JPH0124932Y2 - - Google Patents

Info

Publication number
JPH0124932Y2
JPH0124932Y2 JP1982147019U JP14701982U JPH0124932Y2 JP H0124932 Y2 JPH0124932 Y2 JP H0124932Y2 JP 1982147019 U JP1982147019 U JP 1982147019U JP 14701982 U JP14701982 U JP 14701982U JP H0124932 Y2 JPH0124932 Y2 JP H0124932Y2
Authority
JP
Japan
Prior art keywords
layer
winding
wire
package
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982147019U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5952629U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14701982U priority Critical patent/JPS5952629U/ja
Publication of JPS5952629U publication Critical patent/JPS5952629U/ja
Application granted granted Critical
Publication of JPH0124932Y2 publication Critical patent/JPH0124932Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
  • Wire Bonding (AREA)
JP14701982U 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ Granted JPS5952629U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14701982U JPS5952629U (ja) 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14701982U JPS5952629U (ja) 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5952629U JPS5952629U (ja) 1984-04-06
JPH0124932Y2 true JPH0124932Y2 (enrdf_load_stackoverflow) 1989-07-27

Family

ID=30327064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14701982U Granted JPS5952629U (ja) 1982-09-30 1982-09-30 フアインワイヤ−供給用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5952629U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267852B2 (ja) * 2008-07-23 2013-08-21 Ｔｄｋ株式会社 コイル部品及びコイル部品の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116690Y2 (enrdf_load_stackoverflow) * 1980-11-27 1986-05-22

Also Published As

Publication number Publication date
JPS5952629U (ja) 1984-04-06

Similar Documents

Publication Publication Date Title
US6000599A (en) Bondhead lead clamp apparatus and method
US4739947A (en) Conical coiling of wire on a spool with at least one conically formed flange
JPH0124932Y2 (enrdf_load_stackoverflow)
JPH0917819A (ja) マイクロエレクトロニクス装置の製造における結線方法
JPH0445241Y2 (enrdf_load_stackoverflow)
TWI603911B (zh) Winding structure of bonding wire for semiconductor device
JPS59177255A (ja) 円筒状の糸パツケ−ジのための自動肩部シエ−パ
JPS6236281Y2 (enrdf_load_stackoverflow)
JPS6225489Y2 (enrdf_load_stackoverflow)
JP2836692B2 (ja) 半導体素子のボーディング用線
JPH0541549Y2 (enrdf_load_stackoverflow)
JPS6116690Y2 (enrdf_load_stackoverflow)
JPH05273416A (ja) 光ファイバの巻取りにおける張力制御方法
JP3570696B2 (ja) ファインワイヤー用スプール
JP2001085462A (ja) 半導体ボンディングワイヤー巻き取り用スプール
JPH0117565Y2 (enrdf_load_stackoverflow)
KR200211488Y1 (ko) 권사용 지관
JPH0537976Y2 (enrdf_load_stackoverflow)
JPS5823933B2 (ja) 金属細線供給用スプ−ルの支持装置
JPS61226466A (ja) 極細線の巻取方法
KR900003927A (ko) 권선 방법과 코일 장치
JPS5915493Y2 (ja) ワイヤボンダ−におけるワイヤガイド
JPS5831406Y2 (ja) ボンデイングワイヤの送給装置
JP4134258B1 (ja) 溝付ボンディングワイヤ用スプール
JPH03200676A (ja) スプール装置