JPH01179491A - Circuit substrate - Google Patents

Abstract

PURPOSE:To prevent the separation of a conductor pattern even if the environment varies and perform a connecting operation easily by a method wherein a connecting conductor is formed of a single wire material which consists of a first connecting part, a second connecting part, and a bent part which connects the end of the first connecting part with the end of the second connecting part. CONSTITUTION:A connecting conductor 24 formed of a single wire material 24 is composed of a first connecting part 25, a second connecting part 26, and an arc-shaped bent part 27 which connects the end 25a of the part 25 with the end 26a of the part 26. A tip 25b of the conductor 24 is soldered to a conductor pattern 22. Even if a substrate 20 expands and shrinks alternately to make the spaces vary in dimension, the dimension change is absorbed by the bent part 27, so that stress is not induced in patterns 21 and 22. Consequently, the patterns 21 and 22 are not separated from the substrate 20. By these processes, a connecting operation is easily done.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a circuit in which conductive patterns formed on both sides of a substrate are connected by a connecting conductor penetrating the substrate. Regarding the board.

(Prior Art) FIG. 5 shows a first conventional example of a circuit board that connects conductor patterns formed on both sides of the board. That is, 1 is a substrate, 2 is a conductive pattern formed on the upper surface of the substrate 1,
Reference numeral 3 denotes a conductor pattern formed on the lower surface of the substrate 1.

4 is a hole formed in the substrate 1 and the conductor patterns 2 and 3;
is a connecting conductor made of wire. The connecting conductor 5 is inserted into the hole 4, and both ends thereof are connected to the conductor patterns 2 and 3, respectively, by soldering.

A second conventional example of a circuit board is shown in FIG. That is, 6 is a conductor pattern formed on the lower surface of the substrate 1, 7 is a hole formed in the substrate 1 and the conductor pattern 2, and 8 is a hole formed in the substrate 1 and the conductor pattern 6 at a predetermined distance from the hole 7. This is the hole formed. 9 is a connecting conductor consisting of a 0 ohm resistor,
It has connecting terminals 10 and 11 bent into an L-shape at both ends thereof.

One of the connection terminals 10 of the connection conductor 9 is inserted into the hole 7 and the other connection terminal 11 is inserted into the hole 8, and the connection terminal 10 is connected to the conductor pattern 2 by soldering, and the connection terminal 11 is connected to the conductor pattern. 6 (; Connected by soldering.

A third conventional example of a circuit board is shown in FIG. That is, 12 is a conductor pattern formed on the lower surface of the substrate 1, and 13 is a connecting conductor consisting of a lead wire, which is bent into a 0 shape so as to go around the edge of the substrate 1, and is connected to both ends of the conductor pattern. part conductor 14
．． 14 are connected to the conductor patterns 2 and 12, respectively, by soldering.

(Problem to be Solved by the Invention) In the first conventional example described above, when the substrate 1 repeatedly expands and contracts due to changes in the environment, the substrate 1 and the conductive pattern 2
Due to the difference in expansion coefficient between the connecting conductor 5 and the connecting conductor 5 soldered to the conductor pattern 2
There is a problem that 3 and 3 peel off from the substrate 1.

In the second conventional example, the expansion and contraction of the substrate 1 can be absorbed by the connection conductor 9, and the conductor patterns 2 and 6 are connected to the substrate 1.
Although the problem of peeling off from the conductor patterns 2 and 6 is solved, it is necessary to shift the connection positions of the conductor patterns 2 and 6 and the connection conductor 9 in the horizontal direction, so that the holes 7 and There is a problem in that a relatively long connection length corresponding to the length between the holes 8 is required, and the substrate 1 becomes larger accordingly.

In the third conventional example, the expansion and contraction of the substrate 1 can be absorbed by the connection conductor 13, and the problem of the conductor patterns 2 and 12 peeling off from the substrate 1 is solved, and furthermore, the connection conductor 13 is able to absorb the expansion and contraction of the substrate 1. Unlike the conventional example, the board 1 is not enlarged, but the connecting conductor 13 must be arranged so as to bypass the end of the board 1, and the conductive wires 14 and 14 must be connected to the conductor patterns 2 and 12, respectively. Therefore, there are problems in that the connection work is troublesome and the appearance is poor.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to prevent conductor patterns from peeling off even when the environment changes, to prevent the board from increasing in size due to pattern connection, to facilitate connection work, and to maintain a good appearance. The purpose is to provide a circuit board that can be used.

