JPH01206037A - Composite strength member - Google Patents

Abstract

PURPOSE:To obtain the composite strength member with the best use of ceramic property, while its cooling property is excellent and its thermal stress is small, by sticking metallurgically the laminate composed of a ceramic tile and the composite body in which carbon fiber having no compatibility with metal, is buried in the metal containing copper as its main component to each other. CONSTITUTION:The laminate in which the composite body 5 made of carbon fiber buried in metal and a ceramic tile 4 are brazed, is formed. The ceramic tile is the sintered material containing beryllium and its compound in the amount of 0.1-5wt.% in terms of beryllium, and wherein 80wt.% or more is silicon carbide. Said tile has the high thermal conductivity of 0.2cal/cm.sec. deg.C or more in room temperature and the electric resistance of 10<8>OMEGA.cm or more in room temperature. A metallic substrate 5 is made of nonmagnetic stainless steel and has a corrugated structure the inside of which is forcedly cooled by a coolant. The ceramic tile 4 is jointed to the metallic substrate by way of the intermediate body composed of the metallic member having smaller thermal expansion coefficient than that of the metallic substrate 5 in room temperature. The intermediate body is a composite body in which 30-60vol.% of carbon fiber is buried, with the copper as its main component.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a novel composite strength member, and particularly to a composite strength member suitable for the reactor wall of a container such as a nuclear fusion device that requires heat resistance.

[Conventional technology]

As a nuclear fusion device, for example, a torus type nuclear fusion device is provided with a substantially annular vacuum vessel that confines plasma therein. A plurality of toroidal magnetic field coils that generate a magnetic field for holding plasma in a predetermined space surround the vacuum container and are arranged at predetermined intervals in the length direction of the torus. Further, a plurality of voloidal magnetic field coils are arranged along the vacuum vessel to perform Joule heating of the plasma and to generate a magnetic field for controlling the position of the plasma.

Non-magnetic nickel-based alloy steel and the like are being considered as the material for this vacuum container. However, the vacuum vessel in a nuclear fusion device is exposed to radiation generated by the fusion reaction, such as l4
Since it is irradiated by M e V fast neutrons, Mo or W, which has a high melting point, is fixed with bolts to a metal body having a cooling structure, as described in JP-A No. 55-94181.

[Problem to be solved by the invention]

Since Mo, W, etc. have a relatively large atomic number, they have a disadvantage of poor impurity characteristics, such as atoms sputtered by plasma particles entering the plasma particles and lowering the plasma temperature. Further, since the fusion device is fixed with bolts as described above, the above-mentioned impurity characteristics are further deteriorated in a nuclear fusion device that has a small cooling capacity and is exposed to high heat.

An object of the present invention is to provide a composite strength member that has excellent cooling properties, low thermal stress, and is made of a composite that takes advantage of the characteristics of ceramic.

[Means to solve the problem]

The present invention is a laminate of a ceramic tile and a composite in which fibers incompatible with the metal are embedded in the metal, the composite and the ceramic tile being metallurgically bonded. A composite strength member characterized by:

The composite has copper as a main component and carbon fibers are embedded therein, the ceramic tile is a sintered body containing a small amount of beryllium oxide in the grain boundaries of silicon carbide, and the composite and the ceramic tile are Preferably, it is soldered.

The present invention provides a laminate in which a composite body in which fibers incompatible with the metal are embedded in the metal and a ceramic tile are metallurgically bonded, the laminate being attached to the metal substrate. A composite strength member characterized by being metallurgically joined via a composite.

The joining should be done by the method described in (3) below, the composite strength member should be joined with a predetermined gap between each ceramic tile as described above, and the intermediate body should also have a predetermined gap. Preferably, a groove is provided in the metal substrate opposite the gap. Composite strength members are described below (1)
~(4) applies.

(1) Ceramic tiles Ceramic tiles should have excellent sputtering resistance against irradiation with plasma particles on the reactor wall of a nuclear fusion device.
A heat-resistant ceramic material made of a compound of elements with a low atomic number is preferred.

Ceramic tiles have a thermal conductivity of 0.0 at room temperature. o5caQ
/am・sec・℃ or more, electrical resistivity is 10″″3Ω・
Country or higher is preferred. If a material with high thermal conductivity is used, the cooling effect will be large and sputtering will not occur easily. More preferably, the temperature is 0.2 caQ/an-3 ec.degree. C. or higher, and the temperature of the ceramic tile can be kept sufficiently low against sputtering by plasma particles. A strong magnetic field acts on the furnace wall, and highly conductive materials are subject to the strong force of the magnetic field due to eddy currents.
- Has an electrical resistivity of 3Ω・on or more, especially 108Ω
・Electrical insulation material with a grade or higher is recommended.

The ceramic tile is preferably a sintered body of a compound having a melting point and a decomposition temperature of 1900'C or higher. Also from the viewpoint of the above-mentioned sputtering resistance, the melting point and decomposition temperature of the ceramic material are preferably 1900° C. or higher.

