JPH07220597A - Circuit protective element - Google Patents

Circuit protective element

Info

Publication number
JPH07220597A
JPH07220597A JP975494A JP975494A JPH07220597A JP H07220597 A JPH07220597 A JP H07220597A JP 975494 A JP975494 A JP 975494A JP 975494 A JP975494 A JP 975494A JP H07220597 A JPH07220597 A JP H07220597A
Authority
JP
Japan
Prior art keywords
heating resistor
substrate
resistor
fusible body
circuit protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP975494A
Other languages
Japanese (ja)
Inventor
Takio Maekawa
多喜夫 前川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP975494A priority Critical patent/JPH07220597A/en
Publication of JPH07220597A publication Critical patent/JPH07220597A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To eliminate unevenness in respective parts, and disconnect a current of a specified or larger value surely when it flows through a heating resistor by providing a flat surface part of the heating resistor and a flat part of a fuse element on a base. CONSTITUTION:A heating resistor 2 is a chip resistor of an almost rectangular flat plate to generate hear as current flows, and one flat surface part is provided at a specified position of a base 1 by high-temperature soldering. A fuse element 3 is formed of low melting point alloy or the like as an almost rectangular flat plate to be fused at a specified or higher temperature, and a flat surface part is provided at a specified position of the base 1 by low temperature soldering. A length of a conductive pattern 6 between the heating resistor 2 and the fuse element 3 is set in such a way that the fuse element 3 is fused by heat transmitted from the heating resistor 2 through the conductive pattern 6 before the heating resistor 2 is broken.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子回路に異常電流が
生じたとき電流を遮断し電子回路を保護する回路保護素
子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit protection element for cutting off an electric current and protecting the electronic circuit when an abnormal current occurs in the electronic circuit.

【0002】[0002]

【従来の技術】AC電源やDC電源を利用した電子回路
機器は、電源ラインへのノイズ、雷サージの印加による
電子部品の破壊、電子部品の寿命による該電子部品の破
壊等を起こすことがあり、その影響は種々の形で現れ
る。例えば、プリント基板上に多数の電子部品を配設し
てなる電子回路において、電流値が正常値を超えて大き
くなると、一瞬にして電流ヒューズが切れたり、電子部
品が異常に発熱してプリント基板が焦げたりすることが
あった。
2. Description of the Related Art An electronic circuit device using an AC power supply or a DC power supply may cause noise on the power supply line, destruction of electronic components due to application of lightning surge, and destruction of the electronic components due to the life of the electronic components. , Its effects appear in various ways. For example, in an electronic circuit in which a large number of electronic parts are arranged on a printed circuit board, when the current value exceeds a normal value and becomes large, the current fuse is blown in an instant, or the electronic part heats up abnormally Was sometimes scorched.

【0003】その対策として、図3及び図4に示すよう
な発熱抵抗11と温度ヒューズ12とをラインに直列に入れ
るとともに、これらの被覆部分を互いに密着させること
により、電子回路を保護していた。このものは、発熱抵
抗11に電流が流れると電流の大きさによって発熱抵抗11
が発熱していき、所定以上の電流が流れたとき、発熱抵
抗11が切れる前に温度ヒューズ12が溶断するというもの
であった。
As a countermeasure against this, a heating resistor 11 and a thermal fuse 12 as shown in FIGS. 3 and 4 are put in series in the line, and the covering portions thereof are closely adhered to each other to protect the electronic circuit. . When a current flows through the heating resistor 11, the heating resistor 11 depends on the magnitude of the current.
When the heat is generated and a current more than a predetermined value flows, the thermal fuse 12 is melted before the heat generating resistor 11 is cut.

【0004】[0004]

【発明が解決しようとする課題】ところが、前述したも
のは、発熱抵抗11及び温度ヒューズ12がそれぞれの両端
より露出した導線の端部を半田等によって基板に固定さ
れるため、組立時において発熱抵抗11及び温度ヒューズ
12の位置にバラツキが生じやすく、また、発熱抵抗11と
温度ヒューズ12とが互いに離れやすいものであった。発
熱抵抗11と温度ヒューズ12とが密着せずに離れた状態に
なると、動作不良を発生してしまうことがあった。これ
を解消するために、発熱抵抗11と温度ヒューズ12とを互
いに接着することが考えられるが、接着の工程が増える
ので作業性が悪くなったり、費用がかかったりするなど
の問題があった。
However, in the above-mentioned one, the heat generating resistor 11 and the thermal fuse 12 are fixed to the board by soldering the ends of the lead wire exposed from both ends of the heat generating resistor 11 and the temperature fuse 12, respectively. 11 and thermal fuse
The position of 12 is likely to vary, and the heating resistor 11 and the thermal fuse 12 are easily separated from each other. If the heating resistor 11 and the thermal fuse 12 are separated from each other without being in close contact with each other, a malfunction may occur. In order to solve this, it is conceivable to bond the heat generating resistor 11 and the thermal fuse 12 to each other, but there are problems such as poor workability and cost because the bonding process increases.

