JPH01183334A - Method for polishing sheet - Google Patents

Abstract

PURPOSE:To enable a thin ceramic sheet to be polished with extremely high accuracy by constituting the surface contacting said sheet from a substance having a perforated or finely rough surface to prevent the accuracy of said sheet from degradation due to excessive thickness of layers of adhesives. CONSTITUTION:A perforated plate 11 made of sintered metal or ceramic, etc. is bonded to a bed seat M of ferromagnetic body to correspond to a polishing table bed for magnetic adsorption. Adhesives of one kind of thermoplastic substances are fully impregnated and adsorbed in the perforated plate 11 to moisten and cover the surface contacting a workpiece S with an uniformly thin adhesive film and then mount the workpiece S on the adhesive film so that if necessary the reheating process is carried out to fully bond the perforated plate 11 to the workpiece S. Then, the heated adhesives are liquefied to present a capillary phenomenon so that the adhesives having an extremely thin uniform film thickness carry out an adhesive action provided fully with a necessary holding force for polishing the workpiece S. Thus, an extremely high accuracy ceramic sheet can be polished.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application) The present invention relates to a method for highly precise polishing of thin plates in the ceramic industry.

(Prior art) Conventionally, as shown in FIG. 2, which is a vertical cross-sectional view of the pedestal M, the object to be polished S is mounted on a hollow pedestal M with a hole 2 in the ceiling, and a vacuum is applied from the bottom in the direction of the arrow. It was customary to apply suction and polish the surface H of the head with a whetstone or the like.

In this case, the ceiling itself is bent by △t compared to the normal positional relationship, and the diameter of the hole 2 in the ceiling is larger than that of the object to be polished. When the size of the polishing material becomes large enough to adsorb the material, there is a problem in that the material itself sag into the hole as shown in the figure.

On the other hand, we have similarly conducted research on polishing using vacuum adsorption for porous ceramic or metallic filter materials, but we have found that using materials with fine pores such as
It turned out that it was impossible to do so.

The reason for this is that when polishing ceramic materials, it is done wet, so fine polishing debris is adsorbed into the porous pores along with the polishing liquid, clogging them and inhibiting the adsorption effect. Put it away.

As a result, it is not possible to polish a thin ceramic plate with high precision using the vacuum suction type pedestal M.

Next, another general conventional method is to apply adhesive 30 on the pedestal M so as to have as uniform a thickness as possible, and then press the object S to be polished on the head. However, in reality, it is very difficult to make the adhesive layer uniform in thickness, and one method for polishing the object is to polish the area with excessive adhesive layer. (The problem that the present invention aims to solve) As mentioned in F. In the conventional polishing method, the thin ceramic plate could be polished with high accuracy. However, in the present invention, as shown in FIG. 1, which is a longitudinal cross-sectional view of the pedestal M with a portion cut away, in order to correspond to the polishing table base for magnetic adsorption, ferromagnetic A porous plate 11 made of sintered metal or ceramic is bonded onto the pedestal M of the body.

Since this porous plate is sufficiently thick compared to the thickness of the object to be polished, it can be polished with extremely high precision using a general polishing method.

This porous plate 11 is sufficiently impregnated and adsorbed with adhesive, which is a type of thermoplastic material, so that the surface in contact with the object to be polished is evenly moistened and covered with a thin film of adhesive, and then The object S is placed on the adhesive film, and if necessary, heat treatment is performed again to sufficiently bond the porous plate 11 and the object to be polished.

In the polishing method according to the invention, excess adhesive is stored in many holes.

The heated adhesive liquefies and creates a capillary phenomenon on the contact surface with the object to be adhered, and the adhesive with a uniform and extremely thin film provides the necessary retention when polishing the object. Provides strong adhesive action.

In the main text, we described an example using a porous material, but
The principle of the invention is to create holes or grooves of minute size that store excess adhesive either by primary processing (by direct machining) or by secondary processing (sintering of materials such as fine particles or ribbons of organic material). Materials with a rough surface corresponding to the fine holes or grooves that store excess adhesive, which are created by mixing with a binder, molding, and sintering to create fine holes or grooves. within the scope of the present invention.

According to the present invention, the polishing method is provided with a pedestal M made of a ferromagnetic material as a sufficient condition, but a necessary condition is that the adhesive surface with the object to be polished be porous or have fine holes or grooves having a function acting in place of it. , by providing a plate 11 with an escape area (reservoir) for excess adhesive 30.

7. According to the present invention, it is possible to polish a thin ceramic plate with extremely high precision, and it is expected to be applied in a wide range of fields and has industrial value.

[Brief explanation of the drawing]

FIG. 1 shows an example of the polishing method of the present invention in a partially cutaway vertical cross-sectional view (both FIGS. 2 and 3 are shown using the same depiction method);
The numbers and symbols are common to each figure; M is the pedestal, 11 is the porous plate, S is the object to be polished, and H is the polished surface. FIG. 2 shows a conventional vacuum suction type polishing method, and 2 is a suction hole. FIG. 3 shows a conventional polishing method using an adhesive 30. FIG.

Claims (1)

[Claims] A method for polishing a thin plate, characterized in that the surface in contact with the object to be polished is made of a porous or finely roughened material to prevent deterioration in accuracy due to excessive adhesive layer thickness.