JPH01192191A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH01192191A
JPH01192191A JP1780988A JP1780988A JPH01192191A JP H01192191 A JPH01192191 A JP H01192191A JP 1780988 A JP1780988 A JP 1780988A JP 1780988 A JP1780988 A JP 1780988A JP H01192191 A JPH01192191 A JP H01192191A
Authority
JP
Japan
Prior art keywords
pattern
shielding
hole
wiring pattern
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1780988A
Other languages
Japanese (ja)
Inventor
Shigeo Tsuda
茂雄 津田
Keisuke Oda
啓介 小田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1780988A priority Critical patent/JPH01192191A/en
Publication of JPH01192191A publication Critical patent/JPH01192191A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a structure which is simple in structure and able to shield an electronic circuit section that includes a shielding body by a method wherein a printed wiring board connects electronic components mounted on it with each other and a shielding pattern is provided to be interlinked with a wiring pattern which composes an electronic circuit. CONSTITUTION:A through-hole 8, which electrically connects a front wiring pattern 5 with a rear wiring pattern 5, is provided half way between a front shielding pattern 2 and a rear shielding pattern 3 shifted from each other. Electronic components 6 disposed at meshes respectively are successively connected with each other through the intermediary of the through-hole 8 and the wiring pattern 5 so as to compose a required electronic circuit. Concerning the printed wiring board, a current flowing through the wiring pattern 5 and the through- hole 8 is made to flow through a closed circuit composed of both the shielding patterns 2 and 3 and a shielding through-hole 4. Therefore, the radiation generated from the current which flows through the wiring pattern 5 and the through- hole 8 is attenuated as being absorbed by the above closed circuit, and thus a shielding effect can be attained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はプリント配線基板における電子回路からの輻
射を遮蔽するシールド構造に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shield structure for shielding radiation from electronic circuits on a printed wiring board.

〔従来の技術〕[Conventional technology]

第4図は例えば実開昭61−192499号公報に示さ
れた従来の電子回路のシールド構造を示したものである
1図において(L)はIl!la物からなる基板、(5
)は基板(1)上に形成された配線パターン、(6)は
IC。
FIG. 4 shows a conventional shielding structure of an electronic circuit as disclosed in, for example, Japanese Utility Model Application Publication No. 192499/1983. In FIG. 1, (L) is Il! A substrate made of la material, (5
) is a wiring pattern formed on the substrate (1), and (6) is an IC.

コンデンサ、抵抗等の電子部品であり、電子回路は基板
(1)、配線パターン(5)、電子部品(6)から構成
されている。α・は金属よりなる枠、aDは金属よりな
る上部カバー、(2)は金属よりなる下部カバーであり
、枠Q11 、上部カバー鶴及び下部カバー(2)でシ
ールド体を構成し、このシールド体が輻射源である電子
回路の外周を覆うことで輻射を遮蔽している。
These are electronic components such as capacitors and resistors, and the electronic circuit is composed of a substrate (1), a wiring pattern (5), and an electronic component (6). α・ is a frame made of metal, aD is an upper cover made of metal, and (2) is a lower cover made of metal. The frame Q11, the upper cover crane, and the lower cover (2) constitute a shield body, and this shield body The radiation is shielded by covering the outer periphery of the electronic circuit that is the radiation source.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記のような従来のシールド構造においては、プリント
配線基板の電子回路からの輻射が基準以下で許容される
場合においても、簡易なシールド構造がないためプリン
ト配線基板の外周を金属板等で覆う過剰なシールド構造
としていた。従ってシールド体を含む電子回路部分の外
形寸法、と(に厚み方向が大きくなり、またシールド体
が別部品で構成されるため構造が複雑となるといった課
題があった。
In the conventional shielding structure as described above, even if the radiation from the electronic circuit of the printed wiring board is allowed below the standard, there is no simple shielding structure, so it is necessary to cover the outer periphery of the printed wiring board with metal plates, etc. It had a shield structure. Therefore, there were problems in that the external dimensions and thickness of the electronic circuit portion including the shield body became large, and the structure became complicated because the shield body was composed of separate parts.

