JPH01192191A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH01192191A JPH01192191A JP1780988A JP1780988A JPH01192191A JP H01192191 A JPH01192191 A JP H01192191A JP 1780988 A JP1780988 A JP 1780988A JP 1780988 A JP1780988 A JP 1780988A JP H01192191 A JPH01192191 A JP H01192191A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- shielding
- hole
- wiring pattern
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 230000002238 attenuated effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はプリント配線基板における電子回路からの輻
射を遮蔽するシールド構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shield structure for shielding radiation from electronic circuits on a printed wiring board.
第4図は例えば実開昭61−192499号公報に示さ
れた従来の電子回路のシールド構造を示したものである
1図において(L)はIl!la物からなる基板、(5
)は基板(1)上に形成された配線パターン、(6)は
IC。FIG. 4 shows a conventional shielding structure of an electronic circuit as disclosed in, for example, Japanese Utility Model Application Publication No. 192499/1983. In FIG. 1, (L) is Il! A substrate made of la material, (5
) is a wiring pattern formed on the substrate (1), and (6) is an IC.
コンデンサ、抵抗等の電子部品であり、電子回路は基板
(1)、配線パターン(5)、電子部品(6)から構成
されている。α・は金属よりなる枠、aDは金属よりな
る上部カバー、(2)は金属よりなる下部カバーであり
、枠Q11 、上部カバー鶴及び下部カバー(2)でシ
ールド体を構成し、このシールド体が輻射源である電子
回路の外周を覆うことで輻射を遮蔽している。These are electronic components such as capacitors and resistors, and the electronic circuit is composed of a substrate (1), a wiring pattern (5), and an electronic component (6). α・ is a frame made of metal, aD is an upper cover made of metal, and (2) is a lower cover made of metal. The frame Q11, the upper cover crane, and the lower cover (2) constitute a shield body, and this shield body The radiation is shielded by covering the outer periphery of the electronic circuit that is the radiation source.
上記のような従来のシールド構造においては、プリント
配線基板の電子回路からの輻射が基準以下で許容される
場合においても、簡易なシールド構造がないためプリン
ト配線基板の外周を金属板等で覆う過剰なシールド構造
としていた。従ってシールド体を含む電子回路部分の外
形寸法、と(に厚み方向が大きくなり、またシールド体
が別部品で構成されるため構造が複雑となるといった課
題があった。In the conventional shielding structure as described above, even if the radiation from the electronic circuit of the printed wiring board is allowed below the standard, there is no simple shielding structure, so it is necessary to cover the outer periphery of the printed wiring board with metal plates, etc. It had a shield structure. Therefore, there were problems in that the external dimensions and thickness of the electronic circuit portion including the shield body became large, and the structure became complicated because the shield body was composed of separate parts.
この発明は上記課題を解決するためになされたもので、
シールド体を含む電子回路部分を簡素な構造で遮蔽でき
る構造を得ることを目的とする。This invention was made to solve the above problems,
The purpose is to obtain a structure that can shield an electronic circuit portion including a shield body with a simple structure.
この発明におけるプリント配線基板はプリント配線基板
に装着された電子部品間を接続し、電子回路を゛構成す
る配線パターンに鎖交するシールドパターンを設けたも
のである。The printed wiring board of the present invention is provided with a shield pattern that connects electronic components mounted on the printed wiring board and interlinks with a wiring pattern that constitutes an electronic circuit.
この発明においては、プリント配線基板上に設けられた
シールドパターンが電子回路から発する輻射を電磁誘導
作用により減衰させる。In this invention, a shield pattern provided on a printed wiring board attenuates radiation emitted from an electronic circuit by electromagnetic induction.
第1図はこの発明の一実施例を示す平面図、第2図は第
1図の線n −n、に沿う断面図である0図において(
1)は絶縁物からなる基板、(2)は基板(1)表面に
貼られた金属箔をエツチング等で必要部分を残し形成さ
れた網目状の表面シールドパターン。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along line n-n in FIG.
1) is a substrate made of an insulating material, and (2) is a mesh-like surface shield pattern formed by etching the metal foil pasted on the surface of the substrate (1), leaving the necessary parts.
