JPH01218732A - Manufacture of tip lead pin - Google Patents
Manufacture of tip lead pinInfo
- Publication number
- JPH01218732A JPH01218732A JP4398488A JP4398488A JPH01218732A JP H01218732 A JPH01218732 A JP H01218732A JP 4398488 A JP4398488 A JP 4398488A JP 4398488 A JP4398488 A JP 4398488A JP H01218732 A JPH01218732 A JP H01218732A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- lead pin
- tip
- hole
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 238000005096 rolling process Methods 0.000 claims abstract description 4
- 229910017709 Ni Co Inorganic materials 0.000 claims abstract description 3
- 229910003267 Ni-Co Inorganic materials 0.000 claims abstract description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板へＩＣ，ＬＳＩ等のチップを装
着する為に、該チップをプリント基板へ端子接続するに
用いる尖端リードピンの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing pointed lead pins used to connect a chip such as an IC or LSI to a printed circuit board. .
（従来技術とその問題点）
従来、プリント基板へＩＣ，ＬＳＩ等のチップを端子接
続する為に用いるリードピンは、第２図に示す如くリー
ドピン１のフランジ２の頂面にろう４を取付けて成るも
のである。(Prior art and its problems) Conventionally, lead pins used for terminal connection of IC, LSI, etc. chips to a printed circuit board are made by attaching a solder 4 to the top surface of a flange 2 of a lead pin 1, as shown in Fig. 2. It is something.
ところで、近時集積回路の小型化、大容量化、高密度、
高集積化に伴い、ＩＣ，ＬＳＩ等のチップを端子接続す
る為のリードピンの数が桁違いに多くなり、またリード
ピンの直径が著しく細くなってきた。By the way, in recent years, integrated circuits have become smaller, larger in capacity, higher in density,
With the increase in integration, the number of lead pins for connecting chips such as ICs and LSIs has increased by an order of magnitude, and the diameter of the lead pins has become significantly thinner.
然るに従来のリードピン１の先端は、第３図ａ乃至ｄに
示す如くフラット面５、円弧面６、周縁カットのフラッ
ト面７、周縁アール付フラット面８のいずれかより成る
ので、第４図に示すプリント基板９の細径且つ多数のス
ルホール９ａへリードピンｌを挿入する際の調芯が難し
くて、リードピン１をスルホール９ａへ挿入できなかっ
たり、挿入できても折れたり、曲がったり、或いはスル
ホール９ａを損傷して断線させたりすることが多かった
。However, the tip of the conventional lead pin 1 consists of one of a flat surface 5, an arcuate surface 6, a peripherally cut flat surface 7, and a peripherally rounded flat surface 8, as shown in FIGS. 3a to 3d. It is difficult to align the lead pins 1 when inserting them into the small diameter and large number of through holes 9a of the printed circuit board 9 shown in FIG. The wires were often damaged and disconnected.
この為、尖端リードピンが要望されていたが、ピンが細
いだけに製造が甚だ厄介であった。For this reason, there was a demand for a pointed lead pin, but since the pin was thin, it was extremely difficult to manufacture.
（発明の目的）
本発明は、上記問題点を解決すべくなされたもので、尖
端リードピンの製造方法を提供することを目的とするも
のである。(Object of the Invention) The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a pointed lead pin.
（問題点を解決するだめの手段）
上記問題点を解決するための本発明の尖端リードピンの
製造方法は、Ｆｅ−Ｎｉ、Ｆｅ−Ｎｉ −Ｃｏ又はＣｕ
を主成分とする合金をあらかじめ針状に成形したピンを
、その長胴部の直径の２を最小値とする円錐を付けた平
板ダイスを用いて転造することを特徴とするものである
。(Means for Solving the Problems) The method for manufacturing a pointed lead pin of the present invention to solve the above problems is based on Fe-Ni, Fe-Ni-Co or Cu.
This method is characterized by rolling a pin made of an alloy whose main component is preformed into a needle shape using a flat die equipped with a cone having a minimum value of 2 the diameter of the long body of the pin.
本発明の尖端リードピンの製造方法において、ピンの長
胴部の直径の２を最小値とする円錐を付けた平板ダイス
を用いる理由は、２未満では円錐状のテーパ角が大きく
なって、プリント基板のスルホールへの挿入時スルホー
ル周縁での滑りが悪くなり、スムースに挿入できなくな
るからである。In the manufacturing method of the pointed lead pin of the present invention, the reason why a flat die with a cone whose minimum value is 2 of the diameter of the long body of the pin is used is that if the diameter is less than 2, the taper angle of the cone becomes large and the printed circuit board This is because when inserting into the through hole, the slippage on the periphery of the through hole becomes poor, making it impossible to insert it smoothly.
（実施例） 本発明の尖端リードピンの製造方法を説明する。(Example) A method for manufacturing a pointed lead pin of the present invention will be explained.
直径０．２ｍｍのコバールより成る線材を長さ４．３ｍ
ｍに切断した後、ヘングー加工により第１図ａに示す如
く一端に直径０．４ｍｍ、厚さ０．１ｍｍのフランジ１
０を有する直径０．２ｍｍ、長さ４ ｍｍの素材ビンエ
１を得た。次にこの素材ピン１１を第１図すに示す如く
上下２個の平板ダイスを有する転造機１２にて先端□を
円錐状に切断成形して、第１図Ｃに示す如く長さ４．０
ｍｍ、先端の円錐部１３の長さが０．２ｍｍで直径との
比率が１７１の尖端リードピン１４を得た。次い 、て
この尖端リードピン１４を第１図ｄに示す如くカーホン
治具１５のピン支持孔１６内にセットし、且つフランジ
１０の上にＡｕ−Ｇｅ１２ｗｔ％より成る球形φ（１，
４ｍｍの球状ろう１７をセットした上、加熱炉中に入れ
、水素ガス雰囲気中、４５０’Ｃｌ２Ｏ分間加熱して球
状ろう１７をフランジ１上に溶融して取付けて、第１図
ｅに示す如くろう付尖端リードビン１８を製造した。A wire made of Kovar with a diameter of 0.2 mm and a length of 4.3 m.
