JPH01215031A - Resin-sealed pin grid array type semiconductor package - Google Patents

Abstract

PURPOSE:To decrease the number of processes, and to reduce cost by incorporating a semiconductor pellet into a carrier tape while drooping ly providing the tape with a pin, introducing an assembly to a molding die and transfer-molding and resin-sealing the assembly. CONSTITUTION:A conductor foil is stuck onto a carrier tape 2, a conductor wiring 3 is formed through etching working, and through-holes for droopingly providing pins 4 for external connection are bored to the conductor wiring 3 and the carrier tape 2. Conductive resin adhesives 5 are applied to a pellet fixing section on the carrier tape 2 and the joining sections of the conductor wiring 3 and the pins 4 for external connection, and a pellet 6 is fixed onto the surface of the carrier tape 2 while the pins 4 for external connection are inserted in the downward direction in the through-holes, and fastened to the conductor wiring 3. The pellet 6 and the conductor wiring 3 are connected electrically by wires 7 for connectors, and an assembly is admitted into a molding die, transfer molded, and resin-sealed by a resin seal section 8.

Description

[Detailed description of the invention]

[Industrial Application Field] The present invention relates to a resin-sealed pin grid array type semiconductor package, and more particularly to a pin grid array type semiconductor plastic package in which external connection pins are vertically disposed on a tape and transfer molded. [Prior art] Semiconductor packages (hereinafter simply referred to as packages) in which outer leads, which are leads for connection with a mounting board such as a printed circuit board, extend vertically from the backboard body are called plug-in line packages or pin grid array packages. It is called. In this package, a large number of the above-mentioned actor leads are arranged in the same manner as the base, so it is advantageous when the number of the leads is large. Since the package base (i&)K of the package used was a ceramic substrate or was expensive, it has been proposed to use a resin substrate such as a glass embossed caustic substrate and perform resin sealing by botting. Manufacturing of a pin grid array type package sealed with resin is generally performed as follows. That is, conductive foil (Cu foil) is pasted on both sides of a glass epoxy substrate, and a counterbore (groove) for mounting semiconductor pellets is formed.
At the same time, holes were made for external connection leads (pins) to be erected, Cu foil was etched to form conductor wiring, a resist was applied, plated, and cut, and the pins were erected. The potting frame (dam) is joined, the semiconductor pellet is joined, the conductor wiring on the surface of the glass epoxy board and the semiconductor pellet are wire-bonded using a connector wire, the resin for potting is potted inside the dam, and the resin is bonded. It will be sealed. Regarding the resin-sealed pin grid array type package,

