JPH01248686A - Method for repairing defective conductive through-hole - Google Patents
Method for repairing defective conductive through-holeInfo
- Publication number
- JPH01248686A JPH01248686A JP7751288A JP7751288A JPH01248686A JP H01248686 A JPH01248686 A JP H01248686A JP 7751288 A JP7751288 A JP 7751288A JP 7751288 A JP7751288 A JP 7751288A JP H01248686 A JPH01248686 A JP H01248686A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductivity
- holes
- metallic cement
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 230000002950 deficient Effects 0.000 title abstract description 5
- 239000004568 cement Substances 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000011229 interlayer Substances 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000011084 recovery Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、多層プリント基板、フラットケーブル等に於
ける層間導電スルホールに発生した導電不良スルホール
の補修方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for repairing conductive defective through holes that occur in interlayer conductive through holes in multilayer printed circuit boards, flat cables, and the like.
（従来の技術とその問題点）
従来、プリント基板の導電スルホールに導電不良、つま
りスルホール内に於ける導体めっきの部分的欠落や剥離
が発見されても、パターンが完成していたり、多層化を
行った後では、導体めっきのやり直し、半田付は等は行
うことができないので、補修不可能であった。この為、
導電不良スルホールを有するプリント基板は廃棄してい
たので、その経済的損失は甚だ大きがった。(Conventional technology and its problems) Conventionally, even if a conductive through-hole in a printed circuit board is found to have conductive defects, that is, partial loss or peeling of the conductor plating inside the through-hole, the pattern is completed or multilayering is not possible. After that, it was impossible to re-plate the conductor, solder it, etc., and therefore it was impossible to repair it. For this reason,
Since printed circuit boards having through-holes with poor conductivity were discarded, the economic loss was enormous.
（発明の目的）
本発明は上記問題点を解決すべくなされたもので、導体
めっきや半田付は等によらず簡単に導電性、を回復する
ことのできる導電不良スルホールの補修方法を捉供する
ことを目的とするものである。(Objective of the Invention) The present invention has been made to solve the above-mentioned problems, and provides a method for repairing poor conductivity through-holes that can easily restore conductivity without relying on conductor plating or soldering. The purpose is to
（問題点を解決するための手段）
上記問題点を解決するための本発明の導電不良スルホー
ルの補修方法は、多層プリント基板、フラットケーブル
等に於ける層間導電スルホールに発生した導電不良スル
ホールに対して、Ｇａ −Ｃｕ、Ｇａ−Ｎｉ、Ｇａ−Ａ
ｕ等のＧａ系金属セメントを充填、硬化させて、導電性
を回復することを特徴とするものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the method for repairing poor conductivity through holes of the present invention is a method for repairing poor conductivity through holes that occur in interlayer conductive through holes in multilayer printed circuit boards, flat cables, etc. , Ga-Cu, Ga-Ni, Ga-A
It is characterized in that it is filled with Ga-based metal cement such as U and cured to restore conductivity.
（作用）
上記の如く本発明は導電性に優れたＧａ系金属セメント
を導電不良スルホールに充填、硬化するので、導電不良
スルホールが完全に補修され、導電性が確実に回復する
。(Function) As described above, in the present invention, Ga-based metal cement having excellent conductivity is filled into the poor conductivity through-holes and hardened, so that the poor conductivity through-holes are completely repaired and the conductivity is reliably restored.
尚、Ｇａ系金属セメントを導電不良スルホールに充填す
る際は３０°Ｃ〜４０°Ｃの状態で行うのが好ましい。Incidentally, when filling the through holes with poor conductivity with Ga-based metal cement, it is preferable to do so at a temperature of 30°C to 40°C.
また充填したＧａ系金属セメントの硬化時間は２〜４８
時間に設定される。In addition, the curing time of the filled Ga-based metal cement is 2 to 48
set to time.
（実施例）
本発明の導電不良スルホールの補修方法の一実施例を図
面を参照して説明する。第１図に示す如く厚さ１．６ｍ
ｍの２枚のガラスエポキシ基板１間及び上面、下面に銅
５０μｍより成るパターン２が施され、且つ孔３に銅５
０μｍより成る導体めっき４が施されて成る２層プリン
ト基板５の直径０ 、８ ｍｍの層間スルホールに発生
せる図示の導体欠落の導電不良スルホール６へ、第２図
に示す如（Ｃ，ａ８０−ｔ％−Ｃｕの金属セメント７を
３０°Ｃの状態で充填し、５時間で硬化した。(Example) An example of the method for repairing poor conductivity through holes of the present invention will be described with reference to the drawings. Thickness 1.6m as shown in Figure 1
A pattern 2 made of copper 50 μm is formed between the two glass epoxy substrates 1 and on the upper and lower surfaces of the hole 3.
As shown in FIG. 2, a through hole 6 with conductive defects (C, a80- A t%-Cu metal cement 7 was filled at 30°C and hardened in 5 hours.
