JPH01189103A - Small-sized coil - Google Patents
Small-sized coilInfo
- Publication number
- JPH01189103A JPH01189103A JP1341588A JP1341588A JPH01189103A JP H01189103 A JPH01189103 A JP H01189103A JP 1341588 A JP1341588 A JP 1341588A JP 1341588 A JP1341588 A JP 1341588A JP H01189103 A JPH01189103 A JP H01189103A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- small
- copper foil
- reactance
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 16
- 239000011889 copper foil Substances 0.000 abstract description 16
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 241000252233 Cyprinus carpio Species 0.000 description 16
- 238000005530 etching Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241000270281 Coluber constrictor Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000218772 Zamia Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- OQZCSNDVOWYALR-UHFFFAOYSA-N flurochloridone Chemical compound FC(F)(F)C1=CC=CC(N2C(C(Cl)C(CCl)C2)=O)=C1 OQZCSNDVOWYALR-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品に用いる小型コイμに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a small carp μ used for electronic components.
従来の技術
近年、民生用、産業用を問わず、電子・電気機器の小型
化が進み、それらの部品として用いられるコイルの小型
化も同様に進んでいる。BACKGROUND OF THE INVENTION In recent years, electronic and electrical equipment, both consumer and industrial, have become smaller and smaller, and the coils used as their components have also become smaller.
以下図面を参照しながら、従来の小型コイルの一例につ
いて説明する。An example of a conventional small coil will be described below with reference to the drawings.
第４図（ａ）お工び（ｂｌは最も広く用いられている従
来の小型コイ〜の一例を示す正面図お工び平面図・第５
図は第４図（ｂ）のＢ−Ｂ断面図で、一般に小型平面コ
イμと呼ばれるものである。この小型コイμはセラミッ
ク基板まｔはガヲスエポキン基板すどの基板１１の上に
接合されｔ約０．１ｍ〜１．０ｎ程度の厚さを有する銅
箔にコイ／ｌ／１２が形成されている。一般にコイ／Ｌ
’１２の形成は、コイ／ｌ／１２の形状に沿りて銅箔上
にレジストを塗布し、不用部分、の銅箔をエツチングに
より除去することに工り行なわれている。Figure 4 (a) A front view showing an example of the conventional small carp (bl is the most widely used small carp).
The figure is a sectional view taken along line BB in FIG. 4(b), and is generally called a small flat carp μ. This small carp μ is bonded onto a substrate 11 such as a ceramic substrate or a glass epoxy substrate, and a coil/l/12 is formed on a copper foil having a thickness of approximately 0.1 m to 1.0 nm. Generally carp/L
The '12 is formed by applying a resist onto the copper foil along the shape of the coil/l/12, and removing unnecessary portions of the copper foil by etching.
発明が解決しようとするａ題
しかしながら上記の１うな構成の小型コイルでＦｉ、第
５図に示すように、コイル１２を形成する銅箔と基板１
１の接合部近傍にエツチングによるアンダーカット１３
が生じ、またコイル表面のエツジにはだれ１４が生じる
。これらのアンダーカット１３お工びだれ１４が、コイ
μのリアクタンスの設計値からのずれを生ぜしめ、厳し
い精度の要求される電子・電気機器にはコイ／Ｌ’ｉ選
定して適用しなければならなくなるほどの問題を有して
いｔ０本発明は上記問題を解決するもので、リアクタン
スの設計値に対する誤差の少ない、まｔ製造上のコスト
も従来のものに対して低減できる小型コイ／Ｌ／ｌＷ供
することを目的とするものである。Problem to be Solved by the Invention However, in a small coil having the above-mentioned structure, as shown in FIG.
Undercut 13 by etching near the joint of 1
, and droops 14 are formed on the edges of the coil surface. These undercuts 13 and slits 14 cause the reactance of the carp μ to deviate from the design value, and the carp/L'i must be selected and applied to electronic and electrical equipment that requires strict precision. The present invention solves the above-mentioned problems, and provides a small coil/L/L/L with less error in the reactance design value, and which can reduce manufacturing costs compared to conventional ones. The purpose is to provide IW.