Ceramic tiles contain metal oxides and carbides.

Any material such as nitride or silicide can be used. As oxides, B e O, M g O, A Q 203
゜S ioz, Cab, Tioz, Cr20s
, Fe20a+Y2O3, ZrO2, etc., as carbides, CraC2+NbC, ZrC, BezC, SiC,
'ric, vc, etc., as nitride A Q N, S i
3N4. T i N.

VN, ZrN, NbN, TaN, etc., and examples of silicides include Ti silicide, Zr silicide, ① silicide, and Nb silicide.

Ta silicide, Cr silicide, etc. can be used in a length of 1 m.

Although various materials such as those described above can be used for ceramic tiles, compounds of low atomic number metals having an atomic number of 114 or less are particularly preferred.

For example, compound strength 1 of Si, Al, Mg, and Be is preferred. These compounds include SiC and AlN.

S 1aN4+ t B eo, AlzO3, MgO,
SiO2, or a mixture or compound thereof, or a sintered body containing one or more of these as a main component is preferable, and the power of using a penetrating compound as a raw material for the sintered body is 1°, or It is also possible to use other compounds which produce the above-mentioned compound, so that the resulting upper shear compound constitutes the final sintered body.

In particular, among the ceramic tile materials mentioned above, at least one of beryllium and beryllium compounds is used in an amount of 0.1
The sintered body containing ~5% by weight and 80% by weight or more of silicon carbide has a high thermal conductivity of 0.2caQ/aIl-8ec・℃ or more at room temperature and an electrical resistivity of 108Ω・1 or more at room temperature. A preferred material. Furthermore, a small amount of beryllium oxide, for example, 0.05 to 10% by weight, is contained in the grain boundaries of silicon carbide, so that the sintered body consisting essentially of silicon carbide becomes 0% at room temperature.
．． Since it has a thermal conductivity of 4 caQ/■·Sec·° C. or more and an electrical resistivity of 10 8 Ω·1 or more at room temperature, it is particularly preferable in relation to the cooling structure.

In the ceramic tile, it is preferable that the entire joint surface of the divided ceramic body is joined to the metal body having a cooling structure by a joining layer. It is better to make this segment as large as possible since this can reduce the number of manufacturing steps. However, if it is too large, the thermal stress after bonding becomes large and it becomes easy to break, so a maximum thickness of 1 ocln square and 20 II l'11 is preferable. In particular, the thickness is preferably 5 to 10 n. Ceramic tiles 1 may be manufactured by pressureless sintering, pressure sintering, or other methods.

Preferably, the ceramic tiles are arranged so that their ends overlap when viewed from the projection plane from the plasma, or are embedded so that the metal base and the brazing material are not directly irradiated by plasma particles. In order to arrange them one on top of the other, there are methods such as configuring the end portions of the ceramic bodies at different levels in the thickness direction, or slanting them. Alternatively, instead of overlapping the ceramic tiles at their ends, it is also possible to arrange the ceramic tiles with a predetermined gap and insert the rod of the ceramic body into the groove of the metal body as described above.

(2) Metal substrate with cooling structure The material of the gold R substrate must be non-magnetic at the operating temperature. As a metal body, austenitic steel.

Copper, copper alloys, aluminum, aluminum alloys, titanium, titanium alloys, nickel-based alloys, etc. can be used. As the cooling structure, a corrugated structure can be used in which the unwelded parts of the partially seam-welded overlapping structure are placed in a mold with high-pressure air and inflated to create a space for the coolant to flow. Other methods such as diffusion bonding, pressure welding, and brazing can also be used for partial bonding.

Grooves are formed in the metal substrate. As the groove, the recessed part of the corrugated structure, which creates a space using high-pressure air, can be used as described above. Desired grooves can also be formed by cutting a metal plate. Grooves can reduce thermal stress in bonding ceramic tiles. Further, the width of the groove should be wide enough to prevent excess brazing material from protruding between adjacent ceramic tiles and causing the ceramic bodies to connect to each other when the ceramic tiles are joined by soldering. Since the excess brazing material flows down into the groove and is not present in the gap between the ceramic tiles, the ceramic tiles are not restrained after being bonded. Therefore, thermal stress due to cooling of the metal substrate after bonding can be reduced. The width of the groove is 11111
The above is preferable. However, the width should be limited to a level that provides sufficient bonding strength for the ceramic tiles. The groove is
A plurality of them can be provided on the surface of one metal substrate in the same direction, or a plurality of them can be provided in the vertical and horizontal directions. The former is advantageous in terms of manufacturing, and the latter is preferred in terms of stress relaxation.

The metal base is capable of bonding a plurality of ceramic tiles, and is preferably divided into pieces. The divided metal substrates are assembled into a predetermined shape as a reactor wall of a fusion device by mechanically joining them to another structure after joining the ceramic tiles, or by joining them together by welding.

