JPH01245989A - レーザー切断装置 - Google Patents

レーザー切断装置

Info

Publication number
JPH01245989A
JPH01245989A JP63073206A JP7320688A JPH01245989A JP H01245989 A JPH01245989 A JP H01245989A JP 63073206 A JP63073206 A JP 63073206A JP 7320688 A JP7320688 A JP 7320688A JP H01245989 A JPH01245989 A JP H01245989A
Authority
JP
Japan
Prior art keywords
cutting device
laser
mounting means
laser cutting
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63073206A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459998B2 (enrdf_load_html_response
Inventor
Nobuyuki Hanaoka
花岡 伸行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAITEKUNO KK
Original Assignee
HAITEKUNO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAITEKUNO KK filed Critical HAITEKUNO KK
Priority to JP63073206A priority Critical patent/JPH01245989A/ja
Publication of JPH01245989A publication Critical patent/JPH01245989A/ja
Publication of JPH0459998B2 publication Critical patent/JPH0459998B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
JP63073206A 1988-03-29 1988-03-29 レーザー切断装置 Granted JPH01245989A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63073206A JPH01245989A (ja) 1988-03-29 1988-03-29 レーザー切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63073206A JPH01245989A (ja) 1988-03-29 1988-03-29 レーザー切断装置

Publications (2)

Publication Number Publication Date
JPH01245989A true JPH01245989A (ja) 1989-10-02
JPH0459998B2 JPH0459998B2 (enrdf_load_html_response) 1992-09-24

Family

ID=13511445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63073206A Granted JPH01245989A (ja) 1988-03-29 1988-03-29 レーザー切断装置

Country Status (1)

Country Link
JP (1) JPH01245989A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632915A (en) * 1994-08-29 1997-05-27 Gerber Garment Technology, Inc. Laser material processing apparatus and a work table therefor
JP2011183457A (ja) * 2010-03-09 2011-09-22 Xerox Corp 基材切断用材料搬送システム、及び材料搬送システムにおいて基材を切断する方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152395U (enrdf_load_html_response) * 1985-03-13 1986-09-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152395U (enrdf_load_html_response) * 1985-03-13 1986-09-20

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632915A (en) * 1994-08-29 1997-05-27 Gerber Garment Technology, Inc. Laser material processing apparatus and a work table therefor
JP2011183457A (ja) * 2010-03-09 2011-09-22 Xerox Corp 基材切断用材料搬送システム、及び材料搬送システムにおいて基材を切断する方法

Also Published As

Publication number Publication date
JPH0459998B2 (enrdf_load_html_response) 1992-09-24

Similar Documents

Publication Publication Date Title
US5360486A (en) Blast cleaning apparatus and method with laterally moving conveyor
US5632915A (en) Laser material processing apparatus and a work table therefor
US5262612A (en) Computer-controlled laser cutter
EP2099578B1 (en) Method for treating film material, for instance for manufacturing sanitary products
GB2184383A (en) Laser cutting system
CN101873909B (zh) 用于支撑板状材料和用于处理从其上分离的部分的方法和装置
US20210268604A1 (en) Laser processing apparatus
KR20160010200A (ko) 시트 절단 장치
JP2897016B2 (ja) 自動裁断機におけるリーク防止装置
JPH01245989A (ja) レーザー切断装置
US3889095A (en) Working surface for radiant energy beam cutter
US3742183A (en) Optical element protection in laser apparatus
JPH01245991A (ja) レーザー切断装置
JPH0459999B2 (enrdf_load_html_response)
US3828697A (en) Working surface for radiant energy beam cutter
CN216966625U (zh) 光路防护结构及激光加工装置
CN113305446B (zh) 激光加工装置
JP3777056B2 (ja) 自動送り込み装置
CN216151470U (zh) 激光光路防护结构及激光切割装置
KR100195100B1 (ko) 링크트랙컨베이어
JPWO2020121946A1 (ja) レーザーブランキング装置
CN118321677B (zh) 一种可自动上下料的芯片焊接装置
JPH0366599A (ja) 高速流体切断装置
CN115673568B (zh) 一种人工智能激光加工系统
JPH01140996A (ja) 線的切断加工工作機械におけるワーク搭載装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees