JPH01213557A - Lead inspection device - Google Patents
Lead inspection deviceInfo
- Publication number
- JPH01213557A JPH01213557A JP3882688A JP3882688A JPH01213557A JP H01213557 A JPH01213557 A JP H01213557A JP 3882688 A JP3882688 A JP 3882688A JP 3882688 A JP3882688 A JP 3882688A JP H01213557 A JPH01213557 A JP H01213557A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- displacement
- optical
- light beam
- measures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims description 9
- 238000006073 displacement reaction Methods 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フレキシブルテープ上に形成された回路パタ
ーンにおけるリードの欠けおよび曲がりを検出するリー
ド検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead inspection device for detecting chipping and bending of leads in a circuit pattern formed on a flexible tape.
・ 〔従来の技術〕
従来のリード検査装置は、第３図に示すように、■ＴＶ
カメラ１６によりリード８の像を入力して画像処理装置
で画像処理を行い、リード８の欠けおよび曲がりを二次
元的に検出していた。・ [Conventional technology] As shown in Fig. 3, the conventional lead inspection device
An image of the lead 8 is inputted by the camera 16, and image processing is performed by the image processing device to two-dimensionally detect chipping and bending of the lead 8.
しかし、従来のリード検査装置では、リード像をＩＴＶ
カメラ１６により投影写像するためにリードの欠けおよ
び曲がりを三次元的に検出することはできなかった。ま
た、高精度な検出を行うためには、ＩＴＶカメラのレン
ズ１５は高倍率タイプを用い、検出領域をいくつかに分
割して検出しなければならないが、レンズを高倍率にす
る程外乱先の影響を受けやすく、その上時間がかかると
いう問題を有していた。さらに視野の中心部以外では、
■ＴＶカメラレンズの持つ光学的収差の影響で高精度な
検出ができなかった。However, with conventional lead inspection equipment, the lead image is
Because of projection mapping using the camera 16, it was not possible to three-dimensionally detect chipping and bending of the lead. In addition, in order to perform highly accurate detection, the lens 15 of the ITV camera must be of a high magnification type, and the detection area must be divided into several parts for detection. This has the problem of being easily influenced and taking time. Furthermore, outside the center of the visual field,
■Highly accurate detection was not possible due to the optical aberrations of the TV camera lens.
そこで本発明はこの様な課題を解決するもので、フレキ
シブルテープ６上に形成された回路パターンにおけるリ
ード８の欠けおよび曲がりを三次元的に高精度かつ高速
で検出することを目的とする。SUMMARY OF THE INVENTION The present invention is intended to solve these problems, and aims to three-dimensionally detect chipping and bending of leads 8 in a circuit pattern formed on flexible tape 6 with high precision and high speed.
上記問題を解決するために、本発明の検査装置は、光ビ
ームを測定面の一点に照射して測定する光学式変位検出
装置を平面的に移動させることにより、フレキシブルテ
ープ上に形成された回路パターンにおけるリードの欠け
および曲がりを三次元的に高精度かつ高速に検出するこ
とを特徴とする。In order to solve the above problem, the inspection device of the present invention measures a circuit formed on a flexible tape by moving an optical displacement detection device that measures by irradiating a light beam onto one point on a measurement surface. It is characterized by detecting lead chips and bends in a pattern three-dimensionally with high precision and at high speed.
以下に本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第１図において、光ビーム９を測定面の一点に照射して
測定する光学式変位測定装置１を２次元移動装置２に取
付け、フレキシブルテープ６上に形成されたリード８に
合わせて高速で移動させることにより、リード８の欠け
および曲がりを三次元的に検出する。In FIG. 1, an optical displacement measuring device 1 that measures by irradiating a light beam 9 onto one point on a measurement surface is attached to a two-dimensional moving device 2, and is moved at high speed in accordance with a lead 8 formed on a flexible tape 6. As a result, chips and bends in the lead 8 are detected three-dimensionally.