After cutting it into lengths of 1.5 m, a flange 1 with a diameter of 0.4 mm and a thickness of 0.1 mm is formed at one end as shown in Fig. 1a by cutting.
A material Binye 1 having a diameter of 0.2 mm and a length of 4 mm was obtained. Next, this material pin 11 is cut and formed into a conical shape at the tip by a rolling machine 12 having two upper and lower flat dies as shown in FIG.
A pointed lead pin 14 was obtained in which the length of the conical portion 13 at the tip was 0.2 mm and the ratio to the diameter was 171 mm. Next, the tip lead pin 14 of the lever is set in the pin support hole 16 of the carphone jig 15 as shown in FIG.
After setting a 4 mm spherical solder 17, it was placed in a heating furnace and heated in a hydrogen gas atmosphere for 450 minutes of Cl2O to melt and attach the spherical solder 17 on the flange 1, as shown in Figure 1e. A pointed lead bottle 18 was manufactured.
この実施例のろう□付尖端す−ドピ刈８と、先端がフラ
ット面でその他は実施例と全く同一寸法、同一材質の第
２図に示するう付リードピン１とを、第４図に示される
プリント基板９のスルホール９ａ １００個と１ 、
０（１０個に対する挿入試験を行った処、下記の表に示
すような結果を得た。FIG. 4 shows the soldered pointed tip 8 of this embodiment and the lead pin 1 shown in FIG. 100 through holes 9a of the printed circuit board 9 shown,
0 (An insertion test was conducted on 10 pieces, and the results shown in the table below were obtained.
上記の表の不良内容は、挿入不可（手直しのきかないも
の）、リードピンの曲がり、折れ、スルホール損傷によ
る回路断線等である。The defects listed in the table above include uninsertable (non-repairable), bent or broken lead pins, and broken circuits due to through-hole damage.
上記表の数値で明らかなように従来例のリードピンでは
前記の不良内容が１００本中２本、Ｉ’、０００本中１
１本も発生したのに対し、実施例の尖端り−ドピンでは
全く発生しなかったことが判る。As is clear from the numbers in the table above, in conventional lead pins, the above-mentioned defectiveness was 2 out of 100, I', and 1 out of 000.
It can be seen that in contrast to the case where even one point occurred, in the case of the point-doped pin of the example, no point occurred.
（発明の効果）
以上詳記した通り本発明の尖端り□−ドビンの製造方法
は、調芯することなくプリント基板のスルホールに容易
に挿入することができ、しかも挿入時折れたり、曲がっ
たり、スルホールを損傷して断線させたりすることが無
い尖端リードピンを容易に製造できる効果がある。(Effects of the Invention) As detailed above, the method for manufacturing the pointed □-dobbin of the present invention can be easily inserted into the through-hole of a printed circuit board without alignment, and can be easily inserted into the through-hole of a printed circuit board without being torn or bent during insertion. This has the effect of easily producing a pointed lead pin that does not damage the through hole and cause wire breakage.
第１図ａ乃至ｅは本発明の尖端リードピンの製遣方法を
示す図、第２図は従来のリードピンを示す図、第３図ａ
乃至ｄは従来のり−ドピンの先端面を示す拡大図、第４
図はプリント基板のスルホールとリードピンを示す拡大
図である。
出願人 田中貴金属工業株式会社Figures 1a to 1e are diagrams showing the manufacturing method of the pointed lead pin of the present invention, Figure 2 is a diagram showing a conventional lead pin, Figure 3a
4th to d are enlarged views showing the tip surface of conventional glued pins.
The figure is an enlarged view showing the through holes and lead pins of the printed circuit board. Applicant Tanaka Kikinzoku Kogyo Co., Ltd.
Claims (1)
する合金を用いて、あらかじめ針状に成形したピンを、
その長胴部の直径の１／２を最小値とする円錐を付けた
平板ダイスを用いて転造することを特徴とする尖端リー
ドピンの製造方法。A pin previously formed into a needle shape using an alloy mainly composed of Fe-Ni, Fe-Ni-Co, or Cu is
A method for manufacturing a pointed lead pin, characterized in that rolling is performed using a flat die with a cone having a minimum value of 1/2 of the diameter of the long body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4398488A JPH01218732A (en) | 1988-02-26 | 1988-02-26 | Manufacture of tip lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4398488A JPH01218732A (en) | 1988-02-26 | 1988-02-26 | Manufacture of tip lead pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01218732A true JPH01218732A (en) | 1989-08-31 |
Family
ID=12678985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4398488A Pending JPH01218732A (en) | 1988-02-26 | 1988-02-26 | Manufacture of tip lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01218732A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04134858U (en) * | 1991-06-06 | 1992-12-15 | 東洋電装株式会社 | Lead frame |
| KR100463086B1 (en) * | 2002-01-12 | 2004-12-23 | 금성볼트공업 주식회사 | Manufacture method of pin for wood fixed |
-
1988
- 1988-02-26 JP JP4398488A patent/JPH01218732A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04134858U (en) * | 1991-06-06 | 1992-12-15 | 東洋電装株式会社 | Lead frame |
| KR100463086B1 (en) * | 2002-01-12 | 2004-12-23 | 금성볼트공업 주식회사 | Manufacture method of pin for wood fixed |
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