JPH01201486A - Ag plated powder for electrically conductive paint having superior migration resistance - Google Patents
Ag plated powder for electrically conductive paint having superior migration resistanceInfo
- Publication number
- JPH01201486A JPH01201486A JP63026455A JP2645588A JPH01201486A JP H01201486 A JPH01201486 A JP H01201486A JP 63026455 A JP63026455 A JP 63026455A JP 2645588 A JP2645588 A JP 2645588A JP H01201486 A JPH01201486 A JP H01201486A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- resistance
- migration resistance
- conductive paint
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 50
- 238000013508 migration Methods 0.000 title claims abstract description 30
- 230000005012 migration Effects 0.000 title claims abstract description 30
- 239000003973 paint Substances 0.000 title claims abstract description 13
- 229910001111 Fine metal Inorganic materials 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 28
- 239000002131 composite material Substances 0.000 claims description 15
- 230000007613 environmental effect Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 229910052742 iron Inorganic materials 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 238000009692 water atomization Methods 0.000 abstract description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 abstract 3
- 238000000576 coating method Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- 239000000945 filler Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 101100008046 Caenorhabditis elegans cut-2 gene Proteins 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 101710134784 Agnoprotein Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
大発明は電子工業等で使用される導電塗料用Ａにめっき
複合粉末に関し、特に導電性を確保しつつ耐マイグレー
ション性を改善したＡｇめっき複合粉末に関する。[Detailed description of the invention] [Field of industrial application] The great invention relates to a plating composite powder for conductive paint A used in the electronic industry, etc., and in particular, an Ag plating composite powder that has improved migration resistance while ensuring conductivity. Regarding powder.
近江、電子工業等では、導電ペースト、あるいはｔ’ｆ
ｌｉ波シールド用導！塗料への添加物（導電フィラー）
として偏平加工したＡｇ粉末が多量に用いられている。In Ohmi, electronics industry, etc., conductive paste or t'f
Guide for li wave shield! Additives to paints (conductive fillers)
A large amount of flattened Ag powder is used.
ＡＲは貴金属であり、高価であるにも間わらずこのよう
に工業用に使用されるのは、その優れた電気伝導性と耐
環境性による。即ち、Ｎｉ、Ｆｅ等は安価であるが電気
伝導性に劣り、Ｃ１１は通常は電気伝導性に優れるが、
表面が酸化されるとやはり電気伝導性が劣化する。これ
に対して、Ａｇは金属中で最も電気抵抗が低く、しかも
表面が酸化されても電気伝導性が劣化しない。AR is a noble metal, and although it is expensive, it is used industrially because of its excellent electrical conductivity and environmental resistance. That is, Ni, Fe, etc. are cheap but have poor electrical conductivity, while C11 usually has excellent electrical conductivity, but
If the surface is oxidized, the electrical conductivity will also deteriorate. On the other hand, Ag has the lowest electrical resistance among metals, and its electrical conductivity does not deteriorate even if its surface is oxidized.
そこでこのＡｇの優れた電気的特性を生かしつつコスト
ダウンを図ることのできる方法として、従来、Ｃｕ、Ｎ
ｉ、Ｆｅ等の安価な金属の微粉末の表面に蒲＜Ａｇをめ
っきした複合粉末が提案されている。これは、Ａｇめっ
き微粉末をｉｆ塗料のフィラーとして添加した場合、電
流は主としてフィラーの表面を流れるので、表面がＡｇ
で被覆されておれば、充分な電気伝導性及び耐環境性が
確保できると考えられる点を利用したものである。Therefore, as a method that can reduce costs while taking advantage of the excellent electrical properties of Ag, Cu, N
A composite powder has been proposed in which the surface of a fine powder of an inexpensive metal such as i, Fe or the like is plated with Ag. This is because when Ag plating fine powder is added as a filler in IF paint, the current mainly flows through the surface of the filler, so the surface becomes Ag.
