CN113497066A

CN113497066A - Sensor assembly, camera module and camera device

Info

Publication number: CN113497066A
Application number: CN202010191485.2A
Authority: CN
Inventors: 罗科
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Tech Co Ltd; Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2020-03-18
Filing date: 2020-03-18
Publication date: 2021-10-12

Abstract

The invention discloses a sensor assembly, a camera module and a camera device. The sensor assembly comprises a substrate and a sensor, the sensor is arranged on one surface of the substrate, the contour line of the sensor comprises a first boundary extending along a first direction, a plurality of first sensor pads are arranged on the sensor and at positions close to the first boundary, a plurality of first substrate pads are arranged on the substrate and on the periphery of the sensor corresponding to the first sensor pads, the first substrate pads are arranged in a single row along the first direction, each first sensor pad is electrically connected with the corresponding first substrate pad through a first metal wire, and the first metal wire is formed by routing along the direction from the first substrate pad to the first sensor pad. According to the method and the device, the routing direction between the substrate bonding pad and the sensor bonding pad is changed, so that the structural size of the substrate bonding pad can be reduced, and the substrate bonding pads can be arranged in a single row.

Description

Sensor assembly, camera module and camera device

Technical Field

The invention relates to the field of camera equipment, in particular to a sensor assembly, a camera module and a camera device.

Background

The packaging process of the current market camera mainly adopts a chip-on-board (COB) package, a sensor chip is adhered to a Printed Circuit Board (PCB) by conductive or non-conductive adhesive, and then a PCB bonding pad and a chip bonding pad are electrically connected in a metal wire routing mode. The routing mode between the PCB bonding pad and the chip bonding pad is usually routing from the chip bonding pad, and the metal wire is fused at the PCB bonding pad, so that the structural size of the PCB bonding pad serving as the fusing position of the routing is larger than that of the chip bonding pad due to the routing process requirement. And under the prerequisite of arranging PCB pad and chip pad one-to-one coaxial correspondence, can't guarantee that the PCB pad is the single row and arranges, so the more multirow of the mode of arranging of current PCB pad on PCB arranges. However, there are many disadvantages in the multi-row arrangement of the PCB pads on the PCB, for example, the multi-row arrangement is not favorable for the miniaturization of the camera; multirow is arranged and is easily caused the wiring confusion between two pads, and then leads to the circuit to appear short circuit, winding scheduling problem etc..

Disclosure of Invention

The invention provides a sensor assembly, a camera module and a camera device, and aims to solve the problems of various defects of the conventional arrangement mode of arranging PCB pads in multiple rows on a PCB.

In a first aspect, the invention provides a sensor assembly, which includes a substrate and a sensor, wherein the sensor is disposed on a surface of the substrate, an outline of the sensor includes a first boundary extending along a first direction, a plurality of first sensor pads are disposed on the sensor and at positions close to the first boundary, a plurality of first substrate pads are disposed on the substrate and at the periphery of the sensor corresponding to the plurality of first sensor pads, the plurality of first substrate pads are arranged in a single row along the first direction, each first sensor pad is electrically connected to the corresponding first substrate pad through a first metal wire, and the first metal wire is formed by routing along a direction from the first substrate pad to the first sensor pad.

This application is through changing the routing direction between base plate pad and the sensor pad, begin the routing from base plate pad, can satisfy under the prerequisite of routing technology requirement like this, reduce the structure size of the base plate pad among the prior art, and then can arrange a plurality of first base plate pads along first direction single file, for arranging a plurality of first base plate pad multirow, can reduce sensor module like this with the ascending size in first direction vertically side, be favorable to the miniaturized setting of camera module, also avoided base plate pad multirow to arrange and easily caused the chaotic condition of line, the problem of the mode of arranging that current base plate pad multirow was arranged has a great deal of drawback has been overcome like this.

In one embodiment, a pitch between each of the first substrate pads and the first boundary in a direction perpendicular to the first direction is 0-0.105 mm.

The size of the sensor assembly in the direction perpendicular to the first direction can be minimized as much as possible by optimizing the setting range of the distance between the first substrate pad and the first boundary in the direction perpendicular to the first direction.

In one embodiment, the plurality of first sensor pads are arranged at intervals along the first direction, wherein:

each of the first sensor pads is opposed to the corresponding first substrate pad in a direction perpendicular to the first direction; alternatively, the first and second electrodes may be,

at least one of the plurality of first sensor pads and the corresponding first substrate pad are arranged in a staggered manner in a direction perpendicular to the first direction.