第２図において、発光素子１３から出た光ビーム９は、
送光用レンズ１４によりリード８上に焦点を結ぶ。リー
ド８上で乱反射した光の一部は、受光用レンズ１２に入
り、リード８の光軸方向の変位に対応して、受光位置検
出素子１１上に焦点を結ぶ。従って受光位置検出素子１
１の出力信号を高精度に検出することによって、リード
８の有無および光軸方向の変位を誤差が数ミクロン以下
の高精度で検出することができる。In FIG. 2, the light beam 9 emitted from the light emitting element 13 is
The light is focused on the lead 8 by the light transmitting lens 14. A part of the light diffusely reflected on the lead 8 enters the light receiving lens 12 and focuses on the light receiving position detection element 11 in accordance with the displacement of the lead 8 in the optical axis direction. Therefore, the light receiving position detection element 1
By detecting the output signal 1 with high precision, the presence or absence of the lead 8 and its displacement in the optical axis direction can be detected with high precision with an error of several microns or less.
第４図において、光学式変位測定装置１により検出した
リードの有無および光軸方向の変位情報は、測定誤差が
数ミクロン以下の高精度な移動量測定装置３から得られ
る２次元移動装置２の移動量ｔｉ報と共にデータ処理部
１７に送られて３次元情報として合成処理され、表示部
１８に表示される。In FIG. 4, the presence or absence of a lead and the displacement information in the optical axis direction detected by the optical displacement measuring device 1 are obtained from the two-dimensional moving device 2, which is obtained from the highly accurate displacement measuring device 3 with a measurement error of several microns or less. The information is sent to the data processing unit 17 together with the movement amount ti information, where it is synthesized as three-dimensional information and displayed on the display unit 18.
第５図において、光学式変位測定装置１を取付けた２次
元移動装置２は、光学式変位測定装置１の光ビーム１９
がフレキシブルテープ６上に形成されたリード８を切断
するよう、光ビームの軌跡２０の如く移動する。In FIG. 5, the two-dimensional moving device 2 to which the optical displacement measuring device 1 is attached is connected to a light beam 19 of the optical displacement measuring device 1.
moves along the trajectory 20 of the light beam so as to cut the lead 8 formed on the flexible tape 6.
第６図は、表示部１８における数本のリード８の断面表
示例である。（ａ）は、すべてのリードが良品の場合で
あり、（ｂ）は、−本のリードのみが光学式変位測定装
置の光軸方向に曲がっている場合である。また、（Ｃ）
は、−本のリードのみが２次元移動装置の移動方向に曲
が一部ている場合であり、（ｄ）は、−本のリードのみ
が欠けている場合である。FIG. 6 is an example of a cross-sectional display of several leads 8 on the display section 18. (a) is the case where all the leads are good, and (b) is the case where only the negative leads are bent in the optical axis direction of the optical displacement measuring device. Also, (C)
(d) is a case where only the lead of the - book has a part of the song in the movement direction of the two-dimensional moving device, and (d) is a case where only the lead of the - book is missing.
このように本発明によれば、光ビームを測定面の一点に
照射して測定する光学式変位測定装置を平面的に移動さ
せることにより、フレキシブルテープ上に形成された回
路パターンにおけるリードの欠けおよび曲がりを三次元
的に高精度かつ高速で検出するという効果を有する。As described above, according to the present invention, by moving the optical displacement measurement device that measures by irradiating a light beam onto one point on the measurement surface in a plane, it is possible to eliminate lead chipping and damage in the circuit pattern formed on the flexible tape. This has the effect of detecting bends three-dimensionally with high precision and at high speed.
第１図は本発明のリード検査装置の概略断面図、第２図
は光ビームを測定面の一点に照射して測定する光学式変
位測定装置の一例を示す概略断面図、第３図は従来のリ
ード検査装置の概略図、第４図は本発明のリード検査装
置のデータ処理のブロック図、第５図はフレキシブルテ
ープ上における光ビームの軌跡を示す概略図、第６図（
ａ）はすべてのリードが良品の場合の表示画像図、第６
図（ｂ）、（ｃ）、（ｄ）は−本のリードのみが不良品
の場合の表示画像図である。
１−光学式変位測定装置
２−２次元移動装置
３−移動量測定装置
４−フレキシブルテープ押さえ装置
５−フレキシブルテープ押さえ
６−フレキシブルテープ
７−フレキシブルテーブ送り装置
８−リード
９−光ビーム
１０−リッド検査装置本体
１１−受光位置検出素子
１２−受光用レンズ
１３−発光素子
１４−送光用レンズ
１５−ＩＴＶカメラ用レンズ
１６−■ＴＶカメラ
１７−データ処理部
１８−表示部
１９−光ビーム
２〇−光ビームの軌跡
２１−良好なリードの表示画像
２２−不良なリードの表示画像
第１０
第Ｚ因
第３閑
箋４０
第ぢ昆Fig. 1 is a schematic sectional view of a lead inspection device of the present invention, Fig. 2 is a schematic sectional view showing an example of an optical displacement measuring device that measures by irradiating a light beam onto one point on a measurement surface, and Fig. 3 is a conventional one. 4 is a block diagram of the data processing of the lead inspection device of the present invention, FIG. 5 is a schematic diagram showing the trajectory of the light beam on the flexible tape, and FIG.