When assembling, it is necessary to manufacture the parts with sufficient dimensional accuracy so as not to cause unnecessary resistance to the flow of the refrigerant, and to carefully align and assemble them. Furthermore, when assembling each block of metal bodies, the surfaces are covered with ceramic tiles as described above so that the metal bodies are not directly exposed to plasma particles.

(3) Joining ceramic tiles Ceramic tiles are metallurgically bonded to metal substrates.

Metallurgical joining includes brazing and diffusion joining.

It means atomic bonding by anode bonding, etc., and does not mean mechanical bonding. By providing a gap between each ceramic tile, the generation of thermal stress is small when heated, and the thermal stress in the bonding layer due to contraction of the metal base after bonding is alleviated, which reduces the possibility of cracks caused by bonding of the ceramic tiles. , it is possible to prevent peeling and to obtain a strong bond. If there is no gap, it is impossible to prevent high residual stress due to shrinkage of the metal body after joining, or cracking and peeling.

The size of the gap is determined by taking into account the amount of expansion and contraction during use. When using brazing as a bonding layer.

The brazing material used must have a melting point lower than that of the metal substrate. When stainless steel and nickel-based alloys are used as the metal base, copper alloy brazing filler metals and silver brazing fillers containing manganese are preferred, and since brazing can be performed at around 900°C, the gap during joining should be made to allow cooling from this temperature. The amount may be the sum of the amount obtained by subtracting the amount of shrinkage of the ceramic from the amount of shrinkage of the metal base and the amount of the gap during use of the same length. As the copper alloy brazing filler metal mentioned above, manganese 25
Copper alloys containing ~55% by weight are preferred.

This alloy has a melting point of 870°C to 1,000°C, and can be joined at relatively low temperatures. In particular, a copper alloy containing 35 to 45% by weight of manganese is preferred. This brazing material is effective for bonding non-oxide ceramic tiles, and is further preferred for bonding carbide materials. Further, among the sintered bodies mainly composed of silicon carbide as a carbide, the sintered body contains 0.1 to 5% by weight of one or more of the above-mentioned beryllium and beryllium compounds, and has electrical insulation at room temperature containing 80% by weight or more of silicon carbide. It is effective for joining materials having properties, and is particularly preferred for joining to nickel-based alloys.

JIS current silver solder can be used as a high-temperature brazing material. Silver solder is used especially when using alumina as an oxide-based ceramic body.

It is preferable to provide a metallized layer such as Mo-Mn on the joint surface and join it to stainless steel or a nickel-based alloy.

When aluminum or an aluminum alloy is used as the metal substrate, the brazing material is preferably an aluminum alloy brazing material containing 8 to 15% by weight silicon.

Since this brazing alloy is brazed at a temperature around 550 to 620°C, the gap between each ceramic tile at the time of joining is adjusted according to the brazing temperature. As described above, this brazing material is effective for joining a sintered body mainly composed of silicon carbide to aluminum or an aluminum alloy.

Ceramic tiles can be joined to a metal base by placing the ceramic body on the entire surface of the metal body with a brazing filler metal interposed therebetween, and by heating it.
It is preferable to heat under pressure of ~20 kg/cJ.

Heating can be done in the air, but preferably in a non-oxidizing atmosphere.

The thickness of the adhesive layer is preferably 10 to 100 μm.

(4) Intermediate The ceramic tile is preferably joined to the metal body via an intermediate made of a metal member having a coefficient of thermal expansion at room temperature that is smaller than the coefficient of thermal expansion of the metal body and larger than the coefficient of thermal expansion of the ceramic tile. Specifically, tungsten, molybdenum, and invar alloys.

Composite materials of metals and molybdenum, tungsten.

A metal composite material with high thermal conductivity embedded with carbon fibers is preferred. In particular, a copper composite material with embedded carbon fibers is preferred.

Copper-carbon fiber composites are made by bundling multiple copper-coated carbon fibers, weaving them two-dimensionally, and firing them at high temperatures so that they exhibit a two-dimensional isotropic coefficient of thermal expansion. preferable. It has a coefficient of thermal expansion of 5 to 10XIO-'/°C at room temperature and 0.3 at room temperature without impairing the thermal conductivity of copper.
A thermal conductivity of ~1.0 caQ/cm·Sec·°C can be obtained. It is preferable that carbon fiber is contained in an amount of 30 to 60% by volume. The copper base preferably contains 5% by weight or less of elements that form carbides.

What uses this copper-carbon fiber composite material as an intermediate?

This method is effective for joining the above-mentioned sintered body mainly composed of silicon carbide to a metal body. This intermediate is 5-13X at room temperature
Elastic modulus of 103kg/nl112 and 3-1 at room temperature
It has a coefficient of thermal expansion of 2 x 10-6/'C, and is particularly effective for joining a ceramic body to a metal body whose coefficient of thermal expansion at room temperature is 10 x 10-B/'C or more.

Furthermore, as long as the material has the above-mentioned elastic modulus and thermal expansion coefficient, a silicon carbide sintered body other than a copper-carbon fiber composite can be easily joined to a metal body without causing cracks.

