JPH01266784A - Printed board with fuses - Google Patents

Printed board with fuses

Info

Publication number
JPH01266784A
JPH01266784A JP9583488A JP9583488A JPH01266784A JP H01266784 A JPH01266784 A JP H01266784A JP 9583488 A JP9583488 A JP 9583488A JP 9583488 A JP9583488 A JP 9583488A JP H01266784 A JPH01266784 A JP H01266784A
Authority
JP
Japan
Prior art keywords
fuse
heat
pattern
terminal
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9583488A
Other languages
Japanese (ja)
Other versions
JP2567451B2 (en
Inventor
Masaki Nishikawa
西川　雅規
Seiji Kawamura
川村　静治
Takazo Hayashi
林　享三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP63095834A priority Critical patent/JP2567451B2/en
Publication of JPH01266784A publication Critical patent/JPH01266784A/en
Application granted granted Critical
Publication of JP2567451B2 publication Critical patent/JP2567451B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To facilitate concentration of heat to a fuse pattern and melt the fuse off by heat when an abnormal current flows to protect a diode from a damage caused by heat by providing through-holes around the fuse patterns. CONSTITUTION:A diode is attached between a terminal 3a and a terminal 3c and a fuse pattern 4 is provided between the terminal 3c and a terminal 3b and the diode and the fuse are provided in series. By providing through-holes 5 around the fuse patterns 4, heat emitted from the fuse patterns at the time of current application is difficult to escape from the fuse pattern parts and easily concentrated to the fuse patterns and the fuses are melted off by the heat. With this constitution, the diodes are protected from damages caused by heat.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は回路内の一部にヒユーズパターンを内蔵したプ
リント基板の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement of a printed circuit board having a built-in fuse pattern in a part of the circuit.

（従来の技術及び解決しようとする課題）従来のプリン
ト基板は絶縁基板に銅箔により配設した導体部及びヒユ
ーズバタンイの発熱溶断部を設けて構成されている。(Prior Art and Problems to Be Solved) A conventional printed circuit board is constructed by providing an insulating substrate with a conductor portion made of copper foil and a heat-generating fusing portion of a fuse batten.

このようなプリント基板のヒユーズパターンに異常電流
が流れた場合、同回路に接続したダイオードが発熱によ
りヒユーズパターンより先に壊れてしまうことがあり、
ダイオードを保ｚ口するための働きがない。If an abnormal current flows through the fuse pattern of such a printed circuit board, the diode connected to the circuit may generate heat and break down before the fuse pattern.
There is no function to protect the diode.

（課題を解決するための手段） 本発明は上述の問題点を解消したヒユーズ付プリント基
板を提供するもので、その特徴はヒユーズパターン部周
辺にｎ通孔を設けたことにある。(Means for Solving the Problems) The present invention provides a printed circuit board with a fuse that solves the above-mentioned problems, and its feature is that n through holes are provided around the fuse pattern portion.

第１図は本発明のヒユーズ付プリント基板の具体例のパ
ターン部の上面図である。FIG. 1 is a top view of a pattern portion of a specific example of a printed circuit board with a fuse according to the present invention.

図面において、（１）は絶縁基板、（２）は銅箔により
形成された導体部、（３＾）　（３６）　（３Ｃ）は上
記導体部に設けられた端子、（４）はヒユーズパターン
、（５）ハ上記ヒユーズパターン（４）の周辺に設けた
貫通孔れ、端子（３Ａ　）と（３Ｃ）の間にはヒユーズ
バタン（４）カ設けられて、両者は直列に配設される。In the drawings, (1) is an insulating substrate, (2) is a conductor portion formed of copper foil, (3^) (36) (3C) is a terminal provided on the conductor portion, (4) is a fuse pattern, (5) A fuse button (4) is provided between the through hole provided around the fuse pattern (4) and the terminals (3A) and (3C), and both are arranged in series.

又貫通孔（５）は例えば第２図（イ）のように、ヒュー
ズパターン（４）の折り返しの間隙部に設けてもよいし
、同図（ロ）のようにヒユーズパターン（４）の両側に
沿って設けてもよい。Also, the through hole (5) may be provided in the gap between the folds of the fuse pattern (4), as shown in FIG. It may be provided along the

（作用） 上述したように、ヒユーズパターン（４）の周辺ニｉＴ
通孔（５）を設けることにより、電流通電時にヒユーズ
パターン（４）より放出される熱がその部分から逃げに
くくなり、ヒユーズパターン（４）に熱が集まり易くな
り、ダイオードの熱による破損を防止することができる
。(Function) As mentioned above, the iT around the fuse pattern (4)
By providing the through hole (5), it becomes difficult for the heat emitted from the fuse pattern (4) to escape from that part when current is applied, making it easier for heat to collect in the fuse pattern (4), thereby preventing damage to the diode due to heat. can do.