a) is the display image when all the leads are good, No. 6
Figures (b), (c), and (d) are display images when only the - lead is defective. 1 - Optical displacement measuring device 2 - Two-dimensional moving device 3 - Movement amount measuring device 4 - Flexible tape holding device 5 - Flexible tape holding device 6 - Flexible tape 7 - Flexible table feeding device 8 - Lead 9 - Light beam 10 - Lid Inspection device main body 11 - Light receiving position detection element 12 - Light receiving lens 13 - Light emitting element 14 - Light transmitting lens 15 - ITV camera lens 16 - TV camera 17 - Data processing section 18 - Display section 19 - Light beam 2〇 - Trajectory of light beam 21 - Display image of good lead 22 - Display image of bad lead No. 10
Claims (1)
位測定装置を平面的に移動させることにより、フレキシ
ブルテープ上に形成された回路パターンにおけるリード
の欠けおよび曲がりを三次元的に高精度かつ高速で検出
することを特徴とするリード検査装置By moving an optical displacement measurement device that measures by irradiating a light beam onto a single point on the measurement surface, it is possible to detect chipping and bending of leads in a circuit pattern formed on a flexible tape three-dimensionally with high precision. Lead inspection device featuring high-speed detection
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3882688A JPH01213557A (en) | 1988-02-22 | 1988-02-22 | Lead inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3882688A JPH01213557A (en) | 1988-02-22 | 1988-02-22 | Lead inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01213557A true JPH01213557A (en) | 1989-08-28 |
Family
ID=12536041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3882688A Pending JPH01213557A (en) | 1988-02-22 | 1988-02-22 | Lead inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01213557A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005292136A (en) * | 2004-03-30 | 2005-10-20 | General Electric Co <Ge> | System for inspecting multiplex resolution and its operation method |
-
1988
- 1988-02-22 JP JP3882688A patent/JPH01213557A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005292136A (en) * | 2004-03-30 | 2005-10-20 | General Electric Co <Ge> | System for inspecting multiplex resolution and its operation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3511450B2 (en) | Position calibration method for optical measuring device | |
| JP3967518B2 (en) | Offset measurement method, tool position detection method, and bonding apparatus | |
| JPS61132818A (en) | Detector for position of surface | |
| CN109655837B (en) | Laser ranging method and laser range finder | |
| US5432330A (en) | Two-stage detection noncontact positioning apparatus having a first light detector with a central slit | |
| EP0273717A2 (en) | Method and apparatus for noncontact automatic focusing | |
| EP0234562B1 (en) | Displacement sensor | |
| JP4500729B2 (en) | Surface shape measuring device | |
| KR100295477B1 (en) | Device for measuring the dimensions of objects | |
| EP0019941B1 (en) | Reduction projection aligner system | |
| JPH01213557A (en) | Lead inspection device | |
| JPH02103404A (en) | Lead inspection apparatus | |
| JPH10267624A (en) | Measuring apparatus for three-dimensional shape | |
| JP2020521123A (en) | Image sensor alignment system in multiple directions | |
| JPS6042606A (en) | Optical size measuring device | |
| US4758731A (en) | Method and arrangement for aligning, examining and/or measuring two-dimensional objects | |
| JPS62291512A (en) | Distance measuring apparatus | |
| JP2001317922A (en) | Optical shape measuring device | |
| JPH0444201B2 (en) | ||
| JP4031124B2 (en) | Optical hole shape measuring method and measuring apparatus | |
| JPH0469508A (en) | Method and instrument for optical contactless shape measurement | |
| JPH0524196Y2 (en) | ||
| JP2638356B2 (en) | Focusing spot coaxiality measuring device | |
| JPH0789058B2 (en) | Distance measuring device | |
| JPS62291509A (en) | Distance measuring apparatus |