JPH01181966A - Substrate heating device - Google Patents
Substrate heating deviceInfo
- Publication number
- JPH01181966A JPH01181966A JP515088A JP515088A JPH01181966A JP H01181966 A JPH01181966 A JP H01181966A JP 515088 A JP515088 A JP 515088A JP 515088 A JP515088 A JP 515088A JP H01181966 A JPH01181966 A JP H01181966A
- Authority
- JP
- Japan
- Prior art keywords
- heating chamber
- heating
- chamber
- substrate
- hot air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 97
- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 238000005192 partition Methods 0.000 claims abstract description 24
- 238000005476 soldering Methods 0.000 abstract description 27
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000003993 interaction Effects 0.000 description 5
- 239000006071 cream Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Landscapes
- Tunnel Furnaces (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は回路基板上に塗布したクリーム半田を加熱溶融
して、電子部品を半田付けするための加熱装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heating device for heating and melting cream solder coated on a circuit board to solder electronic components.
従来の技術
家電製品に代表される様に、プリント基板（以下甲板」
と略記する。）上への電子部品の高密度実装技術におい
て、リフロー炉を用いた素子の半田付工法が採用されつ
つある。ここでは、このリフロー炉による半田付工法を
例に本加熱方法について説明する。リフロー工法は、こ
れまでの溶融ハンダ槽に素子の載ったＰ板をデイツプす
るフロー工法と異なシ、半田の微細粒子と、ペーストか
ら成るクリーム状半田をＰ板の所定位置に塗布した後に
素子を置き、赤外線によシ加熱溶融させて、半田付けす
るというものである。Conventional technology As typified by home appliances, printed circuit boards (hereinafter referred to as decks)
It is abbreviated as ) In high-density mounting technology for electronic components on top of electronic devices, a method of soldering devices using a reflow oven is being adopted. Here, the present heating method will be explained using the soldering method using this reflow oven as an example. The reflow method is different from the conventional flow method in which the P plate with the device mounted on it is dipped in a molten solder bath.The reflow method is different from the conventional flow method in which the P plate with the device mounted on it is dipped in a molten solder bath. It is then heated and melted using infrared rays, and then soldered.
以下図面を参照しながら、上述した従来の基板３ヘーシ 加熱装置の一例について説明する。Below, with reference to the drawings, the conventional board 3 hesi An example of a heating device will be explained.
第３図は、従来の基板加熱装置の概略構成を示す。第３
図において、１はコンベアで、２はＰ板、３は発熱体、
４は加熱室、５は冷却ファンである。FIG. 3 shows a schematic configuration of a conventional substrate heating device. Third
In the figure, 1 is a conveyor, 2 is a P plate, 3 is a heating element,
4 is a heating chamber, and 5 is a cooling fan.
加熱室４はトンネル状でかつ内部が水平方向に空洞とな
っており、加熱室４の上部に発熱体３が設置されていて
加熱室４内をＰ板２搬送用のコンベア１が走行するよう
になっている。The heating chamber 4 has a tunnel-like shape and is hollow in the horizontal direction. A heating element 3 is installed at the top of the heating chamber 4, and a conveyor 1 for conveying the P plate 2 runs inside the heating chamber 4. It has become.
以上のように構成された基板加熱装置について、以下そ
の動作を説明する。一定速度Ｖで動くコンベア１上で、
素子を載せたＰ板２は、一定の熱量を発生し続ける発熱
体３によシ加熱される。炉の前の前半部Ａは予熱部で、
通常１５０℃前後にＰ板２を暖める。次いでＢ部で約２
５０℃に加熱し、半田付けを行い、その後、冷却ファン
５で冷却ししかしながら上記のような構成では、加熱室
４外の雰囲気からの加熱室４内への逆流あるいは、冷却
ファン５による加熱室４内への大気温度の雰囲気の逆流
等が起とシ、加熱室４内の温度不均一が発生し、部分的
に半田付けができない半田付不良が生じるという問題が
あった。実際、熱電対を高温半田で固着”されたＰ板２
の温度を測定すると均一性は±４％であった。また、発
熱体３の調整によシ、予熱部Ａと半田付は加熱部Ｂをそ
れぞれ所定の温度に保つことは非常に困難であった。The operation of the substrate heating device configured as described above will be described below. On conveyor 1 moving at a constant speed V,
The P plate 2 on which the elements are mounted is heated by a heating element 3 that continues to generate a constant amount of heat. The first half A in front of the furnace is the preheating section.
