JPH0123959B2 - - Google Patents

Info

Publication number
JPH0123959B2
JPH0123959B2 JP56098828A JP9882881A JPH0123959B2 JP H0123959 B2 JPH0123959 B2 JP H0123959B2 JP 56098828 A JP56098828 A JP 56098828A JP 9882881 A JP9882881 A JP 9882881A JP H0123959 B2 JPH0123959 B2 JP H0123959B2
Authority
JP
Japan
Prior art keywords
circuit board
solder
flexible circuit
wiring pattern
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56098828A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58197A (ja
Inventor
Yukihiko Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP9882881A priority Critical patent/JPS58197A/ja
Publication of JPS58197A publication Critical patent/JPS58197A/ja
Publication of JPH0123959B2 publication Critical patent/JPH0123959B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9882881A 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置 Granted JPS58197A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9882881A JPS58197A (ja) 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9882881A JPS58197A (ja) 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置

Publications (2)

Publication Number Publication Date
JPS58197A JPS58197A (ja) 1983-01-05
JPH0123959B2 true JPH0123959B2 (enrdf_load_stackoverflow) 1989-05-09

Family

ID=14230143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9882881A Granted JPS58197A (ja) 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置

Country Status (1)

Country Link
JP (1) JPS58197A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103800B2 (ja) * 1988-04-28 1994-12-14 太陽誘電株式会社 チップ状回路部品マウント装置
JPH01278097A (ja) * 1988-04-28 1989-11-08 Taiyo Yuden Co Ltd チップ状回路部品配置装置
AU2018382215B2 (en) 2017-12-13 2024-02-22 Enabl A/S System, device and method for lifting and controlling the horizontal orientation and/or position of components

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4115601A (en) * 1977-07-01 1978-09-19 Bell Telephone Laboratories, Incorporated Flexible circuit reflow soldering process and machine

Also Published As

Publication number Publication date
JPS58197A (ja) 1983-01-05

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