[Structure of the Invention] (Means for Solving the Problems) The circuit board of the present invention connects the conductor patterns formed on both surfaces of the board with a connecting conductor, and the connecting conductor is a first connection portion that penetrates the substrate and is connected to the conductor pattern on one side of the substrate; and an end portion of the first connection portion that is connected to the conductor pattern on the other side of the substrate; The device is characterized by being constructed of a single wire, comprising a second connecting portion that is close to the second connecting portion, and a bent portion that connects the end of the first connecting portion and the end of the second connecting portion. That is.

(Function) According to the circuit board of the present invention, since the connecting conductor has a bent portion connecting the end of the first connecting portion and the end of the second connecting portion, Expansion and contraction can be absorbed by the bending section.

Further, the connecting conductor penetrates the board and has an end of the first connecting part connected to the conductive pattern on one side of the board, and an end of the second connecting part connected to the conductive pattern on the other side of the board. Since the structure is such that they are close to each other, the connection length for pattern connection is not very long.

(Example) Hereinafter, a first example of the present invention will be described with reference to FIG. That is, 20 is a substrate, 21 is a conductor pattern formed on the upper surface of one side of the substrate 20, and 22 is a substrate 2.
a conductive pattern formed on the lower surface portion of the other surface portion of 0;
23 is a hole formed in the substrate 2o so as to penetrate therethrough.

Now, 24 is a connection conductor made of one wire, which connects the first connection part 25 and the first connection part 25.
a second connecting portion 26 located substantially perpendicular to the first connecting portion 25 and having a proximal end 26a close to the proximal end 25a of the first connecting portion 25;
An arcuate bent portion 27 connects the proximal end 25a of the first connecting portion 25 and the proximal end 26a of the second connecting portion 26, forming an approximately α-shape as a whole. Thus, the first connecting portion 25 of the connecting conductor 24 is inserted into the hole 23, the tip portion 25b thereof is soldered to the conductive pattern 21, and the intermediate portion of the second connecting portion 26 is connected to the conductive pattern 22. Both conductor patterns 21 and 22 are connected by soldering.

In the above embodiment with such a configuration, the substrate 20 repeatedly expands and contracts due to environmental changes, and the thickness of the substrate 20, for example, the tip portion 26b of the second connecting portion 26 and the first connecting portion 25.
Even if the distance from the tip 25b changes, this change in size is absorbed by the curved portion 27 and no stress is generated on the conductor patterns 21 and 22. Therefore, unlike the first conventional example, the conductor pattern Patterns 21 and 22 will not peel off from substrate 20. In addition, in the connection conductor 24, the base end 25a of the first connection part 25 penetrates through the substrate 20 and is connected to the conductor pattern 21 on the upper surface thereof, and the base end 25a is connected to the conductor pattern 22 on the lower surface of the substrate 20. Second connection part 26
Unlike the second conventional example, the connection length for pattern connection is not very long, and the board 20 does not become large. .

Further, since the connecting conductor 24 can be soldered to the conductor patterns 21 and 22 in the same manner as in the first conventional example, unlike the third conventional example, the connection work to the conductor patterns 21 and 22 is facilitated. The appearance also improves. Furthermore, since the connecting conductor 24 has an arc-shaped bent portion 27 that protrudes from the substrate 20, there is an advantage that this can be used as a test terminal.

FIG. 2 shows a second embodiment of the present invention, which differs from the first embodiment in that a connecting conductor 28 made of a single wire is used instead of the connecting conductor 24. this is,
A long first connecting portion 29 and a second approximately inverted-shaped portion having one side parallel to the first connecting portion 29 and having a base end 30a close to the base end 29a of the connecting portion 29. and a substantially circular bent portion 31 connecting the base end portions 29a, 30a of these connecting portions 29, 30. Thus, the conductor pattern 21.2 by the connecting conductor 28
The connection work in 2 is the same as in the first embodiment, in which the tip 29b of the first connection part 29 is soldered to the conductor pattern 21, and the side part on the side of the tip 30b of the second connection part 30 is soldered to the conductor pattern 21. The pattern 22 is soldered.

