JPH01178383A - Joining body and its manufacture - Google Patents

Abstract

PURPOSE:To simultaneously form the joining body of high reliability and the cooling hole of excellent air-tightness by forming a liquid phase at the low temp. than the m.p. of the joining body element between the joining body elements forming the small groove for a cooling hole on the end face and executing diffused joining by interposing the thin film layer solid soluble with the joining body element. CONSTITUTION:The joining body elements 4a, 4b formed by a copper sheet are abutted via a thin film layer 10. Plural small grooves 6 for cooling hole are formed on the end face of the joining body element 4a and the joining body element 4b becomes the cover of the small groove 6. The thin film layer 10 is formed by a titanium foil 11, fixing the joining body elements 4a, 4b interposing the titanium foil 11 on the base 13 of the inside of a vacuum furnace 12 and placing a pressurizing weight 14. The vacuum furnace 12 inside is then subjected to pressure reducing and heated by a heater 15. According 10 the progress of the heating a liquid phase is formed with the mutual diffusion being progressed on a joining face 7, joining is executed via the liquid phase and a cooling hole 8 is formed at the inner part of and integrated joining body 5.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a bonded body with cooling holes, which is used as a material for an electrode plate of a beam heater, and a method for manufacturing the same. In particular, the present invention relates to a method for producing a bonded body with extremely small amount of deformation (in which a highly reliable bonded body and a cooling hole with excellent airtightness can be simultaneously formed).

(Prior art) Materials generally used for beam acceleration electrode plates include:
In order to ensure electrical properties, cooling capacity, etc., a copper plate with excellent electrical and thermal conductivity is used.

Generally, the beam acceleration electrode plate is heated to a high temperature during use, so cold 7JI operation is required. As shown in FIG. 3(a), a conventional beam acceleration electrode plate 1 has an electrode plate main body 1a formed of a copper plate and a cooling pipe 3 made of copper using a brazing material 2.
a is fixed. In addition, the cold M1 area of the cooling pipe has been increased,
For the purpose of improving the cooling capacity, a cooling pipe 3b having a rectangular cross section may be brazed to the electrode plate main body 1a as shown in FIG. 3(b).

During use, a cooling fluid flows in the cooling pipes 3a and 3b, and the beam acceleration electrode plate 1 is cooled to a predetermined temperature.

However, when the beam acceleration electrode plate 1 using the brazing filler metal 2 as shown in FIGS. 3(a) and 3(b) is used in a high vacuum, components with high vapor pressure contained in the brazing filler metal 2 It evaporates over time and greatly impedes beam acceleration performance.

Therefore, before use, a baking operation is performed for a long time to remove volatile components that generate vapor pressure, but the removal is not complete. Therefore, there is a limit to maintaining the performance of the beam accelerator.

In order to solve the above problem, FIG. 3(C).

As shown in (d), a plurality of joined body elements 4 are butted against each other without using the brazing material 2, and the joint end faces 7 are welded or diffusion bonded to form a joined body 5. A method has also been developed in which the bonded body 5 is used as a material for the beam acceleration electrode plate 1.

That is, FIG. 3(C) is a sectional view showing the structure of the joined body 5 disclosed in JP-A-62-034426, in which a plurality of joined body elements 4 each having narrow grooves 6 for cooling holes formed on the end face thereof. are abutted so that the open ends of both narrow grooves 6 coincide, and the abutted joining end surfaces 7 are joined by, for example, an electron beam welding bead 9 to obtain an integrated joined body 5. Cooling holes 8 are formed inside the joined body 5 by opposed narrow holes 16.6.

In addition, Figure 3(d) shows the structure of the bonded body JJ3 and its manufacturing method disclosed in Proceedings of the 4th Annual Meeting of the Japan Society for Plasma and Nuclear Fusion Science, page 29, ``C6rNB If Electrode Plate New Manufacturing Method''. There is.

