JPH01209759A - Optoelectronic converter - Google Patents
Optoelectronic converterInfo
- Publication number
- JPH01209759A JPH01209759A JP63034570A JP3457088A JPH01209759A JP H01209759 A JPH01209759 A JP H01209759A JP 63034570 A JP63034570 A JP 63034570A JP 3457088 A JP3457088 A JP 3457088A JP H01209759 A JPH01209759 A JP H01209759A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- common
- photoelectric conversion
- electrode
- individual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005693 optoelectronics Effects 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims description 35
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、複数枚の基板を連設してコピーボードや大型
原稿等の画像を読み取る読取装置を形成するのに適した
光電変換装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a photoelectric conversion device suitable for forming a reading device for reading images of copyboards, large originals, etc. by arranging a plurality of substrates in series. be.
従来の技術
一般に、コピーボード等の大面積の画像を読み取るため
には、第１３図及び第１４図に示すように構成されてい
る。すなわち、光電変換装置１を構成する基板２は、製
造装置の大型化、歩留等の製作上の制約から一定の大き
さ以上にすることができず、直線状に配列された光電変
換素子３を基板２の端縁まで形成し、複数枚の基板２を
連設して必要長さの光電変換素子アレイ４を形成してい
る。この光電変換素子アレイ４の長さ、すなわち、読取
幅は約９０ｃｍにも及ぶ。そのため、光電変換素子３に
対する電気的な接続は、各基板２毎に行なわなければな
らず、光電変換素子３の共通電極端子５が基板２の片側
に配列され、マトリックス配線６を介して接続された個
別電極端子７が前記基板２の他側に配列されている。こ
れらの共通電極端子５と個別電極端子７とは、外部回路
端子８にワイヤボンデング９により接続されている。2. Description of the Related Art In general, in order to read large-area images of copyboards and the like, an apparatus is constructed as shown in FIGS. 13 and 14. That is, the substrate 2 constituting the photoelectric conversion device 1 cannot be made larger than a certain size due to manufacturing constraints such as increasing the size of manufacturing equipment and yield, and the photoelectric conversion elements 3 arranged in a linear manner cannot be made larger than a certain size. is formed up to the edge of the substrate 2, and a plurality of substrates 2 are arranged in series to form a photoelectric conversion element array 4 of the required length. The length of this photoelectric conversion element array 4, that is, the reading width is about 90 cm. Therefore, electrical connections to the photoelectric conversion elements 3 must be made for each substrate 2, and the common electrode terminals 5 of the photoelectric conversion elements 3 are arranged on one side of the substrate 2 and connected via matrix wiring 6. Individual electrode terminals 7 are arranged on the other side of the substrate 2. These common electrode terminals 5 and individual electrode terminals 7 are connected to external circuit terminals 8 by wire bonding 9.
発明が解決しようとする問題点
外部回路接続用の共通電極端子５と個別電極端子７とが
光電変換素子アレイ４をはさんで基板２の両側に配置さ
れているため、ワイヤボンデング９等で外部回路端子８
に接続する場合、■工程で行なうことができず、２工程
を必要とし、作業性の上での問題点を有する。Problems to be Solved by the Invention Since the common electrode terminal 5 and the individual electrode terminals 7 for external circuit connection are arranged on both sides of the substrate 2 with the photoelectric conversion element array 4 in between, wire bonding 9 etc. External circuit terminal 8
When connecting, it cannot be done in step (1) and requires two steps, which poses problems in terms of workability.
また、外部回路の配置を基板２の両側に配置しなければ
ならないと云う制約がある。Further, there is a restriction that external circuits must be placed on both sides of the substrate 2.
問題点を解決するための手段
共通電極に形成された共通側端子部と個別電極に形成さ
れた個別側端子とを基板上に形成された光電変換素子の
いずれか一方の片側に配設した。Means for Solving the Problems A common side terminal portion formed on a common electrode and an individual side terminal formed on an individual electrode are arranged on one side of a photoelectric conversion element formed on a substrate.
作用
共通側端子部と個別側端子部とが片側配置であるので、
外部回路と接続される外部回路端子を基板の片側のみに
配設するだけでよく、そのため、ワイヤボンデングによ
る接続作業も一工程でよく、また、外部回路自体も基板
の片側のみに配置するだけでよい。Since the action common side terminal part and individual side terminal part are arranged on one side,
The external circuit terminals connected to the external circuit only need to be placed on one side of the board, so the connection work by wire bonding can be done in one step, and the external circuit itself only needs to be placed on one side of the board. That's fine.