This method takes advantage of the fact that sufficient electrical conductivity and environmental resistance can be ensured if the material is coated with .
しかしながら、Ａｇは高価であることの他に、導電塗料
のフィラーとして使用するとマイグレーシラン現象が発
生し易いという重要な問題がある。However, in addition to being expensive, Ag has an important problem in that when used as a filler in conductive paint, it tends to cause a migration silane phenomenon.
ここでマイグレーション現象とは、絶縁された２つの回
路の間に水分が溜まった状態で、両回路の間に直流電圧
を印加した場合に、Ａｇを陽極として使用していると、
この陽極からＡＲイオンが溶出して陰極に移行し、該陰
極部において成長し、ついには短絡に到る一種の電気化
学的現象であって、特に湿潤な環境下で使用される電子
機器においては重要な問題となっている。Here, the migration phenomenon is when moisture is accumulated between two insulated circuits and a DC voltage is applied between the two circuits, when Ag is used as an anode.
This is a type of electrochemical phenomenon in which AR ions are eluted from the anode, migrate to the cathode, grow at the cathode, and eventually lead to a short circuit, especially in electronic devices used in humid environments. This has become an important issue.
このＡｇのマイグレーションを抑制する手段として、従
来から、ＡｇをＰｄと合金化したり、ＡｇとＰｄの混合
粉末を使用する方法が提案されているが、この方法は極
めて高価につく難点がある。As a means of suppressing this migration of Ag, methods have heretofore been proposed in which Ag is alloyed with Pd or a mixed powder of Ag and Pd is used, but these methods have the drawback of being extremely expensive.
本発明は上記従来の問題点を解決するためになされたも
ので、経済的でかつ耐マイグレーション性に優れた導電
塗料用Ａｇめっき複合粉末を提供することを目的として
いる。The present invention was made in order to solve the above-mentioned conventional problems, and an object of the present invention is to provide an Ag plating composite powder for conductive paint that is economical and has excellent migration resistance.
本発明者らは上記問題点を解決するために鋭意実験研究
を重ね、Ａｇめっき複合粉末においては、基材となる原
料粉末の表面に形成されるへｇ皮膜の厚さが、導を塗膜
の電気比抵抗価だけでなくマイグレーション現象の発生
と大きく関連していることを見出した。そしてこの膜厚
、つまりＡｇ付着量を、電気比抵抗値が実用に供し得る
範囲となり、かつマイグレーションの発生しにくい量に
規定すれば、必要な導電性を確保し、かつ耐マイグレー
ション性を大幅に改善できることにに想到し、さらに実
験研究を重ねて本発明を完成した。The present inventors have conducted extensive experimental research to solve the above problems, and have found that in Ag plating composite powder, the thickness of the heg film formed on the surface of the raw material powder that serves as the base material increases the conductivity of the coating film. It was found that there is a significant correlation not only with the electrical resistivity value but also with the occurrence of the migration phenomenon. If this film thickness, that is, the amount of Ag deposited, is set to a value that keeps the electrical resistivity within a practical range and at which migration is unlikely to occur, the necessary conductivity can be ensured, and the migration resistance can be greatly improved. They came up with an idea that could be improved, and after further experimental research, they completed the present invention.
そこで本発明は、導電塗料用Ａｇめっき複合粉末におい
て、厚さ５μｍ以下に偏平加工された金ｒＸ微粉末、例
えばＣｕ、Ｎｉ、Ｆｅ等の表面にＡｇを該金属微粉末に
対する重量％で１０〜６０％の範囲になるようめっきし
たことを特徴としている。Therefore, in the Ag plating composite powder for conductive coatings, the present invention provides Ag plating composite powder for conductive coatings, in which Ag is applied to the surface of gold r It is characterized by being plated in a range of 60%.
ここで本発明の通用範囲及び各条件の限定理由について
説明する。Here, the scope of the present invention and reasons for limiting each condition will be explained.
