CN104778455A - Active fingerprint sensing device with different sensing areas and manufacturing method of active fingerprint sensing device - Google Patents
Active fingerprint sensing device with different sensing areas and manufacturing method of active fingerprint sensing device Download PDFInfo
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- CN104778455A CN104778455A CN201510178027.4A CN201510178027A CN104778455A CN 104778455 A CN104778455 A CN 104778455A CN 201510178027 A CN201510178027 A CN 201510178027A CN 104778455 A CN104778455 A CN 104778455A
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Abstract
The invention comprises an active fingerprint sensing device with different sensing areas and a manufacturing method of the active fingerprint sensing device. An upper structural body comprising a sensor unit and a lower structural body comprising a sensing circuit are designed and manufactured integrally by a technology; the area of the lower structural body is smaller than that of the upper structural body; a divergence circuit in the upper structural body is electrically connected with the lower structural body; at last, the connected structure works with a circuit board together to be combined and mounted. The technical scheme disclosed by the invention has the advantages as follows: the pitch of the sensing circuit can be shortened under the situation that the pitch of the fingerprint sensing unit cannot be shortened, so that the used area of the chip of the sensing circuit can be reduced, and the cost of the sensing device can be reduced; secondly, the pitch of the sensing circuit element can be enlarged under the situation that the pitch of the fingerprint sensing element is not shortened, and the fingerprint sensing area can be identically added, so that the fingerprint sensors with different effective sensing areas and shapes can be provided for the chip of the identical sensing circuit, and the cost of the sensing device can be reduced.
Description
Technical field
The present invention relates to fingerprint recognition field, particularly a kind of active fingerprint acquisition apparatus and manufacture method thereof with different induction area.
Background technology
For traditional non-optical CMOS (Complementary Metal Oxide Semiconductor) fingerprint acquisition apparatus, during sensing fingerprint, it must sense the lines of finger, and is ensure sensing accuracy, and sensing area must be made at least to be equal to the necessary area of finger contact.
At present, the representational non-optical CMOS (Complementary Metal Oxide Semiconductor) fingerprint acquisition apparatus of most is capacitive fingerprint sensor, such fingerprint sensor has multiple sensing electrode unit being arranged in array, these areas shared by sensing electrode unit and the area of finger be one to one corresponding, the entire area of the fingerprint sensor in what is more important fingerprint sensor must be more than or equal to sensing electrode tuple, so causes production cost to remain high.
Such as have the design of the capacitive fingerprint sensing device of resolution 508dpi, in sensing array, the pitch of sensing electrode unit approximates greatly 50 microns, and each sensing electrode unit all comprises the sensing circuit of a sensing electrode and sensing electrode lower surface simultaneously.Sensing electrode and sensing circuit are normally integrated in semiconductor integrated circuit technique by the production method of sensing electrode unit, simultaneously first as sensing electrode for most upper epidermis metal, thus determine the pitch of sensing electrode unit, be corresponding sensing circuit below each sensing electrode unit simultaneously, thus form a kind of design of single stone-type.But so single stone-type design, for the sensor of area-type, there are much sensing areas just need design great sensing array.Such as, sensing array has 200 X, 200 sensing electrode units, then the sensing area of the 10mm X 10mm that can have an appointment, if add simulation and the digital circuit of periphery, then the area of whole fingerprint sensor or chip will be quite large, makes cost quite high.
The general character defect that this non-optical CMOS (Complementary Metal Oxide Semiconductor) fingerprint acquisition apparatus series products being prepared by prior art exists.
Summary of the invention
The present invention is exactly for the deficiencies in the prior art, a kind of active fingerprint acquisition apparatus with different induction area proposed, which solves the design defect that conventional art exists, while possessing compared with high accurancy and precision, the sensed area that energy Initial adaption is different.
Another object of the present invention proposes a kind of manufacture method and application thereof with the active fingerprint acquisition apparatus of different induction area.
The present invention is directed to sensing and related peripheral process integrated circuit area that in fingerprint induction installation, manufacturing cost is higher, realize cost-saving by the area saving described integrated circuit, simultaneously because technical scheme of the present invention can the sensing area of free setting different size as required, make when different purposes, fingerprint acquisition apparatus of the present invention can be designed to different profiles, presents diversity.
Thus, the present invention proposes a kind of active fingerprint acquisition apparatus with different induction area, described fingerprint acquisition apparatus be by traditional one fingerprint acquisition apparatus on the whole structure be designed to upper structure and lower structure, upper structure and lower structure carry out independent manufacturing and designing respectively, then coordinate circuit board to carry out combination and install.