【0005】本発明は、このような点に鑑みなされたも
のであり、その目的とするところは、個々の部品のバラ
ツキを極めて少なくし、発熱抵抗に所定以上の電流が流
れたとき確実に電流を遮断する回路保護素子を提供する
ことにある。
The present invention has been made in view of the above points, and an object of the present invention is to make the variation of individual parts extremely small, and to make sure that when a current more than a predetermined value flows through the heating resistor. It is to provide a circuit protection element for shutting off the power.

【0006】[0006]

【課題を解決するための手段】前記目的を達成するため
に、請求項1記載の回路保護素子は、所定の外郭を有す
る基板と、平板状をなしその平面部が基板に設けられる
ものであって電流が流れたとき発熱する発熱抵抗と、平
板状をなしその平面部が基板に設けられるものであって
所定以上の温度になったとき溶断する可溶体と、発熱抵
抗と可溶体とが直列接続となるよう基板に印刷配線され
た導電パターンとを備えた構成としている。
In order to achieve the above-mentioned object, the circuit protection element according to claim 1 comprises a substrate having a predetermined outer contour and a flat plate-shaped flat portion provided on the substrate. Heat generation resistance that generates heat when a current flows, a fusible body that is flat and has its flat surface provided on the substrate and that melts when the temperature exceeds a predetermined value, and a heat generation resistance and a fusible body in series. A conductive pattern is printed and printed on the substrate so as to be connected.

【0007】また、請求項2記載の回路保護素子は、請
求項1記載のものの基板に、発熱抵抗と可溶体とを含む
ように直列接続する導電パターンの両端にリード端子を
設けてなる構成としている。
The circuit protection element according to a second aspect of the present invention has a structure in which lead terminals are provided on both ends of a conductive pattern that is connected in series so as to include a heating resistor and a fusible element on the substrate of the first aspect. There is.

【0008】また、請求項3記載の回路保護素子は、請
求項1又は2記載のものの発熱抵抗を、印刷により基板
に設けてなる構成としている。
According to a third aspect of the circuit protection element, the heat generating resistor according to the first or second aspect is provided on the substrate by printing.

【0009】また、請求項4記載の回路保護素子は、請
求項1乃至3の何れか記載のものの基板に、少なくとも
発熱抵抗及び可溶体を被うよう樹脂を被着してなる構成
としている。
Further, the circuit protection element according to claim 4 has a structure in which a resin is attached to the substrate according to any one of claims 1 to 3 so as to cover at least the heating resistor and the fusible body.

【0010】[0010]

【作用】請求項1記載の構成によれば、基板に発熱抵抗
の平面部及び可溶体の平面部が設けられるので、発熱抵
抗及び可溶体が通常位置からずれにくくなる。
According to the structure of the first aspect, since the flat portion of the heating resistor and the flat portion of the fusible body are provided on the substrate, the heating resistor and the fusible body are less likely to be displaced from their normal positions.

【0011】請求項2記載の構成によれば、リード端子
を基板の空いたスペースに設けた場合、全体の小型化が
実現可能となる。
According to the second aspect of the invention, when the lead terminals are provided in the vacant space of the substrate, the miniaturization of the whole can be realized.

【0012】請求項3記載の構成によれば、発熱抵抗を
基板に設けるときの作業性が良く、また、発熱抵抗が通
常位置からずれることがない。
According to the third aspect of the invention, the workability when the heating resistor is provided on the substrate is good, and the heating resistor does not deviate from the normal position.

【0013】請求項4記載の構成によれば、発熱抵抗及
び可溶体が樹脂により保護されるとともに通常位置から
さらにずれにくくなる。
According to the fourth aspect of the present invention, the heat generating resistance and the fusible body are protected by the resin, and further less likely to be displaced from the normal position.

【0014】[0014]

【実施例】本発明の一実施例を図1及び図2に基づいて
説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS.

【0015】この回路保護素子は、基板1 と、発熱抵抗
2 と、可溶体3 と、リード端子4,5と、導電パターン6
とを備えて構成されている。
This circuit protection element consists of a substrate 1 and a heating resistor.
2, fusible body 3, lead terminals 4, 5 and conductive pattern 6
And is configured.

