JPH01241836A - Lead connection of ic component - Google Patents

Abstract

PURPOSE:To allow leads to adhere effectively to electrodes even with a small pitch of the leads and a warpage of a substrate by sequentially bonding the leads to the electrodes with a bonding tool while an IC component is pressed and fixed using a suction nozzle. CONSTITUTION:An IC component 2 to be mounted on a substrate 1 is sucked by a suction nozzle 3 from a component supply unit, conveyed, accurately positioned at the IC component mounting position of the substrate 1, placed thereon, and further pressed by the nozzle 3 to the substrate 1 as it is to be secured. In this case, leads 4 protruding on the outer periphery of the component 2 are accurately disposed on electrodes, not shown, of the substrate 1. A bonding tool 5 heated to a suitable temperature sequentially pressed the leads 4 form above in this state to thermally press-bond the leads 4 to the electrodes of the substrate 1, thereby integrally bonding the leads 4 to the electrodes of the substrate 1 by metal-to-metal bonding. When all the leads 4 of the component 2 are completely thermally press-bonded, the component 2 is mounted on the board, and completely electrically connected.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention is applicable to connecting the leads of an IC component to the electrodes of a substrate,
The present invention relates to a lead connection method for connecting inner leads of a carrier film to electrodes of an IC chip.

2. Description of the Related Art Conventionally, when mounting an IC component on a board and connecting its leads to the electrodes of the board, first, as shown in FIG. Apply and
Next, the IC component 22 is sucked by the suction nozzle 23, placed on the mounting position, and pressed, as shown in FIG. 4(b).
By fixing the IC component 22 with adhesive 24 and then dipping it into a solder tank, as shown in FIG. 4(c),
Each of the leads 25 was collectively connected to the electrode of the substrate 21 with solder 26.

Further, a carrier film 32 is attached to each electrode on the IC chip 31.
When connecting the inner leads 33 of the IC chip 31, as shown in FIG. They were connected together using a bonding tool 35 corresponding to the two.

However, the problem to be solved by the invention is that the mounting of the IC component 22 on the board 21,
In the connection method, as the leads 25 become finer and the lead pitch becomes smaller, for example, from 0.5+nm to 0.3+nm, proper soldering becomes extremely difficult (1), and connection failures may also occur due to warpage of the board 21, etc. There is a problem in that it is more likely to occur, and it is not possible to cope with the increase in the number of leads and the reduction in pitch in IC components 22, which have been progressing in recent years.

Furthermore, since the process of mounting the IC component 22 and the process of connecting the lead 25 are separate, there is also the problem that the number of processes is large.

In addition, when connecting the inner leads 33 to the IC chip 31, it is difficult to bond a group of inner leads with a small lead pitch all at once, and especially with a large ICC chip 3, it is difficult to bond the parallelism of the bonding surface and the uniformity of temperature. Since it is difficult to ensure the properties, there is a problem that antagonistic bonding becomes increasingly difficult. Furthermore, in order to bond the inner leads 33 all at once, each electrode of the IC chip 31 needs to be configured by forming bumps 34 on aluminum pads, as shown in FIG.
There is a problem in that the number of manufacturing steps for IC chips increases accordingly.

In view of the above-mentioned conventional problems, the present invention provides an IC that can accommodate smaller lead pitches and an increase in the number of leads in mounting and connecting IC components to a substrate and connecting inner leads of a carrier film that conform to the electrodes of an IC chip. The purpose is to provide a method for connecting leads of components.

Means for Solving the Problems In order to achieve the above object, the present invention has a method in which when an IC component is mounted on a board and its leads are connected to an electrode, the IC component is sucked with a suction nozzle and placed in a predetermined position on the board. At the same time as the IC component is placed, the suction nozzle is used to press and fix the IC component as it is, and in this state, each lead around the IC component is sequentially crimped and bonded to the electrode of the board using a bonding tool. .

In addition, the inner leads of the carrier film are aligned with the electrodes of the IC chip, and each inner lead of the carrier film is overlapped with each electrode of the IC chip.
The method is characterized in that each inner REIT is sequentially crimped and bonded to an electrode using a bonding tool.

Operation Since the present invention has the above configuration, it is possible to suck IC parts.
/ When attaching to the board by suction with the suction nozzle,
The C component is pressed and fixed, and each lead is pressed and bonded to the electrode in sequence using a bonding tool, so even if the pitch of the leads is small or the board is warped, it can be bonded reliably. . Furthermore, since mounting of IC components and bonding of leads are performed at the same time, both processes can be simplified.

Also, when bonding the electrodes of the IC chip and the inner leads of the carrier film, each inner lead is pressed and bonded to the electrode in sequence using a bonding ink tool, ensuring secure bonding even if the lead pitch is minute. can.

