JPH0269509A - Molding material of phenolic resin - Google Patents
Molding material of phenolic resinInfo
- Publication number
- JPH0269509A JPH0269509A JP22103988A JP22103988A JPH0269509A JP H0269509 A JPH0269509 A JP H0269509A JP 22103988 A JP22103988 A JP 22103988A JP 22103988 A JP22103988 A JP 22103988A JP H0269509 A JPH0269509 A JP H0269509A
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- parts
- phenolic resin
- inorganic filler
- graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 title claims abstract description 10
- 239000005011 phenolic resin Substances 0.000 title claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims description 8
- 229920001568 phenolic resin Polymers 0.000 title claims description 8
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000010439 graphite Substances 0.000 claims abstract description 5
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 5
- 239000011324 bead Substances 0.000 abstract description 2
- 238000004891 communication Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000010451 perlite Substances 0.000 abstract description 2
- 235000019362 perlite Nutrition 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000005350 fused silica glass Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 239000012784 inorganic fiber Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、通信機器、車輛船舶部品
、工業用品、特に軸受部やスラストワッシャ等の摺動部
品用成形品に用いられるフェノール樹脂成形材料に関す
るものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is used for electronic equipment, electrical equipment, communication equipment, vehicle and ship parts, industrial products, especially molded products for sliding parts such as bearings and thrust washers. This invention relates to phenolic resin molding materials.
フェノール樹脂成形材料はその優れた耐熱性、高強度性
で車輛船舶部品、工業用品等に広く用いられて込るが、
軸受部やスラストワッシャー等の摺動部品に用いる場合
は耐熱性、高強度性を更に向上させるため特願昭５９−
２３６１４号に見られるように多量の無機繊維を含有さ
せてｂた。しかし多量の無機繊維の添加は摩擦係数が大
となり耐摩耗性を低下させる欠点があった。Phenol resin molding materials are widely used for vehicle and ship parts, industrial products, etc. due to their excellent heat resistance and high strength.
When used in sliding parts such as bearings and thrust washers, a patent application filed in 1983 was applied to further improve heat resistance and high strength.
As seen in No. 23614, a large amount of inorganic fiber was included. However, the addition of a large amount of inorganic fibers has the disadvantage of increasing the friction coefficient and reducing wear resistance.
従来の技術で述べたように、多量の無機繊維を含有させ
ると、耐熱性、高強度性は向上するが耐摩耗性が低下す
るとＡう問題があった。本発明は従来の技術における上
述の問題点に鑑みてなされたもので、その目的とすると
ころは耐熱性、高強度性は維持した上で耐摩耗性に優れ
た成形品が寿られるフェノール樹脂成形材料を提供する
ことにある。As described in the prior art, when a large amount of inorganic fiber is contained, heat resistance and high strength are improved, but there is a problem in that abrasion resistance is decreased. The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to mold phenolic resin into molded products with excellent wear resistance while maintaining heat resistance and high strength. The purpose is to provide materials.
本発明は黒鉛と粒状無機質充填剤とを含有したことを特
徴とするフェノール樹脂成形材料であるため、耐摩耗性
を向上させることができたもので、以下本発明の詳細な
説明する。The present invention is a phenolic resin molding material characterized by containing graphite and a granular inorganic filler, and thus has improved wear resistance.The present invention will be described in detail below.
本発明に用いる黒鉛の種類は特に限定するものではな−
か、添加量は全量に対し５〜５０亀量％（以下坦にチと
記す）であることか好ましｂ０即ち５優未満では耐摩耗
性を向上し難く、５０憾をこえると袋度が低下する傾向
にあるからである。球状無機質充填剤としては、ガラス
ピーズ、溶融Ｖリカ、パーライト等が用すられるが球状
無機質充填剤であればよく特に限定するものではな偽。The type of graphite used in the present invention is not particularly limited.
It is preferable that the amount added is 5 to 50 weight percent (hereinafter referred to as ``chi'') based on the total amount. If it is less than b0, that is, less than 5, it is difficult to improve the wear resistance, and if it exceeds 50, the baggability will be reduced. This is because it tends to decrease. As the spherical inorganic filler, glass beads, fused V-liquid, perlite, etc. can be used, but any spherical inorganic filler may be used and there are no particular limitations.
添加量は全量に対し５〜５０ｍであることが好ましい。The amount added is preferably 5 to 50 m based on the total amount.
即ち５幅未満では耐熱性が向上し難（，５０％をこえる
と耐摩耗性が低下する傾向にあるからである。That is, if the width is less than 5%, it is difficult to improve the heat resistance (and if it exceeds 50%, the abrasion resistance tends to decrease).