(3)は基板(11の裏面に上記゛と同じ方法により表
面シールド(2)と平面投影方向にて左右、上下方向に
ずらして形成された網目状の裏面シールドパターン。(3) is a mesh-like back shield pattern formed on the back side of the substrate (11) by the same method as in the above (2) and shifted horizontally and vertically from the front shield (2) in the plane projection direction.
(4はシールドスルーホールであり両シールドパターン
+21. (31の平面投影にて重なる部分の数個所に
設けられた両シールドパターン+21.131間を導通
させるものである。(5)は上記両シールドパターン(
2)。(4 is a shield through hole, which connects both shield patterns +21. (21, 131) is provided at several places where they overlap in the planar projection of 31. (5) is a shield through hole that connects both shield patterns +21. pattern(
2).
(3)と同時に同じ方法で形成された配線パターンであ
り基板(ilの両面に所定の回路配線模様に形成されて
いる。(6)はIC,コンデンサ、低抗等の電子部品、
(7)は電子部品(6)の足(端子)が挿入され その
足を配線パターン(5)ヘハンダ等で接続すると共に基
板(1)へ固定するためのスルーホール、(8)は表面
の配線パターン(5)と裏面の配線パターン(5)を導
通させるスルーホールであり表面シールドパターン+2
1と裏面シールドパターン(3)をずらした中間に設け
られている。このスルーホール(8)と配線パターン(
5)を介して順次に別の網目にある電子ぽ品(6)に接
続して所定の電子回路が構成されている。(3) is a wiring pattern formed at the same time and using the same method, and is formed in a predetermined circuit wiring pattern on both sides of the substrate (IL).
(7) is a through hole into which the legs (terminals) of electronic component (6) are inserted, and the legs are connected to wiring pattern (5) with solder, etc., and fixed to the board (1), and (8) is the wiring on the surface. This is a through hole that connects the pattern (5) and the wiring pattern (5) on the back side, and is a front shield pattern +2
1 and the back shield pattern (3). This through hole (8) and the wiring pattern (
A predetermined electronic circuit is constructed by sequentially connecting to electronic components (6) in other meshes via the wires (5).
上記のように構成されたプリント配線基板において配線
パターン(5)及びスルーホール(8)を通ずる電流は
両シールドパターン+21. +31及びシールドスル
ーホール(4)で構成される閉回路の中を通過すること
になる。従って配線パターン(5)及びスルーホール(
Blを通ずる電流から発する輻射をこの閉回路が吸収し
減衰させることによりシールド効果を得ることができる
。In the printed wiring board configured as described above, the current passing through the wiring pattern (5) and the through hole (8) is both shield patterns +21. +31 and the shield through hole (4). Therefore, the wiring pattern (5) and the through hole (
A shielding effect can be obtained by absorbing and attenuating radiation emitted from the current flowing through Bl by this closed circuit.
第3図はこの発明の地の実施例を示す多層プリント配線
基板を用いた場合の断面図であり、図において(1)〜
(8)は上記一実施例にて説、明のものと同じであり、
(9)は、基板+11間に設けられた眉間配線パターン
であり複雑な回路構成の場合に用いられる。FIG. 3 is a cross-sectional view of a multilayer printed wiring board showing an embodiment of the present invention, and in the figure (1) to
(8) is the same as explained in the above embodiment,
(9) is a glabellar wiring pattern provided between the board +11, and is used in the case of a complicated circuit configuration.
該実施例においてもシールドパターン(21i3)及び
シールドスルーホール(4)は上記一実施例と同様のシ
ールド効果を得ることができる。Also in this embodiment, the shield pattern (21i3) and the shield through hole (4) can obtain the same shielding effect as in the above embodiment.
なお、上記一実施例においてシールドパターン12)、
(31の網目寸法と輻射周波数とのシールド効果の関
係は実験によれば綱目寸法 L +、 、= 40 鶴
。In addition, in the above embodiment, the shield pattern 12),
(According to experiments, the relationship between the shielding effect and the mesh size of 31 and the radiation frequency is as follows: L +, , = 40 Tsuru.