Preferably, the intermediate bodies are joined to each other with a gap between them at corresponding portions of the grooves formed in the metal base, similar to ceramic tiles. Then, it is preferable to join the ceramic tiles thereon with a gap between them. However, since the intermediate body is made of metal, the metal body with a cooling structure does not need to have grooves, and the intermediate body is provided on the entire surface of the metal body,
Ceramic tiles can be bonded thereon with gaps formed thereon.

In order to use a sintered body mainly composed of silicon carbide as a ceramic tile and join the above-mentioned copper-carbon fiber composite to the surface thereof, it is preferable to use the above-mentioned copper-manganese alloy solder. Furthermore, in order to bond this copper-carbon fiber composite to a metal base made of aluminum, the ceramic tile and the composite are bonded in advance using the copper-manganese alloy brazing material, and then aluminum is bonded to the composite. Approximately 5 layers
Bonding can be performed by heating up to 48°C and applying a predetermined pressure. In this case, since the main component of the composite is copper, a eutectic reaction occurs with aluminum, so that bonding can be achieved without using a brazing material.

The thickness of the intermediate material is 0.5 to 211I1 to alleviate the difference in thermal expansion coefficient with respect to the ceramic body and to act as a cushion.
1 is preferred. Since the intermediate body can reduce thermal stress at the joint, large ceramic bodies can be joined.

〔Example〕

(Example 1) FIG. 1 is a sectional view of a torus-type nuclear fusion device in which a reactor wall is constructed using the composite strength member of the present invention.

Although not shown, the vacuum vessel 1 has an annular shape (torus) with a center line 10 as a reference, and around it is a toroidal magnetic field coil 8 for confining the plasma 2 in the space of the vacuum vessel 1 and creating a donut-shaped magnetic field. They are arranged along the vacuum container 1 at predetermined intervals. The magnetic field coil 8 is constituted by a superconducting coil cooled by liquid He. A plurality of poloidal coils 9 are arranged around the toroidal magnetic field coil 8 to control the position of the plasma 2.

Although not shown in order to evacuate the inside of the vacuum container 1,
An exhaust system is connected. Further, inside the vacuum vessel 1, a furnace wall attachment of the present invention is provided on the plasma 2 side, and a breeding bracket 6 and a shielding body 7 are provided on the outside of the furnace wall 3. The main furnace wall is provided along the breeding bracket 6. The furnace wall y has a tile-shaped ceramic body 4 joined to a metal base 5 which is forcibly cooled by a refrigerant.

FIG. 2 is a perspective view showing an example of a part of the furnace wall according to the present invention. FIG. 3 is a sectional view taken along line AA' in FIG. The furnace wall J has a structure in which a tile-shaped ceramic body 4 is bonded by a bonding layer 11 to a metal base 5 having a cooling structure in which a flow path 12 through which a refrigerant passes is provided. The ceramic tiles 4 are provided with a gap 14 from each other. This furnace wall stand is formed in the shape of a block, and these blocks are combined to form a structure shown in FIG. 1, which extends along the annular vacuum vessel. The blocks shown in FIG. 2 are joined together by means such as welding, bolts, etc. to form the overall structure shown in FIG. Although 25 tile-shaped ceramic bodies 4 are bonded to the block shown in FIG. 2, this number can be varied. Gap 14
By providing this, thermal stress caused by heating and cooling can be reduced. The dotted line in FIG. 3 is the joint surface 15 when the metal base 5 of the cooling structure is manufactured by joining such as welding.

In the metal body 5, grooves 13 are vertically provided in one direction at predetermined intervals. This groove 13 may be provided in two directions, vertically and horizontally. This groove 13 is formed when the tile-shaped ceramic body 4 is bonded to the metal base 5 using a brazing material, when a single piece of brazing material having the same size as the planar shape of the metal body 5 is used, or when the size of the ceramic tile is Even when using a brazing filler metal that matches the size of the soldering material, the excess soldering material is made to flow into the groove 13. As a result, wax can be prevented from flowing into the gap 14. Furthermore, since the expansion of the tile-shaped ceramic body due to heating during use is not hindered, thermal stress can be reduced. Further, the tile-shaped ceramic bodies are not bonded together by flowing brazing filler metal.

FIG. 4 is a perspective view of a portion of a furnace wall J according to another example of the present invention. FIG. 5 is a sectional view taken along line BB' in FIG. 4. On the furnace wall -β-, tile-shaped ceramic bodies 4 are arranged so as to cross each other so that the metal body 5 having a cooling structure is not directly irradiated by the plasma particles 2. Each tile-shaped ceramic body 4 is formed into a step shape having a convex portion 4′ and a concave portion 4″′, and the convex portion 4′ and the concave portion 41 are joined by crossing each other, and the metal body 5 is formed in the gap 14. The convex portions 4' and the concave portions 41 are provided in both the vertical and horizontal directions.In order to overlap the ceramic tiles 4 so that the metal body 5 is not exposed, a structure is adopted in which the ends are inclined. , a structure in which one is embedded in the other.