A kind of active fingerprint acquisition apparatus with different induction area of the present invention comprises structure induction substrate and lower structure sensor chip, and described upper structure is made up of Rigid substrate materials or flexible substrate material.Described induction substrate is combined to form area-type by multiple sensing unit and responds to matrix, induction sensitivity is also increased while can obtaining large-area fingerprint sensing information thus, lower structure immediately below induction substrate is provided with one or more sensor chip, and described sensing unit and sensor chip are electrically connected by the circuit of dispersing filled in matrix.Sensing unit senses the biological characteristic of biosome and produces multiple sensing signal, sensing signal transfers to sensor chip through dispersing circuit respectively, sensor chip processes sensing signal respectively to obtain multiple output signal, obtains the fingerprint image of complete pressing scope thus.In technical solutions according to the invention, the minimum distribution area of sensor chip is equal to or less than the minimum distribution area containing sensing substrate, and namely the area of described lower structure is less than the area of structure.
Another object of the present invention proposes a kind of manufacture method with the active fingerprint acquisition apparatus of different induction area, and described manufacture method comprises following steps:
Lower structure manufacture, lower structure by more than one or multiple induction chip be combined to form induction matrix, described induction chip is made up of siliceous material, and multiple sensing circuit unit combination with sensing function forms matrix induction chip; Described lower structure has multiple upper connecting portion exposed;
Upper structure manufacture, on being formed structure substrate on form matrix sensing unit and obtain structure on, described upper structure has multiple lower connecting portion exposed; Be provided with in described upper structure connect upper structure sensing unit and lower structure sensing circuit unit disperse circuit, described in disperse circuit and comprise orthogonal at least one horizontal-extending section and at least one vertical extension of section; Electric connection is there is not in described horizontal-extending section with vertical extension of section; Described horizontal-extending district is for receiving scanning information, and described vertical extension area is for sending scanning information; Described sensing unit is mutually electrically connected by dispersing circuit and its connecting circuit is provided with Circuit tuning, and described Circuit tuning is mainly used in distinguishing sensing unit and carrying out corresponding Logic judgment;
Lower structure is arranged at below upper structure, and makes the upper connecting portion of lower structure aim at respectively with the lower connecting portion of upper structure and be bonded together and obtain multiple connecting portion;
Utilize over cap that upper structure and lower structure parcel are covered shape in aggregates, and on over cap, open multiple hole;
Arrange tin ball at lower structure near one end of described protection cap bore, described tin ball is connected with the weld pad of lower structure, and tin ball and external circuits plate are electrically connected and a shaping integral module mutually by reflow technology simultaneously.
The principle of work of fingerprint acquisition apparatus of the present invention is: when pointing near finger print detection device, sensing unit sensing finger fingerprint and produce multiple sensing signal, these sensing signals transfer to sensing circuit (i.e. induction chip) by dispersing circuit, sensing circuit processes sensing signal respectively and obtains output signal, outputs signal to drive to electronic equipment by circuit board and operate accordingly.
One of fingerprint acquisition apparatus of the present invention is very important is characterised in that in lower structure, the minimum distribution area of sensing circuit is less than the minimum distribution area of sensing unit in structure, and namely common fingerprint induction chip area (i.e. the minimum distribution area of sensing circuit in lower structure of the present invention or lower structure) is less than finger sensing induction area (namely going up the minimum distribution area of sensing unit in structure or upper structure).Therefore, lower structure of the present invention can be made into any type of fingerprint sensing chip according to actual needs, as long fine strip shape etc.
The sensing unit of upper structure of the present invention mainly completes sensing finger finger print information, and produces sensing signal and be sent to sensor chip, then carries out data processing by lower structure.The material so causing structure to respond to substrate determines fingerprint sensor characteristic, and upper structure induction substrate can use Rigid substrate materials to make, thus realize whole plane hard class sensor, upper structure induction substrate can also use flexible substrate material to make, thus realizes the bendable sensor of soft whole plane.
Invention is used to have following beneficial effect: technical scheme of the present invention can reduce the pitch of sensing circuit when not reducing sensing unit pitch in fingerprint substrate, the area that the chip that thus can reduce sensing circuit uses, thus the production cost reducing fingerprint acquisition apparatus.Simultaneously, technical solutions according to the invention increase induction area while can realizing reducing sensor chip area, namely can amplify the pitch of sense sensor circuit, thus strengthen actual sensed area and can capture larger effective fingerprint picture, reduce sensing apparatus cost.