[Examples of the literature mentioned include Mc-Graw-
1st Old Book Company Japan1
rVLSI TECHNOLOGYJ published in 1983
Examples include p:5F72-573. [Problem to be solved by the invention] As described above, by using a glass epoxy substrate and performing resin sealing by botting, a package is obtained that is lower in price than a hermetically sealed package using a ceramic substrate. You can, but it's still expensive. This is due to the fact that, as mentioned above, there are many steps such as installing a botting frame, the material costs are high, and it is difficult to automate the resin sealing process, resulting in lower package processing costs. This is because the present invention is still expensive.An object of the present invention is to reduce labor costs and provide an inexpensive resin-sealed pin grid array type package. The characteristics are
This will become clear from the description in the unclear specification and the attached drawings. [Means for Solving the Problems] A brief overview of typical inventions disclosed in this application is as follows. In the present invention, semiconductor pellets are incorporated into a carrier tape that has a sprocket hole for feeding, pins are provided vertically on the tape, the assembled product is placed in a mold, and the assembly is transfer-molded and resin-sealed. Go and become. [Function] As described above, the main process is to set pins upright on the carrier tape and use TAB (Tape Automated Bones).
Semiconductor pellets (hereinafter simply referred to as pellets) can be incorporated using the ding method and then transfer molded, so there is no need to join potting frames, the number of steps is reduced, and material costs are reduced. Since the process can be automated by the TAB method or by transfer molding, it is possible to obtain a resin-sealed pin grid array type package that is inexpensive overall. [Example] Next, an example of the present invention will be described based on the drawings. FIG. 1 shows a sectional view of an embodiment of a package according to the present invention. The package 1 is manufactured, for example, as follows. Attach conductor foil to carrier tape 2 and perform etching to arrange the conductor! form j13. The conductor arrangement @3 and the carrier tape 2 are provided with through holes for vertically penetrating external connection pins 4. A conductive resin adhesive 5 containing metal powder is applied to the pellet fixing part of the carrier tape 2 and the joint part between the conductor arrangement 1113 and the external connection pin 4. ! cloth and pellet 6 with carrier tape 2fi.
At the same time, the external connection pin 4 is inserted downward through the through hole and fixed to the conductor arrangement 3. Next, the pellet 6 and the conductor arrangement #3 are electrically connected using the connector wire 7. After the wire bonding, the assembled product is placed in a molding die, transfer molding is performed, and the area around the joint between the pellet 6, the connector wire 7, the external connection pin 4, and the conductor arrangement 13 is sealed with resin. 8 to seal with resin. Finally, the carrier tape 2 is punched out. FIG. 2 is a sectional view of a package showing another embodiment of the present invention. The package 9 uses the TAB method. A device hole 10 is punched in the center of the carrier tape 2. FIG. 3 shows a plan view of the carrier tape 2. As shown in FIG. Sprocket holes 11 for feeding (alignment) are punched at both ends of the carrier tape 2. Note that the carrier tape 2 shown in FIG. 1 is also punched with similar sedge rocket holes. As shown in FIGS. 2 and 3, the device hole 10
The tip of the conductor arrangement Itj13 protrudes. The conductor wiring 3 is formed in the same manner as described above, and similarly, a through hole 2 for vertically installing an external connection via 4 is provided. The external connection pin 4 is inserted into the through hole 12, and the pin 4 is vertically provided upward as shown in the figure. The pin 4 is fixed to the conductor wiring 3 with the conductive resin adhesive 5 in the same manner as described above. The pellets 6 are joined within the device holes 10 of the carrier tape 2. The pellet 6 is provided with a protruding electrode 13 made of, for example, an Au bump, and the pellet 6 is bonded to the tip of the conductor arrangement II3 by Guyang bonding in TAB. Next, the assembled product is placed in a mold, transfer molded, and resin-sealed.6 In this embodiment, the resin flows into the device hole 10 and forms part of the resin-sealed part 14. ing. The gear rear tape 2 is, for example, a band-shaped tape formed by slitting a resin film to an appropriate width. Conductor layout II! I3 is composed of, for example, Cu metal. The external connecting pin is made of metal, for example. The conductive resin adhesive 5 containing metal powder is, for example, a so-called A
It is composed of something called g-paste. The connector wire 7 is made of, for example, an AgMJPAJ wire. The pellet 6 is made of, for example, a silicon single crystal substrate, and a large number of circuit elements are formed on this pellet (chip) circle using a well-known technique to provide one circuit function. A specific example of a circuit element is a transistor (MOS), for example, and these circuit elements form, for example, a logic circuit and a memory circuit function. According to the present invention, a carrier tape 2 with pins 4 is used,
By forming the resin-sealed portions 8 and 14 by transfer molding, the resin-sealed pin grid array type packages 1 and 9 can be obtained, so the number of steps is shorter than in the past to obtain the packages. In addition, resin sealing can be performed by a transfer molding method that can be automated without using a potting method, making it possible to obtain the package at a low cost overall. Furthermore, the use of the carrier tape 2 made it possible to incorporate the pellets 6 continuously. The invention made by the non-inventor has been specifically explained based on the examples above, but it goes without saying that the present invention is not limited to the above examples and can be modified in various ways without departing from the gist thereof. Nor. [Effects of the Invention] The effects obtained by typical inventions disclosed in this application are briefly explained below. According to the invention, it was possible to obtain a resin-sealed pin grid array type semiconductor package whose cost was reduced compared to the conventional one.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a package showing an embodiment of the invention, FIG. 2 is a sectional view of a package showing another embodiment of the invention, and FIG. 3 is a plan view of the package tape before resin molding. l...Package, 2...Carrier tape, 3...
・Conductor arrangement, 4... External connection pin, 5... Ag paste, 6... Semiconductor pellet, 7... Wire for connector, 8... Resin sealing part, 9... Package ,1
0...Device hole, 11...Tin rocket hole, 12...Through hole, 13...Protruding electrode, 14...
・Resin flange part. Figure 1 Figure 2

Claims (1)

[Claims] 1. Resin sealing made by attaching external connection pins to a carrier tape having sprocket holes for feeding and conductor wiring, bonding semiconductor pellets, and performing resin sealing by transfer molding. Pin grid array type semiconductor package. 2. Claim 1, wherein the resin-sealed pin grid array type semiconductor package is formed by wire-bonding conductor wiring and semiconductor pellets using connector wires.
A resin-sealed pin grid array type semiconductor package as described in 2.