In other words, the joined body 5 shown in FIG. 3(d) consists of two flat joined body elements 4. a and 4b, and narrow grooves 6 for cooling holes are formed in the lower joint element 4a. The conjugate element 4b is assembled so as to cover the full length 6 of the conjugate element 4a. Next, the joined body elements 4a, 4b are heated and pressurized in a vacuum. At this time, solid-phase diffusion occurs at the joint end surface 7, the joined body elements 4a and 4b are joined, and the integrated joined body 5 is 1q, and at the same time, fine particles are added inside the joined body 5.
Cooling holes 8 are formed by i46.

The bonded body 5 shown in FIG. 3(d) has a larger area of the bonded end surface compared to the bonded body 5 shown in FIG. 3(C), and therefore has superior mechanical strength.

(Problem to be solved by the invention) However, in the joined body shown in FIG. 3(C),
There are problems in that electron beam welding tends to be misaligned during bonding work, making it difficult to perform highly accurate bonding work, and deformation due to welding distortion tends to occur, resulting in reduced dimensional accuracy.

In addition, in the joined body shown in FIG. 3(d), in order to join each cooling hole airtightly and prevent leakage of cooling fluid,
Requires considerable pressure operation.

However, when a strong pressing force is applied, the thin grooves formed for cooling holes are deformed or crushed, resulting in a decrease in removal efficiency, and there is a drawback that the entire joined body is significantly deformed. On the other hand, if the bonding is performed using a pressing force that does not cause deformation, there is a problem in that sufficient airtightness of the bonded portion cannot be obtained.

The present invention has been made in order to solve the above-mentioned problems, and it is a joined body that has extremely little deformation, has high reliability, and can simultaneously form cooling holes with excellent airtightness. The purpose of the present invention is to provide a joined body and a method for manufacturing the same.

[Structure of the invention]

(Means for Solving the Problems) The joined body according to the first invention of the present application is composed of a plurality of joined body elements each having narrow grooves for cooling holes formed in the end face, and has a liquid state at a temperature lower than the melting point of the joined body elements. A thin film layer that generates a solid solution with the joined body elements is provided between the joined body elements, and the joined body elements are diffusion bonded together through the thin film layer to form a cooling hole inside the integrated joined body elements. It is characterized by the fact that it has been formed.

Further, the method for manufacturing a bonded body according to the second invention of the present application is such that a liquid phase is formed at a temperature lower than the melting point of the bonded body elements between a plurality of bonded body elements in which thin grooves for cooling holes are formed in at least one of the bonded end surfaces. By applying heat and pressure under vacuum conditions, interdiffusion occurs on the bonded end surfaces, and the abutted bonded body elements are joined and integrated. The method is characterized in that cooling holes are formed inside the joined body at the same time as forming the joined body.

(Function) According to the joined body having the above structure and its manufacturing method, since a thin film layer is provided between the joined body elements, which generates a liquid phase at a temperature lower than the melting point of the joined body elements and forms a solid solution with the joined body elements, heating During operation, the S film layer dissolves to produce a liquid phase through which the atoms of the conjugate element and the atoms of il fiffJffl interdiffuse and rapidly form a eutectic composition.

Since the mutual diffusion rate in this liquid phase is higher than that in the conventional solid phase, the mutual diffusion rate per unit time is large, and the hot stone gradient of each atom near the joint end face is small, causing the joint to The properties of the material change continuously from those of the base material. Therefore, discontinuous surfaces between the base materials that occur in conventional brazing joints are not formed, so that a joined body with excellent mechanical strength can be obtained.

Furthermore, since a liquid phase is generated at the joint end surfaces, a good joint surface with excellent adhesion can be obtained over the entire joint surface of the mountain cherry combination element by simply applying a small pressure force. Also,
The narrow grooves formed for the cooling holes are less likely to be deformed by pressing force, reducing cooling efficiency, and the dimensional accuracy of the product is less likely to be reduced due to deformation.