Accompanying drawing explanation
Fig. 1 is a kind of perspective exploded view with the active fingerprint acquisition apparatus of different induction area of the present invention;
Fig. 2 is a kind of structural representation with structure under the active fingerprint acquisition apparatus of different induction area of the present invention;
Fig. 3 is the structural representation of structure on a kind of active fingerprint acquisition apparatus with different induction area of the present invention;
Fig. 4 be on a kind of active fingerprint acquisition apparatus with different induction area of the present invention structure and lower structure combine before structural representation;
Fig. 5 be on a kind of active fingerprint acquisition apparatus with different induction area of the present invention structure and lower structure combine after structural representation;
Fig. 6 be on a kind of active fingerprint acquisition apparatus with different induction area of the present invention structure and lower structure combine and wafer be adhered on substrate after structural representation;
Fig. 7 is the structural representation after a kind of active fingerprint acquisition apparatus with different induction area of the present invention arranges molding compound;
Fig. 8 is the structural representation after a kind of active fingerprint acquisition apparatus encapsulation with different induction area of the present invention;
Fig. 9 is the structural representation after a kind of molding compound perforate with the active fingerprint acquisition apparatus of different induction area of the present invention;
Figure 10 is the structural representation after a kind of active fingerprint acquisition apparatus welding tin ball with different induction area of the present invention;
Figure 11 is structure and lower structure one-piece construction schematic diagram on a kind of active fingerprint acquisition apparatus with different induction area of the present invention;
Figure 12 is a kind of one-piece construction schematic diagram with the active fingerprint acquisition apparatus of different induction area of the present invention;
Figure 13 is the schematic diagram 1 after a kind of active fingerprint acquisition apparatus modified node method with different induction area of the present invention;
Figure 14 is the schematic diagram 2 after a kind of active fingerprint acquisition apparatus modified node method with different induction area of the present invention;
Figure 15 is the schematic diagram 3 after a kind of active fingerprint acquisition apparatus modified node method with different induction area of the present invention;
In figure: structure on 10 times structures, 11 infrabasal plates, 12 connecting portions, 13 dielectric material 0 sensing circuits, 21 sweep circuits, 22 receiving circuits, 30,31 upper substrates, 32 dielectric structures, 33 operator guards, 40 disperse circuit, 41 horizontal-extending districts, 42 vertical extension areas, 43 export weld pad, 44 insulation courses, 45 molding compound, 46 tin balls, 47 connecting lines, 48 primers, 50 sensing units, 51 scan electrodes, 52 receiving electrodes, 60 circuit boards.
Embodiment
Technical scheme of the present invention is improving fingerprint recognition efficiency and precision while, from the integrated circuit area of saving the higher sensor chip of manufacturing cost, to reach the object reducing fingerprint acquisition apparatus production cost.
Based on above-mentioned, the means realizing object of the present invention traditional fingerprint acquisition apparatus are split as the sensor circuit set at sensor chip place and actual sensing substrate two parts contacted with hand, and make respectively, meanwhile, the sensor circuit set at described sensor chip place comprises the relevant circuit of related peripheral process and design to become single stone-type integrated circuit.Utilize technical solutions according to the invention, breach conventional fingerprint sensing process route, significantly can reduce the production cost of fingerprint acquisition apparatus.In addition, the present invention by an accurate intermediary layer to realize technical purpose of the present invention.Described intermediary layer is silicon intermediary layer, can certainly be glass, stupalith or intermediary layer that other materials was formed, and utilize silicon intermediary layer great advantage to be its semiconductor preparing process that can utilize existing maturation completely.
In technical solutions according to the invention, sensor chip is complete integrated circuit, and utilize integrated circuit preparation technology can make each sensing circuit each other pitch reduction to such as 25um, sense simultaneously substrate sensor circuit each other pitch still maintain the specification of original product requirement.Such as, in the fingerprint acquisition apparatus utilizing traditional handicraft to produce, commercial fingerprint acquisition apparatus requires at least 508dpi, this represents that the pitch of sensing circuit in sensor chip is about 50um, and utilize technical scheme of the present invention, the area of existing sensor chip is only traditional handicraft prepares sensor chip area in fingerprint device 1/4, therefore significantly can save the cost of this sensing circuit.The sensing substrate simultaneously contacted with hand is formed by the plain conductor of integrated circuit preparation technology back segment or print circuit plates making, its relative inexpensiveness, realizes sensor circuit corresponding one to one with sensing circuit while needing both to be assembled formation entirety.In order to reach such effect, the mentality of designing of dispersing circuit must be utilized.
