JPH01185369A - Thermosetting resin molding material - Google Patents
Thermosetting resin molding materialInfo
- Publication number
- JPH01185369A JPH01185369A JP800188A JP800188A JPH01185369A JP H01185369 A JPH01185369 A JP H01185369A JP 800188 A JP800188 A JP 800188A JP 800188 A JP800188 A JP 800188A JP H01185369 A JPH01185369 A JP H01185369A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- molding material
- resin molding
- filler
- talc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 title claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 17
- 239000012778 molding material Substances 0.000 title claims description 16
- 239000000454 talc Substances 0.000 claims abstract description 14
- 229910052623 talc Inorganic materials 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000003086 colorant Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000006082 mold release agent Substances 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気部品、電子部品等に用いられる熱硬化性樹
脂成形材料に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermosetting resin molding material used for electrical parts, electronic parts, etc.
最近の電気部品、電子部品はファイン化のため使用中の
信頼性が強く要求される。このため成形材料の高純度が
必要で、充填剤としても高純度化しやすいシリカ、タル
クが用いられている。Recent electrical and electronic components are becoming increasingly finer and require greater reliability during use. For this reason, a high purity molding material is required, and silica and talc, which are easily purified, are used as fillers.
従来の技術で述べたもののうち、シリカについては高硬
度のため製造設備の摩耗が大で、摩耗による鉄分の混入
という問題が発生し、タルクについては成形品強度が低
下するという問題があった本発明は従来の技術における
上述の問題点に鑑みてなされたもので、その目的とする
ところは、高純度、高強度の成形品が得られる熱硬化性
樹脂成形材料を提供することにある。Among the technologies mentioned in the conventional technology section, silica has a high hardness that causes a lot of wear on manufacturing equipment, leading to the problem of iron contamination due to wear, and talc has the problem of reducing the strength of molded products. The invention was made in view of the above-mentioned problems in the prior art, and its purpose is to provide a thermosetting resin molding material from which molded products with high purity and high strength can be obtained.
本発明はフェノール樹脂に対し、充填剤、離型剤、着色
剤及び必要に応じて硬化剤等を添加してなる熱硬化性樹
脂成形材料において、充填剤として９００’Ｑ以上で焼
成した焼成タルクを含有したことを特徴とする熱硬化性
樹脂成形材料のため、上記目的を達成することができた
もので、以下本発明の詳細な説明する。The present invention is a thermosetting resin molding material prepared by adding a filler, a mold release agent, a coloring agent, a curing agent, etc. to a phenolic resin, and the present invention is a thermosetting resin molding material prepared by adding a filler, a mold release agent, a coloring agent, and if necessary a hardening agent. Since the thermosetting resin molding material is characterized by containing the following, the above object can be achieved, and the present invention will be described in detail below.
本発明に用いる焼成タルクは、従来のタルクと異なり９
００”Ｃ以上で焼成した焼成タルクであることが必要で
ある。即ち焼成温度が９００°Ｃ未満では成形品の強度
が向上しないためである。焼成温度は９００℃以上が必
要であるが、好ましくは９００〜１３５０°Ｃで焼成す
ることが焼成タルクの強度、粉砕のバランスの点でよく
望ましい。焼成タルクの添加量は好ましくは全量の１０
〜９０重厘％ｃ以下単に％と記す）であることが望まし
い。即ち１０％未満では高純度が達成しがたく、９０％
を こえると強度が低下する傾向にあるからである。更
に焼成タルクの平均粒径はｌミクロ、ン程度であること
が分散性、成形品外観の点でよく望ましいことである。The calcined talc used in the present invention differs from conventional talc in that
It is necessary that the calcined talc is fired at 00"C or higher. That is, if the firing temperature is less than 900°C, the strength of the molded product will not improve. The firing temperature must be 900°C or higher, but it is preferable. It is desirable to calcinate at 900 to 1350°C in terms of the strength of the calcined talc and the balance of pulverization.The amount of calcined talc added is preferably 10% of the total amount.
It is desirable that the amount is 90% by weight or less (simply written as %). That is, if it is less than 10%, it is difficult to achieve high purity;
This is because the strength tends to decrease when it exceeds . Furthermore, it is desirable that the average particle size of the calcined talc be on the order of 1 micron to 100 nm in terms of dispersibility and appearance of the molded product.
焼成タルク以外の充填剤として木粉、パルプ、炭酸カル
シウム、クレー、タルク、シリカ、ガフス繊維、布チッ
プ、石膏、水酸化アルミニウム等を添加することもでき
る。熱硬化性樹脂としてはフェノール樹脂、メラミン樹
脂、エポキシ樹脂、不飽和ポリエステル樹脂等の熱硬化
性樹脂全般であるが特にフェノール樹脂が好ましい。フ
ェノール樹脂トしては、フェノール、クレゾール、キシ
レノール等のフェノール類の単独、混合物か＋３＋
らなるフェノール樹脂、更にはフェノールと相溶性のあ
るナフタリン、糖蜜、エポキシ、メラミン等による変性
フェノール樹脂であってもよく、更にはノボラック型フ
ェノール樹脂、レゾール型フェノール樹脂の各れであっ
てもよく任意である。As fillers other than calcined talc, wood flour, pulp, calcium carbonate, clay, talc, silica, gaff fibers, cloth chips, gypsum, aluminum hydroxide, etc. can also be added. The thermosetting resin includes all thermosetting resins such as phenol resin, melamine resin, epoxy resin, and unsaturated polyester resin, but phenol resin is particularly preferred. Examples of phenolic resins include phenolic resins consisting of phenols such as phenol, cresol, and xylenol, either singly or as a mixture, as well as phenolic resins modified with naphthalene, molasses, epoxy, melamine, etc., which are compatible with phenol. It is also possible to use either a novolak type phenol resin or a resol type phenol resin.