Furthermore, since the cooling holes are formed at the same time as the joining operation, the manufacturing process is simplified compared to the conventional method of fixing cooling pipes to the outer surface of the member. Furthermore, since cooling holes are formed inside the joined body and a large cooling surface area is ensured, there is an advantage that the cooling effect is increased.

(Example) Next, an example of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an embodiment of a tM yji of a joined body and an apparatus for carrying out the manufacturing method thereof according to the present invention.

Two joined body elements 4a and 4b made of steel are butted together with a JV membrane layer 10 interposed therebetween. A plurality of narrow grooves 6 for cooling holes are formed in the end face of the joined body element 4a. Zygote element 4
b serves as a lid that closes the narrow groove 6.

The thin film layer 10 is formed by inserting a titanium foil 11 having a J width of several μm into the joint end surface 7. The joined body elements 4a and 4b with the titanium pores 11 interposed therebetween are mounted on the sample stage 13 in the vacuum furnace 12.
fixed on top. A pressure weight 14 made of stainless steel, for example, is placed on the joined body elements 4a, 4b. The pressure intensity by the pressure weight 14 is set to 10 to 100 g/cti.

With the joined body elements 4a and 4b fixed as described above, the inside of the vacuum furnace 12 is depressurized and maintained at a degree of vacuum of about 10-4 to 10-5 Torr. Heat.

As the heating operation progresses, phase n diffusion progresses between the copper atoms (Cu) of the bonded body elements 4a, 4b and the titanium atoms (T i ) of the thin film layer 10 at the bonding end surface 7. When the temperature of the joined body elements 4a, 4b rises to about 900°C,
As shown in the T + -CLl binary phase diagram (not shown), a eutectic reaction between copper and titanium occurs.

And the eutectic composition is T1-63wt%Cu~Ti-70
A liquid phase is generated in a region where mutual diffusion has progressed to about wt% Qu. When held at the above temperature, interdiffusion further progresses over time, and the compositional region where a liquid phase is produced moves.

1 corresponding to the Jl of the titanium foil 11 interposed in this way.
When the temperature is maintained for ~60 minutes, bonding is performed through mutual diffusion and liquid phase at the bonding end surface 7.
will adhere closely, and any gaps or voids that existed before joining will disappear.

After a predetermined heating time has elapsed, the bonding work is completed by cooling to room temperature while maintaining the degree of vacuum. At the same time as the joining operation is completed, the open ends of the narrow grooves 6 are tightly intersected by the opposing joined body elements 4b, and cooling holes 8 are formed inside the integrated joined body 5.

According to this embodiment, since the bonding is performed through the liquid phase, the adhesion of the bonded portion is superior to that of solid phase bonding, and gaps and voids in the bonded portion can be eliminated with an extremely small pressurizing force. .

Further, deformation of the joined body can be suppressed to a small level. Therefore, it is possible to prevent the cooling holes formed inside the joined body from being deformed or crushed, thereby reducing the cooling efficiency and reducing the dimensional accuracy of the product.

Furthermore, since the bonding operation is performed through a liquid phase, the diffusion rate between copper and titanium metal atoms increases compared to the case of in-phase bonding, and bonding can be accomplished in a short time. Therefore, grain coarsening and intergranular cracking of the copper plate can be effectively prevented.

Furthermore, the titanium inserted into the joint as a thin film layer 10 is
Since it has a lower vapor pressure than the copper constituting the joined body element, it is possible to obtain a good joint with less influence of gaps or voids. In particular, compared to a joining method using a silver brazing filler metal containing a metal element with a higher vapor pressure than steel, it is possible to obtain significantly higher joining strength.

In addition, because the diffusion rate of metal atoms is high, the concentration gradient at the joint changes continuously and smoothly from the joining base material, compared to a brazed joint that has a discontinuous concentration gradient. A joint with high mechanical strength can be obtained.

