JPH01205452A - Cooling structure for integrated circuit - Google Patents
Cooling structure for integrated circuitInfo
- Publication number
- JPH01205452A JPH01205452A JP63029385A JP2938588A JPH01205452A JP H01205452 A JPH01205452 A JP H01205452A JP 63029385 A JP63029385 A JP 63029385A JP 2938588 A JP2938588 A JP 2938588A JP H01205452 A JPH01205452 A JP H01205452A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- cooling
- integrated circuit
- heat
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 57
- 239000003507 refrigerant Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は集積回路の冷却構造に関し、特にコールドプレ
ートを使用した水冷式の冷却構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for integrated circuits, and more particularly to a water-cooled cooling structure using a cold plate.
［従来の技術］
従来、この種の集積回路の冷却構造は、例えば第３図に
示す如く、集積回路２１が搭載されたＬＳＩケース２２
をプリント基板２３上に取付の、このＬＳＩケース２２
上に、集積回路２１よりも面積が大きくかつ集積回路２
１に接触した伝熱板２４を設け、この伝熱板２４の上に
シリコーン系ゴムをバインダとして金属又はアルミナ等
の酸化金属をフィシとする可変形性の伝熱体２５を介し
て銅等の伝熱体２６を固着し、この伝熱体２６に伝わる
熱を、伝熱体２６がベローズ２７を介して取付けられた
冷却へツタ゛２８内の冷媒２９により冷却する構造とな
っている（特開昭６Ｏ−１１０１４９）。[Prior Art] Conventionally, this type of integrated circuit cooling structure has an LSI case 22 on which an integrated circuit 21 is mounted, as shown in FIG. 3, for example.
This LSI case 22 is mounted on the printed circuit board 23.
On the top, an integrated circuit 2 having a larger area than the integrated circuit 21 is shown.
A heat transfer plate 24 is provided in contact with the heat transfer plate 24, and a heat transfer material such as copper is placed on the heat transfer plate 24 through a deformable heat transfer body 25 made of metal or oxidized metal such as alumina using silicone rubber as a binder. The heat transfer body 26 is fixed, and the heat transferred to the heat transfer body 26 is cooled by a refrigerant 29 in a bellows 28 to which the heat transfer body 26 is attached via a bellows 27. (Sho 6O-110149).
［発明が解決しようとする課題］
上述した従来の集積回路の冷却構造は、ＬＳＩケース２
２の外形のバラツキや組立時の部品の浮き傾き等のバラ
ツキをなくすために柔軟なベローズ２７を用いて伝導板
２４と伝熱体２５との伝熱面を密着させているが、ベロ
ーズ２７に柔軟性を持たせるために、ベローズ２フ自体
が非常に薄く形成しであるため、強度的に弱くかつ冷媒
２９の漏れるおそれがあるためその取扱いに注意か必要
となり、この結果操作性に劣る欠点があフた。[Problems to be Solved by the Invention] The conventional integrated circuit cooling structure described above is
A flexible bellows 27 is used to bring the heat transfer surfaces of the conductive plate 24 and the heat transfer body 25 into close contact with each other in order to eliminate variations in the external shape of the conductive plate 24 and the floating and inclination of parts during assembly. In order to have flexibility, the bellows 2 flap itself is formed very thin, so it is weak in strength and there is a risk of leakage of the refrigerant 29, so it must be handled with care, resulting in poor operability. There was a flash.
［課題を解決するだめの手段］
本発明は、上記従来の課題を解決するためになされたも
のて、そのための解決手段として、複数のＬＳＩケース
が搭載されたプリント基板上にフレームを設け、該フレ
ームの上記ＬＳＩケースに対応する個所に、冷却パイプ
を有する冷却板を、ＬＳＩケース側に（＝ｊ勢するばね
を介してＬＳＩケースの表面に密着させて取付け、この
冷却板を介して伝ったＬＳＩケースの熱を上記冷却パイ
プ内の冷媒により冷却することを特徴とする集積回路の
冷却構造を提供するものである。[Means for Solving the Problems] The present invention has been made to solve the above-mentioned conventional problems. A cooling plate with a cooling pipe is attached to the part of the frame corresponding to the above LSI case so that it is in close contact with the surface of the LSI case via a spring that exerts force on the LSI case side (=j), and the The present invention provides an integrated circuit cooling structure characterized in that the heat of the LSI case is cooled by the refrigerant in the cooling pipe.