FIG. 6 is a cross-sectional view of the furnace wall in the case where the ceramic tiles 4 in FIG. 4 are all manufactured in the same shape and are used alternately above and below in adjacent portions. This cross section corresponds to the sectional view taken along line BB' in FIG. This B
The B'-B'' cross-section in the direction perpendicular to the -B' cross-section is the one in which the groove 13 is not provided in the metal body 5 in FIG.

Furthermore, as another example of the structure of such a tile-shaped ceramic body, the cross-sectional view taken along the line B'-B'' in FIG.
As an alternative to not providing the grooves 13 in the figure, it is also possible to make the ceramic tile of FIG. 6 straight instead of having a stepped shape in the sectional view taken along line BB', and insert the ceramic body into the grooves 13.

Next, specific bonding between the ceramic tile and the metal base will be described.

As the metal substrate 5, an aluminum plate with a plate thickness of 5IIIl and a JIS standard 5US304 stainless steel plate with a plate thickness of 2 mm+ were used.

As the ceramic tiles, a Si3N+ sintered body, an AlzOa sintered body, and a SiC sintered body containing 2% by weight of Be◯ were used, each having a density of 98% or more of the theoretical density. SiC
In the sintered body, beryllium oxide was present at the grain boundaries of the SiC sintered body. The sintered body is 10 mm thick and 20 mm square. The properties of these sintered bodies are shown in Table 1. The joint surfaces of these sintered bodies were polished to a surface roughness of 10 μm or less.

For 5US304 as a brazing filler metal, 40% by weight Mn
A foil with a thickness of 25 μm consisting of Cu and Cu was used. For aluminum, after metallizing the bonding surface of the ceramic tile, a 50μ thick layer consisting of 12 wt% Si and the balance Al
m foil was used. 5~ for ceramic tiles and metal substrates
A pressure of 10 kg/aJ was applied and heating was performed in an Ar atmosphere using a high frequency heating coil. The heating temperature is 860°C for 5US304 and 580°C for aluminum.
It is ℃. After heating, it was allowed to cool naturally. Most of the melt remained on the joint surface and was used for joining, but a small amount of the melt was drained from the joint surface. The SiC sintered body is prepared by adding a mixture of each powder to l
, after pressure molding at OOOkg/cnt, 10-
It was sintered by heating and holding at 2,000° C. for 1 hour while pressurizing at 300 kg/ant at 5 to 10 −31 −’. AlzOa and 5iaN+ sintered bodies are commercially available.

It was confirmed that the above-described bonding between the ceramic tile and the metal substrate was extremely good, with no cracking or peeling of the ceramic tile.

Table 1 (Example 2) FIG. 7 shows a structure in which a tile-shaped ceramic body 4 and a metal base 5 having a cooling structure are joined with an intermediate body 16 interposed therebetween.
FIG. 2 is a perspective view showing two blocks.

FIG. 8 is a sectional view taken along line c-c' in FIG. 7.

In this example, the ceramic tiles 4 are provided with a gap 14 in the same manner as in FIG. matched and joined.

A groove 13 is provided in the metal base 5 facing the gap 14 . The gap 14 may be made smaller as long as it can suppress the generation of thermal stress due to thermal expansion during use as much as possible.

The intermediate body 16 has a coefficient of thermal expansion intermediate between both the metal substrate 5 and the ceramic tile 4.

The intermediate body 16 can reduce the thermal stress after joining the metal base 5, which has a relatively large coefficient of thermal expansion, such as stainless steel or aluminum, and the ceramic tile 4, which has a coefficient of thermal expansion smaller than that at room temperature. In particular, by using an intermediate body 16 whose thermal expansion coefficient at room temperature and its elastic coefficient are appropriately selected, a large ceramic tile 4 can be bonded with smaller thermal stress.

A specific example of joining will be shown below.

As the ceramic tile, a 40 mm square SiC sintered body manufactured in the same manner as in Example 1 and having a thickness of 40 mm was used, and as an intermediate, a copper-carbon fiber composite was used. First, a ceramic tile and a copper-carbon fiber composite were bonded, and then a 2 mm thick JIS standard 5 US304 stainless steel and a copper-carbon fiber composite were bonded together.
The carbon fiber m composite was brazed.

A copper-carbon fiber composite was manufactured by the following method.

Electroless steel plating is applied to each carbon fiber to a specified thickness.

A plurality of these copper-plated carbon fibers were bundled and woven into a predetermined size so that adjacent portions crossed each other. This woven fabric was heated under pressure at 800° C. in a nitrogen atmosphere to produce a sheet-like composite with a thickness of 1 m. In order to obtain a predetermined thickness, by increasing the thickness of the copper-plated carbon fiber bundle, a composite of the desired thickness can be formed with a single woven fabric. Furthermore, a single woven fabric can be made thinner and multi-layered to achieve a desired thickness, and the latter composite is more effective in terms of properties and smoothness. In addition, the method is not limited to woven fabrics, and any method can be used such as a method of making the fibers into a spiral shape, a method of dispersing short fibers having a length such that the fibers overlap each other and are arranged.