FIG. 3 shows a third embodiment of the present invention, which differs from the first embodiment in that a connecting conductor 32 made of a single wire is used instead of the connecting conductor 24. this is,
A first connecting portion 33 similar to the connecting portion 25, and a first connecting portion 33 similar to the connecting portion 25;
A second connecting portion 34 similar to the connecting portion 26 whose proximal end 34a is close to the proximal end 33a of the connecting portion 33 of It consists of a circular curved portion 35. Therefore, the connecting conductor 32
Conductor pattern 21. The connection work of '22 is the same as in the first embodiment, in which the tip 33b of the first connection part 33 is soldered to the conductor pattern 21, and the second connection part 34 is soldered to the conductor pattern 22. .

FIG. 4 shows a fourth embodiment of the present invention, which differs from the first embodiment in that a connecting conductor 36 made of a single wire is used instead of the connecting conductor 24. this is,
A first connecting portion 37 similar to the connecting portion 25, and this first connecting portion 37
The proximal end portion 37 a of the connecting portion 37 of 1. a second connecting portion 38 similar to the connecting portion 26 in which the proximal end portion 38a is close;
Proximal end 37 a + 3 of these connecting parts 37, 38
8a, and a U-shaped curved portion 39 connecting the parts 8a to 8a. The connection work of the conductor patterns 21 and 22 by the connection conductor 36 is the same as in the first embodiment, and the tip end 37b of the first connection part 37 is soldered to the conductor pattern 21, and the second connection The portion 38 is soldered to the conductive pattern 22.

These second to fourth embodiments also provide the same effects as the first embodiment.

In each of the above embodiments, conductor patterns 21 and 22 are formed on the upper and lower surfaces of the - substrate 20, but instead two substrates each having a conductor pattern formed on one surface are used. It is also possible to use one in which the two are bonded together on the other surface.

[Effects of the Invention] As is clear from the above description, the present invention provides connection conductors that connect conductor patterns formed on both surfaces of a substrate by penetrating through the substrate and connecting conductor patterns formed on one side of the substrate. a second connecting portion connected to the conductor pattern on the other side of the substrate and having an end thereof close to an end of the first connecting portion; Since it is constructed of a single wire and consists of a curved part that connects the end of the connection part and the end of the second connection part, it is possible to prevent the conductor pattern from peeling off even if the environment changes, The connection length for pattern connection does not become so large, the board does not become large, connection work can be easily performed, and the appearance can be improved, which are excellent effects.

[Brief explanation of the drawing]

FIG. 1 is a side view showing the first embodiment of the present invention, FIG. 2 is a view corresponding to FIG. 1 showing the second embodiment of the present invention, and FIG.
The figure is a diagram corresponding to FIG. 1 showing a third embodiment of the present invention, and FIG. 4 is a diagram corresponding to FIG. 1 showing a fourth embodiment of the present invention. FIG. 5 is a diagram equivalent to FIG. 1 of the first conventional example, FIG. 6 is a diagram equivalent to FIG. 1 of the second conventional example, and FIG. 7 is a diagram equivalent to FIG. 1 of the third conventional example. be. In the figure, 20 is a substrate, 21 is a conductor pattern, 22 is a conductor pattern, 23 is an insertion hole, 24, 28, 32 and 36 are connection conductors, 25, 29, 33 and 37 are first connection parts, 2
5a, 29a, 33a and 37a are proximal ends (ends), 2
6, 30. 34 and 38 are second connection parts, 26a, 30
-a, 34a and 38a are proximal ends (ends), 27, 31
．． 35 and 39 indicate curved portions. Applicant: Toshiba Corporation Applicant: Toshiba Audio/Video Engineering Co., Ltd. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] 1. The conductor patterns formed on both sides of the substrate are connected by a connecting conductor, and the connecting conductor is connected to a first conductor pattern that penetrates the substrate and is connected to the conductor pattern on one side of the substrate. a second connecting portion connected to the conductor pattern on the other surface of the substrate and having an end close to the end of the first connecting portion; 1. A circuit board characterized in that the circuit board is constructed of a single wire so as to include a curved part that connects the ends of two connecting parts.