［実施例コ
次に、本発明の実施例について図面を参照して説明する
。[Embodiments] Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例に係る集積回路の冷却構造を
示す断面図、第２図は第１図の集積回路の冷却構造を示
ず一部切欠き側面図である。FIG. 1 is a sectional view showing a cooling structure for an integrated circuit according to an embodiment of the present invention, and FIG. 2 is a partially cutaway side view, not showing the cooling structure for the integrated circuit of FIG.
集積回路の冷却構造は、ＬＳＩケース１の集積回路２を
伝熱板３．冷却板５を介して冷却パイプロにより冷却す
るようになっている。In the integrated circuit cooling structure, an integrated circuit 2 in an LSI case 1 is connected to a heat transfer plate 3. It is designed to be cooled by a cooling pipe via a cooling plate 5.
集積回路２を搭載したＬＳＩケース１は、プリント基板
４に水平に実装されている。このＬＳＩケース１は、集
積回路２の十面積よりも大きい伝熱板３を、集積回路２
の上面に接着させて保持している。伝熱板３は、高熱伝
導率の素材を両面平坦な板状に仕上げて形成したもので
ある。An LSI case 1 mounting an integrated circuit 2 is mounted horizontally on a printed circuit board 4. This LSI case 1 has a heat exchanger plate 3 larger than 10 areas of the integrated circuit 2.
It is held by gluing it to the top surface. The heat exchanger plate 3 is formed by finishing a material with high thermal conductivity into a flat plate shape on both sides.
冷却板５は、上記伝熱板３の１−面に接触した形て位置
している。この冷却板５は、高熱伝導率の素材を少なく
ともド面か平坦な板状に仕上げて形成したものである。The cooling plate 5 is located in contact with the first side of the heat transfer plate 3. The cooling plate 5 is made of a material with high thermal conductivity and is finished into a plate shape with at least a flat surface.
また冷却板５はばね８を介してフレーム９に取付けであ
る。ばね８は第２図に示す如く略Ｚ形をなした弾性部材
で形成してあり、そのイ」勢力によって冷却板５を伝熱
板３の上面に密着する機能を有する。これにより、ＬＳ
Ｉケース１の外形のバラツキや組立時に生じるＬＳＩケ
ース１の高さや傾きのバラツキに拘らず、冷却板５か適
確に伝熱板３に密着する。一方フレーム９は、サポート
１工によりプリント基板４」二に支持されている。Further, the cooling plate 5 is attached to the frame 9 via a spring 8. The spring 8 is formed of an elastic member having a substantially Z shape as shown in FIG. 2, and has the function of bringing the cooling plate 5 into close contact with the upper surface of the heat transfer plate 3 by its diagonal force. As a result, LS
The cooling plate 5 is accurately brought into close contact with the heat exchanger plate 3 regardless of variations in the external shape of the I case 1 and variations in the height and inclination of the LSI case 1 that occur during assembly. On the other hand, the frame 9 is supported on the printed circuit board 4'' by a support.
冷却パイプロは、冷却板５の上面に半田７によって載置
固定されている。この冷却パイプロは各冷却板５上に設
けられ、第２図に示ず如くホース１０により一連に連結
されている。また冷却パイプロ内には冷媒が流れている
。The cooling pipe is mounted and fixed on the upper surface of the cooling plate 5 with solder 7. The cooling pipes are provided on each cooling plate 5 and are connected in series by hoses 10 as shown in FIG. Also, a refrigerant is flowing inside the cooling pipe.
次に、未実施例に係る集積回路の冷却構造が示す作用に
ついて説明する。Next, the effect exhibited by the cooling structure for an integrated circuit according to an unembodied example will be explained.
集積回路２から放出された熱は伝熱板３を介して冷却板
５に至る。この冷却板５はばね８の付勢力によって伝熱
板３に密着しているため、伝熱板３からの熱を十分に吸
収し、吸収した熱を冷却パイプロに伝導する。冷却パイ
プロに伝導された熱は、冷却パイプロ内の冷媒によって
冷却される。Heat released from the integrated circuit 2 reaches the cooling plate 5 via the heat transfer plate 3. Since the cooling plate 5 is in close contact with the heat exchanger plate 3 by the biasing force of the spring 8, it sufficiently absorbs the heat from the heat exchanger plate 3 and conducts the absorbed heat to the cooling pipe. The heat conducted to the cooling pipe is cooled by the refrigerant inside the cooling pipe.