Cu-C fiber composite produced as above and SiC
The sintered body was heated at 860° C. for 5 to 10 minutes with a 50 μm thick brazing filler metal made of 40% by weight manganese and the balance copper.
They were bonded by pressure and heating at kg/cIIY. 35% by volume as Cu-C fiber composite.

Three types containing 45% and 54% were manufactured, and various metals and alloys with different coefficients of thermal expansion and elastic modulus were used as intermediates. These intermediates are 35% Ni and 42
Amber alloy containing %Ni.

Kovar, 5US430. Hastelloy B, pure Ni.

Mo, W.

Using the various intermediates described above, a thickness of 5% consisting of 40% by weight Mn and the balance Cu is formed between the SiC sintered body and these intermediates.
A 0 μm brazing filler metal is interposed, and further the intermediate and 5US304
30 wt% Cu and 70 wt% A between stainless steel
With a 100 μm thick silver solder foil made of g
They were heated in an Ar atmosphere at 860° C. under a pressure of 5 to 10 kg/al to join each other.

FIG. 9 is a diagram showing the quality of bonding regarding the relationship between the coefficient of thermal expansion at room temperature and the modulus of elasticity of the intermediate material when the various intermediate materials described above are used. As shown in the figure, tile-shaped Si
It has been found that as the size of the C sintered body increases, cracks or peeling occur in the SiC sintered body due to not only the thermal expansion coefficient but also the elastic modulus of the intermediate. Since the elastic modulus of the Cu-C fiber composite can be selected depending on the matrix metal, it is possible to bond the composite without cracking or peeling. In the figure, the x mark indicates a crack in the SiC sintered body, the Δ mark indicates a joint strength of 5) cg/nn" or less, and the 0 mark indicates a joint strength of 30 cg/nn" or less.
kg/nu" or more.As a result, as an intermediate material, the coefficient of thermal expansion at room temperature is 3 to 12 x 10""6/'C.
and an elastic modulus of 5 to l3 x 10"kg/lll1
It has been found that a bond with a bonding strength of 12 can provide a high strength bond.

(Example 3) Next, an example will be shown in which aluminum with a plate thickness of 5 mm is used as the metal base. 35% by volume of the above-mentioned fabric with a thickness of 1m
The carbon fiber-copper composite was used as an intermediate material, and was previously joined to the SiC sintered body using a brazing material consisting of 40% by weight Mn and the balance Cu in the same manner as described above. Thereafter, the copper-carbon fiber composite was placed on a metal body made of aluminum with a 100 μm copper foil interposed as a bonding surface, and Ar
A pressure of 5 to 10 kg/Qlf was applied at 580° C. in an atmosphere to join them using the eutectic reaction between copper and aluminum.

Table 2 shows the results of a heat load test conducted by irradiating the surface of the ceramic tile obtained by the above method with a laser beam. The heat load test method is to apply 300% to the surface of ceramic tiles.
A laser beam of W/cJ was irradiated with a cycle of 100 seconds.

In this case, water was flowed at a rate of 8Q/min as a refrigerant on the metal substrate side.

As shown in the table, even when the heat load test was conducted 1,000 times, no destruction or peeling of the ceramic tiles from the joints was observed. Furthermore, the surface temperature on the ceramic tile side and the temperature at the joint between the ceramic tile and the metal base were extremely low, proving that the cooling properties were extremely good.

Table 2 (Example 4) In this example, 2% by weight BeO was used as the ceramic tile.
A sintered body consisting of SiC and the balance, a JIS 304 plate with a thickness of 5 nm and a square of 287 m, which has a corrugated structure as a metal body.
An example is shown in which stainless steel and a composite of Cu and 35% by volume C fiber are used as the intermediate material.

The overall structure of this embodiment is the same as that shown in FIGS.

The ceramic tile has the same characteristics as those manufactured in Example 1, such as a thermal conductivity at room temperature of 0.6 caQ/am·sec and an electrical insulation resistance of 1012Ω=1, and a thickness of 1.
It is a SiC sintered body of 0 field and 40m++ square.

As shown in Fig. 8, this sintered body has a convex portion at the 4' portion with a thickness of 5 layers m and a depth of 5 mm, and a concave portion at the 4'' portion with a thickness of 5.2 tan and a depth of 5 I. .

Water is used as the refrigerant flowing through the passage 12 of the metal substrate 5, and the passage 12 has a width of 35 mm and a height of 2 m. Further, the size of the groove 13 provided in the metal body is 2 layers m in width and 2 nu in height. The Cu-C fiber composite was manufactured in the same manner as in Example 2 and had a thickness of 1 mm and a square size of 40+ nm. This composite has 35% by volume of C fibers and has C81! 2
It is made by laminating layers.