Fig. 1 is a kind of perspective exploded view with the active fingerprint acquisition apparatus of different induction area of the present invention.Fingerprint induction installation of the present invention to being divided into upper structure 30 and lower structure 10 two parts, described upper structure comprises upper substrate 31 and dielectric structure 32 two parts, described upper structure 30 is electrically connected by dispersing circuit 40 with lower structure 10, and described upper structure 30 is connected by connecting portion 12 with lower structure 10 simultaneously; Described circuit 40 of dispersing has horizontal-extending district 41 extension area 42 vertical with at least, described in disperse circuit 40 dielectric structure 32 sections be provided with insulation course 42; Described upper substrate 31 is provided with sensing unit 50, described lower structure is provided with the multiple sensing circuits 20 forming induction chip.The scope of the pitch of the sensing unit 50 of described upper structure is probably between 25 to 80 microns.
It should be noted that, for the mode of dispersing circuit connecting components mentioned in the present invention, to include but not limited between sensing unit, between sensing unit with induction chip, as the horizontal-extending section of reception information and the information of transmission and vertical extension of section with the connected mode between induction chip, it is all technology well-known to those skilled in the art, therefore, in embodiment of the present invention, do not carry out the description of being correlated with.In addition, for the accompanying drawing described in invention, the circuit of dispersing indicated in figure only represents relation between each parts, and might not represent the electric connection between each parts, accompanying drawing is the structure that supplementary text describes fingerprint acquisition apparatus of the present invention.
Technical solutions according to the invention are different from traditional technical matters, in upper structure 30, do not arrange driving component, as MOS transistor or diode etc., but optionally in upper structure, arrange resistance or the passive component such as electric capacity and inductance.
Circuit of dispersing described in the present invention refers to electric connection circuit in divergent shape.
As shown in Figure 2, the lower structure described in technical solution of the present invention is based on substrate, utilizes semiconductor preparing process to form multiple sensing circuit on the substrate, thus makes lower structure forms sensor chip.Owing to having the integrated circuit such as sensing circuit in lower structure 10, therefore descend structure can be known as again sensing integrated circuit under structure.
Especially, for enabling the substrate of lower structure better utilize semiconductor preparing process, in described lower structure, the plate of substrate is semiconductor substrate, preferred silicon substrate.
Upper structure 30 in technical scheme of the present invention is arranged on lower structure 10 along a vertical direction, is used as an accurate silicon intermediary layer and uses.Upper structure 30 at least comprises upper substrate 31, dielectric structure 32 and an operator guards 33.
Described dielectric structure needs to have single or multiple lift material according to design.Described upper substrate is fabricated from a silicon.
It needs to be noted, in technical solutions according to the invention, dielectric structure 32 utilizes the semiconductive thin film of standard deposition and photoetching technique to be formed on upper substrate 31, but not be utilize the mode of assembling to assemble up, move towards to use so the stereographic map in Fig. 1 only disperses circuit 40 for clear display.
Described dielectric structure 32 is positioned at the lower surface of upper substrate 31, and surround disperse circuit 40, for the protection of and supplemental support disperse circuit 40.Operator guards 33 is positioned at the upper surface of upper substrate 31 and surrounds sensor circuit 50, mainly for the protection of sensor circuit 50.Operator guards 33 is made up of general dielectric structure material, also can use to comprise to have hydrophobic and oleophobic material, also can be that the stupalith of other high-dielectric coefficients is made, the combination of multilayer material can also be used to make.
Described general dielectric structure material is the material such as monox and silicon nitride etc., and described to have hydrophobic be aluminium oxide etc. with oleophobic material.
Described circuit 40 of dispersing is formed in structure 30, and is electrically connected to sensing circuit 20 respectively.Respectively disperse circuit 40 and comprise mutually perpendicular at least one horizontal-extending section 41 and at least one vertical extension of section 42.For dispersing circuit, be preferably use at least two horizontal-extending sections 41 extension of section 42 vertical with at least two.As shown in Figure 3, dispersing circuit vertical extension of section 42 place, be provided with the perforation of straight-through silicon wafer, have insulation course 44 between described straight-through silicon wafer perforation and upper substrate 31, the effect of described insulation course is electrically to separate the perforation of straight-through silicon wafer and silicon substrate.
Straight-through silicon wafer perforation in technical solutions according to the invention; it should be noted that: disperse the vertical extension of section 42 of circuit 40 for straight-through silicon wafer perforation; and other distributed lines of correspondence except TSV are essentially the plain conductor that formed in semiconductor preparing process and intermetallic plug metal combines, dielectric structure 32 Main Function described in technical solution of the present invention is plug metal described in protection and plain conductor.Utilize existing common technology to realize for the associated materials of distributed lines and manufacture method.In addition, the intracellular signaling direction of horizontal-extending section 41 is along horizontal direction, and the intracellular signaling direction of vertical extension of section 42 is vertically.