ａＭを解決するｔめの手段
上記問題を解決するｔめに本発明の小型コイルは、コイ
〃の形状を形成した金属箔を積層したものである。さら
に、金属箔のコイル形状の形成はパルスレーザ−を用い
て行うものである。A third means for solving aM In order to solve the above-mentioned problem, the small coil of the present invention is made by laminating metal foils in the shape of a carp. Furthermore, the formation of the coil shape of the metal foil is performed using a pulsed laser.
作用
上記構成により、エツチングの過程で生じるアンダーカ
ットおよびエツジのだれが無くなり、それに１ってコイ
ルのりアクタンスの設計［カラのずれを無くさしめるこ
とができる。まｔ１パｐスレーザーを用いてコイルの形
状を形成することにｊり、コイルの量産性を向上させる
ことができる。Effect: The above configuration eliminates undercuts and edge sagging that occur during the etching process, and also eliminates misalignment of the coil adhesive actance. Also, by forming the shape of the coil using a t1 pulse laser, mass productivity of the coil can be improved.
実施例
以下、本発明の実施例の小型コイルについて、図面を参
照しながら説明する。Embodiments Hereinafter, small coils according to embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）およびｆｂ）は本発明の一実施例における
小型コイρの正面図および平面図である。第１図（ａｌ
に示す工うに、この小型コイ／Ｌ／１はコイル形状（Ｄ
Ｊ＜ターン全形成した薄い銅箔１ａを積層して平面状に
構成したものである。第２図は第１図（ｂ）のＡ−Ａ断
面図を示し、銅箔１ａをｍ層するという構成のため、コ
イル１のエツジのだれなどは生じていない。FIGS. 1(a) and fb) are a front view and a plan view of a small carp ρ in an embodiment of the present invention. Figure 1 (al
As shown in the figure, this small carp/L/1 has a coil shape (D
The thin copper foil 1a with all J< turns formed thereon is laminated to form a planar structure. FIG. 2 shows a sectional view taken along the line A-A in FIG. 1(b), and because of the configuration of m layers of copper foil 1a, the edges of the coil 1 do not sag.
第３図は、銅箔１ａにコイｌｖ１のパターンを形成する
方法を説明する図である。銅箔テープ７はロー／Ｌ’２
Ａ、２Ｂに巻かれ、巻取り側から巻出し側へと移動され
る。このとき、銅箔テープ７の直上に位置したマスク３
全通してパルスレーザ−ビームＸを照射して銅箔テープ
７の不要部分を除去することに工り銅箔テープ７にコイ
ルのパターン形成する。４はパルスレーザ−全発生する
レーザー発振器、５はコリメーター、６はミラーである
。ノー４−発振器４は銅箔の加工においてはＮｄ ：
ＹＡＧレーサーの２次高周波を発生するものであれば好
適であるが、特にそれには限定されない。また、ｌｉ４
箔テープ７のコイルパターンはパターン毎に切断されて
積層され、平面状のコイｉＶ１に形成される。FIG. 3 is a diagram illustrating a method of forming a pattern of coil lv1 on copper foil 1a. Copper foil tape 7 is low/L'2
A and 2B are wound and moved from the winding side to the unwinding side. At this time, the mask 3 located directly above the copper foil tape 7
A coil pattern is formed on the copper foil tape 7 by irradiating the entire copper foil tape 7 with a pulsed laser beam X to remove unnecessary portions of the copper foil tape 7. 4 is a pulse laser - a laser oscillator that generates all of the lights, 5 is a collimator, and 6 is a mirror. No. 4 - Oscillator 4 is Nd when processing copper foil:
Any device that generates the secondary high frequency of a YAG racer is suitable, but is not particularly limited thereto. Also, li4
The coil pattern of the foil tape 7 is cut into patterns and laminated to form a planar coil iV1.