［発明の効果］
以上説明したように本発明の集積回路の冷却構造は、複
数のＬ’ＳＩケースが搭載されたプリント基板上にフレ
ームを設け、該フレームの上記ＬＳＩケースに対応する
個所に、冷却パイプを有する冷却板を、ＬＳＩケース側
に付勢するばねを介してＬＳＩケースの表面に密着させ
て取付けたため、ＬＳＩケースの寸法や組立時のバラツ
キによるＬＳＩケースの高さの差や傾きに拘わらず冷却
板をＬＳＩケースに密着でき、この結果熱抵抗を減少さ
せかつ冷却特性を改善する効果がある。[Effects of the Invention] As explained above, in the integrated circuit cooling structure of the present invention, a frame is provided on a printed circuit board on which a plurality of L'SI cases are mounted, and a portion of the frame corresponding to the LSI cases is provided with a frame. Because the cooling plate with cooling pipes is mounted in close contact with the surface of the LSI case via a spring that biases it toward the LSI case, it is possible to avoid differences in height or tilt of the LSI case due to variations in the dimensions of the LSI case or during assembly. Regardless, the cooling plate can be closely attached to the LSI case, which has the effect of reducing thermal resistance and improving cooling characteristics.
また構造か簡易なため、安価て取扱いに優れ、かつ冷媒
の漏れるおそれも少ないという効果かある。更に冷却板
に冷却パイプを取付けた構造のため、冷却板を薄くでき
、軽量化を図ることができる効果もある。Furthermore, since the structure is simple, it is inexpensive, easy to handle, and has the effect of reducing the risk of refrigerant leakage. Furthermore, since the cooling pipe is attached to the cooling plate, the cooling plate can be made thinner, which has the effect of reducing weight.
第１図は本発明の一実施例に係る集積回路の冷却構造を
示す断面図、第２図は第１図の集積回路の冷却構造を示
す一部切欠き側面図、第３図は従来の集積回路の冷却構
造を示す断面図である。
１．１２：ＬＳＩケース
２．２１：集積回路
３．２４・伝熱板
４．２３ニブリント基板
５：冷却板 ６：冷却パイプ７：半１）
８ ばね
９：フレーム １０：ホース
１１：サポート ２５：可変形性の伝熱体２６：
伝熱体 ２７：へローズ２８：冷却へツタ
２９：冷媒FIG. 1 is a sectional view showing a cooling structure for an integrated circuit according to an embodiment of the present invention, FIG. 2 is a partially cutaway side view showing the cooling structure for an integrated circuit shown in FIG. FIG. 2 is a cross-sectional view showing a cooling structure for an integrated circuit. 1.12: LSI case 2.21: Integrated circuit 3.24/Heat transfer plate 4.23 Niblint board 5: Cooling plate 6: Cooling pipe 7: Half 1)
8 Spring 9: Frame 10: Hose 11: Support 25: Deformable heat transfer body 26:
Heat transfer body 27: Heroes 28: Cooling ivy
29: Refrigerant
Claims (1)
ームを設け、該フレームの上記 ＬＳＩケースに対応する個所に、冷却パイプを有する冷
却板を、ＬＳＩケース側に付勢するばねを介してＬＳＩ
ケースの表面に密着させて取付け、この冷却板を介して
伝ったＬＳＩケースの熱を上記冷却パイプ内の冷媒によ
り冷却することを特徴とする集積回路の冷却構造。[Scope of Claims] A frame is provided on a printed circuit board on which a plurality of LSI cases are mounted, and a spring is provided at a portion of the frame corresponding to the LSI cases to bias a cooling plate having a cooling pipe toward the LSI case. via LSI
A cooling structure for an integrated circuit, which is mounted in close contact with the surface of a case, and the heat from the LSI case transmitted through the cooling plate is cooled by a refrigerant in the cooling pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63029385A JPH0719864B2 (en) | 1988-02-10 | 1988-02-10 | Integrated circuit cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63029385A JPH0719864B2 (en) | 1988-02-10 | 1988-02-10 | Integrated circuit cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01205452A true JPH01205452A (en) | 1989-08-17 |
| JPH0719864B2 JPH0719864B2 (en) | 1995-03-06 |
Family
ID=12274670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63029385A Expired - Lifetime JPH0719864B2 (en) | 1988-02-10 | 1988-02-10 | Integrated circuit cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719864B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925929A (en) * | 1992-07-03 | 1999-07-20 | Hitachi, Ltd. | Cooling apparatus for electronic elements |
-
1988
- 1988-02-10 JP JP63029385A patent/JPH0719864B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925929A (en) * | 1992-07-03 | 1999-07-20 | Hitachi, Ltd. | Cooling apparatus for electronic elements |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719864B2 (en) | 1995-03-06 |
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