The P plate 2 is usually heated to around 150°C. Then in part B about 2
It is heated to 50° C., soldered, and then cooled by the cooling fan 5. However, in the above configuration, the atmosphere outside the heating chamber 4 flows back into the heating chamber 4, or the cooling fan 5 cools the heating chamber. There is a problem in that the backflow of the atmospheric temperature atmosphere into the heating chamber 4 causes non-uniformity in temperature within the heating chamber 4, resulting in soldering defects in which soldering cannot be performed in some areas. In fact, the P plate 2 to which the thermocouple was fixed with high-temperature solder
When the temperature was measured, the uniformity was ±4%. Furthermore, due to the adjustment of the heating element 3, it was extremely difficult to maintain the preheating section A and the soldering heating section B at predetermined temperatures.
本発明は上記問題点に鑑み、加熱室内の温度均一性を向
上させ、予熱部、半田付は部をそれぞれ所定の温度に保
つ手段を設けることによシ、半田付不良の改善と素子品
質の安定を図ることができ上記問題点を解決するために
本発明の第１の発明は、加熱室において、少なくとも１
ケ所以上熱風を加熱室に供給できる手段と、搬送される
基板を阻止しない範囲で少なくとも１ケ所以上の仕切板
を備えたものである。In view of the above-mentioned problems, the present invention improves temperature uniformity in the heating chamber and provides means for maintaining the preheating section and the soldering section at predetermined temperatures, thereby improving soldering defects and improving element quality. In order to achieve stability and solve the above problems, the first invention of the present invention provides at least one
The heating chamber is equipped with means for supplying hot air to the heating chamber at more than one location, and at least one partition plate within a range that does not block the substrates being transported.
また、本発明の第２の発明は、加熱室において、搬送さ
れる基板を阻止しない範囲で少なくとも１５ヘーノ
ケ所以上の仕切板を有し、前記仕切板を境として、前記
加熱室に異なった温度の熱風を供給する手段と、前記仕
切板近傍に排気口を備えたものである。Further, the second invention of the present invention is characterized in that the heating chamber has at least 15 or more partition plates within a range that does not block the substrate being transported, and the heating chamber has different temperatures separated by the partition plates. and an exhaust port near the partition plate.
作 用
本発明の第１の発明の作用は、一定温度の熱風を加熱室
に供給することによシ、気流の流れとして加熱室内から
加熱室外へと流れ、加熱室外の雰囲気が流れ込むことが
ないため、加熱室内の温度均一化を図ることができる。Effect The effect of the first aspect of the present invention is that by supplying hot air at a constant temperature to the heating chamber, the air flows from the heating chamber to the outside of the heating chamber as an air current, and the atmosphere outside the heating chamber does not flow into the heating chamber. Therefore, the temperature inside the heating chamber can be made uniform.
また所定の温度の熱風を供給することによシ、所定の温
度に加熱室を保つことができるという効果を有する。Furthermore, by supplying hot air at a predetermined temperature, it is possible to maintain the heating chamber at a predetermined temperature.
本発明の第２の発明の作用は、加熱室に搬送基板を阻止
しない範囲で仕切板を設け、仕切板を境として、各加熱
室に異なった所定の温度の熱風を供給することによシ、
各加熱室の雰囲気温度を異なった所定の温度に保つこと
ができる。また仕切板を境として、仕切板近傍に排気口
を設けることによシ、各加熱室の所定の雰囲気温度によ
る相互作用を減少させることができ、よシいっそう各加
熱室を所定の温度に保つことができる。The operation of the second aspect of the present invention is achieved by providing a partition plate in the heating chamber within a range that does not block the substrate to be transported, and supplying hot air at a different predetermined temperature to each heating chamber using the partition plate as a boundary. ,
The ambient temperature in each heating chamber can be maintained at a different predetermined temperature. In addition, by providing an exhaust port near the partition plate, it is possible to reduce the interaction caused by the specified atmospheric temperature of each heating chamber, and to better maintain each heating chamber at the specified temperature. be able to.
６ヘージ
実施例
以下本発明の一実施例の基板加熱装置について、図面を
参照しながら説明する。Embodiment 6 A substrate heating apparatus according to an embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の第１の実施例における基板加熱装置を
示すものである。FIG. 1 shows a substrate heating device according to a first embodiment of the present invention.