【0016】基板1 は、紙フェノールやセラミック等に
よって大略矩形状に形成されており、その一端面に発熱
抵抗2 と、可溶体3 と、リード端子4,5 とが直列接続と
なるように導電パターン6 が印刷配線されている。
The substrate 1 is made of paper phenol, ceramic or the like in a substantially rectangular shape, and has a heating resistor 2, a fusible body 3, and lead terminals 4 and 5 electrically connected to one end surface thereof so as to be connected in series. Pattern 6 is printed and wired.

【0017】発熱抵抗2 は、電流が流れると発熱する大
略矩形平板状をなすチップ抵抗であり、一平面部が基板
1 の所定箇所に高温半田により設けられている。可溶体
3 は、所定以上の温度になったとき溶断するように低融
点合金等によって大略矩形平板状に形成されており、一
平面部が基板1 の所定箇所に低温半田により設けられて
いる。可溶体3 を基板1 に設けるとき低温半田を使用し
た理由は、高温半田を使用すると可溶体3 が溶断してし
まうからである。なお、発熱抵抗2 と可溶体3との間の
導電パターン6 の長さは、発熱抵抗2 が切れる前に可溶
体3 が発熱抵抗2 から導電パターン6 を介して伝導され
た熱により溶断するような長さに決められている。リー
ド端子4,5 は、長板状に形成されており、先端側が基板
1 から突出するように基端の平面部が基板1 に高温半田
により設けられている。
The heating resistor 2 is a chip resistor in the shape of a substantially rectangular flat plate that generates heat when an electric current flows, and one plane portion is a substrate.
It is provided at a predetermined location of 1 by high temperature solder. Soluble body
The reference numeral 3 is formed in a substantially rectangular flat plate shape by a low melting point alloy or the like so as to be fused when the temperature exceeds a predetermined value, and one flat surface portion is provided at a predetermined position on the substrate 1 by low temperature soldering. The reason why the low temperature solder is used when the fusible body 3 is provided on the substrate 1 is that the fusible body 3 is melted and cut when the high temperature solder is used. The length of the conductive pattern 6 between the heating resistor 2 and the fusible element 3 is set so that the fusible element 3 is melted by the heat conducted from the heating resistor 2 through the conductive pattern 6 before the heating resistor 2 is cut off. It has been decided on the length. The lead terminals 4 and 5 are formed in a long plate shape, and the tip side is the substrate.
A flat surface of the base end is provided on the substrate 1 by high-temperature solder so as to project from 1.

【0018】次に、本実施例の動作について図2に基づ
いて説明する。リード端子4,5 を介して、発熱抵抗2 及
び可溶体3 に電流が流れると、その電流の大きさに応じ
て発熱抵抗2 が発熱する。回路保護素子は、入力電流が
定格入力であれば切れることがないが、入力電流が大き
くなれば可溶体3 が発熱抵抗2 よりも先に切れるように
なっている。
Next, the operation of this embodiment will be described with reference to FIG. When a current flows through the heating resistors 2 and the fusible body 3 via the lead terminals 4 and 5, the heating resistors 2 generate heat according to the magnitude of the current. The circuit protection element does not break if the input current is the rated input, but the fusible body 3 breaks before the heating resistor 2 when the input current increases.

【0019】以上より、本実施例は、発熱抵抗2 の一平
面部が高温半田により基板1 に設けられ、可溶体3 の一
平面部が低温半田により基板1 に設けられているので、
発熱抵抗2 及び可溶体3 が通常位置からずれにくくな
る。したがって、本実施例は、発熱抵抗2 に所定以上の
電流が流れたとき可溶体3 が溶断するので、確実に電流
を遮断することができる。また、本実施例は、リード端
子4,5 を基板1 の空いたスペースに設けたので、この回
路保護素子全体の形状を小型化することができ、また、
他の電子回路にリード端子4,5 にて接続したとき、大き
なスペースを取ることがない。
As described above, in this embodiment, one flat surface portion of the heating resistor 2 is provided on the substrate 1 by high temperature solder, and one flat surface portion of the fusible body 3 is provided on the substrate 1 by low temperature solder.
The heating resistance 2 and the fusible body 3 are less likely to be displaced from their normal positions. Therefore, in the present embodiment, the fusible body 3 melts down when a current of a predetermined value or more flows through the heating resistor 2, so that the current can be reliably cut off. Further, in this embodiment, since the lead terminals 4 and 5 are provided in the vacant space of the substrate 1, it is possible to downsize the whole shape of the circuit protection element.
It does not take up a lot of space when connected to other electronic circuits with lead terminals 4 and 5.

