JPH01193129A - Method for bonding tip on base metal of cutter or cutting tool - Google Patents
Method for bonding tip on base metal of cutter or cutting toolInfo
- Publication number
- JPH01193129A JPH01193129A JP1634888A JP1634888A JPH01193129A JP H01193129 A JPH01193129 A JP H01193129A JP 1634888 A JP1634888 A JP 1634888A JP 1634888 A JP1634888 A JP 1634888A JP H01193129 A JPH01193129 A JP H01193129A
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- metal
- bonded
- chip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010953 base metal Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 230000000737 periodic effect Effects 0.000 claims abstract description 3
- 238000006722 reduction reaction Methods 0.000 claims abstract 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 150000001247 metal acetylides Chemical class 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 238000011946 reduction process Methods 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 description 10
- 239000010941 cobalt Substances 0.000 description 10
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 239000001263 FEMA 3042 Substances 0.000 description 2
- 229910017974 NH40H Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910001315 Tool steel Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 2
- 229940033123 tannic acid Drugs 0.000 description 2
- 235000015523 tannic acid Nutrition 0.000 description 2
- 229920002258 tannic acid Polymers 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 241001290610 Abildgaardia Species 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 241000287107 Passer Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 description 1
- 229910001981 cobalt nitrate Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
この発明は刃物、工具類のチップと台金との接着方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of bonding a tip of a cutter or tool to a base metal.
刃物、工具のチップ類は高温硬度がたかく耐磨耗性に優
れているので刃物、工具類、耐磨耗部品としての使用度
はたかめられたが、しかし使用に際しての難点■は刃物
、工具類のチップは金属セラミックであることから、抗
折力が低く脆やすい性質であること■チップは台金、シ
ャンク等に銀ロウ付することから強固な接着が得られな
い■線引ダイスにおいては磨擦熱によって銀ロウ付が溶
融する難点があり、これら克服しなければチップ類の広
範な使用は難しいとされている。Chips for cutlery and tools have a high hardness at high temperatures and have excellent abrasion resistance, so they have been increasingly used as cutlery, tools, and wear-resistant parts. Since the chip is made of metal ceramic, it has a low transverse rupture strength and is brittle. - The chip is soldered with silver to the base metal, shank, etc., so strong adhesion cannot be obtained. - Wire drawing dies are prone to friction. There is a drawback that the silver solder melts due to heat, and unless this problem is overcome, widespread use of chips will be difficult.
この発明は特に鋸目形状をもつ刃物、折開工具のチップ
接着に台金接着断面を拡大にして接ｄ面積を大きくする
ことで溶融接着を容易にせしめる。次で台金の熱処理に
おける金属酸化皮膜を、金属還元処理で取り除き処理部
分に還元鉄を出現せしめ。周期率表第８族金属元素のコ
バルト、ニッケル、鉄の３金属で、チップの全表面を金
属還元法、電解メツキ法の複合処理で複層の金属皮膜を
施して、溶融接着でチップと台金を強固な溶融接着法を
提案するもので、簡単な設備でかつ極めて多量に接着工
程が備い、たとえばチップソー刃数４８ピツチにおいて
、一般のコンデンサ式スポット溶接機で接着すれば、約
１４５秒／枚内外の所要時間で接着できることから、台
金チップ双方の非接着以外にほとんど熱影響を及ぼすず
に溶融接着ができる工業的な方法を提供するものである
。In particular, the present invention facilitates melt bonding of chips of blades and folding tools having sawtooth shapes by enlarging the bonding cross section of the base metal and increasing the contact area d. Next, the metal oxide film from the heat treatment of the base metal is removed by metal reduction treatment, allowing reduced iron to appear in the treated area. A multi-layer metal coating is applied to the entire surface of the chip using a combination of metal reduction and electrolytic plating using three metals, cobalt, nickel, and iron, which are metal elements in group 8 of the periodic table, and the chip and base are bonded together by fusion bonding. This method proposes a strong melt-bonding method for gold, which uses simple equipment and has an extremely large amount of bonding process.For example, if a chip saw with 48 pitches is bonded using a general capacitor type spot welder, it will take about 145 seconds. / Since it is possible to bond the inside and outside of the board in the required time, it provides an industrial method that can perform melt bonding with almost no thermal effect other than non-bonding of both the base metal and the chip.
以下にこの発明の詳細な説明する。This invention will be explained in detail below.
チップソー、工具類の台金は普通炭素工具鋼、台金工具
鋼で板厚１．１〜２．６ｍｍ範囲の磨特殊鋼板材を鍛圧
プレスで打抜工程によって鋸目形状に成形されて、金属
熱処理工程でＨＲＣ−４３〜４４の硬度範囲に熱処理さ
れる。The base metal of chip saws and tools is made of ordinary carbon tool steel, a polished special steel plate with a thickness in the range of 1.1 to 2.6 mm, and is formed into a sawtooth shape by a punching process using a forging press. In the heat treatment process, it is heat treated to a hardness range of HRC-43 to HRC-44.
