JPH0126543B2 - - Google Patents
Info
- Publication number
- JPH0126543B2 JPH0126543B2 JP58106701A JP10670183A JPH0126543B2 JP H0126543 B2 JPH0126543 B2 JP H0126543B2 JP 58106701 A JP58106701 A JP 58106701A JP 10670183 A JP10670183 A JP 10670183A JP H0126543 B2 JPH0126543 B2 JP H0126543B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- liquid
- cooling
- fins
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/73—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58106701A JPS59232448A (ja) | 1983-06-16 | 1983-06-16 | 液冷容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58106701A JPS59232448A (ja) | 1983-06-16 | 1983-06-16 | 液冷容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59232448A JPS59232448A (ja) | 1984-12-27 |
| JPH0126543B2 true JPH0126543B2 (cg-RX-API-DMAC10.html) | 1989-05-24 |
Family
ID=14440306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58106701A Granted JPS59232448A (ja) | 1983-06-16 | 1983-06-16 | 液冷容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59232448A (cg-RX-API-DMAC10.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0251836B1 (en) * | 1986-05-30 | 1991-07-17 | Digital Equipment Corporation | Integral heat pipe module |
| US5655598A (en) * | 1995-09-19 | 1997-08-12 | Garriss; John Ellsworth | Apparatus and method for natural heat transfer between mediums having different temperatures |
| US6019167A (en) * | 1997-12-19 | 2000-02-01 | Nortel Networks Corporation | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
| US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
| US6820684B1 (en) * | 2003-06-26 | 2004-11-23 | International Business Machines Corporation | Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
-
1983
- 1983-06-16 JP JP58106701A patent/JPS59232448A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59232448A (ja) | 1984-12-27 |