■ 複合粉末の基材となる原料金Ｉｘ微粉末は、後述の
偏平加工及びＡｇめっき加工が可能であればその材質は
何れでもよい、これは導電フィラーとしての使用状態で
は、電流は主としてｉｘＴ！Ｌフィラーの表面を流れる
から、原料微粉末自体の電気抵抗はあまり問題にならず
、安た耐環境性の優れたＡｇでめっきされるから、原料
微粉末自体の耐環境性もあまり問題にならないからであ
る。この原料微粉末の代表的な例としては、上述の加工
性。■ The raw material Ix fine powder, which is the base material of the composite powder, may be made of any material as long as it can be flattened and Ag plated as described below.When used as a conductive filler, the current is mainly ixT! Since it flows on the surface of the L filler, the electrical resistance of the raw material fine powder itself is not much of a problem, and since it is plated with cheap Ag that has excellent environmental resistance, the environmental resistance of the raw material fine powder itself is not a problem either. It is from. A typical example of this raw material fine powder is the processability described above.
経済性等を考慮してＣｕ、Ｎｉ、Ｆｅが採用できる。Cu, Ni, and Fe can be used in consideration of economic efficiency.
■ 厚さ５μｍ以下に偏平加工した理由導電塗料用の導
電フィラーには偏平加工したものが必要である。これは
薄い塗膜に充分なａ１電性を与えるためには、フィラー
を偏平化して面積を増加させることにより電気的な接点
を多量に作ることが必要なためである。本発明の複合粉
末においても原料微粉末の厚さを頂くする必要があり、
５μ−を越えると表面積、ひいては電気的な接点量が不
足し、充分な電気伝導性が得られない。■ Reason for flattening to a thickness of 5 μm or less Conductive fillers for conductive paints must be flattened. This is because in order to provide sufficient a1 conductivity to a thin coating film, it is necessary to make a large number of electrical contacts by flattening the filler and increasing its area. Even in the composite powder of the present invention, it is necessary to control the thickness of the raw material fine powder,
If it exceeds 5 μ-, the surface area and therefore the amount of electrical contacts will be insufficient, and sufficient electrical conductivity will not be obtained.
■ Ａｇ付着量を重量％で１０〜６０％の範囲とした理
由
本発明者らの実験により、Ａｇめうき看少ないほどＡｇ
イオンの溶出が抑制され、耐マイグレーション性は向上
するが、一方、このめっき音が１０％以下であると、原
料微粉末を完全に覆うことができない、そのためめっき
量１０％以下の微粉末を導電塗料用フィラーとして使用
した場合、電気比抵抗値が極端に大きくなり、充分な電
気伝導性を確保できず、また原料微粉末が外方に露出し
ていることから耐環境性が低下する。一方、Ａｇめっき
量が６０％以上となり、Ａ８めっき層の膜厚があまり厚
（なると、マイグレーション現象が生じ易いというＡｇ
本来の性質が現れて耐マイグレーション性が著しく劣化
する。このように電気伝導性。■ Reason for setting the Ag adhesion amount in the range of 10 to 60% by weight According to experiments conducted by the present inventors, the smaller the amount of Ag, the more Ag
Elution of ions is suppressed and migration resistance is improved, but on the other hand, if this plating noise is less than 10%, it will not be possible to completely cover the raw material fine powder. When used as a paint filler, the electrical resistivity value becomes extremely large, making it impossible to ensure sufficient electrical conductivity, and the environmental resistance decreases because the raw material fine powder is exposed to the outside. On the other hand, if the amount of Ag plating is 60% or more and the thickness of the A8 plating layer is too thick (if the Ag plating layer is too thick, the migration phenomenon is likely to occur).
The original properties appear and the migration resistance deteriorates significantly. Thus electrical conductivity.