Lx””30日1周波数−3QOMHzの場合に5デシ
ベルの減衰であった。The attenuation was 5 dB in the case of Lx''30 days 1 frequency - 3QOMHz.
設けることによりシールド体を含む電子回路部を簡素な
構造で遮蔽するこ、とができる。By providing this, it is possible to shield the electronic circuit section including the shield body with a simple structure.
第1図はこの発明の一実施例を示す平面図、第2図は第
1図の線n−nに沿う断面図、第3図はこの発明の他の
実施例を示す断面図、第4図は従来のシールド構造を示
す断面図である。
図において、+11は基板、(2)は表面シールドパタ
ーン、(3)は裏面シー、ルドパターン、(5)は配線
パターン、(6)は電子部品である。
なお、各図中同一符号は同−又は相、当部分を示す。
第1図
第2図
第3図
第4図FIG. 1 is a plan view showing one embodiment of the present invention, FIG. 2 is a sectional view taken along line nn in FIG. 1, FIG. 3 is a sectional view showing another embodiment of the invention, and FIG. The figure is a sectional view showing a conventional shield structure. In the figure, +11 is a board, (2) is a front shield pattern, (3) is a back shield, a shield pattern, (5) is a wiring pattern, and (6) is an electronic component. Note that the same reference numerals in each figure indicate the same or corresponding parts. Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
子回路を構成する配線パターン、この配線パターンと鎖
交するシールドパターンを備えたことを特徴とするプリ
ント配線基板。A printed wiring board characterized by comprising a wiring pattern that connects electronic components mounted on the printed wiring board to form an electronic circuit, and a shield pattern that interlinks with the wiring pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1780988A JPH01192191A (en) | 1988-01-27 | 1988-01-27 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1780988A JPH01192191A (en) | 1988-01-27 | 1988-01-27 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01192191A true JPH01192191A (en) | 1989-08-02 |
Family
ID=11954056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1780988A Pending JPH01192191A (en) | 1988-01-27 | 1988-01-27 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01192191A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0470031A2 (en) * | 1990-08-02 | 1992-02-05 | International Business Machines Corporation | Circuit board EMI suppressor |
JPH0451584A (en) * | 1990-06-19 | 1992-02-20 | Fuji Electric Co Ltd | Printed wiring board |
-
1988
- 1988-01-27 JP JP1780988A patent/JPH01192191A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0451584A (en) * | 1990-06-19 | 1992-02-20 | Fuji Electric Co Ltd | Printed wiring board |
EP0470031A2 (en) * | 1990-08-02 | 1992-02-05 | International Business Machines Corporation | Circuit board EMI suppressor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH02198187A (en) | Printed wiring board | |
JPH04151899A (en) | Manufacture of electromagnetic wave shielded printed wiring boards | |
JP2516314Y2 (en) | Electromagnetic wave shield printed wiring board | |
JPH01192191A (en) | Printed wiring board | |
JP2741090B2 (en) | Printed board | |
JPH0864983A (en) | Shield case | |
JPS62154609A (en) | Printed coil | |
JPS6117323B2 (en) | ||
JPS6350101A (en) | Electric circuit | |
JPS6017914Y2 (en) | printed circuit board | |
JPH10294588A (en) | Shielding structure for high frequency circuit | |
JPH0621681A (en) | Electronic circuit device | |
JP2785502B2 (en) | Printed board | |
JP2986620B2 (en) | Electronic circuit device | |
JPH02279027A (en) | Radio transmitter-receiver | |
JPH03208366A (en) | Structure of hybrid integrated circuit part | |
JP2774183B2 (en) | Manufacturing method of electromagnetically shielded printed circuit board | |
JPH0287592A (en) | Printed wiring board | |
JPH05335771A (en) | Electromangetic wave shielding structure | |
JPH0287593A (en) | Printed wiring board | |
JPH021920Y2 (en) | ||
JPH058695Y2 (en) | ||
JPH07235796A (en) | High frequency circuit wherein multilayer substrate is used | |
JPH0632413B2 (en) | Electronic device housing structure | |
JPH05327271A (en) | Multilayer wiring board |