このように、コイルパターンを形成しｆ 銅ｆｆ３１ａ
を８Ｉ層するという構成をとることにより、アンダーカ
ットやエツジのだれによるコイル１のリアクタンスの設
計値からのずれを無くすことができる。In this way, a coil pattern is formed.
By adopting the configuration of 8I layers, it is possible to eliminate deviations of the reactance of the coil 1 from the designed value due to undercuts and drooping edges.
まｔ、積層枚数を加減することに工ってもコイル１のリ
アクタンスを容易に調整できる。Furthermore, the reactance of the coil 1 can be easily adjusted by adjusting the number of laminated layers.
さらに、コイμｍのパターン形成にパルスレーザ−を用
いているので、コイ／１／ｌの量産性を上げるには、銅
箔チーグアの移動速度およびパルスレーザ−の照射の繰
り返し速度を上げればよく、従来のエツチングによる方
法エリはるかに容易かつ安価に対応できるｔめ、コスト
低減が可能である。Furthermore, since a pulsed laser is used to form the carp μm pattern, in order to increase the mass productivity of carp/1/l, it is only necessary to increase the moving speed of the copper foil Chigua and the repetition rate of pulsed laser irradiation. The cost can be reduced because the conventional etching method can be applied much more easily and inexpensively.
発明の効果
以上のように本発明によれば、コイμの形状を形成し７
を金属＠を積層する構成とじｔので、コイルのりアクタ
ンスの設計値に対して誤差の少ない小型コイ／Ｉ／を提
供することができるものである。Effects of the Invention As described above, according to the present invention, the shape of the carp μ is formed.
Since the structure is such that metals are laminated, it is possible to provide a small coil /I/ with a small error in the design value of the coil paste actance.
さらに、金属箔のコイルの形状め形成にパルスレーザ−
を用いることにエリ量産性を向上でき、小型コイ／Ｌ’
を安価に製作することができる。Furthermore, pulsed lasers are used to form the shape of metal foil coils.
By using small carp/L', mass productivity can be improved.
can be manufactured at low cost.
第１図（ａｌおよび（ｂ）は、本発明の一実施例におけ
る小型コイルの正面図および平面図、第２図は第１図（
ｂｌのＡ−Ａ断面図、第３図は本発明の一実施例におけ
るパルスレーザ−を用いｔ金属箔のコイルの形状の形成
方法を説明する図、第４図ｆａｌおよび（ｂ）は従来の
小型コイμの正面図および平面図、第５図は第４図（ｂ
ｌのＢ−Ｂ断面図である。
１・・・コイル％１ａ・・・銅箔、２Ａ、２Ｂ・・・ロ
ール、３・・・マスク、４・・・バμス発振器。
代理人 森 本 義 弘
第１図
」ｌＩ■ｌ蜀ａ
第３図
ＺＡ、２Ｂ−〇−ル
３°゛°マスク
４四Ｖルス弁垢器Figures 1 (al and b) are a front view and a plan view of a small coil in an embodiment of the present invention, and Figure 2 is a figure 1 (al).
FIG. 3 is a diagram illustrating a method of forming a coil shape of metal foil using a pulsed laser according to an embodiment of the present invention, and FIG. The front view and plan view of the small carp μ, FIG.