This application sets up first sensor pad and first base plate pad one-to-one through with first direction vertically direction on, only need carry out the routing like this along this vertical direction, and then simplified the process of routing. And stagger first sensor pad and first base plate pad in this vertical direction, be favorable to increasing the interval in the first direction between two adjacent first base plate pads, and then be convenient for carry out the routing to first base plate pad.

In one embodiment, a boundary line of an arrangement region of the plurality of first substrate pads on the substrate does not exceed the first boundary in the first direction.

According to the sensor component, the plurality of first substrate bonding pads are arranged not to exceed the first boundary in the first direction, and the size of the sensor component in the first direction is favorably controlled.

In one embodiment, the contour line of the sensor further includes a second boundary spaced from the first boundary and extending along a second direction, a plurality of second sensor pads are arranged on the sensor and at positions close to the second boundary, a plurality of second substrate pads are arranged on the substrate and located on the periphery of the sensor corresponding to the plurality of second sensor pads, the plurality of second substrate pads are arranged in a single row along the second direction, each of the second sensor pads is electrically connected with the corresponding second substrate pad through a second metal wire, and the second metal wire is formed by routing along a direction from the second substrate pad to the second sensor pad.

This application is through changing the formation mode of second metal wire, so can reduce the size of second base plate pad in the second direction, and then can arrange a plurality of second base plate pads along second direction single row, can reduce the size of sensor subassembly in the direction perpendicular with the second direction like this.

In one embodiment, a boundary line of an arrangement region of the plurality of second substrate pads on the substrate does not exceed the second boundary in the second direction; and/or the distance between each third substrate pad and the third boundary in the direction perpendicular to the third direction is 0-0.105 mm.

According to the sensor component, the plurality of second substrate bonding pads do not exceed the second boundary in the second direction, and the size of the sensor component in the second direction is favorably controlled. By optimizing the setting range of the pitch between the second substrate pad and the second boundary in the direction perpendicular to the second direction, the dimension of the sensor element in the direction perpendicular to the second direction can be made as minimum as possible.

In one embodiment, the contour line of the sensor further includes a third boundary intersecting the first boundary and extending along a third direction, a plurality of third sensor pads are disposed on the sensor and at positions close to the third boundary, a plurality of third substrate pads are disposed on the substrate and located at positions corresponding to the periphery of the sensor, and are arranged in a single row along the third direction, each third sensor pad is electrically connected with the corresponding third substrate pad through a third metal wire, and the third metal wire is formed by routing along a direction from the third substrate pad to the third sensor pad.

This application is through the formation mode that changes third metal wire, so can reduce the size of third base plate pad in the third direction, and then can arrange a plurality of third base plate pads along third direction single row, can reduce the size of sensor subassembly in the direction perpendicular with the third direction like this.

In one embodiment, a boundary line of an arrangement region of the plurality of third substrate pads on the substrate does not exceed the third boundary in the third direction; and/or the distance between each third substrate pad and the third boundary in the direction perpendicular to the third direction is 0-0.105 mm.

According to the sensor component, the plurality of third substrate bonding pads do not exceed the third boundary in the third direction, and the size of the sensor component in the third direction is favorably controlled. By optimizing the setting range of the distance between the third substrate pad and the third boundary in the direction perpendicular to the third direction, the dimension of the sensor element in the direction perpendicular to the third direction can be minimized as much as possible.

In one embodiment, the contour line of the sensor further includes a fourth boundary intersecting with one end of the first boundary far away from the third boundary and extending along a fourth direction, a plurality of fourth sensor pads are arranged on the sensor and at positions close to the fourth boundary, a plurality of fourth substrate pads are arranged on the substrate and located at the periphery of the sensor corresponding to the plurality of fourth sensor pads, the plurality of fourth substrate pads are arranged in a single row along the fourth direction, each fourth sensor pad is electrically connected with the corresponding fourth substrate pad through a fourth metal wire, and the fourth metal wire is formed by routing along the direction from the fourth substrate pad to the fourth sensor pad.

According to the sensor component, the size of the fourth substrate bonding pad in the fourth direction can be reduced by changing the forming mode of the fourth metal wire, and then the plurality of fourth substrate bonding pads can be arranged in a single row along the fourth direction, so that the size of the sensor component in the direction perpendicular to the fourth direction can be reduced.

In one embodiment, a boundary line of an arrangement region of the plurality of fourth substrate pads on the substrate does not exceed the fourth boundary in the fourth direction; and/or a distance between each fourth substrate pad and the fourth boundary in a direction perpendicular to the fourth direction is 0-0.105 mm.