In addition, straight-through silicon wafer is bored a hole and dispersed circuit is connect sensing unit 50 and the media of sensing circuit 20, is mainly used in the conduction use of sensing signal.Instead of as used as encapsulation in conventional art, do signal output for being connected to tin ball or being soldered to circuit board 60.
As shown in Figure 4, Figure 5 and Figure 6, the lower surface of upper structure 30 of the present invention is provided with connecting portion, and the upper surface of described lower structure 10 is provided with lower connecting portion, in the present invention, because upper connecting portion is identical with lower connecting portion structure, be therefore referred to as connecting portion in describing the embodiments of the present; Lower structure 10 of the present invention is being interconnected of connecting portion 12 with the connection of upper structure 30, and has inserted primer 48 between lower structure 10 and upper structure 30 to cover support and connection portion 12.
The principle of work of fingerprint acquisition apparatus of the present invention as shown in figure 13, is formed with multiple sensing unit 50 in described upper structure, and for sensing finger print information, described sensing unit 50 is electrically connected to respectively disperses circuit 40.The fingerprint of sensing unit 50 sensing finger F and produce multiple sensing signal, sensing signal transfers to sensing circuit 20 through dispersing circuit 40 respectively, and sensing circuit unit 20 processes sensing signal respectively and obtains multiple output signal.
Sensing cell 50 of the present invention can sense the biological characteristic of biosome, and this biological characteristic preferably individual institute uniqueness has, but is not limited to this.Such as fingerprint acquisition apparatus of the present invention is except the fingerprint of sensing finger, the electric signal contacted with biosome can also be sensed, such as, be used as touch switch and use or sense the blood constituent under the humidity of skin, temperature, skin, the vascular distribution pattern etc. under skin.
In technical solutions according to the invention, owing to dispersing the particular design of circuit 40, the minimum distribution area (or claiming minimum distribution area of sensing circuit array) the minimum distribution area (or minimum distribution area of sensing circuit array) containing sensing circuit 20 being less than contain sensing cell 50.Namely the pitch of the sensing circuit 20 of sensor chip is less than the pitch of sensing cell 50.
Due to current silicon intermediary layer use metal online live width and line-spacing all identical with existing semiconductor technology of preparing, and Contemporary semiconductor preparation technology has developed into circuit section apart from being 20nm, therefore the present invention utilizes existing semiconductor technology of preparing, makes the sensor chip of small size diverge to large-area sensing unit array.
As shown in Fig. 8, Fig. 9, Figure 10, Figure 11, Figure 12 and Figure 13, in order to the output signal in lower structure be exported, fingerprint acquisition apparatus of the present invention also comprises multiple output weld pad 43, molding compound 45 and a circuit board 60.Export weld pad 43 to be formed on the upper surface of structure 30, and be electrically connected to sensing circuit 20 respectively, in order to output signal.Molding compound 45 covers upper structure 30 and lower structure 10, makes structure 30 and lower structure 10 form one.Circuit board 60 is electrically connected to and exports weld pad 43.As shown in figure 11, export weld pad 43 to be through multiple tin ball 46 and to be soldered on circuit board 60.
As shown in Figures 2 to 11, detailed process is the concrete preparation process of fingerprint acquisition apparatus of the present invention:
As described in Figure 2, infrabasal plate 11 is formed multiple sensing circuit 20 and formed under structure 10, lower structure 10 has multiple connecting portion 12 exposed.Described infrabasal plate is silicon substrate.Utilize semiconductor technology on infrabasal plate, form the dielectric material 13 of multiple sensor circuit 20 and Sensurround slowdown monitoring circuit unit 20.In described lower structure, sensing circuit can comprise the driving component being positioned at silicon substrate and the circuit pack connecting described driving component, certainly at this figure for the purpose of simplifying the description, only represent the sensing circuit array of the sensing circuit 20 of core, described sensing circuit array is a part for a sensing surface-mounted integrated circuit, and described integrated circuit more can comprise relevant simulation and digital circuit.
Upper substrate 31 is formed one group multiple disperse circuit 40 and obtain on structure, respectively dispersing circuit 40 comprises orthogonal horizontal-extending section 41 and vertical extension of section 42, and upper structure has multiple connecting portion exposed.The generation type belonging to the vertical extension of section 42 of straight-through silicon wafer perforation through etching groove, groove can form insulation course, forms metal level on the insulating layer, carries out the step such as electroplating to form the perforation of straight-through silicon wafer as Seed Layer with this metal level.Be worth special instruction, the manufacture of upper substrate 31 of the present invention utilizes complete wafer manufacturing process processing procedure.
Lower structure 10 is placed in transition above structure, and makes the connecting portion of lower structure and upper structure aim at respectively and be bonded together and form entirety.