耐環境性、及び耐マイグレーション性を確保するには、
めっき量は１０〜６０重量％の範囲に規制する必要があ
る。To ensure environmental resistance and migration resistance,
The amount of plating needs to be regulated within the range of 10 to 60% by weight.
本発明に係る導電塗料用Ａｇめっき複合粉末によれば、
原料微粉末へのＡｇめっき量を所定範囲内に規制したの
で、原料粉末をへ８皮膜で完全に覆うことにより比抵抗
値を実用上支障のない範囲に保持できるとともに、耐環
境性を向上できる。According to the Ag plating composite powder for conductive paint according to the present invention,
Since the amount of Ag plating on the raw material fine powder is regulated within a predetermined range, by completely covering the raw material powder with the F-8 film, the resistivity value can be maintained within a range that does not cause any practical problems, and environmental resistance can be improved. .
そして水分存在下で直流電圧を印加してもＡｇイオンが
溶出することはほとんどなく、耐マイグレーション性を
著しく改善できる。Even if a DC voltage is applied in the presence of water, Ag ions are hardly eluted, and migration resistance can be significantly improved.
以下、本発明の詳細な説明する。 The present invention will be explained in detail below.
未実施例は、Ａｇめっき付着量を本発明範囲に規制する
ことによる耐マイグレーション性向と効果を確認するた
めに、以下の手順で行った。In the non-experimental example, the following procedure was carried out in order to confirm the migration resistance and effect by regulating the amount of Ag plating deposited within the range of the present invention.
■ 水アトマイズ法によりＣｕ、Ｎｉ及びＦｅの粒状微
粉末を作成し、これを偏平加工機を用いて偏平加工し、
平均厚さ約１μ鋼、平均粒径的１０μ−の基材となる原
料微粉末を得た。■ Create granular fine powder of Cu, Ni and Fe by water atomization method, flatten it using a flattening machine,
A raw material fine powder serving as a base material having an average thickness of about 1 .mu.m steel and an average particle size of 10 .mu.m was obtained.
■ 下記原料微粉末を種々の組成のＡ ｇＮＯ！水溶液
中に浸漬し、攪拌することにより無電解めっきを施し、
めっき付着量が上記金属微粉末の５〜９０重量％の組成
を有するＡｇめっき複合粉末を作成した。■ AgNO of various compositions using the following raw material fine powder! Electroless plating is applied by immersing in an aqueous solution and stirring,
Ag plating composite powder having a composition in which the amount of plating deposited was 5 to 90% by weight of the above-mentioned fine metal powder was prepared.
■ 上記各めっき付着量を有するＡｇめっき複合粉末、
及び比較例としての市販の偏平加工されたＡｇ微粉末の
それぞれを樹脂に、樹脂：めっき複合粉末の比率が重量
比で２二８となるようにシンナーを用いて充分に混合し
、この混合物をガラス板の上に厚さ９０μｍになるよう
塗布した後、１２０℃で１０分間乾燥して試料塗膜を得
た。これらの塗膜について、電気比抵抗、耐マイグレー
ション性の評価を行った。■Ag plating composite powder having each of the above plating coating weights,
and a commercially available flattened Ag fine powder as a comparative example were thoroughly mixed with a resin using thinner so that the ratio of resin to plating composite powder was 228 by weight, and this mixture was After coating it on a glass plate to a thickness of 90 μm, it was dried at 120° C. for 10 minutes to obtain a sample coating film. These coating films were evaluated for electrical resistivity and migration resistance.
■ 電気比抵抗値は、上記各塗膜の幅ｌｆ１分について
の電気抵抗を抵抗計により測定し、実測した該各塗膜の
膜厚値と上記計測した抵抗値とから求めた。(2) The electrical resistivity value was determined by measuring the electrical resistance of each of the above coating films over a width lf1 minute using a resistance meter, and from the actually measured film thickness value of each coating film and the above measured resistance value.