As a bond between the ceramic tile 4 and the metal base 5, 40
As a bond between stainless steel and a 50 μm thick brazing filler metal Cu-call fiber consisting of weight% Mn and the balance Cu, a thickness of 5
A 0 μm J I SBAg-8 silver brazing filler metal was used in each case. First, 4 is applied to the bonding surface of the metal base 5 having the above structure.
A 0m square Cu-Mn alloy brazing material is placed, a Cu-C fiber composite having the above properties is placed on top of it with a gap of 1mm between each other, and the above-mentioned silver brazing material is placed on the Cu-C fiber composite. Then, 49 of the aforementioned SiC sintered bodies were placed thereon with a gap of 11 mm between each other.

The items set in the above order are carried into an electric furnace where the temperature difference is 5° C. or less and the pressure can be controlled. Next 10kg/af
? In an Ar atmosphere with a pressure of 870
The ceramic tile, intermediate body, and metal base were simultaneously bonded in one heating process by heating and holding at C for 30 seconds. This was taken out from the electric furnace and allowed to cool naturally.

As a result of this joining, the furnace wall contracted significantly on the metal side during cooling, causing bending, but no cracking or peeling occurred in the SiC sintered body, and the thermal stress at the ceramic tile joint was low. Met. This bend was straightened using a press at room temperature. This straightening allows the creation of a flat furnace wall or a furnace wall slightly recessed on the ceramic side without significantly affecting the mink tiles, which are formed by the gaps between each ceramic tile and the grooves in the metal body. Ta.

Such plastic working resulted in further relaxation of the thermal stress in the joint.

(Example 5) In this example, a metal base having a corrugated structure made of aluminum with a plate thickness of 5 mm was used instead of 5US304, and a SiC sintered body and a Cu-(Jit fiber composite) were prepared in advance. 12% by weight was used to bond the Cu-C fiber composite to the metal substrate using the same brazing material as the bonding material and under the same conditions.
Using a brazing filler metal with a thickness of 50 μm consisting of Si and remaining Al,
It was heated at 80° C. under a pressure of 5 to 10 kg/cd, then taken out from the furnace, and the ceramic tile surface was heated with a burner and cooled while creating a temperature difference with the metal substrate side.

The rest is the same as in Example 4.

In this example, as compared to Example 4, the bending toward the metal base could be made much smaller. Also.

No cracking or peeling occurred in the SiC sintered body, and the thermal stress at the joint of the SiC sintered body was low. As in Example 4, this furnace wall was bent concavely toward the ceramic tile side to produce a furnace wall that was flat or concave toward the ceramic tile side.

(Example 6) In this example, the thickness of the ceramic tile was 10 mm,
40mm square commercially available alumina plate, 5uwn thick, 287m square JIS 3 with corrugated structure as metal base
An example using 04 stainless steel is shown below. This embodiment has the structure shown in FIGS. 2 and 3. Metal substrate passage 1
The sizes of the grooves 2 and 13 are the same as in the fourth embodiment.

40 mm square and 50 μm thick on the joint surface of the metal base 5.
A wax consisting of %Mn by weight and the balance Cu was placed thereon, and 49 pieces of alumina were placed thereon with a gap of IIIWl. This was inserted into an electric furnace, and under a pressure of 10 kg/d,
After heating and holding at 870° C. for 30 seconds in an r atmosphere, it was taken out from the furnace and allowed to cool naturally.

As a result of this joining, the furnace wall was bent concavely toward the metal body, but the alumina sintered body was in good condition with no cracking or peeling at all. This bend can be corrected by pressing at room temperature to make it flat or concave to the ceramic body side.
As a result, it was found that thermal stress at the joint can be significantly alleviated. Furthermore, if another ceramic rod is finally inserted into the groove of the metal body, exposure of the metal body can be prevented, and a ceramic tile with a simple structure can be used.

〔Effect of the invention〕

According to the present invention, a composite strength member with excellent cooling characteristics, low thermal stress, and utilizing the characteristics of ceramic can be obtained, and excellent characteristics can be obtained by using it for the reactor wall of a nuclear fusion device.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional configuration diagram of the vacuum vessel and its surroundings of a toroidal fusion device showing an example of applying the composite strength member of the present invention to the reactor wall, and FIGS. A perspective view showing the furnace wall structure using composite strength members.
The cross section of the A-A' section in the figure, Figure 5 is B-B in Figure 4.
6 is a sectional view of another example of the BB' cut section in FIG. 4, and FIG. 8 is a sectional view of the c-c' cut section in FIG. The figure is a diagram showing the relationship between the elastic modulus and thermal expansion coefficient of the intermediate. DESCRIPTION OF SYMBOLS 1... Vacuum container, 2... Plasma particle, 3... Furnace wall, 4... Ceramic tile, 5... Metal base, 8
... Coil, 11 ... Joining layer, 12 ... Coolant passage, 13 ... Groove, 14 ... Gap.

