JPH01182357A - Epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain the title material outstanding in thermal conductivity and moisture resistance, suitable for resin molded products for sealing electrical parts or electronic parts, by incorporating a specified amount of a metal nitride in an epoxy resin molding material spiked with such ingredients as crosslinking agent or curing agent. CONSTITUTION:The objective material can be obtained by incorporating (A) an epoxy resin molding material produced by spiking an epoxy resin with if needed, such ingredients as crosslinking agent (e.g., phenolic resin), curing agent (e.g., aliphatic polyamine), curing accelerator and/or releasant with (B) 60-90wt.% based on the final material, of a metal nitride (e.g., silicon nitride, aluminum nitride).

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to w, 9 a resin mold for sealing IC parts and electronic parts;
- It relates to epoxy resin molding materials mainly used for molded products.

[Conventional technology]

In recent years, in order to improve the performance, high reliability 1, and productivity of electric and electronic mIs, sealing using differential sticks has been used. These electrical and electronic components include, for example, transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc., and are widely applied. The shortening of is becoming a problem. For the sake of strength, crystalline V-liquor and high-purity alumina are added.

[The extreme point that the invention attempts to solve]

Among those described in the conventional technology, the thermal conductivity of the former is 56 x 10 cal/R, with a limit of 0°C;
Although the latter improves thermal conductivity, it often suffers from a decrease in moisture resistance. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide an epoxy resin molding material with excellent thermal conductivity and moisture resistance.

[ll! Means for Solving Problem Q] The present invention adds additives such as a crosslinking agent, a curing agent, a curing accelerator, a #Ii type agent, a coloring agent, a coupling agent, a filler, etc. to the epoxy resin as necessary. In an epoxy resin molding material with the addition of
Since the epoxy resin molding material is characterized in that it contains a metal nitride, the above object can be achieved, and the present invention will be described in detail below.

The epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A type epoxy resin, Novohook type epoxy resin, flexible epoxy resin, and halogenated epoxy resin. , Glyshiji Esthe A/type epoxy resin, or polymer type epoxy resin are not particularly limited. As the crosslinking agent, phenol resin, melamine resin, acrylic/I/resin, area resin, isoryanate, etc. can be used, and there are no particular limitations. As the curing agent, amine curing agents such as aliphatic polyamines, polyamide resins, aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, etc. can be used, and there are no particular limitations. As the curing accelerator, it is necessary to use a phosphorus-based and/or tertiary amine-based curing accelerator.

It is necessary to contain at least a metal nitride as a filler, but if necessary, other fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, carbonate, sium, clay, aluminum etc. Additionally, an inorganic filler such as fufu flour or aluminum hydroxide may be used in combination. As the metal nitride, silicon nitride, aluminum nitride, boron nitride, etc. can be used, and the amount of metal nitride is preferably:
It is desirable to use 60 to 90% (simply expressed as % by weight of 96c or less) of the total amount. That is, if it is less than 60%, thermal conductivity tends to be improved, whereas if it exceeds 90%, moisture resistance tends to decrease. The mold release agent, coloring agent, coupling agent, triphenylphosphine, V-recon rubber, etc. are not particularly limited, as commonly used ones can be used as they are. In this way, the above materials are mixed, kneaded, pulverized, and further granulated if necessary to obtain a molding material. Furthermore, regarding the molding of the molding material, transistors by transfer molding, injection molding, etc.
It is suitable not only for molding large numbers of electronic components such as diodes, capacitors, filters, rectifiers, resistors, and coils, but also for compression molding.

Example! -3 and comparative examples! and 2 The present invention will be explained below based on examples.

The epoxy resin molding material is obtained by blending, mixing, and kneading the materials according to the recipe in Table 1, and the hybrid IC is sealed using a transfer molding machine at a mold temperature of 175°C, a molding pressure of 50~, and a curing time of 3 minutes. Molded.

Table 1: Parts by weight Note: L Epoxy equivalent: 220. Epoxy resin with a softening point of 80°C.

*2 Phenol resin with a hydroxyl equivalent of 104 and a softening point of 87°C.

The thermal conductivity and moisture resistance of Examples 1 to 3 and Comparative Examples 1 and 2 are shown in Table 2.

Notes to Table 2 This is based on the PCT test, and is the time required for corrosion of aluminum wire to reach 10% under 3 atmospheres.

〔Effect of the invention〕

The present invention is constructed as described above. The epoxy resin molding material having the structure described in claim 1 has the effect of improving thermal conductivity and moisture resistance.

Furthermore, the epoxy resin molding material having the structure described in claim 2 has the effect of significantly improving thermal conductivity and moisture resistance.

Claims (2)

[Claims] (1) In an epoxy resin molding material made by adding additives such as a crosslinking agent, a curing agent, a curing accelerator, a mold release agent, a coloring agent, a coupling agent, and a filler to an epoxy resin as necessary, An epoxy resin molding material characterized by containing metal nitride. (2) The epoxy resin molding material according to claim 1, wherein the amount of metal nitride is 60 to 90% by weight of the total amount.