■ 耐マイグレーション性は、図面に示す実験装置によ
って評価した。即ち、ガラス板６上に形成された塗膜１
に幅１ｆｉの切込み２を縦、横に入れ、該切込み２で分
離された両替膜１ａ、ｌｂＯ間に５ｖの直流１［３を接
続し、この状態で上記切込み２部分にスポイトで純粋４
を一滴滴下し、両極間に流れる電流の経時変化を電流計
５で計測した。そして計測電流値が０．５Ａに達するま
での時間（以下、マイグレーシラン時間と記す）によっ
て耐マイグレーション性を評価した。■ Migration resistance was evaluated using the experimental equipment shown in the drawings. That is, the coating film 1 formed on the glass plate 6
Cuts 2 with a width of 1fi are made vertically and horizontally in the cut 2, and a 5V DC 1[3 is connected between the exchange membrane 1a and lbO separated by the cuts 2. In this state, pure 4 is applied to the cut 2 portion with a dropper.
One drop of was added, and the change over time in the current flowing between the two electrodes was measured using an ammeter 5. Migration resistance was evaluated based on the time required for the measured current value to reach 0.5 A (hereinafter referred to as migration time).
Ａｇめっき付着量等の実験条件及び該条件で作成した各
種の金ｒｓ粉末をフィラーとした塗膜の電気比抵抗およ
び耐マイグレーション性の試験結果を第１表に示す。Table 1 shows the experimental conditions such as the amount of Ag plating deposited, and the test results of the electrical resistivity and migration resistance of the coating films prepared under the conditions using various gold RS powders as fillers.
同表からも明らかなように、Ａｇめっき付着量が本発明
範囲より少ない５．８重量％のもの（魚７．１０）は、
マイグレーシラン時間が６０分以上と耐マイグレーショ
ン性は高いものの、電気伝１性が著しく低く、導電フィ
ラーとしての実用には供し得ない、またＡｇめっき付着
量が本発明範囲より多い７０．９０重量％のもの＜１’
ｈ８，９）では、電気伝導性は充分であるものの、マイ
グレーション時間が１５分、 １０分と短く、耐マイグ
レーション性が低い、この点Ａｇ微粉末の場合も同様に
耐マイグレーション性が悪い、これに対してＡｇめっき
付着量が本発明範囲にあるＡｇめっき粉末を用いた塗膜
（−１〜６）の場合は、電気伝導性は市販のＡｇ偏平加
工粉の場合に比べて若干劣るものの実用上支障のない範
囲にあり、かつ、Ａｇ微粉末の最大の欠点である耐マイ
グレーション性に著しく仔れている。As is clear from the same table, when the Ag plating amount is 5.8% by weight, which is less than the range of the present invention (Fish 7.10),
Although the migration resistance is high with a migration silane time of 60 minutes or more, the electrical conductivity is extremely low and it cannot be used for practical use as a conductive filler, and the amount of Ag plating deposited is 70.90% by weight, which is higher than the range of the present invention. <1'
h8,9) have sufficient electrical conductivity, but the migration time is short, 15 minutes, 10 minutes, and the migration resistance is low.In this respect, the migration resistance is similarly poor in the case of Ag fine powder. On the other hand, in the case of a coating film (-1 to 6) using Ag plating powder with an Ag plating deposition amount within the range of the present invention, the electrical conductivity is slightly inferior to that of commercially available Ag flat processed powder, but it is not suitable for practical use. It is within a range that does not cause any problems, and is significantly improved in terms of migration resistance, which is the biggest drawback of fine Ag powder.