Claims (1)

[Scope of Claims] 1. A laminate of a composite in which fibers incompatible with the metal are embedded in the metal and a ceramic tile,
A composite strength member characterized in that the composite body and ceramic tile are metallurgically joined. 2. The composite body is mainly composed of copper with embedded carbon fibers, and the ceramic tile is a sintered body containing a small amount of beryllium oxide in the grain boundaries of silicon carbide, and the composite body and the ceramic tile are A composite strength member according to claim 1, wherein the points are soldered together. 3. According to claim 1 or 2, the ceramic tile is bonded to the metal base via an intermediate made of a metal member having a coefficient of thermal expansion smaller than that of the metal substrate at room temperature. Composite strength member as described. 4. A laminate in which a composite in which fibers incompatible with the metal are embedded in the metal and a ceramic tile are metallurgically bonded, the laminate being a metal substrate with the composite in the metal. A composite strength member characterized by being metallurgically joined via. 5. The composite strength member according to claim 4, wherein the joining is performed by brazing. 6. The composite strength member according to claim 5, wherein the metal base has a corrugated structure whose interior is forcibly cooled by a refrigerant. 7. It has a laminated structure in which a large number of heat-resistant ceramic tiles and a metal substrate are metallurgically bonded, and the ceramic tiles are made of a sintered body mainly composed of silicon carbide containing a small amount of beryllium oxide in the grain boundaries. A composite strength member according to claim 1. 8. The composite strength member according to claim 7, wherein the beryllium oxide is 0.05 to 10% by weight. 9. The composite strength member according to claim 7 or 8, wherein the metal base has a corrugated structure whose interior is forcibly cooled by a refrigerant. 10. It has a laminated structure in which a large number of divided heat-resistant ceramic tiles are metallurgically bonded to a metal base, and a predetermined gap is formed between adjacent ceramic tiles,
The composite strength member according to claim 1, wherein a groove is formed in the metal base at a position corresponding to the gap. 11. The composite strength member of claim 10, wherein the ends of the adjacent ceramic tiles overlap each other. 12. Claim 10, wherein the metal base has a corrugated structure whose interior is forcibly cooled by a refrigerant.
The strength member according to item 1 or item 11. 13. The ceramic tile is bonded to the metal substrate via an intermediate made of a metal member having a coefficient of thermal expansion smaller than that of the metal substrate at room temperature. The strength member according to any one of the above. 14. The ceramic tile has a thermal conductivity of 0.0 at room temperature.
Claim 1: Electrical resistivity of 5 cal/cm・sec・℃ or more and at room temperature is 10^-^3Ω・cm or more
The composite strength member according to any one of items 0 to 13. 15. The ceramic tile has a melting point and a decomposition temperature of 1
The composite strength member according to any one of claims 10 to 14, which is a sintered body of a compound having a temperature of 900°C or higher. 16. The composite strength member according to any one of claims 10 to 15, wherein the ceramic tile is made of a non-oxide ceramic sintered body containing beryllium oxide. 17. The ceramic tile is comprised of a sintered body containing at least one type of beryllium and beryllium compounds, and 80% by weight or more of silicon carbide.
Composite strength member according to item 5. 18. The composite strength member according to any one of claims 13 to 17, wherein the intermediate has fibers embedded in the metal, the fibers having a coefficient of thermal expansion smaller than the coefficient of thermal expansion at room temperature of the metal base. . 19. The intermediate has an elastic modulus of 5 to 13×10 at room temperature.
^3kg/mm^2 and room temperature thermal expansion coefficient 3~12x
18. The composite strength member according to claim 18, which has a temperature of 10^-^6/°C. 20, the intermediate has copper as a main component, and 30 to 6
The strength member according to claim 19, which is constituted by a composite body in which 0% by volume of carbon fibers are embedded. 21. The bonding layer bonding the metal substrate and the ceramic tile, the intermediate body and the metal substrate, or the intermediate body and the ceramic tile is a wax.Claims 10 to 20
The strength member according to any of paragraphs. 22. The ceramic tile is a sintered body containing silicon carbide as a main component, the metal base is non-magnetic austenitic stainless steel, and the bonding layer for bonding these is:
22. A composite strength member according to claim 21, comprising 25 to 55% by weight manganese and the balance copper. 23. The ceramic tile is a sintered body containing silicon carbide as a main component, the metal substrate is aluminum, and the bonding layer for bonding them contains 8 to 15% by weight of Si and the main component is Al. 22. A composite strength member according to claim 21, comprising an alloy. 24. The ceramic tile is made of copper as a main component, through which carbon fibers of 30 to 60% by volume are embedded, manganese of 25 to 55% by weight, and the balance substantially made of copper and wax. Claim 22 joined together
Composite strength member according to item 1 or item 23. 25. The composite strength member according to claim 24, wherein the composite is joined to a metal base made of nonmagnetic austenitic stainless steel by a copper alloy brazing filler metal containing 25 to 55% by weight of manganese. 26. The composite is made of S on a metal substrate made of aluminum.
25. The composite strength member according to claim 24, wherein the composite strength member is joined by a solder made of an Al alloy containing 8 to 15% by weight of i.