この際、ヒユーズパターン面の反対側において、プリン
ト基板の厚さを他のパターン部より薄くすることにより
、熱がヒユーズパターン部に一月集中し易くなり、ダイ
オード保護の効果が一層増大する。At this time, by making the thickness of the printed circuit board thinner than the other pattern portions on the side opposite to the fuse pattern surface, heat is more likely to be concentrated in the fuse pattern portion, further increasing the diode protection effect.

（発明の効果） 以上説明したように、ヒユーズ付プリント基板のヒユー
ズパターンの周辺に貫通孔を設けることにより、この部
分に熱が集中し易くなり、異常電流が流ねた場合、ヒユ
ーズが加熱溶断され、ダイオードの熱による破損を防止
することができる。(Effects of the Invention) As explained above, by providing a through hole around the fuse pattern of a printed circuit board with a fuse, heat is likely to concentrate in this area, and if an abnormal current flows, the fuse will be heated and fused. This prevents damage to the diode due to heat.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明のヒユーズ付プリント基板の具体例のパ
ターン面の上面図である。 第２図（イ）及び（ロ）はいずれも貫通孔の配設位置の
説明図である。 １・・・絶縁基板、２・・・導体部、３ａ、３払３ｃ・
・・端子、４・・・ヒユーズパターン、５・・・貫通孔
。FIG. 1 is a top view of a patterned surface of a specific example of a printed circuit board with a fuse according to the present invention. FIGS. 2(a) and 2(b) are both explanatory diagrams of the arrangement positions of the through holes. DESCRIPTION OF SYMBOLS 1... Insulating board, 2... Conductor part, 3a, 3 payment 3c.
...Terminal, 4...Fuse pattern, 5...Through hole.

Claims (2)

【特許請求の範囲】[Claims] （１）回路内の一部に過電流に対して発熱溶断するヒュ
ーズパターンを有するプリント基板において、ヒューズ
パターン部周辺に貫通孔を設けたことを特徴とするヒュ
ーズ付プリント基板。(1) A printed circuit board with a fuse, which has a fuse pattern that generates heat and melts in response to overcurrent in a part of the circuit, and is characterized in that a through hole is provided around the fuse pattern. （２）ヒューズパターンのパターン面の反対側において
、プリント基板の厚さを他のパターン部より薄くしたこ
とを特徴とする請求項（１）記載のヒューズ付プリント
基板。(2) The printed circuit board with a fuse according to claim (1), wherein the thickness of the printed circuit board is made thinner on the side opposite to the pattern surface of the fuse pattern than on other pattern parts.
JP63095834A 1988-04-18 1988-04-18 Printed circuit board with fuse Expired - Fee Related JP2567451B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63095834A JP2567451B2 (en) 1988-04-18 1988-04-18 Printed circuit board with fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63095834A JP2567451B2 (en) 1988-04-18 1988-04-18 Printed circuit board with fuse

Publications (2)

Publication Number Publication Date
JPH01266784A true JPH01266784A (en) 1989-10-24
JP2567451B2 JP2567451B2 (en) 1996-12-25

Family

ID=14148414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63095834A Expired - Fee Related JP2567451B2 (en) 1988-04-18 1988-04-18 Printed circuit board with fuse

Country Status (1)

Country Link
JP (1) JP2567451B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1045625A1 (en) * 1999-04-14 2000-10-18 Helvar Oy Ab A foil fuse made on a circuit board
EP2429267A1 (en) * 2010-09-08 2012-03-14 Vossloh-Schwabe Deutschland GmbH Multi-layer circuit board with circuit board fixing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102423944B1 (en) * 2016-12-28 2022-07-21 주식회사 엘지에너지솔루션 Printed circuit board with circuit pattern including bottlenect section

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1045625A1 (en) * 1999-04-14 2000-10-18 Helvar Oy Ab A foil fuse made on a circuit board
EP2429267A1 (en) * 2010-09-08 2012-03-14 Vossloh-Schwabe Deutschland GmbH Multi-layer circuit board with circuit board fixing

Also Published As

Publication number Publication date
JP2567451B2 (en) 1996-12-25

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