Furthermore, since the open end of the narrow groove 6 is closed at the same time as the joining operation and the cooling hole 8 is formed, the manufacturing process of the joined body is greatly simplified compared to the conventional method of fixing the cooling pipe to the outer surface of the member. Ru. Further, the cooling holes 8 are formed inside the joined body 5, and a large cooling surface area is ensured, so that the cooling effect is greatly increased.

Next, other embodiments will be described.

In this example, steel or copper alloy is used as the joint element, while i*Fa is formed of silicon (S;) or zirconium (Zr). When using silicon, the bonding temperature is set at 810-850°C, and when using zirconium, it is set at about 900-920°C.

At the above bonding temperature, both components undergo a eutectic reaction with the copper constituting the bonded body elements, so a liquid phase is generated at the bonded portion, and the mutual diffusion of metal elements through the liquid phase causes both bonded body elements to are joined together.

In this example as well, since bonding is performed via a liquid phase, it is possible to obtain a bonded body with a small pressurizing force, a small amount of deformation of the bonded body, and excellent bonding strength.

In yet another embodiment, the assembly element is made of molybdenum (MO) or a molybdenum alloy, which is a high melting point material, while the i layer is made of gold (Au>foil).
A liquid phase is formed by the eutectic reaction between molybdenum and gold, and the same effect as in the previous example has been demonstrated.

Further, while the joining body element is formed of copper or a copper alloy, 1
When a copper alloy foil containing 10 wt% of tin (Sn) is used as the 11th layer, the change in the concentration gradient of copper and tin at the joint becomes more gradual, making it possible to obtain a joined body with excellent mechanical strength. can.

FIG. 2 is a perspective view showing the state in which a cylindrical joined body is formed by the method of the present invention.

A pair of joined body elements 4a formed in the shape of copper pipes.

4b are butted against each other in the axial direction to form an integrated joined body 5. A titanium layer 16 is formed as a thin film layer 10 on the joining end surface 7 of at least one of the joined body elements 4a, 4b.

This titanium layer 76 is formed, for example, by an ion plating method in which titanium is ionized in an empty space or in an inert gas atmosphere, and at the same time, electricity is applied between enclosed electrodes to plate the end faces of the assembly elements.

The bonded body elements 4a, 4b&: about 100 g/cIi (7
) 5 x 10'Tor with applied pressure
It is heated to 900° C. in a vacuum furnace of r culm degree, held for 10 minutes, and then cooled to obtain an integrated joined body 5.

In this bonding operation, a liquid phase is also formed in the titanium layer 16, and the bonded body element 4a is bonded with only a small pressing force.

4b are in close contact with each other, so there is little deformation of the joined body 5.

Further, unlike the conventional method, a pressurizing device that generates a large pressurizing force is not required. Furthermore, since the ion plating method makes it possible to form an extremely thin thin film layer 10, the influence of vapor generated from the joint can be significantly reduced.

In the above embodiments, the thin film layer 10 is formed by inserting a metal foil into the bonding f4 surface, or
Although the ion plating method is used, other thin film forming methods may be used.

That is, a voltage is applied between the electrodes in a low-pressure gas atmosphere to ionize the gas, and the gas ions collide with the metal material, causing the metal atoms ejected from the surface of the metal material to enter the interior of the opposing base material. It is also possible to employ physicochemical vapor phase growth methods such as sputtering, which forms a thin metal film by replacing atoms of the material, and vacuum evaporation, which directly condenses gaseous atoms onto the end faces of the low-temperature bonded elements.

According to the above-mentioned sputtering method, vacuum evaporation method, etc., it is possible to form a thin metal S layer that is even thinner than metal foil. It becomes possible to significantly reduce the amount of steam generated from the layer, and has the effect of significantly shortening the baking time before use.

〔Effect of the invention〕

As explained above, according to the present invention, since a thin film layer is provided between the bonded body elements and forms a liquid phase at a temperature lower than the melting point of the bonded body elements and forms a solid solution with the bonded body elements, thin g! The layer dissolves to produce a liquid phase, and through this liquid phase, atoms of the conjugate element and Ng! The atoms of the layer interdiffuse and a eutectic composition is rapidly formed.