The plurality of fourth substrate bonding pads do not exceed the fourth boundary in the fourth direction, and therefore the size of the sensor assembly in the fourth direction can be controlled conveniently. By optimizing the range of arrangement of the pitch between the fourth substrate pad and the fourth boundary in the direction perpendicular to the fourth direction, the dimension of the sensor module in the direction perpendicular to the fourth direction can be minimized as much as possible.

In a second aspect, the present invention also provides a camera module including the sensor assembly described in any of the various embodiments of the first aspect.

In a third aspect, the present invention further provides a camera device, including the camera module according to any one of the embodiments of the second aspect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a sensor assembly in an embodiment of the invention;

FIG. 2 is a schematic structural diagram of a sensor assembly in yet another embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a sensor assembly in yet another embodiment of the present invention;

fig. 4 is a schematic structural diagram of a sensor assembly in yet another embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the specific embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The packaging technology of the current market camera mainly adopts COB, and a sensor chip is adhered on a printed circuit board by conductive or non-conductive adhesive, and then a PCB bonding pad is electrically connected with a chip bonding pad in a metal lead routing mode. The routing mode between the PCB bonding pad and the chip bonding pad is usually routing from the chip bonding pad, and the metal wire is fused at the PCB bonding pad, so that the structural size of the PCB bonding pad serving as the fusing position of the routing is larger than that of the chip bonding pad due to the routing process requirement. And under the prerequisite of arranging PCB pad and chip pad one-to-one coaxial correspondence, can't guarantee that the PCB pad is the single row and arranges, so the more multirow of the mode of arranging of current PCB pad on PCB arranges. However, there are many disadvantages in the multi-row arrangement of the PCB pads on the PCB, for example, the multi-row arrangement is not favorable for the miniaturization of the camera; multirow is arranged and is easily caused the wiring confusion between two pads, and then leads to the circuit to appear short circuit, winding scheduling problem etc..

To the above problem, the present application provides a sensor assembly, which can be applied to camera modules of camera devices such as mobile phones and digital cameras. As shown in fig. 1 and 2, the sensor assembly 100 includes a substrate 1 and a sensor 2.

The substrate 1 may be a flexible circuit board, a hard circuit board, or a rigid-flex circuit board, and the sensor 2 may be an image sensor. The sensor 2 is disposed on a plate surface of the substrate 1, as shown in fig. 1, a sensing region 25 and an edge region 26 are disposed on a surface of the sensor 2 away from the substrate 1, the edge region 26 is located at a periphery of the sensing region 25, and a plurality of sensor pads (the cross section of the sensor pad may be circular, oval, or polygonal, etc.) are disposed in the edge region 26, the substrate 1 is provided with a plate surface of the sensor 2 and is provided with a plurality of substrate pads corresponding to the plurality of sensor pads at the periphery of the sensor 2 (the cross section of the substrate pad may be circular, oval, or polygonal, etc.), and the plurality of sensor pads are correspondingly electrically connected to the plurality of substrate pads, so as to electrically connect the substrate 1 and the sensor 2. The sensor pad and the substrate pad are electrically connected through a metal wire, and the metal wire is connected with the sensor pad and the substrate pad in a routing bonding mode. In the prior art, a wire bonding mode between a sensor pad and a substrate pad usually starts from the sensor pad, and a metal wire is fused at the substrate pad (such wire bonding mode is hereinafter defined as forward wire bonding), and due to the requirement of a wire bonding process, the structural size of the substrate pad serving as the wire bonding fusing position is large, for example, the width of the existing substrate pad is usually 100 μm (the width of the substrate pad is the size of the substrate pad in the direction perpendicular to the wire bonding direction, and the direction perpendicular to the wire bonding direction is the direction defined by two points on the same plate surface of the substrate 1); the sensor pad and the substrate pad in the present application are electrically connected through a metal wire, and the metal wire is formed by wire bonding along a direction from the substrate pad to the sensor pad (this wire bonding mode is hereinafter defined as reverse wire bonding), so that by starting wire bonding from the substrate pad, the structural size of the substrate pad can be reduced on the premise of meeting the wire bonding process requirement, for example, the width of the substrate pad in the present application is usually 50 μm-60 μm. Moreover, a gap is usually reserved between the substrate bonding pad and the sensor 2 in the routing direction to form an arc height space required by routing, and the arc height space required to be reserved is larger due to the higher arc of the forward routing, and the gap reserved between the substrate bonding pad and the sensor 2 is also larger; the arc height of the reverse routing is small, the space of the reserved arc height is small, and the reserved gap between the substrate bonding pad and the sensor 2 in the routing direction is also small.