In addition, since the inner leads are individually bonded, large IC
In the case of a chip, it is not easily affected by the parallelism between the IC chip and the bonding tool, uneven temperature distribution, etc., and can be bonded reliably. Furthermore, it is possible to directly connect inner leads to electrodes of IC chips that do not have bumps formed thereon.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.

First, a first embodiment shown in FIG. 1 will be described.

In FIG. 1, a substrate 1 is placed on a heat bronch (not shown) and heated to an appropriate temperature. An IC component 2 to be mounted on the substrate 1 is sucked and conveyed by a suction nozzle 3 from a component supply section (not shown), and is transported to the substrate 1.
accurately positioned and placed at the IC component mounting position,
Further, the IC component 2 is directly pressed onto the substrate 1 by the suction nozzle 3 and fixed. At this time, each lead 4 protruding from the outer periphery of the IC component 2 is accurately positioned on each electrode (not shown) of the substrate 1.

In this state, the bonding tool 5 heated to an appropriate temperature applies pressure to each lead 4 from above in order.
and each electrode of the board 1 is bonded by thermocompression, and then the lead 4 and the board 1 are bonded together.
A single electrode is bonded using metal-to-metal bonding. The bonding tool 5 is preferably attached to the tip of an ultrasonic horn, and ultrasonic waves are applied during bonding.

Once all the glue parts 4 of the IC parts 2 have been thermocompressed,
The IC component 2 is mounted on the board, and the electrical connection is completed. Thereafter, the suction nozzle 3 is separated from the substrate 1, and the next step is started.

Next, a second embodiment shown in FIGS. 2 and 3 will be described.

11 is an IC chip, which is positioned and installed on a heatable plate (not shown).

As shown in FIG. 3, this IC chip 11 is provided with an electrode 12 consisting of a chair on which bumps are formed and an aluminum pad. 16 is a passivation film of the IC chip 11. A carrier film 1 is placed on this IC chip 11.
3 are positioned and supplied, each inner lead 1
4 are positioned so as to overlap each electrode 12 of the IC chip 11.

In this state, each inner lead 14 is sequentially pressurized from both sides using a bonding tool 15 attached to the tip of an ultrasonic horn, and ultrasonic waves are applied to sequentially bond each inner lead 14 to each electrode 12. Further, during bonding, the bonding tool 15 is appropriately heated as necessary.

When the inner leads 14 are bonded to all the electrodes of the IC chip 11 in this way, the process moves on to the step of bonding the inner leads 14 to the next IC chip 11.

Effects of the Invention According to the IC component lead connection method of the present invention, when an IC component is suctioned by a suction nozzle and mounted on a board, the IC component is held down and fixed by the suction nozzle, and each lead is connected to the bonding tool. Since the leads are bonded to the electrodes sequentially, even if the pitch of the leads is small or the board is warped, the bonding can be ensured. Also, since the mounting of IC components and the bonding of the leads are done at the same time, both processes are simplified. etc.,
It has a great effect.

Also, when bonding the electrodes of the IC chip and the inner leads of the carrier film, each inner lead is sequentially bonded to the electrode using a bonding tool, so even if the lead pitch is minute or the chip is large, I that can be reliably joined and does not form bumps
The inner leads can be directly bonded to the electrodes of the C chip, and the manufacturing process of the IC chip can be simplified, resulting in great effects.

[Brief explanation of the drawing]

FIG. 1 is a partial cross-sectional front view of the first embodiment of the present invention, FIGS. 2 and 3 show the second embodiment of the present invention, FIG. 2 is a perspective view of the joining process, and FIG. 3 is the joining process. FIG. 4 is a cross-sectional view showing the conventional IC component mounting process; FIG. 5 is a perspective view of the conventional ICC chip and t(v) inner lead bonding process; FIG. The figure is an enlarged cross-sectional front view of the main parts of Fig. 5. 1... Board 2... IC component 3... Suction nozzle 4... ...Lead 5...Bonding tool 11...IC chip 12...Electrode 13...Carrier film 14... ...
...Inner lead 15...Bonding tool. Agent Φ Shizuka Patent Attorney Toshio Nakao (1 person) Figure 4 Figure 5 Figure 6

Claims (2)

[Claims] (1) At the same time as suctioning the IC component with a suction nozzle and placing it on a predetermined position on the board, the IC component is pressed and fixed with this suction nozzle, and in that state, each lead around the IC component is sequentially connected. A method for connecting leads of an IC component, which comprises crimping and bonding to electrodes of a substrate using a bonding tool. (2) The IC chip and the carrier film are aligned, each inner lead of the carrier film is superimposed on each electrode of the IC chip, and each inner lead is bonded by pressing the inner leads to the electrodes in sequence using a bonding tool. How to connect leads of IC parts.