次にチップ接着断面部をスエジング、セイパー加工法で
鋼！の２．０倍に押広げることと、熱処理におけるスー
ケルを取除くことが同時にできるがチップ接着工程前の
時間経過から加工面に自然酸化物が発生する、−これら
の酸化物を、塩化第二鉄、硝酸鉄、塩酸、Ｎ Ｈ４０Ｈ
１整水の混合溶液をチップ接着加工部分に塗布して自然
乾燥後、繰返し塗布をして約３０時間経過後に塗布乾燥
面を軽く毛刷子で取り落してタンニン酸稀薄熱水に４０
分間浸漬して還元鉄の析出を得ることで溶融接着境界面
に金属の中に含まれる炭素を稀薄して、炭化物の発生を
抑制ゼしめカケンダルボイドを防ぎ緻密でかつ強固にチ
ップと溶融接着が得られる、一方のチップ全面域に、塩
化コバルト、硝酸コバルト、塩酸、ＮＨ４０Ｈ，整水の
混合水溶液中に潰し自然乾燥後繰返し潰して３０時間経
過後木製容器に乾燥川砂と処理中のチップと同人して軽
（震動を与えて木製通しで川砂を抜取り、竹製網目容器
でタンニン酸稀薄熱水中で約５０分間浸漬して還元コバ
ルト素地を設けてその上に無電解コバルト、電解コバル
ト鍍金で２μ〜３μ層厚の皮膜を設けて尚そのコバルト
皮膜の上に電解鉄鍍金を２００μｍ３００μの皮膜膜を
施して、鉄タラソドチソプが形成することは、焼結金属
チップ類の特性からチップ素地との間にこれらの第８元
素金属で皮膜することはチップから来る抵抗共震を防ぎ
脆やすさを保護して溶融接着する上でかかせない方法で
ある。Next, the cross section of the chip is swaged and processed using the saper processing method! However, natural oxides are generated on the processed surface due to the passage of time before the chip bonding process. Iron, iron nitrate, hydrochloric acid, NH40H
1. Apply a mixed solution of water to the chip adhesion processing area and let it air dry. After about 30 hours of repeated application, lightly remove the applied dry surface with a bristle brush and soak in hot water diluted with tannic acid for 40 minutes.
By soaking for 1 minute to obtain precipitation of reduced iron, the carbon contained in the metal is diluted at the interface of the molten bond, suppressing the generation of carbides, preventing sintering voids, and creating a dense and strong molten bond with the chip. The entire area of one of the chips was crushed in a mixed aqueous solution of cobalt chloride, cobalt nitrate, hydrochloric acid, NH40H, and purified water, dried naturally, and crushed repeatedly for 30 hours. After 30 hours, the dried river sand and the chips being processed were placed in a wooden container. The river sand was extracted using a wooden passer with a light vibration applied to it, and soaked in hot water diluted with tannic acid for about 50 minutes in a bamboo mesh container to form a reduced cobalt base, which was then plated with electroless cobalt and electrolytic cobalt. A film with a thickness of 2μ to 3μ is formed on the cobalt film, and then a 200μm to 300μ film of electrolytic iron plating is applied on top of the cobalt film to form an iron thallus. Coating with these 8th element metals in between is an essential method for preventing resistance resonance coming from the chips and protecting their fragility for melt bonding.
実施例１
台金鋼板は台金工具鋼５ＫＳ−５１で炭素Ｃ含有量は０
．７５％〜０．８５％を含む板厚１． ｌ ｍｍ直径１
８０ ｍｍの鋸目形状にプレス打抜後に、雰囲気熱処理
炉で焼入する硬度ＨＲＣ−４４範囲で処理する、次ぎに
第１図に示すスエジングセイパー加工でクラッドチップ
接着断面を２．９ｍｍの厚みに押広げて第１表に示す還
元溶液の操作でチップ接着部分に還元鉄を析出させる。Example 1 The base metal steel plate is base metal tool steel 5KS-51 and the carbon C content is 0.
．． Plate thickness including 75% to 0.85%1. l mm diameter 1
After press punching into a serrated shape of 80 mm, it is hardened in an atmospheric heat treatment furnace to a hardness in the HRC-44 range.Then, the clad chip bonded cross section is made into a 2.9 mm hardness by swaging saper processing as shown in Figure 1. It is spread to a thickness and reduced iron is precipitated at the chip bonding area by operating the reducing solution shown in Table 1.
接着するチップは次の寸法である２、Ｏｍｍ Ｘ ２．
Ｏｍｍ Ｘ ５，５ｍｍの長方形粉末金属チップを第２
表に示す還元コバルト溶液、前記に示す操作で析出させ
てその上２層皮膜は第３表に示すコバルト無電解鍍金操
作で２μ〜３μの皮膜を設ける、さらに電解鉄鍍金を２
００μ〜３００μの範囲で鉄皮膜クラッドチップとして
。The chip to be bonded has the following dimensions: 2.0mm x 2.
