JPS6240737Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a holder for abrasive processing that holds a workpiece during abrasive processing.

When the workpiece is in the form of a flake, conventionally the workpiece is bonded to a holder and subjected to abrasive processing. However, this method not only impairs the precision of abrasive processing due to the presence of adhesive between the workpiece and the holder and the heating required for adhesion, but also the adhesion and peeling work. This has become an obstacle to improving productivity. Therefore, as shown in FIGS. 1 and 2, a vacuum passage 3 is provided on the workpiece attachment surface 2 of the holder 1.
and a suction groove 4 communicating with this decompression passage 3,
It has been considered to suction the workpiece W under reduced pressure, but the arrangement of the suction grooves 4 and the contact portions 5 is rough and unevenly distributed, resulting in air remaining between the contact portions 5 and the workpiece W. , a phenomenon in which the workpiece W is curved by the suction groove 4 may occur, which may impair the machining accuracy.

The present invention has been made based on the above-mentioned circumstances, and has a permeable porous hole with a filtration rate of 10 μm or more and 50 μm or less, which is surrounded by a support and has a workpiece adsorption surface that is polished smoothly together with the support. A rigid member and a circular packing provided on the support surrounding the workpiece suction surface are provided near the workpiece suction surface to prevent foreign matter from entering the workpiece suction surface during processing. In addition to preventing deformation of the workpiece due to adsorption, it is possible to perform abrasive processing with good flatness and high precision.

Hereinafter, the present invention will be described based on examples with reference to the drawings.

As shown in FIGS. 3 and 4, the abrasive processing holder of the present invention includes a support 11 and a
It is composed of a decompression passage 12 provided in the support body 11, a porous rigid member 13 and a packing 14 attached to the support body 11.

The support body 11 is a disc-shaped body made of stainless steel or the like, and is provided with a plurality of stepped holes 16 having a larger diameter on one end surface 15 side at positions equally dividing the circumference (only one is shown). ), a porous rigid member 13 is fitted into the large diameter portion 16a of these stepped holes 16, and the small diameter portion communicates with a vacuum source (not shown) that sucks the workpiece W through the porous rigid member 13. A decompression passage 12 is formed.
The support body 11 further has the large diameter portion 1 on the one end surface 15.
A ring-shaped packing groove 18 is formed in the vicinity of 6a and has an appropriate hardness and an amount of protrusion from the packing groove 18, so that when polishing pressure is applied through the workpiece, The gasket 14 located on the same plane as the object suction surface 19 is held.

The porous rigid member 13 has a filtration value representing air permeability of 10 μm (nominal size) to 50 μm, and is made of sintered metal such as bronze or stainless steel, which is used for filters and the like. Note that the filtration degree here means a value that means that particles having a particle size exceeding the nominal size are prevented from passing through. In this embodiment, the porous rigid member 13 is shown to have a disk-like shape with a uniform thickness. It is possible to equalize the forces.

However, the porous rigid member 13 of the lever is polished so that its suction surface 19 is flush with one end surface 15 of the support 11, as shown in FIG. The accuracy of this polished surface is preferably set to a roughness of 2 μm or less.
In the figure, 19a... is a close contact part, and 19b... is a suction groove.

When polishing is performed using the holder configured as described above, a flaky workpiece W is adsorbed onto the support 1 via the air permeable porous rigid member 13 by a vacuum source (not shown). . Then, as shown in FIG. 5, the polishing rotary disk 20 is rotated to press the workpiece W while supplying a polishing liquid in which a polishing material is suspended.

During this processing, the workpiece W does not curve much for the following reason and is closely adsorbed to the porous rigid member, resulting in polishing with good flatness.

(b) The close contact portion 19a and the suction groove 1, which could not be avoided conventionally because the porous rigid member 13 is used.
The uneven distribution of 9b can be solved and distributed uniformly.

(b) Since the porous rigid member 13 is formed to have a filtration rate of 50 μm or less, it is possible to reduce the curvature of the workpiece W caused by the suction groove 19b being too large.

(c) Since the porous rigid member 13 is formed to have a filtration rate of 10 μm or more, even if the polishing material intrudes undesirably, the polishing material usually has a thickness of 1 μm or less, so it is possible to prevent the adsorption force from decreasing due to clogging. .

(d) The packing 14 prevents the polishing liquid from entering between the workpiece W and the support 11, and serves to keep the two W (the support 11 and the porous rigid member 13) in close contact with each other.

(e) Polishing the suction surface helps to further improve the flatness of the workpiece W.

As detailed above, the present invention has a diameter of 10 μm or more and 50 μm.
By forming it so that it is adsorbed to a permeable porous rigid member with a filtration rate of less than m, it is possible to prevent air remaining due to uneven distribution of the contact area and suction grooves, and to prevent bending of the workpiece due to excessive suction grooves. In addition, by providing a gasket to prevent the polishing liquid from entering, the workpiece is brought into close contact with the suction part without the presence of polishing agent, and by polishing the suction part, the workpiece is removed. By improving the flatness of the material, we were able to perform abrasive processing with much higher precision than before.

It goes without saying that the present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the gist thereof.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway plan view of a conventional holder for abrasive processing, Fig. 2 is a sectional view taken along the - line in Fig. 1, and Fig. 3 is an abrasive processing example of the present invention. A partially cutaway plan view of the holder, FIG. 4 is the same as in FIG.
FIG. 5 is an enlarged view of section A in FIG. 4, which is a sectional view taken along the line. 11... Support body, 12... Decompression passage, 13...
Porous rigid member, 14... Packing, 18... Packing groove, 19... Adsorption surface, W... Workpiece.

Claims (1)

[Scope of utility model registration request] 10 μm or more with a workpiece adsorption surface surrounded by a support and polished smoothly together with the support
an air permeable porous rigid member with a filtration rate of 50 μm or less;
A vacuum passage communicating with the air permeable porous rigid member; and a workpiece provided in the support body surrounding the workpiece suction surface near the workpiece suction surface, the workpiece being sucked by the reduced pressure of the vacuum passageway. 1. A holder for abrasive grain processing, comprising an annular packing that is deformed by the polishing pressure applied to the object and positioned on the same plane as the workpiece adsorption surface.