JPH01255567A - Thermal head for printer - Google Patents

Thermal head for printer

Info

Publication number
JPH01255567A
JPH01255567A JP8298088A JP8298088A JPH01255567A JP H01255567 A JPH01255567 A JP H01255567A JP 8298088 A JP8298088 A JP 8298088A JP 8298088 A JP8298088 A JP 8298088A JP H01255567 A JPH01255567 A JP H01255567A
Authority
JP
Japan
Prior art keywords
electrode
layer
electrodes
resistance layer
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8298088A
Other languages
Japanese (ja)
Inventor
Kazuya Oishi
一哉 大石
Tatsuo Honda
本田 龍夫
Tadashi Ito
廉 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Holdings Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Koki Co Ltd filed Critical Hitachi Ltd
Priority to JP8298088A priority Critical patent/JPH01255567A/en
Publication of JPH01255567A publication Critical patent/JPH01255567A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To facilitate the formation of an optimum heating resistance layer for an electrode pattern, by providing a reference position mark for processing the heating resistance layer together when the electrode pattern is formed or after it is formed. CONSTITUTION:A glass glazed layer 2 is laminated on a head insulation substrate 1 formed of alumina ceramic or the like, and a plurality of electrodes 3 and 4 formed of metal conductors are provided thereon at an equal interval. In addition, marks 7 and 8 are also formed. The common electrode 3 and the electrode 4 are insulated on the glazed layer 2, and a resistance layer 5 is laminated thereon in the shape of a belt so that it intersects the electrodes 3 and 4. In the resistance layer 5, slits 6 are provided in the direction perpendicular to the longitudinal direction of this layer and substantially in the vicinity of the center between the electrodes provided in juxtaposition. Since the relative positional relation with an electrode pattern is very important for a slit processing as a countermeasure for cross talk, the marks are advantageous as references for the slit processing. In addition, the relative positional relation with the electrodes can be known easily from the marks, and this is very favorable for a forming processing of the resistance layer.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は発熱式ファクシミリや発熱式プリンタ装置など
に係わり、特に記録部のサーマルヘッドに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat-generating facsimile machine, a heat-generating printer device, etc., and particularly relates to a thermal head of a recording section.

〔従来の技術〕[Conventional technology]

一般によく知られているように、プリンタ用サーマルヘ
ッドはセラミック材を基板としてその表面に蓄熱のため
のガラス系のグレーズ層を設け、その上に電極層及びプ
リント用発熱抵抗体層を備えたものを複数個並設し、さ
らにその上に高伝熱性の保護膜層を積層して構成される
。そして電極に選択的に電気信号を加えることで抵抗体
を発熱させ、記録紙に直接熱を伝えたり、インク紙を介
した熱転写により所要の文字や図形を発色印刷する手段
である。電極層に積層して形成された発熱抵抗体層は、
並設された複数個の電極と交差して帯状に積層されるの
が普通であるが、この発熱抵抗体層に流れる電流は所定
の対向する電極のみならず、隣接した電極に対しても分
流する場合が生ずる。これが一般にクロストークと称さ
れるものである。記録濃度が高い場合にはあまり問題に
ならないが、濃度の低い場合すなわち、例えば1画素の
記録を行うような場合にはむしろクロストークの少ない
のが好ましいこのため例えば特開昭62−164560
号に述べられているごとく対向する電極と隣接する電極
間上に位置する抵抗層にスリット加工又は分割するなど
して分流を防ぐ方法がとられる。ところで従来、スリッ
ト加工する際の位置合わせにはその基準点の設置が明確
でなかったため、最適スリット位置がずれるなどの不具
合があった。このため均一な記録画素が得にくいなどの
難点があった。しかし従来技術にはこの点の具体的な方
法が明示されていないのが現状であった。
As is generally well known, a thermal head for printers uses a ceramic material as a substrate, has a glass-based glaze layer on its surface for heat storage, and has an electrode layer and a heating resistor layer for printing on top of that. It is constructed by arranging multiple layers in parallel, and then layering a highly heat conductive protective film layer on top of the layers. By selectively applying electric signals to the electrodes, the resistor generates heat, and the heat is directly transmitted to the recording paper, or the desired characters and figures are colored and printed by thermal transfer via the ink paper. The heating resistor layer formed by laminating the electrode layer is
Normally, the layers are stacked in a band shape, crossing multiple electrodes arranged in parallel, but the current flowing through this heating resistor layer is shunted not only to a predetermined opposing electrode, but also to adjacent electrodes. There are cases where this happens. This is generally called crosstalk. This is not much of a problem when the recording density is high, but when the density is low, for example when recording one pixel, it is preferable to have less crosstalk.
As described in the above-mentioned No. 1, a method of preventing current splitting is taken, such as by forming slits or dividing the resistance layer located between the opposing electrodes and the adjacent electrodes. By the way, in the past, the setting of the reference point for positioning during slit processing was not clear, which caused problems such as the optimum slit position being shifted. For this reason, there were problems such as difficulty in obtaining uniform recorded pixels. However, the current state of the art is that no specific method for this point has been specified in the prior art.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記スリット加工には一般に例えばレーザ光などによる
トリミング加工法が用いられるが、電極との位置関係が
極めて重要になる。しかしながら電極パターン形成後、
その上に不透明の発熱抵抗層を積層して形成するため正
確な位置を掴み難いなどの問題があった。すなわち複数
の相対向する電極間の中心線の上に抵抗ペーストを印刷
、焼結して形成するが、抵抗層が一般にずれて設けられ
る場合の多いことがその原因となるところである。
For the above-mentioned slit processing, a trimming method using, for example, a laser beam is generally used, but the positional relationship with the electrode is extremely important. However, after forming the electrode pattern,
Since an opaque heat generating resistor layer is laminated on top of the heat generating resistor layer, there are problems such as difficulty in determining the exact position. That is, a resistive paste is printed and sintered on the center line between a plurality of opposing electrodes, but this is caused by the fact that the resistive layer is generally disposed in an offset manner.