Omm x 5,5mm rectangular powder metal tip into the second
The reduced cobalt solution shown in the table is deposited by the operations shown above, and a two-layer film is formed on it by the cobalt electroless plating process shown in Table 3, with a thickness of 2μ to 3μ.
As an iron coated clad chip in the range of 00μ to 300μ.
コンデンサ式スポット溶接機で前記の台金とを、５５０
Ｋｇ／７−の加圧力として溶融電流約７．４６ｋＡ／３
μｓで溶融接着する、その接着強度は約３１５Ｋｐの引
張強度試験に耐えるものであった。Using a capacitor type spot welder, welded the base metal with 550
Melting current approximately 7.46kA/3 as a pressing force of Kg/7-
The bonding strength was such that it could withstand a tensile strength test of about 315 Kp, which was melted and bonded in μs.
第１図はチップと溶融接着する台金接着面のスエジグ、
セイパー加工断面とその加工装置図の１部を示す。
第１表 第２表
還元鉄溶液 還元コバルト溶液整水 ２００整
水 ２００
ＦｅＣＩａｓＨｚＯ５ＣＯＣｌ２６Ｈ２０５Ｆｅ（ＮＯ
３） ２ Ｃｏ（ＮＯ３）６Ｈ２０２，５ＣＩ２
２．５ ＣＩ２ ２．５
ＮＨ４０Ｈ５ＮＨ４ＯＨ５
第３表
無電解コバルト溶液
塩化コバルトＣＯＣｌ２６Ｈ２０３０９／１次亜りん酸
ナトリウム ２０９／（１くえん酸ナト
リウム ３５９／１１塩化アンモン
５０１／（ＩＰ Ｈ９，５
溶温 ００９５
手続補正１Figure 1 shows the sedge on the base metal bonding surface that is melt-bonded to the chip.
A part of the saper processing cross section and the processing equipment diagram are shown. Table 1 Table 2 Reduced iron solution Reduced cobalt solution water conditioning 200 water conditioning 200 FeCIasHzO5COCl26H205Fe(NO
3) 2Co(NO3)6H202,5CI2
2.5 CI2 2.5 NH40H5NH4OH5 Table 3 Electroless cobalt solution Cobalt chloride COCl26H20309/1 Sodium hypophosphite 209/(1 Sodium citrate 359/11 Ammonium chloride
501/(IP H9,5 Melting temperature 0095 Procedure amendment 1
Claims (3)
セイパー加工によって、接着するチップの帳面まで台金
接着面を押広げて接着面積を拡大にしてチップを強固に
台金に電流溶融接着をする方法。(1) Swaging the adhesive surface of the base metal to which the chip is attached.
A method in which the bonding surface of the base metal is expanded to the surface of the chip to be bonded using saper processing to expand the bonding area and the chip is firmly bonded to the base metal by current melting.
類の台金にチップを接着する前に、台金接着部分を金属
還元反応処理によって、酸化皮膜を取り除き炭化物の発
生を抑制させ、溶融接着を容易に接着する方法。(2) Before adhering the chip to the base metal of metal saws, tip saws, band saws, and hack saws, the part where the base metal is attached is subjected to a metal reduction reaction treatment to remove the oxide film and suppress the generation of carbides, making it easy to bond by melt bonding. how to.
に、周期率表第８族第１Ｂ族の該金属で、溶融接着瞬間
の熱変化を除ける範囲の単層復層の金属皮覆を施し鉄ク
ラッドチップにして台金と溶融接着をすることを特徴と
する方法。(3) On the base metal of cutlery and tools, the entire surface of the chip to be bonded is made of a metal from Group 8, Group 1B of the periodic table, and has a single-layer multi-layer metal coating in a range that excludes the thermal change at the moment of melt bonding. A method characterized by applying a covering to an iron clad chip and melt-bonding it to a base metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1634888A JPH01193129A (en) | 1988-01-26 | 1988-01-26 | Method for bonding tip on base metal of cutter or cutting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1634888A JPH01193129A (en) | 1988-01-26 | 1988-01-26 | Method for bonding tip on base metal of cutter or cutting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01193129A true JPH01193129A (en) | 1989-08-03 |
Family
ID=11913866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1634888A Pending JPH01193129A (en) | 1988-01-26 | 1988-01-26 | Method for bonding tip on base metal of cutter or cutting tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01193129A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023001018A (en) * | 2021-06-17 | 2023-01-04 | 株式会社オリジン | Chip manufacturing apparatus, chip manufacturing method, chip for cutting tool, and pedestal |
-
1988
- 1988-01-26 JP JP1634888A patent/JPH01193129A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023001018A (en) * | 2021-06-17 | 2023-01-04 | 株式会社オリジン | Chip manufacturing apparatus, chip manufacturing method, chip for cutting tool, and pedestal |
| WO2023190077A1 (en) * | 2021-06-17 | 2023-10-05 | 株式会社オリジン | Tip manufacturing device, tip manufacturing method, cutting tool tip, and pedestal |
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