熱硬化性樹脂、充填剤以外の添加剤としては、金属石鹸
、ステアリン酸等の離型剤や着色剤、更には必要に応じ
てヘキサミン等の硬化剤や界面活性剤等を添加し混合、
混線、粉砕し、必要に応じて造粒して熱硬化性樹脂成形
材料を得るものである。Additives other than the thermosetting resin and filler include metal soap, mold release agents such as stearic acid, coloring agents, and if necessary, hardening agents such as hexamine and surfactants, etc., and mix.
A thermosetting resin molding material is obtained by mixing, pulverizing, and granulating if necessary.
得られた成形材料は直圧成形、トフンスファー成形、射
出成形、更には注型等によって成形され成形品を得るこ
とができるものである。The obtained molding material can be molded by direct pressure molding, tofusfer molding, injection molding, casting, etc. to obtain a molded product.
実施例１乃至３と比較例１及び２ 以下本発明を実施例にもとづいて説明する。Examples 1 to 3 and Comparative Examples 1 and 2 The present invention will be explained below based on examples.
第１表の配合物を混合、混練、粉砕してフェノール樹脂
成形材料を得、該成形材料を成形圧力３００ ｋｇ／ｃ
ｄ 、 １６５ ”Ｃで３分間直圧成形して成形品を得
た。A phenolic resin molding material was obtained by mixing, kneading, and pulverizing the compounds shown in Table 1, and the molding material was molded at a molding pressure of 300 kg/c.
d. Direct pressure molding was performed at 165"C for 3 minutes to obtain a molded product.
ｉ ４ ）
第 １ 表
実施例１乃至３と比較例１及び２の成形品の強度、塩素
イオン濃度等は第２表のようである。i4) Table 1 The strength, chloride ion concentration, etc. of the molded products of Examples 1 to 3 and Comparative Examples 1 and 2 are as shown in Table 2.
第 ２ 表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する熱硬化性樹脂成形材料に
おいては高強度、高純度性が向上する結果を有している
。Table 2 [Effects of the Invention] The present invention is constructed as described above. The thermosetting resin molding material having the structure described in claim 1 has improved high strength and high purity.
又、特許請求の範囲第２項に記載した構成を有する熱硬
化性樹脂成形材料においては、高強度、高純度性が著る
しく向上する結果を有している。Further, in the thermosetting resin molding material having the structure described in claim 2, high strength and high purity are significantly improved.
Claims (2)
び必要に応じて硬化剤等を添加してなる熱硬化性樹脂成
形材料において、充填剤として９００℃以上で焼成した
焼成タルクを含有したことを特徴とする熱硬化性樹脂成
形材料。(1) A thermosetting resin molding material prepared by adding a filler, a mold release agent, a coloring agent, a curing agent, etc. as necessary to a thermosetting resin, which is baked at 900°C or higher as a filler. A thermosetting resin molding material characterized by containing talc.
ことを特徴とする特許請求の範囲第１項記載の熱硬化性
樹脂成形材料。(2) The thermosetting resin molding material according to claim 1, wherein the amount of calcined talc is 10 to 90% by weight of the total amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP800188A JPH01185369A (en) | 1988-01-18 | 1988-01-18 | Thermosetting resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP800188A JPH01185369A (en) | 1988-01-18 | 1988-01-18 | Thermosetting resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01185369A true JPH01185369A (en) | 1989-07-24 |
Family
ID=11681141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP800188A Pending JPH01185369A (en) | 1988-01-18 | 1988-01-18 | Thermosetting resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01185369A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011168013A (en) * | 2010-02-22 | 2011-09-01 | Toppan Printing Co Ltd | Thermal transfer recording medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5213537A (en) * | 1975-07-22 | 1977-02-01 | Mitsubishi Plastics Ind Ltd | Preparation of plastic molding composition with improved dimensional r estoration |
| JPS55109216A (en) * | 1979-02-09 | 1980-08-22 | Kanegafuchi Chem Ind Co Ltd | Talc as synthetic resin filler and preparing the same |
| JPS58215434A (en) * | 1982-05-28 | 1983-12-14 | ローヌ―プーラン・シミ | Forming composition based on polymer reinforced with mineral filler, manufacture, means for carrying out same and formed articles therefrom |
-
1988
- 1988-01-18 JP JP800188A patent/JPH01185369A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5213537A (en) * | 1975-07-22 | 1977-02-01 | Mitsubishi Plastics Ind Ltd | Preparation of plastic molding composition with improved dimensional r estoration |
| JPS55109216A (en) * | 1979-02-09 | 1980-08-22 | Kanegafuchi Chem Ind Co Ltd | Talc as synthetic resin filler and preparing the same |
| JPS58215434A (en) * | 1982-05-28 | 1983-12-14 | ローヌ―プーラン・シミ | Forming composition based on polymer reinforced with mineral filler, manufacture, means for carrying out same and formed articles therefrom |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011168013A (en) * | 2010-02-22 | 2011-09-01 | Toppan Printing Co Ltd | Thermal transfer recording medium |
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