The outline of the sensor 2 includes a first boundary 31 extending in the first direction, and a plurality of first sensor pads 21 are provided on the sensor 2 at positions close to the first boundary 31. The contour of the sensor 2 may be a circle, an ellipse, a polygon, an irregular shape, or the like, and the contour of the sensor 2 may be divided into a plurality of boundaries. The sensor 2 may have a plurality of sensor pads provided near one boundary, or the sensor 2 may have a plurality of sensor pads provided near two or more boundaries, respectively. For example, as shown in fig. 1, the outline of the sensor 2 is a square shape, and has four boundaries, that is, a first boundary 31, a second boundary 32, a third boundary 33, and a fourth boundary 34, then the edge region 26 may be divided into a first sub-edge region near the first boundary 31, a second sub-edge region near the second boundary 32, a third sub-edge region near the third boundary 33, and a fourth sub-edge region near the fourth boundary 34, and a plurality of sensor pads may be provided in only one sub-edge region, or a plurality of sensor pads may be provided in two, three, or four sub-edge regions. The specific arrangement of the plurality of sensor pads in one sub-edge region may not be particularly limited, and in a specific embodiment, a plurality of first sensor pads 21 are disposed on the sensor 2 and near the first boundary 31, and the plurality of first sensor pads 21 are spaced along the first direction, so as to facilitate wire bonding of the plurality of first sensor pads 21.

A plurality of first substrate bonding pads 11 are arranged on the substrate 1 and on the periphery of the sensor 2 corresponding to the plurality of first sensor bonding pads 21, the plurality of first substrate bonding pads 11 are arranged in a single row along a first direction, each first sensor bonding pad 21 is electrically connected with the corresponding first substrate bonding pad 11 through a first metal wire 41, and the first metal wire 41 is formed by routing along the direction from the first substrate bonding pad 11 to the first sensor bonding pad 21. As described above, since the first metal wires 41 are formed by reverse wire bonding, the size of the first substrate pads 11 in the first direction can be reduced, and thus the plurality of first substrate pads 11 can be arranged in a single row along the extending direction of the first boundary 31, as opposed to the plurality of first substrate pads 11 arranged in multiple rows, so that the size of the sensor assembly 100 in the direction perpendicular to the first direction (the direction perpendicular to the first direction is the direction defined by two points on the same surface of the substrate 1, for example, as shown in fig. 1 and 2, in a specific embodiment, the contour line of the sensor 2 further includes a third boundary 33 perpendicular to the first boundary 31 and extending along a third direction, which is the direction perpendicular to the first direction). It should be noted that, in the present application, the two are perpendicular, which means that the included angle between the two is 90 ° or approximately 90 °.

It is understood that, as described above, since the first metal wires 41 are formed by reverse bonding, the gap reserved between the first substrate pads 11 and the sensor 2 in the bonding direction can be set smaller. When the plurality of first substrate pads 11 are closer to the first boundary 31, the sensor assembly 100 can be more compact, which is advantageous for reducing the size of the sensor assembly 100. Therefore, as shown in fig. 1 and fig. 2, in a specific embodiment, the distance between each first substrate pad 11 and the first boundary 31 in the direction perpendicular to the first direction (i.e., in the third direction) is a, and a is in a range of 0-0.105mm, that is, the plurality of first substrate pads 11 are close to the first boundary 31 in the direction perpendicular to the first direction (i.e., in the third direction), so that the dimension of the sensor assembly 100 in the direction perpendicular to the first direction (i.e., in the third direction) can be minimized as much as possible by optimizing the distance a between the first substrate pads 11 and the first boundary 31 in the direction perpendicular to the first direction (i.e., in the third direction).

Similarly, the plurality of first substrate pads 11 may be close to the first boundary 31 in the first direction, as shown in fig. 1 and 2, in a specific embodiment, the boundary line of the arrangement region of the plurality of first substrate pads 11 on the substrate 1 (the boundary line of the arrangement region of the plurality of first substrate pads 11 on the substrate 1 is shown as a dashed box a1 in fig. 1 and 2) does not exceed the first boundary 31 in the first direction, and the size of the sensor assembly 100 in the first direction may be advantageously controlled by providing the plurality of first substrate pads 11 close to the first boundary 31 in the first direction, that is, the arrangement region of the plurality of first substrate pads 11 does not exceed the first boundary 31 in the first direction.