第１図において、６は予備加熱室、７は半田付加熱室、
８は仕切板、９は熱風供給口、１０は発熱体、１１はＰ
板、１２は搬送コンベア、１３は冷却ファンである。In Fig. 1, 6 is a preheating chamber, 7 is a soldering heating chamber,
8 is a partition plate, 9 is a hot air supply port, 10 is a heating element, 11 is P
12 is a conveyor, and 13 is a cooling fan.
以上のように構成された基板加熱装置について、以下そ
の動作を説明する。The operation of the substrate heating device configured as described above will be described below.
まずクリーム半田を塗布したチップ実装Ｐ板１１は搬送
コンベア１２に載せられ、予備加熱室６に送られ、発熱
体１０によって１５０℃前後に加熱される。次に半田付
加熱室７に送られ、発熱体１゜及び熱風供給口９から供
給される２５０℃前後の熱風によって、Ｐ板は約２５０
℃に加熱され、最終的には冷却ファン１３によって冷却
され、取シ出される。First, the chip mounting plate 11 coated with cream solder is placed on the conveyor 12, sent to the preheating chamber 6, and heated to around 150° C. by the heating element 10. Next, the P board is heated to approximately 250°C by hot air of around 250°C sent to the soldering heat chamber 7 and supplied from the heating element 1° and the hot air supply port 9.
℃ and finally cooled down by the cooling fan 13 and taken out.
以上のように本実施例によれば、一定温度の熱７ヘー。As described above, according to this embodiment, the heat is kept at a constant temperature of 7 h.
風を加熱室に供給することにょシ、気流の流れとして、
半田付加熱室γ内から半田付加熱室Ｔ外へと流れ、半田
付加熱室Ｔ内へ外気が流れ込むことがないため、半田付
加熱室内の温度均一化を図ることができる。また所定の
温度の熱風を供給することにより、所定の温度に半田付
加熱室７を保つことができ、温度不均一による半田不良
率を低減することができる。In order to supply wind to the heating chamber, as an air flow,
Since outside air flows from inside the soldering heat chamber γ to outside the soldering heat chamber T and does not flow into the soldering heat chamber T, the temperature inside the soldering heat chamber T can be made uniform. Further, by supplying hot air at a predetermined temperature, the soldering heat chamber 7 can be maintained at a predetermined temperature, and the solder failure rate due to temperature non-uniformity can be reduced.
実際、Ｐ板１１に熱電対を高温半田に固着して温度を測
定すると、均一性は±１．５％に向上した。In fact, when the temperature was measured by fixing a thermocouple to the P plate 11 with high-temperature solder, the uniformity improved to ±1.5%.
次に、本発明の第２の実施例について、図面を参照しな
がら説明する。Next, a second embodiment of the present invention will be described with reference to the drawings.
第２図は本発明の第２の実施例における基板加熱装置を
示すものである。FIG. 2 shows a substrate heating device according to a second embodiment of the present invention.
第２図において、１４は予備加熱室、１５は半田付加熱
室、１６は仕切板、１７は第一熱風供給口、１８は第二
熱風供給口、１９は発熱体、２゜はＰ板、２１は搬送コ
ンベア、２２は冷却ファン、２３は上部排気口、２４は
下部排気口である。In FIG. 2, 14 is a preheating chamber, 15 is a soldering heat chamber, 16 is a partition plate, 17 is a first hot air supply port, 18 is a second hot air supply port, 19 is a heating element, 2° is a P plate, 21 is a conveyor, 22 is a cooling fan, 23 is an upper exhaust port, and 24 is a lower exhaust port.
以上のように構成された基板加熱装置について、以下そ
の動作を説明する。The operation of the substrate heating device configured as described above will be described below.
まずクリーム半田を塗布したチップ実装Ｐ板２゜は、搬
送コンベア２１に載せられ、予備加熱室１４に送られる
。発熱体１９及び、第二熱風供給口１８から供給される
約１５０ ’ｃ １ｍ／ｓの熱風によって予備加熱室１
４内には、約１５０℃前後の雰囲気の均熱ゾーンが形成
されておシ、Ｐ板２ｏも、予備加熱室１４内で約１５０
℃に均一に加熱される。First, the chip mounting P board 2° coated with cream solder is placed on the conveyor 21 and sent to the preheating chamber 14. The preheating chamber 1 is heated by the heating element 19 and hot air of about 150'c 1m/s supplied from the second hot air supply port 18.
In the preheating chamber 14, a soaking zone with an atmosphere of about 150°C is formed.
heated evenly to ℃.
次に半田付加熱室１５に搬送され、発熱体１９及び、第
一熱風供給口１７から供給される約２３０℃。Next, the temperature of about 230° C. is transferred to the soldering heat chamber 15 and supplied from the heating element 19 and the first hot air supply port 17 .