その結果、導電不良スルホール６全体が導電体となり、
導電性が回復した。またこの導電体は後工程に於いて機
械的な振動、衝撃が与えられても決して脱落することが
無く、導電性を保持できた。As a result, the entire conductive through hole 6 becomes a conductor,
Conductivity was restored. Furthermore, this conductor never fell off even when mechanical vibrations and shocks were applied in the post-process, and it maintained its conductivity.
（発明の効果）
以上の説明で判るように本発明の導電不良スルホールの
補修方法によれば、導体めっきや半田付は等によらずに
導電不良スルホールへＧａ系金属セメントを充填、硬化
するだけで簡単に導電性を回復することができるので、
従来のように導電不良スルホールを有するプリント基板
を廃棄する必要が無い。また導電不良スルホールを埋め
たＧａ系金属セメントは後工程において振動、衝撃が与
えられても決して脱落することが無く、導電性を保持で
きるという効果がある。(Effects of the Invention) As can be seen from the above explanation, according to the method for repairing poor conductivity through-holes of the present invention, the poor conductivity through-holes are simply filled with Ga-based metal cement and hardened, without conducting conductor plating or soldering. conductivity can be easily restored with
There is no need to discard printed circuit boards having through-holes with poor conductivity, unlike in the past. Furthermore, the Ga-based metal cement that fills the through holes with poor conductivity never falls off even when subjected to vibrations or shocks in the subsequent process, and has the effect of maintaining conductivity.
第１図及び第２図は本発明の導電不良スルホールの補修
方法を示す図である。
出願人 田中貴金属工業株式会社
５２７％７゛ソ〉ト４七交
を１図
５−２４シブン〉ト蚤亭及
茅２凪FIGS. 1 and 2 are diagrams showing a method for repairing poor conductivity through holes according to the present invention. Applicant: Tanaka Kikinzoku Kogyo Co., Ltd. 527% 7゛ Soto 4 Shichiko
Claims (1)
間導電スルホールに発生した導電不良スルホールに対し
て、Ｇａ−Ｃｕ、Ｇａ−Ｎｉ、Ｇａ−Ａｕ等のＧａ系金
属セメントを充填、硬化させて、導電性を回復すること
を特徴とする導電不良スルホールの補修方法。1. Ga-based metal cement such as Ga-Cu, Ga-Ni, Ga-Au, etc. is filled and hardened to improve conductivity for conductive through holes that occur in interlayer conductive through holes in multilayer printed circuit boards, flat cables, etc. A method for repairing through-holes with poor conductivity, characterized by recovery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7751288A JPH01248686A (en) | 1988-03-30 | 1988-03-30 | Method for repairing defective conductive through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7751288A JPH01248686A (en) | 1988-03-30 | 1988-03-30 | Method for repairing defective conductive through-hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01248686A true JPH01248686A (en) | 1989-10-04 |
Family
ID=13636019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7751288A Pending JPH01248686A (en) | 1988-03-30 | 1988-03-30 | Method for repairing defective conductive through-hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01248686A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55108103A (en) * | 1979-02-14 | 1980-08-19 | Sony Corp | Conductive materaial |
-
1988
- 1988-03-30 JP JP7751288A patent/JPH01248686A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55108103A (en) * | 1979-02-14 | 1980-08-19 | Sony Corp | Conductive materaial |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4487654A (en) | Method of manufacturing printed wiring boards | |
| US5271548A (en) | Method for applying solder to and mounting components on printed circuit boards | |
| US4438561A (en) | Method of reworking printed circuit boards | |
| KR20030091793A (en) | Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus | |
| MY151656A (en) | Printed substrate through which very strong currents can pass and corresponding production method | |
| CN113709984A (en) | Method for manufacturing circuit board by using laser to process electroplating holes, welding pads, anti-plating and anti-corrosion patterns | |
| US20030080092A1 (en) | Rework method for finishing metallurgy on chip carriers | |
| JPH01248686A (en) | Method for repairing defective conductive through-hole | |
| JP2666470B2 (en) | Electroless plating method | |
| US4978422A (en) | Method for improving insulation resistance of printed circuits | |
| JP2003008229A (en) | Printed circuit board and method of manufacturing the same | |
| JPS6197995A (en) | Making of through hole type circuit board | |
| JP2002190664A (en) | Semiconductor device using printed-wiring board | |
| JP2002198639A (en) | Printed wiring board, manufacturing method therefor and mounting method of electronic component | |
| JP2003318507A (en) | Method of manufacturing circuit board | |
| JP2774409B2 (en) | Flip chip mounting method | |
| JP3991588B2 (en) | Method for manufacturing printed wiring board | |
| JPH04110491A (en) | Circuit board | |
| JPH01266788A (en) | Method of repairing disconnection of small diameter through-hole of printed wiring board | |
| JPH01155683A (en) | Manufacture of printed wiring board | |
| JP3646460B2 (en) | Method for forming printed circuit board having inspection electrode | |
| JPS5934691A (en) | Method of producing printed circuit board | |
| SU1081820A2 (en) | Process for manufacturing multilayer printed circuit boards | |
| JP2811112B2 (en) | Solder supply plate | |
| JP2002076582A (en) | Component mounting board and its producing method |