JPH0118575B2 - - Google Patents

Info

Publication number
JPH0118575B2
JPH0118575B2 JP60142458A JP14245885A JPH0118575B2 JP H0118575 B2 JPH0118575 B2 JP H0118575B2 JP 60142458 A JP60142458 A JP 60142458A JP 14245885 A JP14245885 A JP 14245885A JP H0118575 B2 JPH0118575 B2 JP H0118575B2
Authority
JP
Japan
Prior art keywords
film
silicon
protective film
silicon film
reference example
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60142458A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6175513A (ja
Inventor
Tadashi Saito
Nobuo Kodera
Shigekazu Minagawa
Takashi Tokuyama
Takao Myazaki
Haruo Ito
Hiroshi Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60142458A priority Critical patent/JPS6175513A/ja
Publication of JPS6175513A publication Critical patent/JPS6175513A/ja
Publication of JPH0118575B2 publication Critical patent/JPH0118575B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2921Materials being crystalline insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth

Landscapes

  • Recrystallisation Techniques (AREA)
JP60142458A 1985-07-01 1985-07-01 シリコン結晶膜の製造方法 Granted JPS6175513A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60142458A JPS6175513A (ja) 1985-07-01 1985-07-01 シリコン結晶膜の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60142458A JPS6175513A (ja) 1985-07-01 1985-07-01 シリコン結晶膜の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12331375A Division JPS6046539B2 (ja) 1975-10-15 1975-10-15 シリコン結晶膜の製造方法

Publications (2)

Publication Number Publication Date
JPS6175513A JPS6175513A (ja) 1986-04-17
JPH0118575B2 true JPH0118575B2 (enFirst) 1989-04-06

Family

ID=15315783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60142458A Granted JPS6175513A (ja) 1985-07-01 1985-07-01 シリコン結晶膜の製造方法

Country Status (1)

Country Link
JP (1) JPS6175513A (enFirst)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5123975A (en) * 1989-03-28 1992-06-23 Ricoh Company, Ltd. Single crystal silicon substrate
US8633483B2 (en) * 2007-06-26 2014-01-21 Massachusetts Institute Of Technology Recrystallization of semiconductor wafers in a thin film capsule and related processes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4843423A (enFirst) * 1971-10-04 1973-06-23
BE789904A (fr) * 1971-10-12 1973-04-10 Wellcome Found Procedes de synthese organique

Also Published As

Publication number Publication date
JPS6175513A (ja) 1986-04-17

Similar Documents

Publication Publication Date Title
US3341361A (en) Process for providing a silicon sheet
JPS6046539B2 (ja) シリコン結晶膜の製造方法
JPH0118575B2 (enFirst)
JP3657036B2 (ja) 炭化ケイ素薄膜および炭化ケイ素薄膜積層基板の製造方法
US4128681A (en) Method for producing an InSb thin film element
JP2708559B2 (ja) 結晶性半導体膜の形成方法
US6951585B2 (en) Liquid-phase growth method and liquid-phase growth apparatus
US6794274B2 (en) Method for fabricating a polycrystalline silicon film
JP2532252B2 (ja) Soi基板の製造方法
JP4142931B2 (ja) 粒状シリコン結晶の製造装置および製造方法
JP3851416B2 (ja) 結晶シリコン膜の製法
JPH101392A (ja) 結晶シリコン薄膜の形成方法
JPS5928326A (ja) 3次元集積回路部材の製造方法
JPH0354819A (ja) Soi基板の製造方法
JPS63184319A (ja) 単結晶薄膜の形成方法
JPH03116924A (ja) 単結晶半導体薄膜の製造方法
JP2000306915A (ja) シリコンウエハの製造方法
JPH02105517A (ja) 半導体装置の製造方法
JPS6341210B2 (enFirst)
JPH0562898A (ja) 単結晶膜の製造方法
JPS6152971B2 (enFirst)
JPH0746683B2 (ja) 半導体装置の製造方法
JPS6126598A (ja) ゲルマニウム薄膜結晶の製造方法
JPS5932437B2 (ja) 帯状シリコン結晶の製造装置
JPS6126211A (ja) 半導体結晶成長方法