１ｍ／ｓの熱風によって形成された均熱ゾーン内で、Ｐ
板２０は約２５０℃に加熱される。その後、冷却ファン
２２で冷却され取シ出される。また、予備加熱室１４と
半田付加熱室１５の各々に異なった温度の熱風を供給し
ているため、互いの雰囲気の影響を少なくするために、
上部排気口２３（排気速度０．５ｍ／ｓと下部排気口２
４（排気速度０．５ｍ／ｓ ）で排気を行なっている。In the soaking zone formed by hot air of 1 m/s, P
Plate 20 is heated to approximately 250°C. Thereafter, it is cooled by the cooling fan 22 and taken out. In addition, since hot air of different temperatures is supplied to each of the preheating chamber 14 and the soldering heat chamber 15, in order to reduce the influence of each other's atmosphere,
Upper exhaust port 23 (exhaust speed 0.5 m/s and lower exhaust port 2
4 (exhaust speed 0.5 m/s).
以上のように本実施例によれば、予備加熱室１４と半田
付加熱室１５の間に仕切板１６を設け、予９ヘーシ
偏加熱室１４と半田付加熱室１５にそれぞれに異なった
所定の温度の熱風を供給することにょ９、各加熱室の雰
囲気温度を異なった所定の温度に保つことができ、まだ
熱風送風の効果により均熱な領域を拡大することができ
る。まだ、仕切板１θを境として、仕切板１６近傍に上
部排気口２３と下部排気口２４を設けることにょシ、予
熱加熱室１４と半田付加熱室１５の所定の雰囲気温度に
よる相互作用を減少させることができ、よシいっそう加
熱室を所定の温度に保つことができる。As described above, according to this embodiment, the partition plate 16 is provided between the preheating chamber 14 and the soldering heat chamber 15, and the preheating chamber 14 and the soldering heat chamber 15 have different predetermined values. By supplying hot air at a certain temperature, the ambient temperature in each heating chamber can be maintained at a different predetermined temperature, and the uniformly heated area can be expanded due to the effect of blowing hot air. However, by providing the upper exhaust port 23 and the lower exhaust port 24 in the vicinity of the partition plate 16 with the partition plate 1θ as the boundary, interaction between the preheating chamber 14 and the soldering heating chamber 15 due to the predetermined ambient temperature is reduced. This makes it possible to better maintain the heating chamber at a predetermined temperature.
次に、本発明の第３の実施例について、図面を参照しな
がら説明する。Next, a third embodiment of the present invention will be described with reference to the drawings.
第３の実施例における基板加熱装置は、第２の実施例の
第２図と全く同じ構造であり、違うのは、上部排気口２
３の排気速度は０．２ ｍ／ｓ、下部排気口２４の排気
速度は０．８ｍ／ｓであることである。The substrate heating device in the third embodiment has exactly the same structure as that in FIG. 2 of the second embodiment, except that the upper exhaust port 2
The exhaust speed of No. 3 is 0.2 m/s, and the exhaust speed of the lower exhaust port 24 is 0.8 m/s.
この場合の基板加熱装量について、以下その動作を説明
する。The operation of the substrate heating amount in this case will be explained below.
動作は第２の実施例と同じであるが、違うのは、第一熱
風供給口１了（温度２３０℃、流入速度１１０・＼−７
ｍ／ｓ ）と第二熱風供給口１８（温度１５０℃、流入
速度１ｒｎ／／ｓ）から供給される熱風の気流流れを乱
さないため、上部排気口２２の排気速度を０．２ｍ／ｓ
、下部排気口２４の排気速度をＱ、８ｒＶ′Ｓとした
ことにある。The operation is the same as the second embodiment, but the difference is that the first hot air supply port 1 (temperature 230°C, inflow velocity 110·\-7 m/s) and the second hot air supply port 18 (temperature 150°C) The exhaust speed of the upper exhaust port 22 was set to 0.2 m/s in order not to disturb the air flow of hot air supplied from the inflow speed of 1rn//s).
, the exhaust speed of the lower exhaust port 24 is set to Q, 8rV'S.
