JPH01197573A - Resin-base insulating paste - Google Patents
Resin-base insulating pasteInfo
- Publication number
- JPH01197573A JPH01197573A JP2005488A JP2005488A JPH01197573A JP H01197573 A JPH01197573 A JP H01197573A JP 2005488 A JP2005488 A JP 2005488A JP 2005488 A JP2005488 A JP 2005488A JP H01197573 A JPH01197573 A JP H01197573A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- coupling agent
- filler
- silane coupling
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 8
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- 229920000877 Melamine resin Polymers 0.000 abstract description 4
- 239000000454 talc Substances 0.000 abstract description 4
- 229910052623 talc Inorganic materials 0.000 abstract description 4
- 239000004640 Melamine resin Substances 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 229920002050 silicone resin Polymers 0.000 abstract description 3
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 abstract description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 abstract description 2
- 229940088601 alpha-terpineol Drugs 0.000 abstract description 2
- 235000019445 benzyl alcohol Nutrition 0.000 abstract description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 abstract 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004843 novolac epoxy resin Substances 0.000 abstract 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000011195 cermet Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、樹胞系絶縁ペースト、特にハイブリットＩＣ
等の主にアルミナ基板上に形成された抵抗体、電極等の
回路を保護するために塗布される樹胞系絶縁ペーストの
組成に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin-based insulating paste, particularly a hybrid IC.
The present invention relates to the composition of a resin-based insulating paste that is mainly applied to protect circuits such as resistors and electrodes formed on an alumina substrate.
従来左技糊
一般に、回路部品のアルミナ基板上に形成されたＣｕ
、 Ａｇ／Ｐｄ電極回路やサーメット系抵抗体の防湿、
防塵５機械的保護あるいはソルダーレジストとして、樹
胞系絶縁ペーストが用いられている。Traditionally, Cu paste is generally formed on the alumina substrate of circuit components.
, Moisture proofing of Ag/Pd electrode circuits and cermet resistors,
Dust-proofing 5: Tree-based insulating paste is used for mechanical protection or as a solder resist.
この種の樹胞系絶縁ペーストは、フェノール樹脂。This kind of tree-based insulation paste is made of phenolic resin.
エポキシ樹脂、メラミン樹脂、シリコン樹脂等の結合剤
樹脂と、シリカ、アルミナ、タルク等の充填剤と、α−
テルピネオール、ベンジルアルコール、ブチルカルピト
ール等の溶剤とを混練したもので、被保護回路上にスク
リーン印刷等で塗布し、その後焼付けられる。Binder resin such as epoxy resin, melamine resin, silicone resin, filler such as silica, alumina, talc, etc.
It is a mixture of solvents such as terpineol, benzyl alcohol, butylcarpitol, etc., and is applied onto the circuit to be protected by screen printing or the like, and then baked.
さらに、この種の樹胞系絶縁ペーストを２６０℃程度の
耐熱性を要するソルダーレジストとして用いる場合には
、結合剤樹脂として硬化架橋密度の高いＯ−クレゾール
ノボラック型エポキシ樹脂等が使用されている。Further, when this type of resin-based insulation paste is used as a solder resist that requires heat resistance of about 260° C., an O-cresol novolak type epoxy resin or the like with a high cured crosslinking density is used as the binder resin.
明が 決しようとする課題
しかしながら、前記従来の樹胞系絶縁ペーストでは基板
や被保護回路、特にガラス質の多い抵抗体との密着性が
悪く、とりわけソルダーレジストとして使用する場合に
は密着性不良から電極等が変質、劣化するという問題点
を有していた。特に、０−タレゾールノボラック型エポ
キシ樹脂を含む樹胞系絶縁ペーストでは、耐熱性が良好
でソルダーレジストとして適しているだけに大きな問題
点であった。However, the conventional resin-based insulating pastes described above have poor adhesion to substrates and circuits to be protected, especially to resistors with a large amount of glass, and especially when used as solder resists, they have poor adhesion. However, there was a problem in that the electrodes etc. were altered and deteriorated. In particular, the resin-based insulating paste containing the 0-talesol novolac type epoxy resin had a serious problem since it had good heat resistance and was suitable as a solder resist.
課題を解決するための手段
そこで、本発明に係る樹胞系絶縁ペーストは、結合剤樹
脂と充填剤と溶剤とを含む樹胞系絶縁ペーストであって
、さらにこれらの成分に対して約０．０５〜１５吐％の
シランカップリング剤を含むことを特徴とする。Means for Solving the Problems Therefore, the dendritic insulating paste according to the present invention is a dendritic insulating paste containing a binder resin, a filler, and a solvent, and further contains about 0.0% of these components. It is characterized by containing 0.05 to 15% of a silane coupling agent.