実施例
本発明の第一の実施例を第１図乃至第８図に基づいて説
明する。本実施例は第４図に示すようなコピーボード１
０に利用したもので、そのコピーボード１０の原稿面ｌ
ｌ側にはその原稿面１１に沿わせて移動する読取ユニッ
ト１２が左右方向に移動自在に取付けられている。前記
読取ユニット１２は、第５図に示すように縦長の開口１
３が形成されたケース１４を有し、このケース１４内に
は前記原稿面１１の高さに略等しい長さの光源１５、レ
ンズアレイ１６、読取装置１７が設けられている。この
読取装置１７の光電変換素子アレイ１８の長さも前記原
稿面１１の高さ方向の寸法に略一致している。そして、
前記読取装置１７の下面にはプリント配線基板１９が配
設されている。Embodiment A first embodiment of the present invention will be explained based on FIGS. 1 to 8. This embodiment uses a copyboard 1 as shown in FIG.
0, the original side of the copyboard 10
A reading unit 12 that moves along the document surface 11 is mounted on the l side so as to be movable in the left and right directions. The reading unit 12 has a vertically long opening 1 as shown in FIG.
A light source 15, a lens array 16, and a reading device 17 having a length substantially equal to the height of the document surface 11 are provided in the case 14. The length of the photoelectric conversion element array 18 of this reading device 17 also substantially matches the dimension in the height direction of the document surface 11. and,
A printed wiring board 19 is arranged on the lower surface of the reading device 17.
しかして、前記読取ユニット１２に設けられた読取装置
１７は、第６図に示すように前記原稿面１１よりも長い
寸法のベース２０に複数枚の光電変換装置２１を直線状
に配列固定したものである。As shown in FIG. 6, the reading device 17 provided in the reading unit 12 has a plurality of photoelectric conversion devices 21 arranged and fixed in a linear manner on a base 20 having a dimension longer than the document surface 11. It is.
これらの光電変換装置２１は、第７図に示すように光電
変換素子２２が基板２３上に直線状に形成され、これら
の光電変換素子２２に接続された共通側端子２４と、そ
の光電変換素子２２にマトリックス配ｔ＄２５を介して
接続された個別側端子２６とが前記光電変換素子２２の
片側に配設されて構成されている。As shown in FIG. 7, these photoelectric conversion devices 21 include photoelectric conversion elements 22 formed linearly on a substrate 23, a common side terminal 24 connected to these photoelectric conversion elements 22, and the photoelectric conversion elements An individual side terminal 26 connected to 22 via a matrix arrangement 25 is disposed on one side of the photoelectric conversion element 22.
しかして、このような光電変換装置２１の電気的な等価
回路は第８図に示される状態であり、共通電極２７と個
別電極２８とを対向させて光電変換素子２２を形成し、
前記共通電極２７側は複数個毎にブロック化して前記共
通側端子２４にそれぞれ接続され、前記個別電極２８は
マトリックス配線２５を介して前記個別側端子２６に接
続されている。The electrical equivalent circuit of such a photoelectric conversion device 21 is as shown in FIG.
The common electrodes 27 are divided into blocks and connected to the common side terminals 24, and the individual electrodes 28 are connected to the individual side terminals 26 via matrix wiring 25.
ついで、第１図と第２図とに基づいて前記光電変換装置
２１の詳細な構造を説明する。本実施例は薄膜技術によ
り各部が形成されているものである。まず、絶縁材料よ
りなる前記基板２３上に前記マトリックス配線２５の複
数本の横ライン２９が平行に形成され、その上に絶縁層
３０が形成されている。この絶縁層３０の上にはａ−３
ｉ等による光導電層３１が形成され、この光導電層３１
の上で前記共通電極２７と前記個別電極２８とが櫛歯状
に対向して前記光電変換素子２２が形成され、前記個別
電極２８からは前記横ライン２９と交叉する縦ライン３
２がそれぞれ延長され、前記横ライン２９と前記縦ライ
ン３２とがスルーホール３３により互いに接続されて前
記マトリックス配線２５が形成されている。Next, the detailed structure of the photoelectric conversion device 21 will be explained based on FIG. 1 and FIG. 2. In this embodiment, each part is formed using thin film technology. First, a plurality of horizontal lines 29 of the matrix wiring 25 are formed in parallel on the substrate 23 made of an insulating material, and an insulating layer 30 is formed thereon. On this insulating layer 30 is a-3
A photoconductive layer 31 is formed by i, etc., and this photoconductive layer 31
The photoelectric conversion element 22 is formed by the common electrode 27 and the individual electrodes 28 facing each other in a comb-teeth shape, and from the individual electrodes 28 there are vertical lines 3 intersecting the horizontal lines 29.
