JPH01255514A - Transfer mold die - Google Patents

Transfer mold die

Info

Publication number
JPH01255514A
JPH01255514A JP63082198A JP8219888A JPH01255514A JP H01255514 A JPH01255514 A JP H01255514A JP 63082198 A JP63082198 A JP 63082198A JP 8219888 A JP8219888 A JP 8219888A JP H01255514 A JPH01255514 A JP H01255514A
Authority
JP
Japan
Prior art keywords
cavity
mold
ejector pin
mirror
light accepting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63082198A
Other languages
Japanese (ja)
Inventor
Mitsuru Koarai
満 小荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Video Corp
Pioneer Corp
Original Assignee
Pioneer Video Corp
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Video Corp, Pioneer Electronic Corp filed Critical Pioneer Video Corp
Priority to JP63082198A priority Critical patent/JPH01255514A/en
Priority to KR1019880012202A priority patent/KR910008613B1/en
Publication of JPH01255514A publication Critical patent/JPH01255514A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings

Abstract

PURPOSE:To carry out mirror processing easily by installing an ejector pin with its end face as a mirror surface in a position facing to a light accepting surface of a light accepting element in a cavity for molding the light accepting element. CONSTITUTION:An ejector pin 7 is installed being able to be disclosed or undisclosed in a position to a light accepting surface of a light accepting element molded in a cavity 6, that is in the center. The end of said ejector pin 7 is finished as a mirror surface 8, smooth and of high accuracy. Transparent plastic such as epoxy resin or the like is injected into the cavity 6, and the plastic is heated by the heat of a mold block 5 heated by a heater and cured, while the surface of said plastic mold 9 is finished up with the surface roughness same as the surface roughness of the cavity 6. As a result, the roughness of the surface of a light accepting surface 10 of the plastic mold 9 is determined by the mirror surface 8 of the ejector pin 7, and a mirror surface of highly accurate finishing is formed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、フォトダイオード等の受光素子を、透明なエ
ポキシ樹脂等のプラスチックでモールドするためのトラ
ンスファーモールド金型の改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a transfer mold die for molding a light receiving element such as a photodiode with a transparent plastic such as an epoxy resin.

〔従来の技術〕[Conventional technology]

従来のこの種のトランスファーモールド金型を第４図、
第５図に示す。A conventional transfer mold of this type is shown in Figure 4.
It is shown in FIG.

このトランスファーモールド金型は、金型ブロック１内
に受光素子をモールドするプラスチックが注入されるキ
ャビティ２が設けられ、受光素子の受光部に対向するキ
ャビティ２の中心部は鏡面４に仕上げられている。This transfer mold mold is provided with a cavity 2 in which plastic for molding a light-receiving element is injected into a mold block 1, and the center of the cavity 2 facing the light-receiving part of the light-receiving element is finished with a mirror surface 4. .

そして、この鏡面４の左右両側にイジェクターピン３が
出没自在に設けられているものである。Ejector pins 3 are provided on both the left and right sides of this mirror surface 4 so as to be freely retractable.

このキャビティ２内に注入された樹脂は、金型ブロック
１を加熱するヒータの熱によって加熱され、熱硬化する
。The resin injected into the cavity 2 is heated by the heat of the heater that heats the mold block 1, and is thermally hardened.

この熱硬化によって必要充分な機械的強度にまでプラス
チックが硬化した後、イジェクターピン３が突出してプ
ラスチックが押出され、製品Ａの離型が行われる。After the plastic is hardened to a necessary and sufficient mechanical strength by this thermosetting, the ejector pin 3 protrudes, the plastic is extruded, and the product A is released from the mold.

この製品Ａは、第６図に示すようにキャビティ２の表面
粗さと同じ表面粗さに仕上げられるため、受光素子の受
光部の表面となる表面は、キャビティ２の鏡面４によっ
て鏡面Ａ、に仕上げられる。Since this product A is finished to have the same surface roughness as the surface roughness of the cavity 2 as shown in FIG. It will be done.

従って、受光素子に入射する光線は、乱されることなく
受光素子に入射されるものである。Therefore, the light beam incident on the light receiving element is incident on the light receiving element without being disturbed.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の前述のトランスファーモールド金型においては、
キャビティ２の中心部に鏡面４を形成するため、金型ブ
ロック１そのものに、しかも窪んでいるキャビティ２内
に鏡面加工を行わなければならない。In the conventional transfer mold mold mentioned above,
In order to form a mirror surface 4 in the center of the cavity 2, mirror finishing must be performed on the mold block 1 itself, and moreover, on the inside of the cavity 2, which is recessed.