本発明の目的は、クロストークの少ない良好なサーマル
ヘッドを得るため、電極パターンに対する最適な発熱抵
抗層の形成を容易にならしむるにある。
SUMMARY OF THE INVENTION An object of the present invention is to facilitate the formation of an optimal heating resistor layer for an electrode pattern in order to obtain a good thermal head with less crosstalk.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的は、ヘッド絶縁基板上にグレーズ層を付着させ
た後で、電極パターンを形成する際、若しくは形成後1
発熱抵抗層加工用のマークパターンをも形成しておく、
電極上に積層された抵抗層にスリット加工をする際、こ
のマークを基準位置として認識して加工時の位置合わせ
を行ない、例えばレーザ光などにより最適形状、サイズ
のトリミング加工が容易に、かつ正確に達成できること
になる。なお、マーク形成位置は抵抗層の位置以外を選
ぶことで何んら加工の障害とはならない。
The above purpose is used when forming the electrode pattern after depositing the glaze layer on the head insulating substrate, or immediately after forming the electrode pattern.
Also form a mark pattern for processing the heating resistor layer.
When cutting slits in the resistor layer stacked on the electrode, this mark is recognized as a reference position and aligned during processing, making it easy and accurate to trim the optimum shape and size using laser beams, etc. can be achieved. Note that by selecting a mark forming position other than the position of the resistive layer, there will be no hindrance to processing.

さらにヘッド基板上に予め電極用導体材と発熱抵抗体材
を積層付着させ、その後にエツチング法などにより両者
を所定のパターンにトリミング形成する場合においても
、前記と同様に電極パターン形成と同時にマークパター
ンをも考慮しておくことで、電極位置に対する発熱抵抗
層との相対位置関係が容易に、正確に得ることができる
Furthermore, even when the electrode conductor material and the heat generating resistor material are laminated and adhered on the head substrate in advance, and then both are trimmed into a predetermined pattern by etching or the like, the mark pattern is formed at the same time as the electrode pattern is formed as described above. By also taking this into account, the relative positional relationship between the electrode position and the heating resistor layer can be easily and accurately obtained.

〔作用〕[Effect]

本発明は、発熱抵抗層に対して例えばレーザ光などを用
いてスリットトリミング加工などをするにあたり、適正
かつ正確な加工すべき位置決めをするために、電極パタ
ーンを形成時、若しくは形成後に併せて基準位置マーク
を、も予め設けておくことで、この基準位置から算出し
た所定のサイズ、形状のスリットの加工位置を正確に掴
むことができ、加工精度の向上が図れる。
In order to properly and accurately position the heat-generating resistor layer for slit trimming using a laser beam, etc., the present invention provides a standard for forming an electrode pattern during or after forming the electrode pattern. By providing a position mark in advance, the processing position of a slit of a predetermined size and shape calculated from this reference position can be accurately grasped, and processing accuracy can be improved.

