JPH0453179A - Flexible printed board and manufacture thereof - Google Patents
Flexible printed board and manufacture thereofInfo
- Publication number
- JPH0453179A JPH0453179A JP15770590A JP15770590A JPH0453179A JP H0453179 A JPH0453179 A JP H0453179A JP 15770590 A JP15770590 A JP 15770590A JP 15770590 A JP15770590 A JP 15770590A JP H0453179 A JPH0453179 A JP H0453179A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- land
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 11
- 230000008054 signal transmission Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
フレキシブルプリント基板を他のフレキシブルプリント
基板又は普通のプリント基板に接続する接続方法に関し
、
フレキシブルプリント板の中間で他の基板へ接続可能と
することを目的とし、
可撓性及び絶縁性を有するベースフィルムと、その上に
設けられた導体線とを少なくとも具備して成るフレキシ
ブルプリント基板において、上記導体線にランドを設け
、該ランド及びベースフィルムを貫通して周辺がジグザ
グ状の孔を設けるように構成する。[Detailed Description of the Invention] [Summary] Regarding a connection method for connecting a flexible printed circuit board to another flexible printed circuit board or an ordinary printed circuit board, the present invention aims to enable connection to another board in the middle of the flexible printed circuit board. A flexible printed circuit board comprising at least a flexible and insulating base film and a conductor wire provided thereon, wherein a land is provided on the conductor wire and the land and the base film are penetrated. It is configured to have a hole with a zigzag shape around the periphery.
また上記フレキシブルプリント基板のランドを貫通した
孔を通して、該ランドと、他のプリント基板のランドと
を半田ブリッジにて接続するように構成する。Further, the land is connected to a land of another printed circuit board by a solder bridge through a hole penetrating the land of the flexible printed circuit board.
本発明はフレキシブルプリント基板を他のフレキシプル
プリント基板又は普通のプリント基板に接続する接続方
法に関する。The present invention relates to a connection method for connecting a flexible printed circuit board to another flexible printed circuit board or an ordinary printed circuit board.
現在各種電子装置においては、実装上の利便のため、銅
箔よりなる導体線をポリイミド等のベースフィルム上に
形成した柔軟性のあるフレキシブルプリント基板が広く
使用されている。Currently, in various electronic devices, flexible printed circuit boards, in which conductor wires made of copper foil are formed on a base film such as polyimide, are widely used for convenience in mounting.
このため、フレキシブルプリント基板同士、又はフレキ
シブルプリント基板と普通のプリント基板との接続を安
価で且つ高信頼で行なう必要がある。Therefore, it is necessary to connect flexible printed circuit boards to each other or to connect flexible printed circuit boards to ordinary printed circuit boards at low cost and with high reliability.
従来のフレキシブルプリント基板の代表例を第４図に示
す。これはポリイミド等よりなるベースフィルム１の上
に銅等を用いた導体線２を設け、その上を保護フィルム
３で覆ったものである。この他図示しないがベースフィ
ルムの両面に導体線を設けたもの、あるいは保護フィル
ムを省いたものなどがある。A typical example of a conventional flexible printed circuit board is shown in FIG. In this case, a conductor wire 2 made of copper or the like is provided on a base film 1 made of polyimide or the like, and the conductor wire 2 is covered with a protective film 3. In addition, although not shown, there are those in which conductor wires are provided on both sides of the base film, and those in which a protective film is omitted.
このようなフレキシブルプリント基板の他のプリント基
板への接続方法としては、専用のコネクタが広く使われ
ている。しかし専用コネクタは高価であるため、直接半
田付けによる接続方法も用いられている。A dedicated connector is widely used as a method for connecting such a flexible printed circuit board to another printed circuit board. However, since dedicated connectors are expensive, direct soldering connection methods are also used.