フェノール樹脂としては、フェノール、クレゾール、キ
シレノール等のフェノール類の嵐独、混合物からなるフ
ェノール樹脂、更にはフェノールと相溶性のあるナフタ
リン、糖密、エポキシ等による変性フェノール樹脂であ
ってもよ−。添加量としては好ましくは全体量の２５〜
ＳＯＷが望まし−０即ち２５悌未満では強度低下が太き
（、ＳＯｌをこえると耐熱性、耐摩耗性が低下する傾向
にあるからである。上記の黒鉛、球状無機質充填剤、フ
ェノール樹脂以外の添加剤としては通常用すられるヘキ
サミン等の硬化剤、離型剤、着色剤、補強剤、充填剤を
そのまま用いることができ更に必要に応じてアミノン５
フ表面処理剤を用す分散性をよくシ、混合、混練、粉砕
し必要に応じて造粒してフェノール樹脂成形材料を得る
ものである。The phenol resin may be a phenol resin made of a mixture of phenols such as phenol, cresol, or xylenol, or a phenol resin modified with naphthalene, molasses, epoxy, etc., which are compatible with phenol. The amount added is preferably 25 to 25% of the total amount.
SOW is desirable, and if it is less than -0, that is, 25 degrees, the strength will decrease significantly (because if it exceeds SOL, heat resistance and abrasion resistance tend to decrease. As additives, commonly used curing agents such as hexamine, mold release agents, colorants, reinforcing agents, and fillers can be used as they are, and if necessary, amino 5.
A phenolic resin molding material is obtained by thoroughly dispersing the mixture using a surface treatment agent, mixing, kneading, pulverizing, and granulating if necessary.
以下本発明を実施例にもとずｂて説明する。The present invention will be explained below based on examples.
実施例１と２及び比較例１と２
ｆａ１表の配合表に基づき材料を配合、混合、混線、粉
砕してフェノール樹脂成形材料を得、該フェノール樹脂
成形材料ヲ３００Ｋｑ／ｄ 、 １６５＠ｅ１？２分間
成形して成形品を得た。Examples 1 and 2 and Comparative Examples 1 and 2 A phenolic resin molding material was obtained by blending, mixing, cross-mixing, and pulverizing the materials according to the formulation table in Table FA1. A molded product was obtained by molding for 2 minutes.
第１表
実施例１と２及び比較例１と２の成形品の性能は第２表
のようである。Table 1 The performance of the molded products of Examples 1 and 2 and Comparative Examples 1 and 2 is as shown in Table 2.
本発明は上述した如く構成されてｂる。特許請求の範囲
第１項に記載した構成を有するフェノール樹脂成形材料
におりては耐摩耗性を向上させる効果がある。The present invention is constructed as described above. The phenolic resin molding material having the structure described in claim 1 has the effect of improving wear resistance.
Claims (1)
とするフェノール樹脂成形材料。(1) A phenolic resin molding material characterized by containing graphite and a spherical inorganic filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22103988A JPH0269509A (en) | 1988-09-02 | 1988-09-02 | Molding material of phenolic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22103988A JPH0269509A (en) | 1988-09-02 | 1988-09-02 | Molding material of phenolic resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0269509A true JPH0269509A (en) | 1990-03-08 |
Family
ID=16760530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22103988A Pending JPH0269509A (en) | 1988-09-02 | 1988-09-02 | Molding material of phenolic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0269509A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011088967A (en) * | 2009-10-21 | 2011-05-06 | Starlite Co Ltd | Resin composition for sliding member and resin-made sliding member |
| JP2012025940A (en) * | 2010-06-25 | 2012-02-09 | Panasonic Electric Works Co Ltd | Phenol resin molding material and phenol resin molded article |
| EP3130640A4 (en) * | 2014-12-25 | 2017-05-31 | Sumitomo Bakelite Co.,Ltd. | Phenolic-resin molding material for sliding member, and sliding member |
-
1988
- 1988-09-02 JP JP22103988A patent/JPH0269509A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011088967A (en) * | 2009-10-21 | 2011-05-06 | Starlite Co Ltd | Resin composition for sliding member and resin-made sliding member |
| JP2012025940A (en) * | 2010-06-25 | 2012-02-09 | Panasonic Electric Works Co Ltd | Phenol resin molding material and phenol resin molded article |
| EP3130640A4 (en) * | 2014-12-25 | 2017-05-31 | Sumitomo Bakelite Co.,Ltd. | Phenolic-resin molding material for sliding member, and sliding member |
| CN107109030A (en) * | 2014-12-25 | 2017-08-29 | 住友电木株式会社 | Slide unit phenolic resin moulding material and slide unit |
| JPWO2016104624A1 (en) * | 2014-12-25 | 2017-10-05 | 住友ベークライト株式会社 | Phenolic resin molding material for sliding member and sliding member |
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