It is a BB sectional view of l. 1...Coil %1a...Copper foil, 2A, 2B...Roll, 3...Mask, 4...Bus oscillator. Agent Yoshihiro Morimoto Figure 1'' lI ■ l Shu a Figure 3 ZA, 2B-〇-ru 3°゛° Mask 44V Rus valve holder
Claims (1)
コイル。 ２ パルスレーザーを用いてコイルの形状を形成した金
属箔を積層してなる小型コイル。1. A small coil made by laminating metal foils shaped like a coil. 2. A small coil made by laminating metal foil that has been shaped into a coil using a pulsed laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1341588A JPH01189103A (en) | 1988-01-22 | 1988-01-22 | Small-sized coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1341588A JPH01189103A (en) | 1988-01-22 | 1988-01-22 | Small-sized coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01189103A true JPH01189103A (en) | 1989-07-28 |
Family
ID=11832501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1341588A Pending JPH01189103A (en) | 1988-01-22 | 1988-01-22 | Small-sized coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01189103A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111566894A (en) * | 2018-05-25 | 2020-08-21 | Oppo广东移动通信有限公司 | Wireless charging receiving device and mobile terminal |
| CN111566889A (en) * | 2018-05-25 | 2020-08-21 | Oppo广东移动通信有限公司 | Wireless charging receiving device and mobile terminal |
| US10896145B2 (en) | 2011-12-30 | 2021-01-19 | Bedrock Automation Platforms Inc. | Communications control system with a serial communications interface and a parallel communications interface |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60258911A (en) * | 1984-06-05 | 1985-12-20 | Fuji Xerox Co Ltd | Winding method of transformer |
| JPS6373606A (en) * | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | Manufacture of thick film inductor |
-
1988
- 1988-01-22 JP JP1341588A patent/JPH01189103A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60258911A (en) * | 1984-06-05 | 1985-12-20 | Fuji Xerox Co Ltd | Winding method of transformer |
| JPS6373606A (en) * | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | Manufacture of thick film inductor |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10896145B2 (en) | 2011-12-30 | 2021-01-19 | Bedrock Automation Platforms Inc. | Communications control system with a serial communications interface and a parallel communications interface |
| CN111566894A (en) * | 2018-05-25 | 2020-08-21 | Oppo广东移动通信有限公司 | Wireless charging receiving device and mobile terminal |
| CN111566889A (en) * | 2018-05-25 | 2020-08-21 | Oppo广东移动通信有限公司 | Wireless charging receiving device and mobile terminal |
| CN111566894B (en) * | 2018-05-25 | 2023-06-02 | Oppo广东移动通信有限公司 | Wireless charging receiving device and mobile terminal |
| CN111566889B (en) * | 2018-05-25 | 2024-02-02 | Oppo广东移动通信有限公司 | Wireless charging receiving device and mobile terminal |
| US11949275B2 (en) | 2018-05-25 | 2024-04-02 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Wireless power reception apparatus and mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4328411A (en) | Cutting amorphous metal by crystallization with a laser or electron beam | |
| US6649864B2 (en) | Method of laser drilling | |
| US5933218A (en) | Laser beam machining apparatus | |
| JPS6263487A (en) | Manufacturing plane electric circuit | |
| CA1124341A (en) | Metallized film capacitor and method of manufacture | |
| WO2004014595A1 (en) | Laser processing device, processing method, and method of producing circuit substrate using the method | |
| JP2007167957A (en) | Method of forming via hole using laser beam | |
| JP7289162B2 (en) | Processing method of microholes in the upper mold for laminating thin film sheets using femtosecond laser | |
| CN107378274A (en) | A kind of laser boring method | |
| JPH01189103A (en) | Small-sized coil | |
| JPH07193375A (en) | Method of processing ceramic green sheet with film | |
| JPH07109836B2 (en) | How to make a tape carrier | |
| JPH11121900A (en) | Production of circuit board | |
| KR100434072B1 (en) | Through hole forming method of pcb using laser | |
| JPH05315178A (en) | Manufacture of thin coil | |
| JPH01178390A (en) | Manufacture of clad sheet | |
| JPS62131419A (en) | Metallized film whose coating metal layer is locally removedand manufacture of the same | |
| JPS60254406A (en) | Thin-film magnetic head | |
| JP4333172B2 (en) | Laser processing apparatus and laser processing method | |
| JPH07142255A (en) | Multilayer coil and its manufacture | |
| JPH09266234A (en) | Tape carrier manufacturing method | |
| JPH02129906A (en) | Manufacture of film capacitor | |
| JPS62115798A (en) | Manufacture of flexible printed circuit | |
| De Silva et al. | The fabrication of foil masks using laser cutting | |
| JPS61251006A (en) | Manufacture of printed coil |