第５図は従来公知の半田付けによる接続方法を示す図で
ある。この方法は図に示すようにフレキシブルプリント
基板４の端部に導体線２に接続した半月状のランド５を
設け、この部分の保護フィルムを除去しておき、このラ
ンド５を半田ブリッジ６で他のプリント基板７の導体線
８に接続している。FIG. 5 is a diagram showing a conventionally known connection method by soldering. In this method, as shown in the figure, a half-moon-shaped land 5 connected to the conductor wire 2 is provided at the end of the flexible printed circuit board 4, the protective film of this part is removed, and the land 5 is connected to another part using a solder bridge 6. It is connected to the conductor wire 8 of the printed circuit board 7.
上記従来のフレキシブルプリント基板の半田による接続
方法では、フレキシブルプリント基板の端部でのみ接続
可能であり、フレキシブルプリント基板の中間で他のプ
リント基板へ信号を接続する場合には使用できないとい
う問題があった。The above conventional method of connecting flexible printed circuit boards by soldering has the problem that connections can only be made at the ends of the flexible printed circuit board, and cannot be used when connecting signals to other printed circuit boards in the middle of the flexible printed circuit board. Ta.
本発明は上記従来の問題点に鑑み、フレキシブルプリン
ト基板の中間において他のプリント基板に接続できるフ
レキシブルプリント基板及びその接続方法を提供するこ
とを目的とする。SUMMARY OF THE INVENTION In view of the above conventional problems, an object of the present invention is to provide a flexible printed circuit board that can be connected to another printed circuit board in the middle of the flexible printed circuit board, and a method for connecting the flexible printed circuit board.
上記目的を達成するために本発明のフレキシブルプリン
ト基板においては、可撓性及び絶縁性を有するベースフ
ィルム１３と、その上に設けられた導体線１１とを少な
くとも具備して成るフレキシブルプリント基板において
、上記導体線１１にランド１２を設け、該ランド１２及
びベースフィルム１３を貫通して周辺がジグザグ状の孔
１４を設けたことを特徴とする。In order to achieve the above object, the flexible printed circuit board of the present invention includes at least a flexible and insulating base film 13 and a conductor wire 11 provided thereon. The present invention is characterized in that a land 12 is provided on the conductor wire 11, and a hole 14 having a zigzag shape at the periphery is provided through the land 12 and the base film 13.
また本発明のフレキシブルプリント基板の接続方法では
、上記フレキシブルプリント基板１０のランド１２を貫
通した孔１４を通して、該ランド１２と、他のプリント
基板１６の導体１７とを半田ブリッジ１８にて接続する
ことを特徴とする。Further, in the flexible printed circuit board connection method of the present invention, the land 12 of the flexible printed circuit board 10 is connected to the conductor 17 of another printed circuit board 16 by a solder bridge 18 through the hole 14 penetrating the land 12. It is characterized by
本発明はフレキシブルプリント基板１０の導体線１１に
ランド１２を設け、その下のベースフィルム１３と共に
該ランド１２に周辺がジグザグ状をした貫通孔１４を設
けたことにより、フレキシブルプリント基板１０の中間
で他のプリント基板１６の導体１７に半田ブリッジ１８
で接続することができる。またランド１２に設けた孔１
４がジグザグ状の周辺を有するため半田との接触辺が長
くなり、半田付けの信頼性を向上することができる。In the present invention, a land 12 is provided on the conductor wire 11 of the flexible printed circuit board 10, and a through hole 14 having a zigzag shape around the periphery is provided in the land 12 together with the base film 13 below. Solder bridge 18 to conductor 17 of other printed circuit board 16
can be connected with. Also, the hole 1 provided in the land 12
4 has a zigzag-shaped periphery, the contact side with the solder becomes longer, and the reliability of soldering can be improved.
第１図は本発明のフレキシブルプリント基板の実施例を
示す図であり、（ａ）は平面図、（ｂ）はａ図のＢ部拡
大図、（Ｃ）はｂ図のｃ−ｃ線における断面図である。FIG. 1 is a diagram showing an embodiment of the flexible printed circuit board of the present invention, (a) is a plan view, (b) is an enlarged view of part B in diagram a, and (C) is a view taken along line c-c in diagram b. FIG.
