JPH0126530B2 - - Google Patents
Info
- Publication number
- JPH0126530B2 JPH0126530B2 JP56165034A JP16503481A JPH0126530B2 JP H0126530 B2 JPH0126530 B2 JP H0126530B2 JP 56165034 A JP56165034 A JP 56165034A JP 16503481 A JP16503481 A JP 16503481A JP H0126530 B2 JPH0126530 B2 JP H0126530B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- feed
- attached
- pulse motor
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Die Bonding (AREA)
- Control Of Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56165034A JPS5866341A (ja) | 1981-10-16 | 1981-10-16 | リ−ドフレ−ム及びキヤリアの移送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56165034A JPS5866341A (ja) | 1981-10-16 | 1981-10-16 | リ−ドフレ−ム及びキヤリアの移送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5866341A JPS5866341A (ja) | 1983-04-20 |
| JPH0126530B2 true JPH0126530B2 (enFirst) | 1989-05-24 |
Family
ID=15804572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56165034A Granted JPS5866341A (ja) | 1981-10-16 | 1981-10-16 | リ−ドフレ−ム及びキヤリアの移送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5866341A (enFirst) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60145141U (ja) * | 1984-03-09 | 1985-09-26 | 株式会社東芝 | Icフレ−ムの搬送整列装置 |
| JPS6197836U (enFirst) * | 1984-11-30 | 1986-06-23 |
-
1981
- 1981-10-16 JP JP56165034A patent/JPS5866341A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5866341A (ja) | 1983-04-20 |
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