2 are extended, and the horizontal lines 29 and the vertical lines 32 are connected to each other by through holes 33 to form the matrix wiring 25.
そして、前記共通電極２７の一部にはワイヤボンデング
３４が接続される共通側端子２４が形成され、前記個別
電極２８のそれぞれからは、前記光電変換素子２２の間
を通って前記共通電極２７側に引き出される引出線３５
を介してワイヤボンデング３４が接続される前記個別側
端子２６が形成されている。A common side terminal 24 to which a wire bonding 34 is connected is formed in a part of the common electrode 27, and from each of the individual electrodes 28, the common electrode 27 passes between the photoelectric conversion elements 22. Leader line 35 drawn out to the side
The individual terminal 26 is formed to which the wire bonding 34 is connected.
また、このような構造の等価回路は第３図に示すもので
ある。すなわち、光電変換素子２２の片側に共通側端子
２４と個別側端子２６とが配設されている。Further, an equivalent circuit of such a structure is shown in FIG. That is, the common side terminal 24 and the individual side terminal 26 are arranged on one side of the photoelectric conversion element 22.
このような構成において、光電変換素子２２の片側に共
通側端子２４と個別側端子２６とが配設されているので
、これらの共通側端子２４及び個別側端子２６と外部端
子とをワイヤボンデング３４により接続する接続作業は
、−工程で済むことになる。また、外部回路も光電変換
装置２１の片側に集中して配置することができ、これに
より、外部回路自体の電気的接続も容易になる。In such a configuration, since the common side terminal 24 and the individual side terminal 26 are arranged on one side of the photoelectric conversion element 22, the common side terminal 24 and the individual side terminal 26 and the external terminal are wire bonded. The connection work performed by 34 can be completed in -step. Further, the external circuits can also be arranged concentrated on one side of the photoelectric conversion device 21, which facilitates the electrical connection of the external circuits themselves.
また、共通側端子２４と個別側端子２６とを光電変換素
子２２の片側に配置しても共通電極２７と個別電極２８
とが互いにクロスすることがないので、クロス点のリー
ク電流等が発生するおそれがなく、ショートあるいはリ
ーク電流等によるＳＺＮ比の低下をきたすことがない。Moreover, even if the common side terminal 24 and the individual side terminal 26 are arranged on one side of the photoelectric conversion element 22, the common electrode 27 and the individual electrode 28
Since they do not cross each other, there is no risk of leakage current occurring at the crossing point, and the SZN ratio does not decrease due to short circuit or leakage current.
次に、第９図及び第１０図に基づいて本発明の第二の実
施例を説明する。前記実施例と同一部分は同一符号を用
い、説明も省略する。まず、本実施例は個別電極２６に
接続された引出線３５を絶縁層３０の下に形成し、共通
電極２７と個別電極２８との間に絶縁層３０が存するよ
うに構成されている。そして、引出線３５と個別電極２
８どの間及び引出線３５と個別側端子２６との間はスル
ーホール３６により接続されている。Next, a second embodiment of the present invention will be described based on FIGS. 9 and 10. The same parts as in the previous embodiment are denoted by the same reference numerals, and the description thereof will be omitted. First, in this embodiment, the lead wire 35 connected to the individual electrode 26 is formed under the insulating layer 30, and the insulating layer 30 exists between the common electrode 27 and the individual electrode 28. Then, the leader wire 35 and the individual electrode 2
8 and between the lead wire 35 and the individual side terminal 26 are connected by a through hole 36.
したがって、引出線３５に隣接された共通電極２７と個
別電極２８との間にリーク電流が発生するおそれがない
。Therefore, there is no risk of leakage current occurring between the common electrode 27 and the individual electrodes 28 adjacent to the lead wire 35.
本発明の第三の実施例を第１１図及び第１２図に基づい
て説明する。前記実施例と同一部分は同一符号を用い、
説明も省略する。本実施例は、絶縁層３０を介して引出
線３５を光電変換素子２２の下に通したものである。そ
して、引出線３５と個別電極２８との間及び引出′ａ３
５と個別側端子２６との間はスルーホール３６により接
続されている。A third embodiment of the present invention will be described based on FIGS. 11 and 12. The same parts as in the above embodiment are designated by the same reference numerals.
Explanation will also be omitted. In this embodiment, a lead wire 35 is passed under the photoelectric conversion element 22 via an insulating layer 30. And between the lead wire 35 and the individual electrode 28 and the lead 'a3
5 and the individual side terminal 26 are connected through a through hole 36.