第１表
〔発明の効果〕
以上のように本発明に係る導電塗料用Ａｇめっき複合粉
末によれば、原料粉末を５μｍ以下の厚さにするととも
に、Ａｇめっき付着量を１０〜６０重量％に規制したの
で、電気伝導性、耐環境性を確保しながら、耐マイグレ
ーション性を大幅に改善できる効果があり、その工業的
価値は極めて大きい。Table 1 [Effects of the Invention] As described above, according to the Ag plating composite powder for conductive paint according to the present invention, the thickness of the raw material powder is 5 μm or less, and the amount of Ag plating deposited is 10 to 60% by weight. This regulation has the effect of significantly improving migration resistance while ensuring electrical conductivity and environmental resistance, and its industrial value is extremely large.
図面は本発明の効果を確認するための実験装置を示す構
成図である。
特許出願人 株式会社 神戸製鋼所
代理人 弁理士 下 市 努
１實仇The drawing is a configuration diagram showing an experimental apparatus for confirming the effects of the present invention. Patent applicant: Kobe Steel, Ltd. Agent: Patent attorney: Tsutomu Shimoichi
Claims (1)
面にＡｇを該金属微粉末の１０〜６０重量％付着させた
ことを特徴とする耐マイグレーション性に優れた導電塗
料用Ａｇめっき複合粉末。(1) Ag plating composite for conductive paint with excellent migration resistance, characterized in that 10 to 60% by weight of Ag is attached to the surface of fine metal powder that has been flattened to a thickness of 5 μm or less powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63026455A JPH01201486A (en) | 1988-02-05 | 1988-02-05 | Ag plated powder for electrically conductive paint having superior migration resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63026455A JPH01201486A (en) | 1988-02-05 | 1988-02-05 | Ag plated powder for electrically conductive paint having superior migration resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01201486A true JPH01201486A (en) | 1989-08-14 |
Family
ID=12193981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63026455A Pending JPH01201486A (en) | 1988-02-05 | 1988-02-05 | Ag plated powder for electrically conductive paint having superior migration resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01201486A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011144441A (en) * | 2010-01-18 | 2011-07-28 | Namics Corp | Silver-coated nickel powder and method for producing the same |
| JP2011201958A (en) * | 2010-03-24 | 2011-10-13 | Taiyo Holdings Co Ltd | Electroconductive resin composition and electronic circuit board |
| JP2014091842A (en) * | 2012-11-01 | 2014-05-19 | Dowa Electronics Materials Co Ltd | Method of manufacturing silver coating copper alloy powder |
| JP2014118590A (en) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | Fibrous silver fine particle aggregate |
| JP2014118589A (en) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | Coated fibrous copper fine particle aggregate |
| JP2017201062A (en) * | 2017-06-23 | 2017-11-09 | Ｄｏｗａエレクトロニクス株式会社 | Method for producing silver-coated copper alloy powder |
| CN110170650A (en) * | 2019-06-06 | 2019-08-27 | 上海交通大学 | A method of preparing high compactness and the complete silver-coated copper powder of cladding |
-
1988
- 1988-02-05 JP JP63026455A patent/JPH01201486A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011144441A (en) * | 2010-01-18 | 2011-07-28 | Namics Corp | Silver-coated nickel powder and method for producing the same |
| JP2011201958A (en) * | 2010-03-24 | 2011-10-13 | Taiyo Holdings Co Ltd | Electroconductive resin composition and electronic circuit board |
| JP2014091842A (en) * | 2012-11-01 | 2014-05-19 | Dowa Electronics Materials Co Ltd | Method of manufacturing silver coating copper alloy powder |
| JP2014118590A (en) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | Fibrous silver fine particle aggregate |
| JP2014118589A (en) * | 2012-12-14 | 2014-06-30 | Unitika Ltd | Coated fibrous copper fine particle aggregate |
| JP2017201062A (en) * | 2017-06-23 | 2017-11-09 | Ｄｏｗａエレクトロニクス株式会社 | Method for producing silver-coated copper alloy powder |
| CN110170650A (en) * | 2019-06-06 | 2019-08-27 | 上海交通大学 | A method of preparing high compactness and the complete silver-coated copper powder of cladding |
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