JPH01209379A - Probe card for inspecting electronic component - Google Patents

Abstract

PURPOSE:To achieve a higher inspection accuracy, by arranging two transmission paths for specified impedances connected in parallel to use both as intact or to use one alone by separating the other therefrom to be made matchable with either of measuring terminals of a tester in which specified impedance are mixed. CONSTITUTION:Two transmission paths 3 are arranged in parallel from a signal connection terminal 2 of a probe card 1 for inspecting pellets to an inspection stylus 4 connected to an electronic component 10. Here, a characteristic impedance of one transmission path 3 is set at 100OMEGA. When a characteristic impedance is 100OMEGA at a measuring terminal of an electronic component tester connected to the signal connection terminal 2, one of the transmission paths 3 is separated to be used for apart 8 in separation. When the characteristic impedance is 50OMEGA at the measuring terminal of the tester, two of the transmission paths 3 are used as in parallel. This permits a matching as well when the characteristic impedance of the electronic component tester is both 100OMEGA and 50OMEGA.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a probe card (test needle wiring board) used for performing operation tests on electronic components such as semiconductor devices in pellet form, and mainly relates to high-frequency Or for probe cards that test with high-speed signals.

[Prior art]

For probe cards for testing electronic components, see Japanese Patent Application Laid-Open No. 5
3-139983 etc.

Conventional probe cards for testing semiconductor pellets that test using high-speed signals have one signal transmission path for one signal path on an insulating substrate called a board, and are composed of several signal paths gathered together. Ta.

Further, since the characteristic impedance of the signal transmission path of an electronic component testing machine is often 50 ohms, only 50 ohms is used for the signal transmission path of the probe card.

[Problem to be solved by the invention]

In the above conventional technology, when the signal transmission path characteristic impedance at the measurement terminal of the electronic component testing machine is different, for example, 5
When the signal transmission path of the measurement terminal having a characteristic impedance of 0 ohms was branched into two and used as two signal transmission paths of 100 ohms, a mismatch in characteristic impedance occurred between the probe card and the signal transmission path. Furthermore, when the signal transmission path of the probe card was adjusted to 100 ohms, there was a mismatch in characteristic impedance with the 50 ohm transmission path.

This causes deterioration of signal waveform quality and waveform distortion, reducing measurement accuracy of electronic components.

Therefore, in the present invention, the characteristic impedance is 50.
It is an object of the present invention to provide a probe card that can easily match impedance to both ohm and 100 ohm signal transmission paths.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

The above problem is that by connecting two parallel signal transmission lines with a characteristic impedance of 100 ohms, it appears as one transmission line with a characteristic impedance of 50 ohms. This is achieved by separating one of the two 100 ohm transmission lines at both ends of the parallel connection to create a transmission line with a characteristic impedance of 100 ohms.

[Effect]

The above probe card for pellet inspection can be applied to a transmission line with a characteristic impedance of 50 ohms by using the above means.
It also facilitates ohmic transmission lines.

As a result, impedance matching can be achieved whether the measurement terminal of the electronic component testing machine has a characteristic impedance of 50 ohm or 100 ohm, without degrading the signal waveform quality (by transmitting the signal, the measurement accuracy of electronic components can be improved. I'm letting you do it.

, [Example 1] Examples of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a plan view showing a portion of a probe card 1 for pellet inspection according to the present invention, and FIG. 2 is a sectional view taken along line AA of the same.