そのために、鏡面加工作業が困難であるばかりでな（、
多くの手間がかかっていた。This not only makes mirror finishing work difficult (,
It took a lot of effort.

又、この鏡面４が傷ついたり、損傷したりした場合には
、１キヤビテイを形成するｌチェース全部を交換しなけ
ればならないため、補修費用、時間を必要とする等の欠
点があった。In addition, if the mirror surface 4 is scratched or damaged, the entire l chase forming one cavity must be replaced, resulting in disadvantages such as increased repair costs and time.

〔発明の目的〕[Purpose of the invention]

本発明は、従来のトランスファーモールド金型における
前述の欠点を解消し、受光素子の受光面となるプラスチ
ックモールドの表面を鏡面とするための鏡面加工を行い
易くすると共に、この鏡面が損傷した場合でも容易、且
つ短時間に補修できるトランスファーモールド金型を提
供することを目的とする。The present invention eliminates the above-mentioned drawbacks of conventional transfer mold molds, makes it easy to perform mirror finishing on the surface of the plastic mold that becomes the light-receiving surface of the light-receiving element, and even when the mirror surface is damaged. The purpose of the present invention is to provide a transfer mold die that can be repaired easily and in a short time.

〔発明の概要〕[Summary of the invention]

本発明は前述の目的を達成するために、受光素子をモー
ルドするためのキャビティにおける受光素子の受光面に
対向する位置に、先端面を鏡面としたイジェクターピン
を設けたことを要旨とするものである。In order to achieve the above-mentioned object, the present invention is characterized in that an ejector pin with a mirror-finished tip is provided in a cavity for molding the light receiving element at a position facing the light receiving surface of the light receiving element. be.

〔実施例〕〔Example〕

次に、本発明の実施の一例を、第１図、第２図について
説明する。Next, an example of implementation of the present invention will be described with reference to FIGS. 1 and 2.

５はキャビティ６を形成した金型ブロックで、このキャ
ビティ６内にモールドされる受光素子の受光面に対向す
る位置、即ち中心にイジェクターピン７が出没可能に設
けられる。Reference numeral 5 denotes a mold block in which a cavity 6 is formed, and an ejector pin 7 is retractably provided at a position facing the light-receiving surface of the light-receiving element molded within the cavity 6, that is, at the center.

このイジェクターピン７の先端は、平滑な高精度の鏡面
８に仕上げられているものである。The tip of this ejector pin 7 is finished into a smooth, highly accurate mirror surface 8.

このトランスファーモールド金型は、従来と同様に、エ
ポキシ樹脂等の透明プラスチックがそのキャビティ６に
注入される。In this transfer mold mold, transparent plastic such as epoxy resin is injected into the cavity 6 as in the conventional case.

そして、ヒータで加熱されている金型ブロック５の熱に
よってプラスチックが加熱されて硬化するが、第３図に
示すこのプラスチックモールド９はキャビティ６の表面
粗さと同じ表面粗さに、表面が仕上げられる。Then, the plastic is heated and hardened by the heat of the mold block 5 heated by the heater, and the surface of this plastic mold 9 shown in FIG. 3 is finished to the same surface roughness as the surface roughness of the cavity 6. .

そのため、プラスチックモールド９の受光面ｌＯの表面
は、イジェクターピン７の鏡面８によって面粗さは決定
されるので、高精度な鏡面に仕上げられることとなる。Therefore, the surface roughness of the light-receiving surface IO of the plastic mold 9 is determined by the mirror surface 8 of the ejector pin 7, so that it is finished into a highly accurate mirror surface.

このプラスチックモールド９が必要充分な機械的強度に
まで硬化した後、プラスチックモールド９をキャビティ
６から離型するが、この時イジェクターピン７はキャビ
ティ６から突出し、プラスチックモールド９を押出し、
その成型が完了する。After this plastic mold 9 has hardened to a necessary and sufficient mechanical strength, the plastic mold 9 is released from the cavity 6, but at this time, the ejector pin 7 protrudes from the cavity 6 and extrudes the plastic mold 9.
The molding is completed.

〔発明の効果〕〔Effect of the invention〕

本発明は畝上のように、受光素子をモールドするキャビ
ティの受光面位置に先端面を鏡面としたイジェクターピ
ンを設けたので、キャビティに鏡面加工を施す必要がな
（なり、イジェクターピンの先端面に鏡面加工を施せば
よいこととなる。In the present invention, an ejector pin with a mirror-finished tip surface is provided at the light-receiving surface position of the cavity in which the light-receiving element is molded, like a ridge, so there is no need to mirror-finish the cavity. All that is required is to apply a mirror finish to the surface.

