JPH01210268A - Polishing method and device - Google Patents

Abstract

PURPOSE:To suppress damage of wafer and to perform polishing work stably by providing an ejector for spraying polishing agent onto a work such as a polishing cloth or a wafer prior to polishing work thereby reducing vibration during polishing work. CONSTITUTION:An ejector 18 for spraying polishing agent is provided independently from a polishing agent supply means 10 assembled into the body of a polishing device. The ejector 18 sprays polishing agent sufficiently onto the surface of a polishing cloth 9 and a work 3 prior to polishing work. Then upper and lower lathes 1, 2 are lowered to hold the work 3 mounted in a carrier 7 between the lathes 1, 2. Under this state, a solenoid valve 16 in the polishing agent supply means 10 is excited to feed polishing agent through a receiver 12, a tube 15 and a supply port 14 to the polishing cloth 8, the work 3 and the polishing cloth 9 sequentially. Then an inner gear 5 and a sun gear 6 are rotated to rotate the lathes 1, 2 relatively so as to polish the upper and lower faces of the work 3 with low vibration.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a stable polishing process for polishing wafers, memory disks, etc. by reducing vibration during polishing and suppressing damage to the wafer or other object to be eroded. The present invention relates to a polishing method and a polishing apparatus that can perform the following steps.

[Conventional technology]

The case of a conventionally used double-sided polishing device will be explained. As shown in FIG. 2, the lower surface plate 1 and the lower surface plate 2 are each driven independently by a drive source (not shown), and between the upper surface plate 1 and the lower surface plate 2 there is a disc-shaped inner surface of Ueno. Workpiece 3 such as
A plurality of carriers 7 are set, each having a workpiece holding hole 4 capable of holding the workpiece in a flat shape and having toothed portions on the outer circumferential surface, and meshing with an internal gear 5 and a sun gear 6 to rotate and revolve. There is. In addition, polishing cloths 8.9 are pasted on the opposing surfaces of the lower surface plate 1 and the lower surface plate 2, respectively.

Further, an abrasive supply means 10 essential for polishing is provided above the lower surface plate l, and this abrasive supply means IO
The polishing side support 12 is attached to the upper surface plate holding shaft 11 provided at the upper medium heat of the lower surface plate I, the abrasive supply line 13 that supplies abrasive to the polishing side support 12, and the upper polishing side support 12 from the polishing side support 12. It consists of a tube 15 disposed between an abrasive supply port I4 that penetrates downward through the disk 1, and the abrasive is supplied from the abrasive supply line 13 to the polishing side receiver 12. The tube 15 flows down the abrasive supply port 14', and the abrasive cloth 8,
It is supplied to the workpiece 3 and the polishing cloth 9. Note that the upper surface plate 1, the upper surface plate holding shaft 11, etc. are moved up leaving the carrier 7 on the lower surface plate 2, and are separated from the lower surface plate 2.

It is constructed as described above, and during polishing, the workpiece 3 such as a sea urchin is held in the workpiece holding hole 4 of the carrier 7, and the polishing agent is fully supplied, while the surface plate 1 and the lower surface plate 2
While pressing the workpiece 3, the carrier 7 rotates and revolves, and the polishing process is performed by the relative movement of the upper and lower surface plates 1.2.

[Problem to be solved by the invention]

In conventional polishing equipment, when polishing an object with a polishing force immediately after replacing the polishing cloth with a new one or cleaning the polishing cloth using pure water, etc., the polishing cloth is A sufficient layer of abrasive is not formed on the surface of the workpiece due to reasons such as the abrasive has not penetrated sufficiently or the abrasive has not been sufficiently supplied to the surface of the workpiece.
Therefore, the slippage between the polishing cloth and the workpiece and between the workpiece and the carrier becomes unstable, causing vibrations, which may appear as a squeaking sound. If this state continues for a long time during polishing, not only the desired removal rate cannot be obtained, but also there is a problem that the removal force is damaged, and stable polishing cannot be performed.

SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing apparatus and a polishing method that can reduce vibration during polishing, suppress damage to wafers, etc., and perform stable polishing.

[Means to solve the problem]

In the polishing method of the present invention, a workpiece is loaded into a hole in a carrier that meshes with a sun gear and an internal gear and rotates and revolves between upper and lower surface plates. In the polishing method of polishing the workpiece while supplying an abrasive with a supply means, the abrasive supply means is incorporated into the main body of the polishing apparatus prior to the polishing process, by moving the upper surface plate upward and separating it from the lower surface plate. The abrasive is sprayed onto the polishing cloth using a separate abrasive spray device, and after the abrasive has sufficiently penetrated into the polishing cloth, the upper surface plate is lowered to move the workpiece loaded in the carrier up and down. This is a method of polishing while pressing with both discs.

The polishing device uses a power source connected to an abrasive supply means built into the main body of the polishing device, or is separate from the abrasive supply source connected to the abrasive supply means. This apparatus supplies an abrasive using the abrasive supply source as a supply source, and is provided with an injection device that can spray and stop the abrasive separately from the abrasive supply means.

[Function] Prior to polishing, a polishing cloth is sprayed with abrasive by an abrasive injection device that is installed separately from the abrasive supply means built into the main body of the polishing device. Stable polishing can be performed with less damage to the workpiece.

In fact, the polishing device supplies the abrasive separately from the abrasive supply means built into the main body. A spraying device is installed to spray the abrasive material.