この発明は上記課題を解決するためになされたもので、
シールド体を含む電子回路部分を簡素な構造で遮蔽でき
る構造を得ることを目的とする。
This invention was made to solve the above problems,
The purpose is to obtain a structure that can shield an electronic circuit portion including a shield body with a simple structure.

〔課題を解決するための手段〕[Means to solve the problem]

この発明におけるプリント配線基板はプリント配線基板
に装着された電子部品間を接続し、電子回路を゛構成す
る配線パターンに鎖交するシールドパターンを設けたも
のである。
The printed wiring board of the present invention is provided with a shield pattern that connects electronic components mounted on the printed wiring board and interlinks with a wiring pattern that constitutes an electronic circuit.

〔作 用〕[For production]

この発明においては、プリント配線基板上に設けられた
シールドパターンが電子回路から発する輻射を電磁誘導
作用により減衰させる。
In this invention, a shield pattern provided on a printed wiring board attenuates radiation emitted from an electronic circuit by electromagnetic induction.

〔実施例〕〔Example〕

第1図はこの発明の一実施例を示す平面図、第2図は第
1図の線n −n、に沿う断面図である0図において(
1)は絶縁物からなる基板、(2)は基板(1)表面に
貼られた金属箔をエツチング等で必要部分を残し形成さ
れた網目状の表面シールドパターン。
FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along line n-n in FIG.
1) is a substrate made of an insulating material, and (2) is a mesh-like surface shield pattern formed by etching the metal foil pasted on the surface of the substrate (1), leaving the necessary parts.

(3)は基板(11の裏面に上記゛と同じ方法により表
面シールド(2)と平面投影方向にて左右、上下方向に
ずらして形成された網目状の裏面シールドパターン。
(3) is a mesh-like back shield pattern formed on the back side of the substrate (11) by the same method as in the above (2) and shifted horizontally and vertically from the front shield (2) in the plane projection direction.

(4はシールドスルーホールであり両シールドパターン
+21. (31の平面投影にて重なる部分の数個所に
設けられた両シールドパターン+21.131間を導通
させるものである。(5)は上記両シールドパターン(
2)。
(4 is a shield through hole, which connects both shield patterns +21. (21, 131) is provided at several places where they overlap in the planar projection of 31. (5) is a shield through hole that connects both shield patterns +21. pattern(
2).

(3)と同時に同じ方法で形成された配線パターンであ
り基板(ilの両面に所定の回路配線模様に形成されて
いる。(6)はIC,コンデンサ、低抗等の電子部品、
(7)は電子部品(6)の足(端子)が挿入され その
足を配線パターン(5)ヘハンダ等で接続すると共に基
板(1)へ固定するためのスルーホール、(8)は表面
の配線パターン(5)と裏面の配線パターン(5)を導
通させるスルーホールであり表面シールドパターン+2
1と裏面シールドパターン(3)をずらした中間に設け
られている。このスルーホール(8)と配線パターン(
5)を介して順次に別の網目にある電子ぽ品(6)に接
続して所定の電子回路が構成されている。
(3) is a wiring pattern formed at the same time and using the same method, and is formed in a predetermined circuit wiring pattern on both sides of the substrate (IL).
(7) is a through hole into which the legs (terminals) of electronic component (6) are inserted, and the legs are connected to wiring pattern (5) with solder, etc., and fixed to the board (1), and (8) is the wiring on the surface. This is a through hole that connects the pattern (5) and the wiring pattern (5) on the back side, and is a front shield pattern +2
1 and the back shield pattern (3). This through hole (8) and the wiring pattern (
A predetermined electronic circuit is constructed by sequentially connecting to electronic components (6) in other meshes via the wires (5).

上記のように構成されたプリント配線基板において配線
パターン(5)及びスルーホール(8)を通ずる電流は
両シールドパターン+21. +31及びシールドスル
ーホール(4)で構成される閉回路の中を通過すること
になる。従って配線パターン(5)及びスルーホール(
Blを通ずる電流から発する輻射をこの閉回路が吸収し
減衰させることによりシールド効果を得ることができる
In the printed wiring board configured as described above, the current passing through the wiring pattern (5) and the through hole (8) is both shield patterns +21. +31 and the shield through hole (4). Therefore, the wiring pattern (5) and the through hole (
A shielding effect can be obtained by absorbing and attenuating radiation emitted from the current flowing through Bl by this closed circuit.