従って、その鏡面加工が容易となるばかりでなく、鏡面
加工の手間や時間が著しく削減され、そのコストを大巾
に引き下げることができる。Therefore, the mirror finishing is not only facilitated, but also the effort and time required for the mirror finishing is significantly reduced, and the cost can be significantly reduced.

又、この鏡面が損傷した場合でも、イジェクターピンの
交換のみで足り、この補修のため金型を成型機から取り
外す必要がなくなったこと、金型そのものへの補修も要
しないこと等によって、補修の時間、作業の容易性等に
よって、補修のコストも引き下げが可能となるものであ
る。Furthermore, even if this mirror surface is damaged, it is only necessary to replace the ejector pin, and there is no need to remove the mold from the molding machine for repair, and there is no need to repair the mold itself, which makes repair work easier. The cost of repair can also be reduced depending on time, ease of work, etc.

さらに、イジェクターピンをキャビティ中央部に配設す
ることにより、金型構造を簡素化できると共に離型性の
向上が可能となるものである。Further, by arranging the ejector pin in the center of the cavity, it is possible to simplify the mold structure and improve mold releasability.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の断面図、 第２図はその下面図、 第３図はその製品の受光素子モールドの斜面図、第４図
は従来の金型の断面図、 第５図はその下面図、 第６図はその製品の受光素子モールドの斜面図である。 ５・・・金型ブロック、６・・・キャビティ、７・・・
イジェクターピン、訃＠面、９・・・プラスチックモー
ルド、１０・・・受光面。 特許出願人　　パイオニア株式会社 同　　　　　パイオニアビデオ株式会社第１因 り 第２０ 第３図Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a bottom view thereof, Fig. 3 is an oblique view of a light-receiving element mold of the product, Fig. 4 is a sectional view of a conventional mold, and Fig. 5 The figure is a bottom view, and Figure 6 is an oblique view of the light-receiving element mold of the product. 5... Mold block, 6... Cavity, 7...
Ejector pin, bottom surface, 9... plastic mold, 10... light receiving surface. Patent Applicant Pioneer Corporation Pioneer Video Corporation No. 1 Reason 20 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 　フォトダイオード等の受光素子を透明なエポキシ樹脂
等のプラスチックでモールドする金型のキャビティにお
ける受光素子の受光部に対向する位置に先端を鏡面とし
たイジェクターピンを配設したことを特徴とするトラン
スファーモールド金型。A transfer mold characterized in that an ejector pin with a mirror-finished tip is disposed in a cavity of a mold in which a light-receiving element such as a photodiode is molded with plastic such as transparent epoxy resin at a position facing the light-receiving part of the light-receiving element. Mold.
JP63082198A 1988-04-05 1988-04-05 Transfer mold die Pending JPH01255514A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63082198A JPH01255514A (en) 1988-04-05 1988-04-05 Transfer mold die
KR1019880012202A KR910008613B1 (en) 1988-04-05 1988-09-21 Transfer mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63082198A JPH01255514A (en) 1988-04-05 1988-04-05 Transfer mold die

Publications (1)

Publication Number Publication Date
JPH01255514A true JPH01255514A (en) 1989-10-12

Family

ID=13767728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63082198A Pending JPH01255514A (en) 1988-04-05 1988-04-05 Transfer mold die

Country Status (2)

Country Link
JP (1) JPH01255514A (en)
KR (1) KR910008613B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2809228A1 (en) * 2000-05-22 2001-11-23 St Microelectronics Sa Injection mold for encapsulating opto=electronic integrated circuit has insert fitted into cavity with front surface parallel to face of circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60105515A (en) * 1983-11-14 1985-06-11 Nec Corp Mold
JPS6042614B2 (en) * 1984-06-21 1985-09-24 九州日本電気株式会社 Bonding method for semiconductor devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60105515A (en) * 1983-11-14 1985-06-11 Nec Corp Mold
JPS6042614B2 (en) * 1984-06-21 1985-09-24 九州日本電気株式会社 Bonding method for semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2809228A1 (en) * 2000-05-22 2001-11-23 St Microelectronics Sa Injection mold for encapsulating opto=electronic integrated circuit has insert fitted into cavity with front surface parallel to face of circuit
US6858933B2 (en) 2000-05-22 2005-02-22 Stmicroelectronics S.A. Injection mold for an optical semiconductor package and corresponding optical semiconductor package

Also Published As

Publication number Publication date
KR910008613B1 (en) 1991-10-19
KR890015837A (en) 1989-11-25

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