〔Example〕

Hereinafter, an explanation will be given based on FIG. 1, which is an embodiment of the present invention. This figure shows an embodiment of a double-sided polishing apparatus, and the same parts as those of the conventional apparatus shown in FIG.

The abrasive supply line 13 is provided with a solenoid valve 16, and when the solenoid valve 16 is energized, the abrasive flows into the abrasive supply line I.
3 to the polishing side receiver 12, and while being stored in the polishing side receiver 12, the abrasive flows through the tube 15 and the abrasive supply port 14, and is sequentially supplied to the polishing cloth 8, the workpiece 3, and the polishing cloth 9. It is configured. The abrasive supply source may be a simple tank equipped with a pump, and the abrasive material may be supplied by this pump.

Further, a flexible tube (such as a soft tube) 17 that can be moved manually to easily spread the abrasive is connected to the abrasive supply line 13, and this tube I7
A Java-type spraying device 1 for spraying abrasive is connected to the tip. This spraying device 18 has a lever (not shown), and when the lever is pushed, the abrasive is sprayed, and when it is released, it stops. In this embodiment, the abrasive supplied to the injection device 18 was supplied from an abrasive supply source that is supplied to an abrasive supply means built into the main body of the polishing apparatus, but a supply source other than this abrasive supply source may be used. It is also possible to supply from It goes without saying that the spraying device may be of any other type as long as it can spray the abrasive.

With this structure, during polishing, the upper surface plate 1 is first moved upward, and then the workpiece 3 such as a wafer is placed into the workpiece holding hole 4 of the carrier 7. Next, the sprayer 18 is grasped by hand and the lever is pressed to sufficiently spray the abrasive onto the surface of the workpiece 30 and the abrasive cloth 9. In this case, it is also possible to sprinkle it on the polishing cloth 8. After lowering the upper surface plate 1 and sandwiching the workpiece 3 between the upper and lower surface plates 1.2, the solenoid valve 16 is energized to supply abrasive to the polishing side receiver I2.

The polishing agent supplied to the polishing side receiver 12 flows down into the tube 15 and the polishing agent supply port 14', and is sequentially supplied to the polishing cloth 8, the workpiece 3, and the polishing cloth 9. Therefore, the internal gear 5 and the sun gear 6 are rotated to cause the carrier 75 to rotate and revolve, and the upper and lower surface plates 112 are rotated, giving relative motion to the upper and lower surface plates 1.2 to simultaneously polish the upper and lower surfaces of the workpiece 3.

〔Effect of the invention〕

Prior to polishing, by sufficiently sprinkling abrasive onto the workpiece, such as an abrasive cloth or wax, the surface of the workpiece will be covered with a sufficient layer of abrasive, and the space between the polishing cloth and the workpiece and the surface of the workpiece will be covered. The sliding between the workpiece and the carrier is stabilized, vibration is small, and the desired polishing removal rate can be obtained without damaging the workpiece, making stable polishing possible.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the polishing apparatus of the present invention, and FIG. 2 is a sectional view of a conventional polishing apparatus. ' 1...Upper surface plate, 2...Lower surface plate, 3...
・Workpiece, 5... Internal gear, 6... Sun gear,
7...Carrier, 8.9...Abrasive cloth, 10...
- Abrasive supply means, 18... injection device.・Applicant: Toshiba Machine Co., Ltd.

Claims (1)

[Scope of Claims] 1. A workpiece is loaded into a hole in a carrier that meshes with a sun gear and an internal gear and rotates and revolves between upper and lower surface plates, and the abrasive cloth and abrasive agent provided on the upper and lower surface plates are used to process the device. In the polishing method of polishing the workpiece while supplying the abrasive with an abrasive supply means incorporated in the workpiece, the upper surface plate is moved upward and, prior to the polishing process, an abrasive supply means provided separately from the abrasive supply means is provided. A polishing method characterized in that an abrasive is sprayed onto a polishing cloth using an abrasive jetting device, and the polishing process is performed after the abrasive has sufficiently penetrated into the polishing cloth. 2. A sun gear, an internal gear, a carrier that rotates and revolves in mesh with both gears, and an upper and lower surface plate that holds the carrier from above and below and is attached with abrasive cloth for polishing the workpiece loaded in the carrier. and an abrasive supply means for supplying an abrasive, the polishing apparatus for polishing the workpiece while supplying an abrasive by the abrasive supply means, the polishing apparatus being connected to the abrasive supply means built into the polishing apparatus. A polishing apparatus, characterized in that an abrasive is supplied using an abrasive supply source as a supply source, and an injection device capable of spraying and stopping the abrasive is provided separately from the abrasive supply means. 3. A sun gear, an internal gear, a carrier that meshes with both gears and rotates and revolves, and an upper and lower setter that holds the carrier from above and below and is attached with abrasive cloth that polishes the workpiece loaded in the carrier. A polishing apparatus comprising a disc and an abrasive supply means for supplying an abrasive and polishing the workpiece while supplying an abrasive by the abrasive supply means, wherein the abrasive supply means is incorporated in the polishing apparatus. The abrasive is supplied from an abrasive supply source different from the abrasive supply source connected to the abrasive, and an injection device capable of spraying and stopping the abrasive is provided separately from the abrasive supply means. Characteristic polishing equipment.