Each of the first sensor pads 21 is electrically connected to the corresponding first substrate pad 11. The plurality of first sensor pads 21 are electrically connected to the plurality of first substrate pads 11 correspondingly, and the number of the first sensor pads 21 may be greater than that of the first substrate pads 11, so that two or more sensor pads 21 are electrically connected to the same first substrate pad 11; the number of the first sensor bonding pads 21 can be the same as that of the first substrate bonding pads 11, and the first sensor bonding pads 21 are electrically connected with the first substrate bonding pads 11 in a one-to-one correspondence manner, so that routing of the first sensor bonding pads 21 is facilitated. Wherein, there are various arrangements for the one-to-one electrical connection between the first sensor pads 21 and the first substrate pads 11, as shown in fig. 1, a plurality of first sensor pads 21 may be arranged at intervals along a first direction, each first sensor pad 21 being opposed to a corresponding first substrate pad 11 in a direction perpendicular to the first direction (i.e., in a third direction), for example, the first sensor pad 21 and the first substrate pad 11 may have a square cross section, and the first sensor pad 21 and the first substrate pad 11 may be opposite to each other in a direction perpendicular to the first direction such that the first sensor pad 21 and the first substrate pad 11 have the same central axis, the first sensor bonding pads 21 are arranged in the direction perpendicular to the first direction and are opposite to the first substrate bonding pads 11 one by one, so that routing is carried out along the perpendicular direction, and the routing process is simplified; as shown in fig. 2, the plurality of first sensor pads 21 are arranged at intervals along the first direction, at least one of the plurality of first sensor pads 21 and the corresponding first substrate pad 11 are arranged in a staggered manner in a direction perpendicular to the first direction (i.e., in a third direction), and the first sensor pads 21 and the first substrate pads 11 are staggered in the perpendicular direction, which is beneficial to increasing the distance between two adjacent first substrate pads 11 in the first direction, and is further convenient for routing the first substrate pads 11.

This application changes the routing direction between first base plate pad 11 and the first sensor pad 21, can reduce first base plate pad 11's structural dimension like this, and then can arrange a plurality of first base plate pads 11 along first direction single file, for arranging a plurality of first base plate pad 11 multirow, can reduce sensor assembly 100 like this with the size of first direction vertically orientation (be the third direction) on (being), be favorable to the miniaturized setting of camera module, also avoided base plate pad multirow to arrange and easily cause the chaotic condition of line, the problem of having a great deal of drawbacks in the mode of setting that current base plate pad multirow was arranged has been overcome so.

As described above, a plurality of sensor pads may be disposed in two or more sub-edge regions, and then substrate pads may be disposed on the substrate 1 corresponding to the two or more sub-edges. As shown in fig. 1, in a specific embodiment, the outline of the sensor 2 further includes a second boundary 32 spaced apart from the first boundary 31 and extending along the second direction (in a specific embodiment, the first boundary 31 is parallel or approximately parallel to the second boundary 32), a plurality of second sensor pads 22 are disposed on the sensor 2 and near the second boundary 32, a plurality of second substrate pads 12 are disposed on the substrate 1 and at the periphery of the sensor 2 corresponding to the plurality of second sensor pads 22, the plurality of second substrate pads 12 are arranged in a single row along the second direction, each second sensor pad 22 is electrically connected to the corresponding second substrate pad 12 through a second metal wire 42, and the second metal wire 42 is formed by wire bonding along the direction from the second substrate pad 12 to the second sensor pad 22. The second metal wires 42 are formed by reverse wire bonding, so that the size of the second substrate pads 12 in the second direction can be reduced, and the plurality of second substrate pads 12 can be arranged in a single row along the second direction, which can reduce the size of the sensor assembly 100 in the direction perpendicular to the second direction (similarly, the direction perpendicular to the second direction is also the direction defined by two points on the same surface of the substrate 1, for example, as shown in fig. 1 and 2, in a specific embodiment, the contour line of the sensor 2 further includes a third boundary 33 perpendicular to the second boundary 32 and extending along a third direction, and then the third direction is the direction perpendicular to the second direction).