〔実施例〕〔Example〕

以下1本発明の一実施例を第1図〜第2図により説明す
る。第1図はサーマルヘッドの部分拡大した斜視図であ
り、第2図は第1図を上部から見た平面図である。アル
ミナセラミック等で成型されたヘッド絶縁基板1上にガ
ラスグレーズWJ2が積層され、その上に金属導体でな
る電極3,4が複数個等間隔に設ける。このようにして
平行パターンが形成されている。またマーク7.8も形
成されである。このうち電極3は共通電極である。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a partially enlarged perspective view of the thermal head, and FIG. 2 is a plan view of FIG. 1 viewed from above. A glass glaze WJ2 is laminated on a head insulating substrate 1 made of alumina ceramic or the like, and a plurality of electrodes 3 and 4 made of metal conductors are provided thereon at equal intervals. In this way, parallel patterns are formed. Marks 7.8 are also formed. Among these electrodes, electrode 3 is a common electrode.

共通電極3と電極4とはグレーズ層5上で絶縁されてお
り、この上に抵抗層5を電極3,4と交差して帯状に積
層しである。従って発熱ドツトを発生すべく選択された
所定の対向電極間に信号電圧が電極4側から供給される
と、その電流の流路は電極4から抵抗層5へ矢印で示す
ような径路で共通電極3へと流れることになる。また抵
抗層5にはその長手方向と直角方向に、そして並設され
た電極間のほぼ中央付近にスリット6を設けである。
The common electrode 3 and the electrode 4 are insulated on a glaze layer 5, and a resistive layer 5 is laminated thereon in a band shape intersecting with the electrodes 3 and 4. Therefore, when a signal voltage is supplied from the electrode 4 side between the predetermined opposing electrodes selected to generate heating dots, the current flow path is from the electrode 4 to the resistance layer 5 along the path shown by the arrow, and then the common electrode It will move on to 3. Further, a slit 6 is provided in the resistance layer 5 in a direction perpendicular to its longitudinal direction and approximately in the center between the electrodes arranged in parallel.

このスリット6により選択された所定の対向電極と隣接
する共通電極へ向おうとする電流は妨げられ、対向電極
間のみに集中して流れることになる。
The slit 6 prevents the current from flowing toward the common electrode adjacent to the selected counter electrode, so that the current flows concentrated only between the counter electrodes.

なお実際には発熱抵抗層5の上にさらに高伝熱性の保護
膜層を設け、記録紙との摺動摩耗の防止を図っているが
図示は省略した。
In reality, a highly heat conductive protective film layer is further provided on the heat generating resistor layer 5 to prevent sliding wear on the recording paper, but this is not shown.

上記構成によれば一般には発熱抵抗層の形成は、金属マ
スクパターンで電極の上から抵抗体材を均−に成膜し焼
結加工する。このため焼結後の形状変化及び電極パター
ンとの若干の位置ずれ等の発生は否めない、クロストー
ク対策としてのスリット加工は電極パターンとの相対位
置関係が極めて重要なため、前記電極成形の際に設けら
れたマークがスリット加工の基準として都合がよい。こ
のようなマークによる電極との相対位置関係を容易に掴
むことができるため、抵抗層の成形加工上極めて有利に
なる。ところでマークの設置数量、形状、形成位置は限
定されず、任意に選べることは容易に理解される。電極
パターンとの相対位置関係が明確にでき、電極に対する
電気的悪影響を及ぼさず、かつ電極パターン製作上都合
のよいものを選べることは勿論である。すなわち第3図
〜第5図に他の実施例を示した。第3図はマーク7が細
線でしかも凹状に切欠きによってマーキングした場合を
示しており、第4図はマーク7.8をペース基板の対角
線上の位置に2個設けた場合を示しており、第5図は点
状のマーク7.8を電極上に印した場合の実施例である
。マークは電極と一体的に形成してもよく、印刷による
厚膜であってもまた蒸着による薄膜の場合での形成のい
ずれであってもよい。
According to the above structure, the heating resistor layer is generally formed by uniformly depositing the resistor material on the electrode using a metal mask pattern and then sintering the resistor material. For this reason, it is unavoidable that the shape changes after sintering and slight positional deviation with the electrode pattern occurs.When forming slits as a crosstalk countermeasure, the relative positional relationship with the electrode pattern is extremely important, so when forming the electrode, The mark provided on the surface is convenient as a reference for slit processing. Since the relative positional relationship with the electrode can be easily grasped by such a mark, it is extremely advantageous in forming the resistive layer. By the way, it is easily understood that the number, shape, and formation position of marks are not limited and can be arbitrarily selected. Of course, it is possible to select a material that has a clear relative positional relationship with the electrode pattern, does not have an electrically adverse effect on the electrode, and is convenient for manufacturing the electrode pattern. That is, other embodiments are shown in FIGS. 3 to 5. Fig. 3 shows a case in which the mark 7 is a thin line marked with a concave notch, and Fig. 4 shows a case in which two marks 7 and 8 are provided diagonally on the pace board. FIG. 5 shows an example in which dot-shaped marks 7.8 are marked on the electrodes. The mark may be formed integrally with the electrode, and may be formed as a thick film by printing or a thin film by vapor deposition.