本実施例は、同図に示すように、フレキシブルプリント
基板１０の導体線１１の途中にランド１２を設け、該ラ
ンド１２に、その下のベースフィルム１３と共に周辺が
ジグザグ状の孔１４を設け、且つランド１２の上の部分
の保護フィルム１５を除去したものである。なおベース
フィルムの両面に導体線を有するフレキシブルプリント
基板の場合には、上面の導体線に設けたランドに対向す
る下面の導体線部分は除去しておく必要がある。In this embodiment, as shown in the figure, a land 12 is provided in the middle of the conductor wire 11 of the flexible printed circuit board 10, and a hole 14 with a zigzag shape around the periphery is provided in the land 12 together with the base film 13 below. In addition, the protective film 15 above the land 12 has been removed. In the case of a flexible printed circuit board having conductor wires on both sides of the base film, it is necessary to remove the conductor wire portion on the lower surface that faces the land provided on the conductor wire on the upper surface.
このように構成された本実施例は、フレキシブルプリン
ト基板の中間で他のプリント基板と接続することができ
る。In this embodiment configured in this way, the flexible printed circuit board can be connected to another printed circuit board in the middle.
第２図は本発明のフレキシブルプリント基板の接続方法
を示す図である。FIG. 2 is a diagram showing a method of connecting a flexible printed circuit board according to the present invention.
本接続方法は、第１図で説明したフレキシブルプリント
基板１０を用い、第２図の如くランド１２を他のプリン
ト基板１６の導体１７に孔１４を通して半田付けし、半
田ブリッジ１８を形成して接続するのである。This connection method uses the flexible printed circuit board 10 described in FIG. 1, and solders the land 12 to the conductor 17 of another printed circuit board 16 through the hole 14 as shown in FIG. 2, forming a solder bridge 18 for connection. That's what I do.
本接続方法によればフレキシブルプリント基板１０を、
その中間で他のプリント基板１６（フレキシブルプリン
ト基板又は通常のプリント基板を含む）に接続でき、且
つ孔１４がジグザグ状の周辺を有しているため半田との
接触辺が長くなり、半田付けの信頼性が向上する。According to this connection method, the flexible printed circuit board 10
It can be connected to another printed circuit board 16 (including a flexible printed circuit board or a normal printed circuit board) in the middle, and since the hole 14 has a zigzag-shaped periphery, the contact side with the solder is long, making it easier to solder. Improved reliability.
第３図は本発明をサーマルプリンタのヘッド信号伝達用
フレキシブルプリント基板に応用した例を示す図である
。同図において１９はサーマルヘッド、２０はサーマル
ヘッドの信号伝達用フレキシブルプリント基板、２１は
その端子部、２２は接続されるフレキシブルプリント基
板、２３は接続部の半田ブリッジである。そしてフレキ
シブルプリント基板２２は、その中間で半田ブリッジ２
３により信号伝達用のフレキシブルプリント基板２０に
接続されている。このように本接続方法によればフレキ
シブルプリント基板をその中間の所要の位置で他のプリ
ント基板に接続することができ、且つ端部で接続するよ
りも強度的に有利である。FIG. 3 is a diagram showing an example in which the present invention is applied to a flexible printed circuit board for head signal transmission of a thermal printer. In the figure, 19 is a thermal head, 20 is a flexible printed circuit board for signal transmission of the thermal head, 21 is a terminal portion thereof, 22 is a flexible printed circuit board to be connected, and 23 is a solder bridge for a connecting portion. The flexible printed circuit board 22 has a solder bridge 2 in between.
3, it is connected to a flexible printed circuit board 20 for signal transmission. As described above, according to the present connection method, a flexible printed circuit board can be connected to another printed circuit board at a desired position in the middle, and is more advantageous in terms of strength than connecting at an end.
以上説明した様に、本発明によれば、フレキシブルプリ
ント基板を、その中間で他のプリント基板へ接続するこ
とができる。またその接続は強度及び接続の信頼性が高
く装置の性能向上に寄与するところ大である。As explained above, according to the present invention, a flexible printed circuit board can be connected to another printed circuit board in the middle thereof. In addition, the connection has high strength and reliability, and greatly contributes to improving the performance of the device.