It should be noted that and multiple lower structure 10 can be set in fingerprint induction installation as required.Utilize the multiple lower structure 10 belonging to chip level be arranged in array and be connected with the upper structure belonging to crystal circle grade, come to produce in a large number by the technology of chip stack on wafer.In addition, described connecting portion can also utilize the form of dimpling block to implement.Described dimpling block can be solder bump, copper bump or other metal couplings, such as the projection that gold, silver, nickel, tungsten, Aluminum-aluminum alloy form.
The juncture of lower structure and upper structure connecting portion can be that scolding tin engages or direct metal-metal diffusion bond.Such as, a dielectric structure can be formed on the metal exposed, again opening is defined to expose connection gasket to dielectric structure, then on connection gasket and dielectric structure, a copper seed layer is formed, then on copper seed layer, form photoresistance and an opening is defined to photoresistance, then electroplating, to form layers of copper, then in layers of copper, form weld cap, then remove photoresistance to carry out reflow to form dimpling block.
Insert a primer 48 at lower structure and upper structure connecting portion, described primer 48 surrounds connecting portion.
Then molding compound 45 is used upper structure and lower structure 10 to be fixed together.Utilize existing COW technology, moulding compound can be filled between adjacent lower structure 10, in order to the carrying out of follow-up cutting process.
Upper substrate 31 is formed and is multiplely electrically connected to the sensing unit 50 dispersing circuit 40, and upper substrate 31 and sensing unit 50 form an operator guards 33.Sensing unit 50 is used as sensing and is used, and the principle of electric capacity/electric field induction can be utilized to carry out the fingerprint of sensing finger and produce multiple sensing signal.Described sensing signal is respectively through the sensing circuit 20 dispersing circuit 40 and transfer to sensor chip.The sensing circuit 20 of sensor chip processes sensing signal respectively to obtain multiple output signal.Sensor circuit 50 is dissipated into from the sensing circuit 20 of sensor chip, so the minimum distribution area containing sensing circuit 20 is less than the minimum distribution area containing sensing cell 50 owing to reaching.
In order to by the signal of sensor chip 20 take out, multiple semiconductor preparing process and packaging technology can be adopted to complete, below illustrate two illustrate but unrestricted in illustrating.
In order to form fingerprint acquisition apparatus of the present invention, above-mentioned manufacture method also comprises: the part removing molding compound 45, exposes the multiple output weld pads 43 be formed on structure 30 surface.The mode removing the part of molding compound 45 can utilize laser to remove.
Implant multiple tin ball 46 on output weld pad 43, then utilize reflow technology to be soldered on circuit board 60 by output weld pad 43.This circuit board 60 has at least one deck conductor articulamentum, mainly sensing signal will be connected to other electronic installations (such as processor of mobile phone) and use, and makes electronic installation control the running of fingerprint acquisition apparatus simultaneously.
Based on above-mentioned technological means, the present invention also proposes a kind of first fingerprint sensor improved, and in this modified node method, upper structure 30 does not form straight-through silicon wafer perforation, but the horizontal-extending section dispersing circuit 40 the top is used as sensing cell.
Based on this thinking, first fingerprint acquisition apparatus improved is the improvement to upper structure, the upper structure 30 of described improvement at least comprises a dielectric structure 32 and disperses circuit 40, described circuit 40 of dispersing is formed in structure 30, described circuit 40 of dispersing comprises mutually perpendicular at least one horizontal-extending section 41 and at least one vertical extension of section 42, described in disperse circuit horizontal-extending district be sensing cell 50.
Based on technological means of the present invention, the present invention also proposes a kind of second fingerprint sensor improved, as shown in Figure 13, Figure 14 and Figure 15, the sensing cell 50 of fingerprint acquisition apparatus of the present invention comprises scan electrode 51 and receiving electrode 52, and described receiving electrode 52 adopts the orthogonal intertexture shape of two metal level design formings with scan electrode 51.Described vertical intertexture refer to the connecting line 47 of receiving electrode 52 and scan electrode 51 perpendicularly across and do not produce and be electrically connected.In addition, in lower structure, sensing circuit 20 comprises sweep circuit 21 and receiving circuit 22, and described sweep circuit is electrically connected to a line in scan electrode 51, to carry out scanning motion, described receiving circuit 22 is electrically connected to the row in receiving electrode 52, obtains sensing signal to carry out receiving action.