【0020】なお、本実施例では、発熱抵抗2 と可溶体
3 との間に導電パターン6 を介在させたが、発熱抵抗2
と可溶体3 とを密着させるようにしてもよい。
In this embodiment, the heating resistor 2 and the fusible element are used.
Although the conductive pattern 6 is interposed between the
The soluble body 3 may be closely attached.

【0021】また、本実施例では、可溶体3 を低融点合
金等により形成しその周囲を露出させたが、周囲に絶縁
材を被覆して温度ヒューズを構成してもよい。
Further, in the present embodiment, the fusible body 3 is formed of a low melting point alloy or the like and the periphery thereof is exposed, but the periphery may be covered with an insulating material to form a thermal fuse.

【0022】また、本実施例では、発熱抵抗2 をチップ
抵抗としたが、別のものを用いてもよい。例えば、発熱
抵抗2 を印刷により基板1 に設けられる抵抗(厚膜抵
抗,薄膜抵抗等)とした場合、発熱抵抗2 を基板1 に設
けるときの作業性を良くすることができ、発熱抵抗2 が
基板1 から通常位置からずれることがない。この発熱抵
抗2 は、入力電流の大きさに応じて厚膜抵抗と薄膜抵抗
とを使いわけるようにすればよい。この他、発熱抵抗2
を従来例にあるような発熱抵抗とした場合、可溶体3 が
動作不良を起こし、発熱抵抗2 が図2に示した発熱抵抗
オープン領域で切れたとき、音が発生し使用者に危機感
を与えることがあるので、望ましくは使用しないほうが
よい。
Further, in the present embodiment, the heating resistor 2 is a chip resistor, but another one may be used. For example, when the heating resistor 2 is a resistor (thick film resistor, thin film resistor, etc.) provided on the substrate 1 by printing, the workability when the heating resistor 2 is provided on the substrate 1 can be improved, and the heating resistor 2 can be It does not deviate from the normal position from board 1. As the heat generating resistor 2, a thick film resistor and a thin film resistor may be selectively used according to the magnitude of the input current. In addition to this, heat resistance 2
When the heat resistance is the same as in the conventional example, when the fusible body 3 malfunctions and the heat resistance 2 cuts in the heat resistance open area shown in Fig. 2, a sound is generated and the user feels a sense of crisis. Since it may be given, it is preferably not used.

【0023】さらに、本実施例では、基板1 に設けられ
た各部材を露出状態としたが、リード端子4,5 を除くよ
うにして基板1 にエポキシ樹脂等の樹脂を被着してもよ
い。この場合、発熱抵抗2 及び可溶体3 が樹脂により保
護されるので、外的な要因による損傷を防止することが
でき、発熱抵抗2 及び可溶体3 が樹脂により通常位置か
らさらにずれにくくなる。また、衝撃や大電流が流れる
ことにより内部の部材(発熱抵抗2 、可溶体3 )が壊れ
ても、それが飛び散ることがなく、安全である。
Further, in this embodiment, the respective members provided on the substrate 1 are exposed, but the lead terminals 4 and 5 may be removed, and a resin such as an epoxy resin may be attached to the substrate 1. . In this case, since the heat generating resistance 2 and the fusible body 3 are protected by the resin, damage due to external factors can be prevented, and the heat generating resistance 2 and the fusible body 3 are further less likely to be displaced from their normal positions by the resin. Further, even if the internal members (heating resistance 2, fusible body 3) are broken due to impact or large current flow, it is safe because it does not scatter.

【0024】[0024]

【発明の効果】請求項1記載の回路保護素子は、基板に
発熱抵抗の平面部及び可溶体の平面部が設けられるの
で、発熱抵抗及び可溶体が通常位置からずれにくくな
り、その結果、発熱抵抗に所定以上の電流が流れたとき
確実に電流を遮断することができる。
In the circuit protection element according to the first aspect of the present invention, since the flat portion of the heat generating resistor and the flat portion of the fusible body are provided on the substrate, the heat generating resistor and the fusible body are less likely to be displaced from their normal positions, and as a result, heat is generated. When a current more than a predetermined value flows through the resistor, the current can be surely cut off.

【0025】請求項2記載の回路保護素子は、請求項1
記載の効果に加え、リード端子を基板の空いたスペース
に設けた場合、全体の小型化が実現可能にすることがで
きる。
The circuit protection device according to a second aspect is the first aspect.
In addition to the effects described above, when the lead terminals are provided in the vacant space of the substrate, the miniaturization of the whole can be realized.