Similarly, since the second metal wire 42 is formed by reverse wire bonding, the gap reserved between the second substrate pad 12 and the sensor 2 in the wire bonding direction can be set smaller. When the plurality of second substrate pads 12 are closer to the second boundary 32, the sensor assembly 100 can be more compact, which is advantageous for reducing the size of the sensor assembly 100. Therefore, as shown in fig. 1 and fig. 2, in a specific embodiment, the distance between each second substrate pad 12 and the second boundary 32 in the direction perpendicular to the second direction (i.e., in the third direction) is b, and the value of b is in the range of 0-0.105mm, that is, the plurality of second substrate pads 12 are close to the second boundary 32 in the direction perpendicular to the second direction (i.e., in the third direction), so that the dimension of the sensor assembly 100 in the direction perpendicular to the second direction (i.e., in the third direction) can be minimized as much as possible by optimizing the distance b between the second substrate pads 12 and the second boundary 32 in the direction perpendicular to the second direction (i.e., in the third direction). It is also possible to make the plurality of second substrate pads 12 close to the second boundary 32 in the second direction, as shown in fig. 1 and 2, in a specific embodiment, the boundary line of the arrangement region of the plurality of second substrate pads 12 on the substrate 1 (the boundary line of the arrangement region of the plurality of second substrate pads 12 on the substrate 1 is shown as a dashed frame a2 in fig. 1 and 2) does not exceed the second boundary 32 in the second direction, and it is advantageous to control the size of the sensor assembly 100 in the second direction by setting the plurality of second substrate pads 12 close to the second boundary 32 in the second direction, that is, the arrangement region of the plurality of second substrate pads 12 does not exceed the second boundary 32 in the second direction.

Similarly, the plurality of second sensor pads 22 and the plurality of second substrate pads 12 may be electrically connected in a one-to-one correspondence. And a plurality of second sensor pads 22 are arranged at intervals along the second direction, each second sensor pad 22 is opposite to the corresponding second substrate pad 12 in the direction perpendicular to the second direction (i.e., in the third direction), or at least one of the plurality of second sensor pads 22 is offset from the corresponding second substrate pad 12 in the direction perpendicular to the second direction (i.e., in the third direction).

In fig. 1, a plurality of sensor pads are disposed in two spaced sub-edge regions of the sensor 2, or a plurality of sensor pads are disposed in two adjacent sub-edge regions of the sensor 2, for example, as shown in fig. 3 and 4, the sensor assembly 100 may be configured to simultaneously dispose the substrate pads and the sensor pads corresponding to a third boundary 33 connecting the first boundary 31 and the second boundary 32, in addition to disposing the substrate pads and the sensor pads corresponding to the first boundary 31 and the second boundary 32, in a specific embodiment, the contour line of the sensor 2 further includes a third boundary 33 intersecting the first boundary 31 and extending along a third direction, a plurality of third sensor pads 23 are disposed on the sensor 2 and near the third boundary 33, a plurality of third substrate pads 13 are disposed on the substrate 1 and at the periphery of the sensor 2 and corresponding to the plurality of third sensor pads 23, the third substrate pads 13 are arranged in a single row along the third direction, each third sensor pad 23 is electrically connected with the corresponding third substrate pad 13 through a third metal wire 43, and the third metal wires 43 are formed by routing along the direction from the third substrate pads 13 to the third sensor pads 23. The third metal wires 43 are formed by reverse wire bonding, so that the size of the third substrate pads 13 in the third direction can be reduced, and the plurality of third substrate pads 13 can be arranged in a single row along the third direction, so that the size of the sensor assembly 100 in the direction perpendicular to the third direction can be reduced (similarly, the direction perpendicular to the third direction is also the direction defined by two points on the same surface of the substrate 1, for example, as shown in fig. 3 and 4, in a specific embodiment, the first boundary 31 is perpendicular to the third boundary 33, and then the first direction is the direction perpendicular to the third direction).

Similarly, since the third metal wire 43 is formed by reverse wire bonding, the gap reserved between the third substrate pad 13 and the sensor 2 in the wire bonding direction can be set smaller. When the plurality of third substrate pads 13 are closer to the third boundary 33, the sensor assembly 100 can be more compactly arranged, which is advantageous in reducing the size of the sensor assembly 100. Therefore, in a specific embodiment, the distance between each third substrate pad 13 and the third boundary 33 in the direction perpendicular to the third direction (i.e., the first direction) is c, and the value of c ranges from 0 to 0.105mm, that is, the third substrate pads 13 are close to the third boundary 33 in the direction perpendicular to the third direction (i.e., the first direction), so that the dimension of the sensor component 100 in the direction perpendicular to the third direction (i.e., the first direction) can be minimized as much as possible by optimizing the distance c between the third substrate pads 13 and the third boundary 33 in the direction perpendicular to the third direction (i.e., the first direction). It is also possible to let the plurality of third substrate pads 13 approach the third boundary 33 in the third direction, in a specific embodiment, the boundary line of the arrangement region of the plurality of third substrate pads 13 on the substrate 1 (the boundary line of the arrangement region of the plurality of third substrate pads 13 on the substrate 1 is shown as a dashed line frame a3 in fig. 3) does not exceed the third boundary 33 in the third direction, and it is advantageous to control the size of the sensor assembly 100 in the third direction by setting the plurality of third substrate pads 13 to approach the third boundary 33 in the third direction, that is, the arrangement region of the plurality of third substrate pads 13 does not exceed the third boundary 33 in the third direction.