本発明において、結合剤ｊＭＪ指としてはフェノール樹
脂、エポキシ樹脂とりわけ。−クレゾールノボラック型
エポキシ樹脂、メラミン樹脂、シリコン樹脂等が用いら
れる。充填剤としてはシリカ。In the present invention, the binder is preferably a phenolic resin or an epoxy resin. -Cresol novolak type epoxy resin, melamine resin, silicone resin, etc. are used. Silica is used as a filler.
アルミナ、タルク等が用いられる。溶剤としてはα−デ
ルピネ才一ル、ベンジルアルコール、ブチルカルピトー
ル
また、シランカップリング剤としては、例えば、７−ゲ
リシドキシブロピルトリメトキシシラン。Alumina, talc, etc. are used. Examples of the solvent include α-delpine acid, benzyl alcohol, and butyl carpitol. Examples of the silane coupling agent include 7-gelicidoxypropyltrimethoxysilane.
β−（３、４、エポキシシクロヘキシル）エチルトリメ
トキシシラン、Ｎ−β（アミノエチル）７−アミノプロ
ビルトリメトキシシラン、Ｎ−β（アミノエチル）７−
アミノプロピルメチルジメトキシシラン、７−メルカブ
トプルピルトリメトキシシラン
グ剤は、その分子中に２個以上の異なった反応基を有す
る有機けい索車量体であり、反応基のうし一つはガラス
、金属，けい砂等の無機質と化学結合する反応基、例え
ば、メトキシ基，エトキシ基。β-(3,4,epoxycyclohexyl)ethyltrimethoxysilane, N-β(aminoethyl)7-aminopropyltrimethoxysilane, N-β(aminoethyl)7-
Aminopropylmethyldimethoxysilane, 7-mercabutoprpyltrimethoxysilane, is an organic polymer having two or more different reactive groups in its molecule, one of which is glass. , reactive groups that chemically bond with inorganic substances such as metals and silica sand, such as methoxy groups and ethoxy groups.
シラノール基であり、いま一つの反応基は種々の合成樹
ノ后を構成する有機質材料と化学結合する反応基、例え
ば、ビニール基，エポキシ基，メクアクリル基，アミン
基，メルカプト基等からなるものである。Another reactive group is a silanol group, and another reactive group is a reactive group that chemically bonds with organic materials constituting various synthetic resins, such as a vinyl group, an epoxy group, a methacrylic group, an amine group, a mercapto group, etc. be.
シランカップリング剤は他の成分に対して約０、 ０５
ｗｔ％未満ではその目的とする密若力の向上が十分には
発揮されず、約１ ５ｗｔ％を越えると印刷性に支障を
来す場合があり、含有量としては約０． ０５〜１５ｗ
ｔ％が適当である。The silane coupling agent has a ratio of about 0.05 to other components.
If it is less than 15 wt%, the desired improvement in density and youthfulness will not be achieved sufficiently, and if it exceeds about 15 wt%, printability may be affected, and the content should be about 0.5 wt%. 05~15w
t% is appropriate.
以上の樹胞系絶縁ペーストは回路基板上に抵抗。The above tree-based insulation paste is used as a resistor on the circuit board.
電極等の被保護回路を含む様に塗布され、焼付けられ、
被保護回路の防湿，防塵，機械的保護，ソルダーレジス
トとして機能する。It is coated and baked to include protected circuits such as electrodes,
Functions as moisture proofing, dustproofing, mechanical protection, and solder mask for protected circuits.
伍−升 以上の本発明においては、結合剤樹脂，充填剤。5 - Masu In the present invention described above, binder resin and filler.
溶剤中に含有きれるシランカップリング剤の反応基が基
板に含まれている無機質や回路に含まれている無機質フ
ィラー、抵抗体中のガラス質，結合剤樹脂と化学的に結
合され、物理的な結合と相俟って、基板及び被保護回路
上に強固に結合され、密着性が向上することとなる。The reactive group of the silane coupling agent that can be contained in the solvent is chemically combined with the inorganic material contained in the substrate, the inorganic filler contained in the circuit, the glass in the resistor, and the binder resin, resulting in a physical reaction. Together with the bonding, it is firmly bonded onto the substrate and the circuit to be protected, and the adhesion is improved.
尖施忽
以下、本発明に係る樹胞系絶縁ペーストの実施例につき
説明する。Examples of the dendritic insulation paste according to the present invention will be described below.