以上のように第３の実施例について、予備加熱室１４と
半田付加熱室１５の間に仕切板を設け、予備加熱室１４
と半田加熱室１５それぞれに異なった所定の温度の熱風
を供給することによシ、各加熱室の雰囲気温度を異なっ
た所定の温度に保つことができ、また熱風送風の効果に
よシ均熱な領域を拡大することができる。また仕切板１
６を境として、仕切板１６近傍に上部排気口２３と下部
排気口２４を設け、上部排気口２３の排気速度より下部
排気口２４の排気速度を大きくすることによシ、供給さ
れた熱風の流れを乱すことなく、予備加熱室１４と半田
付加熱室１５の所定の雰囲気温度による相互作用を減少
させることができ、よシいっそう予備加熱室１４と半田
付加熱室１５をそれぞれ所定の温度に保つことができる
。As described above, in the third embodiment, a partition plate is provided between the preheating chamber 14 and the soldering heat chamber 15, and the preheating chamber 14
By supplying hot air at different predetermined temperatures to each of the solder heating chambers 15 and 15, the ambient temperature of each heating chamber can be maintained at a different predetermined temperature, and the hot air blowing effect can evenly heat the heating chambers. It is possible to expand the area. Also, partition plate 1
6, an upper exhaust port 23 and a lower exhaust port 24 are provided in the vicinity of the partition plate 16, and by making the exhaust speed of the lower exhaust port 24 higher than the exhaust speed of the upper exhaust port 23, the supplied hot air can be It is possible to reduce the interaction between the preheating chamber 14 and the soldering heat chamber 15 due to the predetermined atmospheric temperatures without disturbing the flow, and it is possible to further reduce the interaction between the preheating chamber 14 and the soldering heat chamber 15 at the predetermined temperatures. can be kept.
１１ヘーノ
なお、本発明の第二及び第三の実施例において、上部排
気口２３と下部排気口２４としたが、下部排気口２４の
みでも良い。In the second and third embodiments of the present invention, the upper exhaust port 23 and the lower exhaust port 24 are provided, but only the lower exhaust port 24 may be used.
又、本発明の発熱体１０．１９は上部のみとしたが、上
下両数から加熱しても良い。Further, although the heating elements 10 and 19 of the present invention are used only from the upper part, heating may be performed from both the upper and lower parts.
又、本発明の第一、第二及び第三の実施例において、Ｐ
板冷却用に冷却ファン１３．２２を取シ付けたが、無く
ても良い。Furthermore, in the first, second and third embodiments of the present invention, P
Cooling fans 13 and 22 are installed to cool the board, but they do not need to be provided.
また、これまで基板のりフロー半田付けを例に説明した
が、この内容は一般の任意の基板加熱に適用できること
は言うまでもない。Further, although the explanation has been given using board glue flow soldering as an example, it goes without saying that this content can be applied to heating any general board.
発明の効果
以上述べたように、本発明の第１の発明によれば、一定
の温度の熱風を加熱室に供給することにより、気流の流
れとして加熱室内から加熱室外へと流れ、加熱室外の雰
囲気が流れ込むことがないため、加熱室内の温度均一化
を図ることができる。Effects of the Invention As described above, according to the first aspect of the present invention, by supplying hot air at a constant temperature to the heating chamber, the air flows from the heating chamber to the outside of the heating chamber as a flow of air, and the air outside the heating chamber is heated. Since the atmosphere does not flow in, the temperature inside the heating chamber can be made uniform.
また所定の温度の熱風を供給することによシ、所定の温
度に加熱室を保つことができ、その効果は大なるもので
ある。Furthermore, by supplying hot air at a predetermined temperature, the heating chamber can be maintained at a predetermined temperature, which is highly effective.
また本発明の第２の発明によれば、加熱室に搬送基板を
阻止しない範囲で仕切板を設け、仕切板を境として、各
加熱室に異なった所定の温度の熱風を供給することによ
シ、各加熱室の雰囲気温度を異なった所定の温度に保つ
ことができる。また仕切板を境として、仕切板近傍に排
気口を設けることにより、各加熱室の所定の雰囲気温度
による相互作用を減少させることができ、よシいっそう
各加熱室を所定の温度に保つことができる。According to the second aspect of the present invention, a partition plate is provided in the heating chamber within a range that does not block the substrate to be transported, and hot air of a different predetermined temperature is supplied to each heating chamber with the partition plate as a boundary. Second, the ambient temperature in each heating chamber can be maintained at a different predetermined temperature. In addition, by providing an exhaust port near the partition plate, it is possible to reduce the interaction caused by the predetermined atmospheric temperature of each heating chamber, making it possible to maintain each heating chamber at a predetermined temperature. can.