このように構成することにより、光電変換素子２２の間
に引出線３５を通す必要がないので、隣接間隔を小さく
することができ、素子密度を高めることが可能である。With this configuration, it is not necessary to pass the leader wire 35 between the photoelectric conversion elements 22, so that the distance between adjacent photoelectric conversion elements 22 can be reduced, and the element density can be increased.
発明の効果
本発明は上述のように、共通電極に形成された共通側端
子部と個別電極に形成された個別側端子とを基板上に形
成された光電変換素子のいずれか一方の片側に配設した
ので、外部回路と接続される外部回路端子を基板の片側
のみに配設するだけでよく、そのため、ワイヤボンデン
グによる接続作業も一工程でよく、また、外部回路自体
も基板の片側のみに配置するだけでよい等の効果を有す
る。Effects of the Invention As described above, the present invention provides a method in which the common side terminal portion formed on the common electrode and the individual side terminals formed on the individual electrodes are arranged on one side of a photoelectric conversion element formed on a substrate. Since the external circuit terminals connected to the external circuit only need to be placed on one side of the board, the connection work by wire bonding can be done in one step, and the external circuit itself can only be placed on one side of the board. It has the effect that it only needs to be placed in the
第１図は本発明の第一の実施例を示す一部の拡大平面図
、第２図はそのＡ−Ａ線断面図、第３図は等価回路図、
第４図はコピーボードの斜視図、第５図は読取ユニット
の断面図、第６図は複数個の光電変換装置を直線状に配
列して形成した読取装置の平面図、第７図は一つの光電
変換装置の平面図、第８図は等価回路図、第９図は本発
明の第二の実施例を示す一部の拡大平面図、第１０図は
そのＢ−Ｂ線断面図、第１１図は本発明の第三の実施例
を示す一部の拡大平面図、第１２図はそのＣ−Ｃ線断面
図、第１３図は従来の一例を示す平面図、第１４図は読
取装置の平面図である。
２１・・・光電変換装置、２２・・・光電変換素子、２
３・・・基板、２４・・・共通側端子、２６・・・個別
側端子、２７・・・共通電極、２８・・・個別電極見Ｌ
ｌ−圓
１」
一５５図
Ｊ７６図
ｊ６ 図
５９ 閃
３ｚ ２ｑ ８Ｊ
５．１０ 図FIG. 1 is an enlarged plan view of a part of the first embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A, and FIG. 3 is an equivalent circuit diagram.
FIG. 4 is a perspective view of the copyboard, FIG. 5 is a sectional view of the reading unit, FIG. 6 is a plan view of the reading device formed by linearly arranging a plurality of photoelectric conversion devices, and FIG. 8 is an equivalent circuit diagram, FIG. 9 is a partially enlarged plan view showing the second embodiment of the present invention, and FIG. Fig. 11 is an enlarged plan view of a portion of the third embodiment of the present invention, Fig. 12 is a sectional view taken along the line C-C, Fig. 13 is a plan view showing a conventional example, and Fig. 14 is a reading device. FIG. 21... Photoelectric conversion device, 22... Photoelectric conversion element, 2
3... Board, 24... Common side terminal, 26... Individual side terminal, 27... Common electrode, 28... Individual electrode view L
1-55 Figure J76 Figure j6 Figure 59 Sen3z 2q 8J 5.10 Figure
Claims (1)
光電変換素子が基板上に形成され、これらの光電変換素
子を直線状に配列した光電変換装置において、前記共通
電極に形成された共通側端子部と前記個別電極に形成さ
れた個別側端子とを前記基板上における前記光電変換素
子の片側に配設したことを特徴とする光電変換装置。In a photoelectric conversion device in which a large number of photoelectric conversion elements are formed on a substrate by common electrodes and individual electrodes facing each other, and these photoelectric conversion elements are arranged in a straight line, a common side terminal portion formed on the common electrode. and an individual side terminal formed on the individual electrode are arranged on one side of the photoelectric conversion element on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63034570A JPH01209759A (en) | 1988-02-17 | 1988-02-17 | Optoelectronic converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63034570A JPH01209759A (en) | 1988-02-17 | 1988-02-17 | Optoelectronic converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01209759A true JPH01209759A (en) | 1989-08-23 |
Family
ID=12417986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63034570A Pending JPH01209759A (en) | 1988-02-17 | 1988-02-17 | Optoelectronic converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01209759A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323670A (en) * | 1989-06-21 | 1991-01-31 | Matsushita Graphic Commun Syst Inc | Contact type image sensor |
-
1988
- 1988-02-17 JP JP63034570A patent/JPH01209759A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323670A (en) * | 1989-06-21 | 1991-01-31 | Matsushita Graphic Commun Syst Inc | Contact type image sensor |
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