実施例としては、以下の表に示す３種のものを製造し、
それぞれ密着性のテストを行なった。As an example, three types shown in the table below were manufactured,
Adhesion tests were conducted for each.
各実施例１〜４については、結合剤樹脂のうち主剤とし
て０−タレゾールノボラック型エポキシ樹脂、硬化剤と
してノボラック型フェノール樹脂を用いた。充填剤とし
てはシリカを用いた。これらの固型成分比は、充填剤４
０ｗｔ％、樹脂主剤４０ｗｔ％、硬化剤２０ｗｔ％であ
る。また、硬化促進剤としてイミダゾール系のものを樹
脂主剤に対して０．２畦％含有させた。さらに、溶剤に
はα−テルピネオールとベンジルアルコールの混合系を
用いた。For each of Examples 1 to 4, an 0-talesol novolac type epoxy resin was used as the main component of the binder resin, and a novolac type phenol resin was used as the curing agent. Silica was used as the filler. These solid component ratios are as follows: filler 4
0 wt%, resin base material 40 wt%, and curing agent 20 wt%. Furthermore, an imidazole-based curing accelerator was contained in an amount of 0.2% based on the resin base material. Furthermore, a mixed system of α-terpineol and benzyl alcohol was used as the solvent.
なお、実施例４ではこの硬化促進剤は含有されていない
。Note that in Example 4, this curing accelerator was not contained.
さらに、シランカップリング剤としは７−ゲリシドキシ
ブロビルメトキシシランを前記ペースト成分に対して、
実施例１では０． ０５ｗｔ％、実施例２では３ｗｔ％
、実施例３では７ｗｔ％、実施例４では１１ｗｔ％含有
きせた。Furthermore, as a silane coupling agent, 7-gelicidoxybrobylmethoxysilane is added to the paste component,
In Example 1, 0. 05wt%, 3wt% in Example 2
In Example 3, the content was 7 wt%, and in Example 4, it was 11 wt%.
以上の成分を混練して樹胞系絶縁ペーストとし、抵抗体
を形成した基板上に塗布し、２１０℃で６０分間焼付け
を行なった。基板はＡｌｔｏｎを焼結したものを用いた
。抵抗体はガラス質サーメット系抵抗体ペーストを前記
基板上に塗布，焼成したものである。The above components were kneaded to form a resin-based insulating paste, which was applied onto a substrate on which a resistor had been formed, and baked at 210° C. for 60 minutes. The substrate used was sintered Alton. The resistor is made by applying a glassy cermet resistor paste onto the substrate and firing it.
密着性テストは、前記基板，抵抗体上に各実施例１〜°
４の樹胞系絶縁ペーストをスクリーン印刷で塗布し、２
１０°Ｃ 、６０分の焼付は後、６０分間煮沸し、粘若
テープによるクロスカット試験を行なって剥離の程度を
調べたものである。The adhesion test was conducted by applying each of Examples 1 to ° on the substrate and resistor.
Apply the tree-based insulation paste from step 4 by screen printing, and
After baking at 10° C. for 60 minutes, the samples were boiled for 60 minutes and a cross-cut test was performed using sticky tape to examine the degree of peeling.
なお、同時に、比較例１．２として、シランカップリン
グ剤の含有量のみを０ｗｔ％、０．０３ｗｔ％に変更し
た樹胞系絶縁ペーストを製造し、前記同様の密着性テス
トを試みた。At the same time, as Comparative Example 1.2, resin-based insulating pastes were produced in which only the content of the silane coupling agent was changed to 0 wt% and 0.03 wt%, and the same adhesion test as above was attempted.
［以下余 白コ
密着性に関しては、比較例１．２ではいずれもガラス質
サーメット系抵抗体に対して剥離が生じたのに対し、各
実施例ではアルミナ基板、ガラス質抵抗体のいずれに対
しても良好な密着性を示し、特に後者に対する密着性が
大きく改善きれていることが明白となった。Regarding adhesion, in Comparative Examples 1 and 2, peeling occurred to the glassy cermet resistor, whereas in each example, peeling occurred to both the alumina substrate and the glassy resistor. It was clear that the adhesion to the latter was particularly improved.
なお、本発明の樹胞系絶縁ペーストにおいて、シランカ
ップリング剤の含有率の上限を他の成分に対して約１５
ｗｔ％としたのは、この上限を越えると密着性は良好で
あっても印刷性に支障を来すおそれがあることによる。In addition, in the tree-based insulation paste of the present invention, the upper limit of the content of the silane coupling agent is approximately 15% relative to other components.