Similarly, the plurality of third sensor pads 23 and the plurality of third substrate pads 13 may be electrically connected in a one-to-one correspondence. And a plurality of third sensor pads 23 are arranged at intervals along the third direction, each third sensor pad 23 is opposite to the corresponding third substrate pad 13 in the direction perpendicular to the third direction (i.e. the first direction), or at least one of the plurality of third sensor pads 23 is staggered from the corresponding third substrate pad 13 in the direction perpendicular to the third direction (i.e. the first direction).

As described above, a plurality of sensor pads may be disposed in each of the four sub-edge regions of the sensor 2, for example, as shown in fig. 4, the sensor assembly 100 may be disposed with a substrate pad and a sensor pad corresponding to the first boundary 31, the second boundary 32, the third boundary 33 and the fourth boundary 34, respectively, in a specific embodiment, the outline of the sensor 2 further includes the fourth boundary 34 intersecting with one end of the first boundary 31 away from the third boundary 33 and extending along the fourth direction, a plurality of fourth sensor pads 24 are disposed on the sensor 2 and near the fourth boundary 34, a plurality of fourth substrate pads 14 are disposed on the substrate 1 and at the periphery of the sensor 2 corresponding to the plurality of fourth sensor pads 24, the plurality of fourth substrate pads 14 are arranged in a single row along the fourth direction, each of the fourth sensor pads 24 is electrically connected to the corresponding fourth substrate pad 14 through the fourth metal wire 44, and the fourth metal wire 44 is wire-bonded along the direction from the fourth substrate pad 14 to the fourth sensor pad 24. The fourth metal wire 44 is formed by reverse wire bonding, so that the size of the fourth substrate pad 14 in the fourth direction can be reduced, and the plurality of fourth substrate pads 14 can be arranged in a single row along the fourth direction, so that the size of the sensor assembly 100 in the direction perpendicular to the fourth direction can be reduced (likewise, the direction perpendicular to the fourth direction is also the direction defined by two points on the same plate surface of the substrate 1, for example, as shown in fig. 4, in a specific embodiment, the first boundary 31 is perpendicular to the fourth boundary 34, and then the first direction is the direction perpendicular to the fourth direction).

Similarly, since the fourth metal wire 44 is formed by reverse wire bonding, the gap reserved between the fourth substrate pad 14 and the sensor 2 in the wire bonding direction can be set smaller. As the fourth substrate pads 14 are closer together at the fourth boundary 34, the more compact the sensor assembly 100 is, which in turn facilitates a reduction in the size of the sensor assembly 100. In a specific embodiment, the distance between each of the fourth substrate pads 14 and the fourth boundary 34 in the direction perpendicular to the fourth direction (i.e., the first direction) is d, and the value of d ranges from 0 mm to 0.105mm, that is, the fourth substrate pads 14 are close to the fourth boundary 34 in the direction perpendicular to the fourth direction (i.e., the first direction), so that the dimension of the sensor assembly 100 in the direction perpendicular to the fourth direction (i.e., the first direction) can be minimized as much as possible by optimizing the distance d between the fourth substrate pads 14 and the fourth boundary 34 in the direction perpendicular to the fourth direction (i.e., the first direction). It is also possible to let the plurality of fourth substrate pads 14 approach the fourth boundary 34 in the fourth direction, and in a specific embodiment, the boundary line of the arrangement region of the plurality of fourth substrate pads 14 on the substrate 1 (the boundary line of the arrangement region of the plurality of fourth substrate pads 14 on the substrate 1 is shown by a dashed frame a4 in fig. 3) does not exceed the fourth boundary 34 in the fourth direction, and it is advantageous to control the size of the sensor assembly 100 in the fourth direction by setting the plurality of fourth substrate pads 14 approach the fourth boundary 34 in the fourth direction, that is, the arrangement region of the plurality of fourth substrate pads 14 does not exceed the fourth boundary 34 in the fourth direction.

