JPH0124940Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Industrial application field The present invention relates to a stem for an optical semiconductor device, and particularly to an optical semiconductor device that includes a built-in light emitting element and a light receiving element and sends an optical signal to an optical fiber. Regarding the improvement of stems used in

The above-mentioned optical semiconductor device is used for optical communication, etc., and the built-in light receiving element monitors the level of optical output sent from the optical semiconductor device to the optical fiber in order to make the level appropriate. be.

Therefore, it is desired that the light receiving element be disposed at a predetermined position relative to the built-in light emitting element, and it is desired that the stem has a structure that can easily meet this demand.

(b) Prior Art FIG. 2 is a perspective view a and a side sectional view b showing the structure of a conventional stem for an optical semiconductor device.

In FIG. 2, reference numeral 1 denotes a substrate made of, for example, iron Fe, 2 a light emitting element mounting member made of, for example, copper Cu, which is fixed to the substrate 1 by silver brazing, etc., and 3 is a light emitting element mounting position. Reference numeral 4 denotes a light-receiving element mounting plate made of, for example, an iron-nickel-FeNi alloy, which is fixed by welding or the like to a lead terminal 7 that is insulated and fixed to the substrate 1 via a glass 6, and 5 is a light-receiving element mounting position.

In addition to 7, there are lead terminals 8, 9, and 10, all of which are made of, for example, iron-nickel FeNi alloy.
Lead terminals 8 and 9 are insulated and fixed to substrate 1 similarly to lead terminal 7, and lead terminal 10 is connected and fixed to substrate 1 by welding or the like. Among these lead terminals, 7 and 8 are for leading out the electrodes of the light receiving element, and 9 and 10 are for leading out the electrodes of the light emitting element.

(c) Problems to be solved by the invention The light receiving element mounted on the light receiving element mounting plate 4 is
As mentioned above, the light receiving element mounting position 5 is for monitoring the light output level of the light emitting element attached to the light receiving element mounting member 2, so the light receiving element mounting position 5 is used to place the light receiving element in a predetermined position and orientation after the light receiving element is mounted. It must be maintained at

In the stem for an optical semiconductor device having the configuration shown in FIG. 2, when attaching the light receiving element to the light receiving element mounting position 5, the end of the light receiving element is aligned with the end of the light receiving element mounting plate 4. Although positioning has become extremely easy, as shown in FIG. 3 (side sectional view) corresponding to FIG. There is a problem in that the pressure P applied during wire bonding for connection may cause the light receiving element mounting plate 4 to tilt and the light receiving element mounting position 5 to move, causing the light receiving element to deviate from a predetermined position or posture. There is.

(d) Means for solving the problem The above problem is solved by fixing the light-receiving element mounting plate to a lead terminal that penetrates the board and is insulated and fixed to the board at a part remote from the light-emitting element mounting member. This problem can be solved by insulatingly fixing to the substrate at the tip of a cut-and-raised part that stands up on the substrate side and is provided in the vicinity of the mounting position of the light-receiving element within the surface of the light-receiving element mounting plate.

(e) Effect By fixing the light-receiving element mounting plate not only with lead terminals as in the past but also with the above-mentioned cut-and-raise method, the rigidity of the light-receiving element mounting position is greatly increased, making it easier for bonding, etc. It will no longer move due to the applied pressure. Furthermore, since the cutting and raising is done within the plane of the light receiving element mounting plate, the above-mentioned ease of positioning the light receiving element is not lost, and the fixing of the cutting and raising tip on the substrate is done within the plane of the light receiving element mounting plate. Being able to be carried out within the projection area of the element mounting plate and without any need to modify any other parts of the conventional stem, this measure is economically practicable.

Thus, in the stem for an optical semiconductor device according to the present invention, the light receiving element can be easily disposed at a predetermined position.

(f) Embodiment The structure of an embodiment of the stem for an optical semiconductor device according to the present invention will be explained in FIG. 1 (a perspective view a and a side cross-sectional view b). .

FIGS. 1 a and b correspond to FIGS. 2 a and b, respectively, and the stem for an optical semiconductor device shown in FIG. In place of the light-receiving element mounting plate 4a having a cut-and-raised portion 4b, the tip of the cut-and-raised portion 4b is fixed.

Due to this change, the substrate 1 shown in FIG.
A glass 6a is added to insulate and fix the tip of the cut and raised portion 4b. Other details are the same as shown in Figure 2.

The light-receiving element mounting plate 4a configured in this manner has the following advantages: the rigidity of the light-receiving element mounting position 5 is significantly increased, the above-mentioned ease of positioning of the light-receiving element is maintained, and other features of the conventional stem are achieved. As mentioned above, there is no need to change any part.

Further, the light-receiving element mounting plate 4a can be manufactured in the same manner as forming the light-receiving element mounting plate 4, for example, by press working, and the substrate 1a can be manufactured by adding holes 1b to the substrate 1. Also, since the fixing with the glass 6a can be performed simultaneously with the fixing with the glass 6, the increase in cost for switching from the stem shown in FIG. 2 to the stem shown in FIG. 1 is extremely small.

(g) Effect of the invention As explained above, by taking the measures of the invention, it is possible to increase the rigidity of the mounting position of the light receiving element economically without losing the ease of positioning the light receiving element. This has the effect of making it possible to provide a stem for an optical semiconductor device that makes it easy to arrange elements at predetermined positions.

[Brief explanation of the drawing]

FIG. 1 is a perspective view a and a side sectional view b showing the structure of an embodiment of the stem for an optical semiconductor device according to the present invention.
FIG. 2 is a perspective view a and a side sectional view b showing the structure of a conventional stem for an optical semiconductor device, and FIG. 3 is a side sectional view showing the movement of the light receiving element mounting position. In the drawings, 1 and 1a are the substrate, 1b is the hole, 2 is the light-emitting element mounting member, 3 is the light-emitting element mounting position, 4 and 4a is the light-receiving element mounting plate, 4b is the cut-up, 5 is the light-receiving element mounting position, 6, 6a represents glass, 7 to 10 represent lead terminals, and P represents pressing force, respectively.

Claims (1)

[Scope of utility model registration request] A light emitting element mounting member is provided that stands up on a flat plate-like substrate, and the light receiving element is mounted on the edge of the upper surface so that the light receiving element is located on the substrate side of the light emitting element that is attached to the tip of the side surface of the mounting member, and A light-receiving element mounting plate extending substantially parallel to the substrate in a direction opposite to the mounting member from the mounting position of the light-receiving element penetrates the substrate at a portion remote from the mounting member and is insulated and fixed to the substrate. In addition to being fixed to the lead terminal, it is insulated and fixed to the substrate at the tip of a cut and raised portion that stands up on the substrate side and is provided near the mounting position of the light receiving element within the surface of the light receiving element mounting plate. Features stem for optical semiconductor devices.