A kind of second sensing structure improving fingerprint acquisition apparatus of the present invention is similar to the projecting type capacitor of conventional touch panel, although scan electrode 51 and receiving electrode 52 are arranged in array in foursquare mode, but scan electrode 51 and receiving electrode 52 also can arrange, in the manner of a rhombus to improve coverage rate.What be different from conventional touch panel is that scan electrode in this improvement project 51 is not covered by glass with receiving electrode 52, covering scan electrode 51 is operator guards with receiving electrode 52, the thickness range of described operator guards is approximately between 0.1 micron to 60 microns, be preferably 10 to 50 microns, and the resolution of the present embodiment is far above contact panel, the resolution of sensing circuit unit is 25 to 80 microns, be preferably 50 microns, also much smaller than the 6mm of contact panel, the technology of contact panel finger is used as single piece of information input, the present invention is then the lines that will scan finger surface, this all makes sensing element structure difficulty of the present invention far above traditional contact panel, therefore traditional Projected capacitive touch panel design cannot reach fingerprint completely, the function of vascular distribution pattern and blood constituent sensing.
In addition, in the second improvement project of the present invention, sweep circuit 21 and receiving circuit 22 all design on one chip.Sweep circuit 21 and receiving circuit 22 are combined into sensing circuit 20.Disperse circuit 40 and comprise horizontal-extending section 41 and vertical extension of section 42 equally.
In addition, in the second improvement project of the present invention, the horizontal area of the silicon of lower structure 10 is not corresponding one to one with the horizontal area of upper structure 30, so silicon can be designed to be elongated and very little, contributes to further reducing costs.Moreover the fingerprint acquisition apparatus that this kind improves is compared with the first fingerprint acquisition apparatus improved, and its another difference is that sensing cell (comprising scan electrode 51 and receiving electrode 52) is not positioned at directly over lower structure 10.
Second fingerprint acquisition apparatus improved also provides a kind of induction substrate to be upper structure, this structure be used for sensing one finger fingerprint and produce multiple sensing signal, and sensor chip little induction substrate far away, so induction substrate determines sensor characteristic, use rigid substrate material and be that whole plane hard sensor and flexible substrate material are the bendable sensor of soft whole plane.So can there is the product sensor of many characteristics.
Being a little of technical scheme of the present invention: the pitch that can reduce sensing circuit when not reducing the pitch of fingerprint sensing unit, the area that the chip that thus can reduce sensing circuit uses, reduces the cost of sensing apparatus by this; Secondly, the pitch of sensing circuit unit can be reduced when not reducing the pitch of fingerprint sensing unit, the area that the chip that thus can reduce sensing circuit uses, reducing the cost of sensing apparatus.
Claims (15)
1. there is an active fingerprint acquisition apparatus for different induction area, it is characterized in that: described fingerprint acquisition apparatus comprises structure, lower structure, circuit board and molding compound;
Described upper structure is an induction substrate, described induction substrate is provided with multiple sensing unit and sensing unit corresponding disperse circuit; Described multiple sensing unit is combined to form area-type matrix; The lower surface of described induction substrate forms dielectric structure by semiconductive thin film deposition technique and photoetching technique, and described dielectric structure is for the protection of dispersing circuit and supplemental support disperses circuit; The upper surface of described induction substrate is provided with operator guards, and described operator guards is for surrounding sensing unit;
Described disperse circuit be formed at structure induction substrate in and be electrically connected with the induction chip of lower structure;
Circuit of dispersing in described induction substrate comprises orthogonal at least one horizontal-extending section and at least one vertical extension of section; Electric connection is there is not in described horizontal-extending section with vertical extension of section; Described horizontal-extending district is for receiving scanning information, and described vertical extension area is for sending scanning information;
Described vertical extension area is straight-through silicon wafer perforation, has insulation course between described straight-through silicon wafer perforation and induction substrate;
Described lower structure be by more than one or multiple induction chip be combined to form induction matrix, described induction chip is made up of siliceous material, and multiple sensing circuit unit combination with sensing function forms matrix induction chip;
The lower surface of described upper structure is provided with connecting portion, the upper surface of described lower structure is provided with lower connecting portion, the lower connecting portion of described upper structure and the lower connecting portion of lower structure are interconnected to form connecting portion, are filled with primer between multiple described connecting portion;
The area of described lower structure is less than the area of structure;
Upper structure and lower structure cover and are formed with entirety by described molding compound;
Described molding compound has multiple hole, and described upper structure arranges tin ball near one end, described molding compound hole, and described tin ball is connected with the weld pad of upper structure, and described tin ball and circuit board are electrically connected mutually by reflow technology;
Described circuit board has at least one deck conductor articulamentum, and sensing signal mainly will be connected on other electronic installations and use by described conductor articulamentum, makes described electronic installation control the operation of described sensing apparatus simultaneously.
2. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, is characterized in that: the operator guards in described upper structure be with general dielectric structure material or containing hydrophobic with the material of oleophobic or the stupalith of high-dielectric coefficient or multilayer material be prepared from for starting material.
3. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, it is characterized in that: described sensing unit is mutually electrically connected by dispersing circuit and its connecting circuit is provided with Circuit tuning, described Circuit tuning is mainly used in distinguishing sensing unit and carrying out corresponding Logic judgment.
4. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, is characterized in that: described upper structure and lower structure are prepared by Rigid substrate materials or flexible substrate material.
5. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, it is characterized in that: described in disperse circuit the top be straight-through silicon wafer perforation, the circuit of dispersing of other parts is combined to form for the plain conductor that formed in induction substrate preparation technology and intermetallic plug metal; The lower surface dielectric structure of described induction substrate is for the protection of described plug metal and plain conductor.
6. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, it is characterized in that: described in disperse the horizontal-extending section of circuit intracellular signaling direction be along horizontal direction, and the intracellular signaling direction of vertical extension of section is vertically.
7. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, it is characterized in that: the horizontal area of described lower structure is not corresponding one to one with the horizontal area of upper structure, following structure is designed to elongated and little.
8. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, is characterized in that: between in described upper structure, the distance of sensing unit pitch is 25 to 80 microns.
9. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1, it is characterized in that: the sensing unit in upper structure can also be combined by receiving electrode and scan electrode and substitute, described receiving electrode interleaving design vertical with scan electrode and form sensing unit, the connecting line that described vertical intertexture refers to described receiving electrode and scan electrode mutually perpendicularly across and do not produce and be electrically connected.
10. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 9, is characterized in that: described scan electrode and receiving electrode are arranged in array in the mode of square or rhombus.
11. a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 9; it is characterized in that: described scan electrode and receiving electrode are not covered by glass; what cover scan electrode and receiving electrode is respond to the operator guards that upper surface of base plate arranges, and the thickness range of described operator guards is between 0.1 micron to 60 microns.
12. 1 kinds of preparation methods with the active fingerprint acquisition apparatus of different induction area, is characterized in that:
Integral design and manufacture are containing sensing unit and the upper structure dispersing circuit, and Integral design contains the lower structure of sensing circuit with manufacturing;
The area of described lower structure is less than the area of structure;
By in upper structure disperse circuit and lower structure is electrically connected, then coordinate circuit board carry out combination install formation fingerprint acquisition apparatus.
13. application utilizing a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 1 to realize, is characterized in that: described fingerprint acquisition apparatus is applied to whole plane hard class sensor or the soft bendable sensor of whole plane.
14. a kind of application with the active fingerprint acquisition apparatus realization of different induction area as claimed in claim 13, is characterized in that: described fingerprint acquisition apparatus is a kind of sensing living body feature signal sensing device.
15. application that realize of a kind of active fingerprint acquisition apparatus with different induction area as claimed in claim 14, is characterized in that: described sensing living body feature telltale comprises the device of vascular distribution pattern under the device of blood constituent under the device of biological characteristic touch switch, sensing human body skin humidity and temperature, sensing skin and sensing skin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510178027.4A CN104778455A (en) | 2015-04-16 | 2015-04-16 | Active fingerprint sensing device with different sensing areas and manufacturing method of active fingerprint sensing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510178027.4A CN104778455A (en) | 2015-04-16 | 2015-04-16 | Active fingerprint sensing device with different sensing areas and manufacturing method of active fingerprint sensing device |
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| CN104778455A true CN104778455A (en) | 2015-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510178027.4A Pending CN104778455A (en) | 2015-04-16 | 2015-04-16 | Active fingerprint sensing device with different sensing areas and manufacturing method of active fingerprint sensing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106067005A (en) * | 2016-06-03 | 2016-11-02 | 成都艾德沃传感技术有限公司 | Fingerprint recognition system processing method and fingerprint recognition system |
| WO2020118598A1 (en) * | 2018-12-13 | 2020-06-18 | Wuhan United Imaging Healthcare Surgical Technology Co., Ltd. | Devices, systems and methods for user monitoring using electronic skin |
-
2015
- 2015-04-16 CN CN201510178027.4A patent/CN104778455A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106067005A (en) * | 2016-06-03 | 2016-11-02 | 成都艾德沃传感技术有限公司 | Fingerprint recognition system processing method and fingerprint recognition system |
| WO2020118598A1 (en) * | 2018-12-13 | 2020-06-18 | Wuhan United Imaging Healthcare Surgical Technology Co., Ltd. | Devices, systems and methods for user monitoring using electronic skin |
| CN113543698A (en) * | 2018-12-13 | 2021-10-22 | 武汉联影智融医疗科技有限公司 | Apparatus, system and method for user monitoring using electronic skin |
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Application publication date: 20150715 |