The reason why it is set as wt% is that if this upper limit is exceeded, printability may be impaired even if the adhesion is good.
また、本発明に係る樹胞系絶縁ペーストは以上の実施例
に限定するものではなく、その要旨の範囲内で種々に変
更可能である。特に、結合剤樹脂や充填剤として他のエ
ポキシ系樹脂、フェノール系樹脂、メラミン系樹脂ある
いはアルミナ、タルクを用いることができ、その成分比
も任意である。Further, the dendritic insulation paste according to the present invention is not limited to the above embodiments, and can be variously modified within the scope of the gist thereof. In particular, other epoxy resins, phenol resins, melamine resins, alumina, and talc can be used as binder resins and fillers, and their component ratios are arbitrary.
さらに、アルミナ以外のセラミック製あるいは樹脂製の
基板、カーボン系抵抗体、Ａｇ電極等幅広く適用し、密
着性の向上を図ることができる。Furthermore, it can be widely applied to ceramic or resin substrates other than alumina, carbon-based resistors, Ag electrodes, etc. to improve adhesion.
λ肌座匈１
以上の説明で明らかな様に、本発明によれば、結合剤樹
脂、充填剤、溶剤に対して約０．０５〜１５孔％のシラ
ンカップリング剤を加えたため、該シランカップリング
剤の反応基の作用にて基板や抵抗体、電極等との結合力
が増大して密着性が向上する。As is clear from the above explanation, according to the present invention, since the silane coupling agent is added in an amount of about 0.05 to 15% to the binder resin, filler, and solvent, the silane Due to the action of the reactive group of the coupling agent, the bonding force with the substrate, resistor, electrode, etc. is increased and the adhesion is improved.
特許出願人 株式会社村田製作所Patent applicant: Murata Manufacturing Co., Ltd.
Claims (1)
ーストであって、さらにこれらの成分に対して約０．０
５〜１５ｗｔ％のシランカップリング剤を含むことを特
徴とする樹脂系絶縁ペースト。(1) A resin-based insulation paste containing a binder resin, a filler, and a solvent, and further contains about 0.0% of these components.
A resin-based insulating paste characterized by containing 5 to 15 wt% of a silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005488A JPH01197573A (en) | 1988-01-29 | 1988-01-29 | Resin-base insulating paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005488A JPH01197573A (en) | 1988-01-29 | 1988-01-29 | Resin-base insulating paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01197573A true JPH01197573A (en) | 1989-08-09 |
Family
ID=12016357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005488A Pending JPH01197573A (en) | 1988-01-29 | 1988-01-29 | Resin-base insulating paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01197573A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2010018852A1 (en) * | 2008-08-13 | 2012-01-26 | 旭硝子株式会社 | Article with coating composition and coating film formed thereon |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5026606A (en) * | 1973-07-09 | 1975-03-19 | ||
| JPS5575291A (en) * | 1978-12-01 | 1980-06-06 | Hitachi Ltd | Photosensittve resin composition for coating hybrid integrated circuit |
| JPS59189174A (en) * | 1983-04-12 | 1984-10-26 | Sumitomo Bakelite Co Ltd | Heat-resistant electrical insulating paint composition |
| JPS61151278A (en) * | 1984-12-25 | 1986-07-09 | Sumitomo Bakelite Co Ltd | Resin composition and coating for electrical insulation |
| JPS61283671A (en) * | 1985-06-11 | 1986-12-13 | Sumitomo Bakelite Co Ltd | Electrical insulating paint |
-
1988
- 1988-01-29 JP JP2005488A patent/JPH01197573A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5026606A (en) * | 1973-07-09 | 1975-03-19 | ||
| JPS5575291A (en) * | 1978-12-01 | 1980-06-06 | Hitachi Ltd | Photosensittve resin composition for coating hybrid integrated circuit |
| JPS59189174A (en) * | 1983-04-12 | 1984-10-26 | Sumitomo Bakelite Co Ltd | Heat-resistant electrical insulating paint composition |
| JPS61151278A (en) * | 1984-12-25 | 1986-07-09 | Sumitomo Bakelite Co Ltd | Resin composition and coating for electrical insulation |
| JPS61283671A (en) * | 1985-06-11 | 1986-12-13 | Sumitomo Bakelite Co Ltd | Electrical insulating paint |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2010018852A1 (en) * | 2008-08-13 | 2012-01-26 | 旭硝子株式会社 | Article with coating composition and coating film formed thereon |
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