第１図は本発明の第一の実施例における基板加熱装置の
断面図、第２図は本発明の第二の実施例における基板加
熱装置の断面図、第３図は従来の基板加熱装量の断面図
である。
６．１４・−・・・・予備加熱室、７，１５・・・・−
・半田加熱室、８，１６・・・・・・仕切板、９・・・
・・・熱風供給口、１７・・・・・・第一熱風供給口、
１８・・・・・・第二熱風供給口、１０，１９・・・・
・・発熱体、１１．２０・・・・・・Ｐ板、１２．２１
・・・・・・搬送コンベア、２３・・・・・・上部排気
口、２４・・・・・・下部排気口。FIG. 1 is a cross-sectional view of a substrate heating device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a substrate heating device according to a second embodiment of the present invention, and FIG. 3 is a conventional substrate heating device. FIG. 6.14...- Preheating chamber, 7,15...-
・Solder heating chamber, 8, 16... Partition plate, 9...
...Hot air supply port, 17...First hot air supply port,
18...Second hot air supply port, 10,19...
...Heating element, 11.20... P plate, 12.21
...Transportation conveyor, 23...Top exhaust port, 24...Bottom exhaust port.
Claims (3)
前記加熱室内で搬送することができる手段とを有した基
板加熱装置において、少なくとも１ケ所以上熱風を前記
加熱室内に供給できる手段と、搬送される前記基板を阻
止しない範囲で少なくとも１ヶ所以上のを有することを
特徴とする基板加熱装置。(1) In a substrate heating apparatus having a tunnel-shaped heating chamber having heating means and means capable of transporting a substrate within the heating chamber, means capable of supplying hot air into the heating chamber at least at one or more locations; . A substrate heating device characterized in that it has at least one or more locations within a range that does not block the substrate being transported.
前記加熱室内で搬送することができる手段とを有した基
板加熱装置において、搬送される前記基板を阻止しない
範囲で少なくとも１ヶ所以上の仕切板を有し、前記仕切
板を境として、各前記加熱室に異なった温度の熱風を供
給する手段と、前記仕切板近傍に排気口を有することを
特徴とする基板加熱装置(2) In a substrate heating apparatus having a tunnel-shaped heating chamber having a heating means and means capable of transporting the substrate within the heating chamber, at least one or more locations are provided within a range that does not block the substrate being transported. A substrate heating device comprising a partition plate, means for supplying hot air at different temperatures to each of the heating chambers with the partition plate as a boundary, and an exhaust port near the partition plate.
以上熱風供給側と反対側にあることを特徴とする特許請
求の範囲第２項記載の基板加熱装置。(3) The substrate heating device according to claim 2, wherein at least one exhaust port near the partition plate is located on the side opposite to the hot air supply side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63005150A JPH0751273B2 (en) | 1988-01-13 | 1988-01-13 | Substrate heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63005150A JPH0751273B2 (en) | 1988-01-13 | 1988-01-13 | Substrate heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01181966A true JPH01181966A (en) | 1989-07-19 |
| JPH0751273B2 JPH0751273B2 (en) | 1995-06-05 |
Family
ID=11603248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63005150A Expired - Fee Related JPH0751273B2 (en) | 1988-01-13 | 1988-01-13 | Substrate heating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751273B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0440569U (en) * | 1990-08-04 | 1992-04-07 | ||
| JPH0498364U (en) * | 1990-08-13 | 1992-08-25 | ||
| CN111442641A (en) * | 2019-01-16 | 2020-07-24 | 日本碍子株式会社 | Heat treatment furnace |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614870U (en) * | 1984-06-08 | 1986-01-13 | 千住金属工業株式会社 | reflow oven |
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
-
1988
- 1988-01-13 JP JP63005150A patent/JPH0751273B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614870U (en) * | 1984-06-08 | 1986-01-13 | 千住金属工業株式会社 | reflow oven |
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0440569U (en) * | 1990-08-04 | 1992-04-07 | ||
| JPH0498364U (en) * | 1990-08-13 | 1992-08-25 | ||
| CN111442641A (en) * | 2019-01-16 | 2020-07-24 | 日本碍子株式会社 | Heat treatment furnace |
| JP2020112336A (en) * | 2019-01-16 | 2020-07-27 | 日本碍子株式会社 | Heat treatment furnace |
| CN111442641B (en) * | 2019-01-16 | 2023-09-19 | 日本碍子株式会社 | heat treatment furnace |
| TWI839439B (en) * | 2019-01-16 | 2024-04-21 | 日商日本碍子股份有限公司 | Heat treatment furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751273B2 (en) | 1995-06-05 |
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