第１図は本発明のフレキシブルプリント基板の実施例を
示す図、
第２図は本発明のフレキシブルプリント基板の接続方法
を示す図、
第３図は本発明をサーマルヘッド信号伝達用フレキシブ
ルプリント基板に応用した例を示す図、第４図は従来の
フレキシブルプリント基板を示す図、
第５図は従来のフレキシブルプリント基板の他のプリン
ト基板への半田接続方法を示す図である。
図において、
１０はフレキシブルプリント基板、
１１は導体線、
１２はランド、
１３はベースフィルム、
１４はジグザグ状の孔、
１５は保護フィルム、
１６は他のプリント基板、
１７は他のプリント基板の導体、
１８は半田ブリッジ
を示す。Fig. 1 is a diagram showing an embodiment of the flexible printed circuit board of the present invention, Fig. 2 is a diagram showing a connection method of the flexible printed circuit board of the present invention, and Fig. 3 is a diagram showing an embodiment of the flexible printed circuit board of the present invention. FIG. 4 is a diagram showing a conventional flexible printed circuit board, and FIG. 5 is a diagram showing a method of soldering a conventional flexible printed circuit board to another printed circuit board. In the figure, 10 is a flexible printed circuit board, 11 is a conductor wire, 12 is a land, 13 is a base film, 14 is a zigzag hole, 15 is a protective film, 16 is another printed circuit board, and 17 is a conductor of another printed circuit board. , 18 indicates a solder bridge.
Claims (2)
と、その上に設けられた導体線（１１）とを少なくとも
具備して成るフレキシブルプリント基板において、 上記導体線（１１）にランド（１２）を設け、該ランド
（１２）及びベースフィルム（１３）を貫通して周辺が
ジグザグ状の孔（１４）を設けたことを特徴とするフレ
キシブルプリント基板。1. Base film with flexibility and insulation (13)
and a conductor wire (11) provided thereon, wherein a land (12) is provided on the conductor wire (11), and the land (12) and the base film (13) are provided on the conductor wire (11). A flexible printed circuit board characterized by having a hole (14) having a zigzag shape around the periphery extending through the board.
のランド（１２）を貫通した孔（１４）を通して、該ラ
ンド（１２）と、他のプリント基板（１６）の導体（１
７）とを半田ブリッジ（１８）にて接続することを特徴
とするフレキシブルプリント板の接続方法。2. Flexible printed circuit board (10) according to claim 1.
The conductor (1) of the land (12) and the other printed circuit board (16) are connected through the hole (14) penetrating the land (12) of the
7) and a flexible printed board connection method characterized by connecting with a solder bridge (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15770590A JPH0453179A (en) | 1990-06-18 | 1990-06-18 | Flexible printed board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15770590A JPH0453179A (en) | 1990-06-18 | 1990-06-18 | Flexible printed board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0453179A true JPH0453179A (en) | 1992-02-20 |
Family
ID=15655574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15770590A Pending JPH0453179A (en) | 1990-06-18 | 1990-06-18 | Flexible printed board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453179A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6822169B2 (en) | 2001-06-07 | 2004-11-23 | Matsushita Electric Industrial Co., Ltd. | Flexible printed circuit board and connecting method thereof |
| CN110972410A (en) * | 2020-01-07 | 2020-04-07 | 电子科技大学 | Method for realizing rapid tin conduction of multilayer interconnected FPC (flexible printed circuit) |
-
1990
- 1990-06-18 JP JP15770590A patent/JPH0453179A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6822169B2 (en) | 2001-06-07 | 2004-11-23 | Matsushita Electric Industrial Co., Ltd. | Flexible printed circuit board and connecting method thereof |
| CN110972410A (en) * | 2020-01-07 | 2020-04-07 | 电子科技大学 | Method for realizing rapid tin conduction of multilayer interconnected FPC (flexible printed circuit) |
| CN110972410B (en) * | 2020-01-07 | 2021-04-20 | 电子科技大学 | Method for realizing rapid tin conduction of multilayer interconnected FPC (flexible printed circuit) |
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