Similarly, the plurality of fourth sensor pads 24 and the plurality of fourth substrate pads 14 may be electrically connected in a one-to-one correspondence. And a plurality of fourth sensor pads 24 are arranged at intervals along the fourth direction, each fourth sensor pad 24 is opposite to the corresponding fourth substrate pad 14 in the direction perpendicular to the fourth direction (i.e. the first direction), or at least one of the plurality of fourth sensor pads 24 is arranged in a staggered manner from the corresponding fourth substrate pad 14 in the direction perpendicular to the fourth direction (i.e. the first direction).

The application also provides a camera module, and the camera module comprises the sensor assembly.

The application also provides a camera device which can be a mobile phone, a digital camera, a tablet computer and the like. Specifically, the camera device comprises the camera module.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The utility model provides a sensor assembly, its characterized in that, includes base plate and sensor, the sensor set up in a face of base plate, the outline line of sensor includes the first border that extends along first direction, just be being close to on the sensor the position on first border is equipped with a plurality of first sensor pads, just be located on the base plate the periphery of sensor corresponds a plurality of first sensor pads are provided with a plurality of first base plate pads, a plurality of first base plate pads along the first direction is single row and arranges, each first sensor pad with correspond through first metal wire electric connection between the first base plate pad, just first metal wire is along following first base plate pad extremely the direction routing of first sensor pad forms.

2. The sensor assembly of claim 1, wherein a spacing between each of the first substrate pads and the first boundary in a direction perpendicular to the first direction is 0-0.105 mm.

3. The sensor assembly of claim 1, wherein the first plurality of sensor pads are spaced apart along the first direction, wherein:

4. The sensor assembly of claim 1, wherein a boundary line of an arrangement area of the plurality of first substrate pads on the substrate does not exceed the first boundary in the first direction.

5. The sensor assembly of claim 1, wherein the outline of the sensor further includes a second boundary spaced from the first boundary and extending along a second direction, wherein a plurality of second sensor pads are disposed on the sensor and adjacent to the second boundary, wherein a plurality of second substrate pads are disposed on the substrate and at a periphery of the sensor corresponding to the plurality of second sensor pads, wherein the plurality of second substrate pads are arranged in a single row along the second direction, each of the second sensor pads is electrically connected to the corresponding second substrate pad by a second metal wire, and the second metal wire is formed by routing along a direction from the second substrate pad to the second sensor pad.

6. The sensor assembly of claim 5, wherein a boundary line of an arrangement area of the plurality of second substrate pads on the substrate does not exceed the second boundary in the second direction; and/or the distance between each third substrate pad and the third boundary in the direction perpendicular to the third direction is 0-0.105 mm.

7. The sensor package of any of claims 1-6, wherein the outline of the sensor further includes a third boundary intersecting the first boundary and extending along a third direction, a plurality of third sensor pads are disposed on the sensor and near the third boundary, a plurality of third substrate pads are disposed on the substrate and at the periphery of the sensor corresponding to the plurality of third sensor pads, the plurality of third substrate pads are arranged in a single row along the third direction, each third sensor pad is electrically connected to the corresponding third substrate pad through a third metal wire, and the third metal wire is formed by wire bonding along a direction from the third substrate pad to the third sensor pad.

8. The sensor assembly of claim 7, wherein a boundary line of an arrangement area of the plurality of third substrate pads on the substrate does not exceed the third boundary in the third direction; and/or the distance between each third substrate pad and the third boundary in the direction perpendicular to the third direction is 0-0.105 mm.

9. The sensor assembly of claim 7, wherein the contour of the sensor further includes a fourth boundary intersecting with an end of the first boundary away from the third boundary and extending along a fourth direction, a plurality of fourth sensor pads are disposed on the sensor and at a position close to the fourth boundary, a plurality of fourth substrate pads are disposed on the substrate and at a position on the periphery of the sensor corresponding to the plurality of fourth sensor pads, the plurality of fourth substrate pads are arranged in a single row along the fourth direction, each of the fourth sensor pads is electrically connected to the corresponding fourth substrate pad through a fourth metal wire, and the fourth metal wire is formed by routing along a direction from the fourth substrate pad to the fourth sensor pad.

10. The sensor assembly of claim 9, wherein a boundary line of an arrangement area of the plurality of fourth substrate pads on the substrate does not exceed the fourth boundary in the fourth direction; and/or a distance between each fourth substrate pad and the fourth boundary in a direction perpendicular to the fourth direction is 0-0.105 mm.

11. A camera module comprising a sensor assembly according to any one of claims 1 to 10.

12. A camera device, comprising the camera module according to claim 11.