the number of occurrences is large in cases such as Comparative Example 1, in which this is not added, and in Comparative Example 2, in which the amount added is less than the specified range. Further, in cases where the addition 1fi exceeds the specified range as in Comparative Example 3, the additive is deposited on the surface of the semiconducting layer. In general, it can be seen that those containing no hydroxyl groups, such as Comparative Examples 4 and 5, have no water tree inhibiting effect.
「発明の効果」
以上の説明から明らか4【通り、本発明によれば市カク
°−プルの耐水トリー性を大幅に向上させることが出来
る。``Effects of the Invention'' As is clear from the above description, the present invention can significantly improve the water resistance of city pulls.
Claims (1)
水酸基を含む脂肪酸又はその金属塩0.01〜3.0重
量部及び導電性付与剤を添加したことを特徴とする電力
ケーブル用押出型半導電性樹脂組成物。1. An extruded semiconducting material for power cables, characterized in that 0.01 to 3.0 parts by weight of a fatty acid containing a hydroxyl group in the molecule or a metal salt thereof and a conductivity imparting agent are added to 100 parts by weight of an ethylene polymer. Resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9726988A JPH01267905A (en) | 1988-04-20 | 1988-04-20 | Extruded type semiconductive resin compound for electric power cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9726988A JPH01267905A (en) | 1988-04-20 | 1988-04-20 | Extruded type semiconductive resin compound for electric power cable |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01267905A true JPH01267905A (en) | 1989-10-25 |
Family
ID=14187814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9726988A Pending JPH01267905A (en) | 1988-04-20 | 1988-04-20 | Extruded type semiconductive resin compound for electric power cable |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01267905A (en) |
-
1988
- 1988-04-20 JP JP9726988A patent/JPH01267905A/en active Pending
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