【0026】請求項3記載の回路保護素子は、請求項1
又は2記載の効果に加え、発熱抵抗を基板に設けるとき
の作業性を良くすることができる。また、発熱抵抗が通
常位置からずれることがないので、発熱抵抗に所定以上
の電流が流れたときさらに確実に電流を遮断することが
できる。
The circuit protection device according to claim 3 is the circuit protection device according to claim 1.
Alternatively, in addition to the effect described in 2, it is possible to improve workability when the heating resistor is provided on the substrate. Further, since the heat generating resistance does not deviate from the normal position, it is possible to more reliably interrupt the current when a current more than a predetermined value flows through the heat generating resistance.

【0027】請求項4記載の回路保護素子は、請求項1
乃至3の何れか記載の効果に加え、発熱抵抗及び可溶体
が樹脂により保護されるので、外的な要因による損傷を
防止することができる。また、発熱抵抗及び可溶体が樹
脂により通常位置からさらにずれにくくなるので、発熱
抵抗に所定以上の電流が流れたときさらに確実に電流を
遮断することができる。
The circuit protection device according to claim 4 is the circuit protection device according to claim 1.
In addition to the effect described in any one of 1 to 3, since the heat generation resistance and the fusible body are protected by the resin, damage due to external factors can be prevented. Further, since the heat generating resistor and the fusible body are more difficult to be displaced from the normal position by the resin, the current can be more surely cut off when a current more than a predetermined value flows through the heat generating resistor.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.

【図2】その入力電流による動作の特性を示すグラフで
ある。
FIG. 2 is a graph showing a characteristic of an operation according to the input current.

【図3】従来例の斜視図である。FIG. 3 is a perspective view of a conventional example.

【図4】その回路図である。FIG. 4 is a circuit diagram thereof.

【符号の説明】[Explanation of symbols]

1 基板 2 発熱抵抗 3 可溶体 4 リード端子 5 リード端子 6 導電パターン 1 Board 2 Heat resistance 3 Fusible body 4 Lead terminal 5 Lead terminal 6 Conductive pattern

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 所定の外郭を有する基板と、平板状をな
しその平面部が基板に設けられるものであって電流が流
れたとき発熱する発熱抵抗と、平板状をなしその平面部
が基板に設けられるものであって所定以上の温度になっ
たとき溶断する可溶体と、発熱抵抗と可溶体とが直列接
続となるよう基板に印刷配線された導電パターンとを備
えた回路保護素子。
1. A substrate having a predetermined contour, a flat plate-shaped flat portion provided on the substrate, and a heating resistor that generates heat when an electric current flows, and a flat plate-shaped flat portion on the substrate. What is provided is a circuit protection element, comprising a fusible body that melts and cuts when a temperature rises above a predetermined level, and a conductive pattern printed and printed on a substrate so that a heating resistor and the fusible body are connected in series.
【請求項2】 前記基板に、発熱抵抗と可溶体とを含む
ように直列接続する導電パターンの両端にリード端子を
設けてなる請求項1記載の回路保護素子。
2. The circuit protection element according to claim 1, wherein lead terminals are provided at both ends of a conductive pattern that is connected in series on the substrate so as to include a heating resistor and a fusible body.
【請求項3】 前記発熱抵抗を、印刷により基板に設け
てなる請求項1又は2記載の回路保護素子。
3. The circuit protection element according to claim 1, wherein the heat generating resistor is provided on the substrate by printing.
【請求項4】 前記基板に、少なくとも発熱抵抗及び可
溶体を被うよう樹脂を被着してなる請求項1乃至3の何
れか記載の回路保護素子。
4. The circuit protection element according to claim 1, wherein the substrate is covered with a resin so as to cover at least the heat generating resistance and the fusible body.
JP975494A 1994-01-31 1994-01-31 Circuit protective element Pending JPH07220597A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP975494A JPH07220597A (en) 1994-01-31 1994-01-31 Circuit protective element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP975494A JPH07220597A (en) 1994-01-31 1994-01-31 Circuit protective element

Publications (1)

Publication Number Publication Date
JPH07220597A true JPH07220597A (en) 1995-08-18

Family

ID=11729085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP975494A Pending JPH07220597A (en) 1994-01-31 1994-01-31 Circuit protective element

Country Status (1)

Country Link
JP (1) JPH07220597A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015177190A (en) * 2014-03-17 2015-10-05 スマート エレクトロニクス インク fuse resistor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015177190A (en) * 2014-03-17 2015-10-05 スマート エレクトロニクス インク fuse resistor
US9697969B2 (en) 2014-03-17 2017-07-04 Smart Electronics Inc. Fuse resistor

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