This pellet inspection probe card has a signal transmission path 3 printed on the entire surface of a disc-shaped insulating substrate (board) 1 with a circular hole in the center, a probe needle 4 at one end of the transmission path, and a probe needle 4 at the other end. A signal connection terminal 2 is provided at the top. This probe card receives an electric signal through a signal connection terminal 2 connected to the measurement terminal tip 9 of an electronic component testing machine, and has two 100 ohm transmission lines 3 arranged in parallel and a test needle attached to the tip. 4 transmits an electrical signal to an electronic component 10 such as a semiconductor pellet, and vice versa.
0 is transmitted to the measurement terminal tip 9 of the electronic component testing machine, and a large number of these are arranged radially surrounding the electronic component 10. Here, the 100 ohm transmission line 3 has a microstrip line structure with a characteristic impedance of 100 ohm due to the back shield layer 5. Further, the inter-signal shield 6 is connected to the shield wire of the measurement terminal 9 of the electronic component testing machine through the signal wire shield terminal 7. Two of these 100 ohm transmission lines 3 are connected in parallel, and are equivalent to one 50 ohm transmission line in terms of characteristics, and impedance matched with the measurement terminal tip 9 of an electronic component testing machine having a characteristic impedance of 50 ohms. can do. In addition, these two parallel-connected 10
If both ends of one of the 0 ohm transmission lines 3 are cut off at the cutoff portion 8, it becomes one 100 ohm transmission line due to its characteristics,
Impedance matching can be performed with the measurement terminal tip 9 of an electronic component testing machine which has a characteristic impedance matching of 100 ohms. In this way, it can be easily matched to both a 50 ohm transmission path and a 100 ohm transmission path.
In the probe card 1, there is a 50 ohm transmission line and a 10
0 ohm transmission lines can be mixed.

[Embodiment 2] FIGS. 3 and 4 show transmission lines 3 on both upper and lower surfaces of an insulating substrate 1.
．． 3 and 3, and an intermediate shield layer 11 connected to the signal set shield terminal 7 is arranged in between. It is also possible to form a 100 ohm microstrip line structure using these transmission lines.Although the invention made by the present invention has been specifically explained based on the embodiments above, the present invention is not limited to the above embodiments. (, various changes can be made without departing from the gist thereof.

For example, the number of transmission lines, their mounting positions, impedance values, etc. can be changed as necessary.

〔Effect of the invention〕

As explained above in the embodiments, the present invention allows two 100 ohm transmission lines 3 connected in parallel to be used as two lines or one line separated and used as only one line. It is possible to impedance match both a transmission line with a characteristic impedance and a transmission line of 100 ohms. In addition, each transmission line on the probe card 1 can be switched to 50 ohm or 100 ohm separately, so even if the measurement terminal of an electronic component testing machine has a mixture of characteristic impedances of 50 ohm and 100 ohm, it can be switched to either 50 ohm or 100 ohm. The impedance of can also be matched.

Therefore, the accuracy of testing the electronic component 10 can be improved without causing waveform deterioration or waveform distortion due to impedance mismatch to the transmitted electrical signal.

[Brief explanation of the drawing]

FIG. 1 is a partial plan view of a semiconductor pellet calibration probe card showing an embodiment of the present invention, and FIG. 2 is a cross-sectional oblique view taken along the line AA in FIG. 1. FIG. 3 is a partial plan view of a semiconductor pellet inspection IE probe card showing another embodiment of the present invention, and FIG. 4 is a sectional oblique view taken along line A-A in FIG. 3. 1... Insulating substrate (board), 2... Signal connection terminal,
3...100 ohm transmission line, 4...Test needle, 5...
・Back shield layer, 6... Signal shield, 7...
Shield terminal, 8... Separated portion, 9... Measurement terminal tip for electronic component test, 10... Electronic component (semiconductor pellet), 11... Intermediate shield clothing.

Claims (1)

[Claims] 1. A device for testing electronic components in which a plurality of signal transmission paths having specific impedances are arranged in parallel on an insulating substrate, a probe needle is provided at one end of each transmission path, and an external connection terminal is provided at the other end. 1. A probe card for testing electronic components, characterized in that a plurality of transmission lines are arranged in parallel, and some of the transmission lines are separated or connected in parallel. 2. The probe card for testing electronic components according to claim 1, wherein a set of two transmission lines is arranged in parallel on one main surface of a substrate.