Since the rate of mutual diffusion of metal atoms in this liquid phase is higher than that in the conventional same phase, the mutual diffusion sickness per unit time increases significantly.

Therefore, the concentration gradient of each atom near the joint end face becomes small, and the characteristics of the joint part continuously change from the characteristics of the base material. Therefore, discontinuous surfaces between the base materials that occur in conventional brazing joints are not formed, so that a joined body with excellent mechanical strength can be obtained.

In addition, since a liquid phase is generated at the joint end face, gaps and voids can be eliminated by simply applying a small pressure, and a good joint surface with good adhesion can be obtained over the entire joint surface of the inner joint body element. .

In addition, the thin grooves formed for the cooling holes are less likely to be deformed by pressing force, thereby reducing the cooling efficiency and reducing the dimensional accuracy of the product.

Since the cooling holes are formed at the same time as the dry bonding operation, the manufacturing process is simplified compared to the conventional method of fixing cooling pipes to the outer surface of the member. In addition, cooling holes are formed inside the bonded body and a large cooling surface area is ensured, resulting in excellent effects such as increased cooling effect.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an embodiment of the structure of a joined body according to the present invention and an apparatus for carrying out the manufacturing method thereof, and FIG. 2 shows a state in which a cylindrical joined body is manufactured by the method of the present invention. A perspective view, FIG. 3(a) is a sectional view showing the structure of a conventional electrode plate provided with circular cooling pipes, and FIG. 3(b) is a cross-sectional view showing the structure of a conventional electrode plate provided with square cooling pipes. 3rd cross-sectional view showing
Figure (C) is a sectional view showing the structure of a conventional joined body formed by joining joined body elements by electron beam welding, and Figure 3 (
d) is a sectional view showing the structure of a conventional bonded body formed by diffusion bonding. 1... Electrode plate for beam acceleration, 1a... Electrode plate body,
2... Brazing metal, 3.3a, 3b... Cooling pipe, 4.4
a. 4b... Joined body element, 5... Joined body, 6... Side groove, 7... Joining end surface, 8... Cold hole, 9... Electron beam welding bead, 10...' ；rjJMeiroi, 11・
... Titanium foil, 12 ... Vacuum furnace, 13 ... Trial #stand, 14 ... Pressure weight, 15 ... Heater, 16 ... Titanium layer. Saki I Sub No. 25A (A) Cd) Quasi-3 Cause

Claims (5)

[Claims] 1. Consisting of a plurality of joined body elements with narrow grooves for cooling holes formed on the end faces, a thin film layer that generates a liquid phase at a temperature lower than the melting point of the joined body elements and forms a solid solution with the joined body elements is provided between the joined body elements,
A bonded body characterized in that cooling holes are formed inside the bonded body elements that are integrated by diffusion bonding the bonded body elements together through the thin film layer. 2. The assembly of claim 1, wherein the assembly element is made of copper or a copper alloy, while the thin film layer is made of one of titanium (Ti), silicon (Si) and zirconium (Zr). . 3. The assembly of claim 1, wherein the assembly element is made of molybdenum or a molybdenum alloy, while the thin film layer is made of gold (Au). 4. A thin film layer that generates a liquid phase at a temperature lower than the melting point of the joined body elements and forms a solid solution with the joined body elements is formed between a plurality of joined body elements in which narrow grooves for cooling holes are formed on at least one joint end surface. Later, by heating and pressurizing under vacuum conditions, mutual diffusion is caused on the joint end surfaces, and the butted joint body elements are joined to form an integrated joint, and at the same time, cooling holes are formed inside the joint. A method for manufacturing a joined body, characterized by: 5. 5. The method for manufacturing a bonded body according to claim 4, wherein the thin film layer is formed by a physicochemical vapor phase growth method such as an ion plating method, a sputtering method, or a vacuum evaporation method.