〔発明の効果〕〔Effect of the invention〕

以上詳述したように本発明によれば、発熱抵抗層のスリ
ットが電極パターンに対する最適な位置と形状に加工で
きるため、クロストークの少ない高品質の記録画素が得
られるといった効果を奏する。
As described in detail above, according to the present invention, the slits in the heating resistor layer can be processed to the optimal position and shape with respect to the electrode pattern, so that high-quality recording pixels with less crosstalk can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例を示すサーマルヘッド斜視図、
第2図は第1図に示す実施例の平面図、第3図〜第5図
は本発明による他の実施例を示すサーマルヘッド斜視図
である。 1・・・絶縁基板、2・・・グレーズ層、3・・・共通
電極、4・・・電極、5・・・抵抗層、6・・・スリッ
ト、7,8・・・マーク。 第1図 3第2図 第3図 第4図 第5図 4ろ
FIG. 1 is a perspective view of a thermal head showing an embodiment of the present invention;
FIG. 2 is a plan view of the embodiment shown in FIG. 1, and FIGS. 3 to 5 are perspective views of a thermal head showing other embodiments of the present invention. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Glaze layer, 3... Common electrode, 4... Electrode, 5... Resistance layer, 6... Slit, 7, 8... Mark. Figure 1 Figure 3 Figure 2 Figure 3 Figure 4 Figure 5 Figure 4

Claims (1)

【特許請求の範囲】 1、絶縁基板と、少なくとも該絶縁基板上に対向する電
極層、発熱抵抗体からなる抵抗層とを順次積層してなる
プリンタ用サーマルヘッドにおいて、目視可能な位置に
あつて対向する電極間の中心位置を見い出すことのでき
るマークを少なくとも1個具備したことを特徴とするプ
リンタ用サーマルヘッド。 2、前記マークは、少なくとも点または線、若しくはこ
れらの集合体形状からなり、少なくとも1個備えたこと
を特徴とする特許請求の範囲第1項記載のプリンタ用サ
ーマルヘッド。 3、前記マークの形状は、凸または凹状に設けられたこ
とを特徴とする特許請求の範囲第1項記載のプリンタ用
サーマルヘッド。
[Scope of Claims] 1. A thermal head for a printer comprising an insulating substrate, at least an electrode layer facing the insulating substrate, and a resistance layer consisting of a heating resistor, which are successively laminated at a visually visible position. A thermal head for a printer, comprising at least one mark by which the center position between opposing electrodes can be found. 2. The thermal head for a printer according to claim 1, wherein the mark is composed of at least one dot or line, or an aggregate shape thereof. 3. The thermal head for a printer according to claim 1, wherein the mark is provided in a convex or concave shape.
JP8298088A 1988-04-06 1988-04-06 Thermal head for printer Pending JPH01255567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8298088A JPH01255567A (en) 1988-04-06 1988-04-06 Thermal head for printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8298088A JPH01255567A (en) 1988-04-06 1988-04-06 Thermal head for printer

Publications (1)

Publication Number Publication Date
JPH01255567A true JPH01255567A (en) 1989-10-12

Family

ID=13789363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8298088A Pending JPH01255567A (en) 1988-04-06 1988-04-06 Thermal head for printer

Country Status (1)

Country Link
JP (1) JPH01255567A (en)

Similar Documents

Publication Publication Date Title
US3903393A (en) Thermal printing head
US4651168A (en) Thermal print head
US4399444A (en) Heat-sensitive recording head
US4138605A (en) Thermal printing head
JPS60129272A (en) Printing head for electrolytic printer and manufacture thereof
JPH01255567A (en) Thermal head for printer
US4965589A (en) Recording head having spaced-apart electrodes
US4635075A (en) Thermal print head and process for producing
JPH03227662A (en) Thermal head
JP2686318B2 (en) Method of manufacturing energization type recording head
JP3033064B2 (en) Thermal head
JP2575554B2 (en) Edge type thermal head
JPS5812775A (en) Manufacture of thermal head
JPS61139453A (en) Thermal head
JP2605729B2 (en) Thermal head
JP3348927B2 (en) Method of manufacturing thick film type thermal print head
JP2554556B2 (en) Thermal print head
JPS61272169A (en) Thermal head
JPH03184875A (en) Thermal head
JPH0725175B2 (en) Thermal head
JPS62288062A (en) Thermal head
JPH01264202A (en) Resistance device for hybrid integrated circuit
JPH05318796A (en) Thermal head
JPS61188161A (en) Thermal head and its positioning
JPH03258558A (en) Printing head