第3図はこの発明の地の実施例を示す多層プリント配線
基板を用いた場合の断面図であり、図において(1)〜
(8)は上記一実施例にて説、明のものと同じであり、
(9)は、基板+11間に設けられた眉間配線パターン
であり複雑な回路構成の場合に用いられる。
FIG. 3 is a cross-sectional view of a multilayer printed wiring board showing an embodiment of the present invention, and in the figure (1) to
(8) is the same as explained in the above embodiment,
(9) is a glabellar wiring pattern provided between the board +11, and is used in the case of a complicated circuit configuration.

該実施例においてもシールドパターン(21i3)及び
シールドスルーホール(4)は上記一実施例と同様のシ
ールド効果を得ることができる。
Also in this embodiment, the shield pattern (21i3) and the shield through hole (4) can obtain the same shielding effect as in the above embodiment.

なお、上記一実施例においてシールドパターン12)、
 (31の網目寸法と輻射周波数とのシールド効果の関
係は実験によれば綱目寸法 L +、 、= 40 鶴
In addition, in the above embodiment, the shield pattern 12),
(According to experiments, the relationship between the shielding effect and the mesh size of 31 and the radiation frequency is as follows: L +, , = 40 Tsuru.

Lx””30日1周波数−3QOMHzの場合に5デシ
ベルの減衰であった。
The attenuation was 5 dB in the case of Lx''30 days 1 frequency - 3QOMHz.

〔発明の効果〕〔Effect of the invention〕

設けることによりシールド体を含む電子回路部を簡素な
構造で遮蔽するこ、とができる。
By providing this, it is possible to shield the electronic circuit section including the shield body with a simple structure.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例を示す平面図、第2図は第
1図の線n−nに沿う断面図、第3図はこの発明の他の
実施例を示す断面図、第4図は従来のシールド構造を示
す断面図である。 図において、+11は基板、(2)は表面シールドパタ
ーン、(3)は裏面シー、ルドパターン、(5)は配線
パターン、(6)は電子部品である。 なお、各図中同一符号は同−又は相、当部分を示す。 第1図 第2図 第3図 第4図
FIG. 1 is a plan view showing one embodiment of the present invention, FIG. 2 is a sectional view taken along line nn in FIG. 1, FIG. 3 is a sectional view showing another embodiment of the invention, and FIG. The figure is a sectional view showing a conventional shield structure. In the figure, +11 is a board, (2) is a front shield pattern, (3) is a back shield, a shield pattern, (5) is a wiring pattern, and (6) is an electronic component. Note that the same reference numerals in each figure indicate the same or corresponding parts. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] プリント配線基板上へ装着された電子部品間を接続し電
子回路を構成する配線パターン、この配線パターンと鎖
交するシールドパターンを備えたことを特徴とするプリ
ント配線基板。
A printed wiring board characterized by comprising a wiring pattern that connects electronic components mounted on the printed wiring board to form an electronic circuit, and a shield pattern that interlinks with the wiring pattern.
JP1780988A 1988-01-27 1988-01-27 Printed wiring board Pending JPH01192191A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1780988A JPH01192191A (en) 1988-01-27 1988-01-27 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1780988A JPH01192191A (en) 1988-01-27 1988-01-27 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH01192191A true JPH01192191A (en) 1989-08-02

Family

ID=11954056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1780988A Pending JPH01192191A (en) 1988-01-27 1988-01-27 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH01192191A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0470031A2 (en) * 1990-08-02 1992-02-05 International Business Machines Corporation Circuit board EMI suppressor
JPH0451584A (en) * 1990-06-19 1992-02-20 Fuji Electric Co Ltd Printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0451584A (en) * 1990-06-19 1992-02-20 Fuji Electric Co Ltd Printed wiring board
EP0470031A2 (en) * 1990-08-02 1992-02-05 International Business Machines Corporation Circuit board EMI suppressor

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