KR890015837A - Transfer Mold Mold - Google Patents

Transfer Mold Mold Download PDF

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Publication number
KR890015837A
KR890015837A KR1019880012202A KR880012202A KR890015837A KR 890015837 A KR890015837 A KR 890015837A KR 1019880012202 A KR1019880012202 A KR 1019880012202A KR 880012202 A KR880012202 A KR 880012202A KR 890015837 A KR890015837 A KR 890015837A
Authority
KR
South Korea
Prior art keywords
mold
transfer
light
receiving element
affine
Prior art date
Application number
KR1019880012202A
Other languages
Korean (ko)
Other versions
KR910008613B1 (en
Inventor
미쓰루 고아라이
Original Assignee
마쓰모도 세이야
파이오니아 가부시끼가이샤
미요시 노부히로
파이오니아 비데오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마쓰모도 세이야, 파이오니아 가부시끼가이샤, 미요시 노부히로, 파이오니아 비데오 가부시끼가이샤 filed Critical 마쓰모도 세이야
Publication of KR890015837A publication Critical patent/KR890015837A/en
Application granted granted Critical
Publication of KR910008613B1 publication Critical patent/KR910008613B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings

Abstract

내용 없음No content

Description

트랜스퍼 몰드금형Transfer Mold Mold

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1 도는 본 발명의 일실시예의 단면도, 제 3 도는 그 제품의 수광소자몰드의 사면도. 제 6 도는 그 제품의 수광소자 몰드의 사면도이다.1 is a cross-sectional view of one embodiment of the present invention, and FIG. 3 is a perspective view of a light receiving element mold of the product. 6 is a perspective view of a light receiving element mold of the product.

Claims (1)

포토다이오드등의 수광소자를 투명한 에폭시수지등의 플라스틱으로 몰드하는 금형의 캐비티에 있어서 수광소자의 수광부에 대향하는 위치에 선단을 경면으로한 이젝터어핀을 배설한 것을 특징으로하는 트랜스퍼몰드 금형.A mold for transferring a light-receiving element such as a photodiode to a plastic such as a transparent epoxy resin, wherein the ejector affine is disposed at a position opposite to the light-receiving portion of the light-receiving element. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019880012202A 1988-04-05 1988-09-21 Transfer mould KR910008613B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-82198 1988-04-05
JP63082198A JPH01255514A (en) 1988-04-05 1988-04-05 Transfer mold die

Publications (2)

Publication Number Publication Date
KR890015837A true KR890015837A (en) 1989-11-25
KR910008613B1 KR910008613B1 (en) 1991-10-19

Family

ID=13767728

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880012202A KR910008613B1 (en) 1988-04-05 1988-09-21 Transfer mould

Country Status (2)

Country Link
JP (1) JPH01255514A (en)
KR (1) KR910008613B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2809228B1 (en) 2000-05-22 2003-10-17 St Microelectronics Sa INJECTION MOLD FOR THE MANUFACTURE OF AN OPTICAL SEMICONDUCTOR PACKAGE AND OPTICAL SEMICONDUCTOR PACKAGE

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60105515A (en) * 1983-11-14 1985-06-11 Nec Corp Mold
JPS6042614B2 (en) * 1984-06-21 1985-09-24 九州日本電気株式会社 Bonding method for semiconductor devices

Also Published As

Publication number Publication date
KR910008613B1 (en) 1991-10-19
JPH01255514A (en) 1989-10-12

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