JPH011763A - polymer composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a polymer composition that provides a colorless or white conductive coating or a conductive molded article.

(Prior art) Cuprous iodide is white and has good electrical conductivity, so by applying it to non-conductive polymers, the color tone (black) of conventional carbon blank-containing conductive polymers can be improved.
There are many attempts to solve this problem, and some have already been commercialized. The main methods are: ■ Mixing cuprous iodide particles with a polymer, or ■ Treating a polymer molded product with iodine and then immersing it in a cuprous salt-containing solution. There are two ways to form a film, but in (2) the cuprous iodide particles are required to be minute.

In addition, it is difficult to prevent secondary aggregation of the particles during mixing, resulting in a decrease in moldability (this tendency is remarkable in fibers and films).

) and poor appearance of the resulting molded product are unavoidable.

In case (2), the process becomes complicated, and there are other problems such as the fact that only one surface portion can be made conductive, and the formed cuprous iodide layer tends to fall off due to friction or bending.

(Problems to be Solved by the Invention) The present invention solves the above-mentioned problems in making non-conductive polymers conductive by diluting iodide, particularly the problems caused by secondary agglomeration of cuprous iodide particles. Aim for a solution.

(Means for Solving the Problems) The present invention achieves the above objects, and uses cuprous iodide [A
] Consists of a dipolymer [B] and a solvent [C] that dissolves both [A] and [B], and the weight ratio of [A] and [B] is 90:10 to 30:70. 1. The polymer composition of the present invention exists in a uniform solution state.

A conductive composition which has good processability and which is obtained by removing the solvent [C] after forming a thin film or molding and which is made of cuprous iodide [A] and a polymer [B] and has a good appearance. becomes.

The present invention will be explained below.

The cuprous iodide [A] used in the present invention is usually obtained by a known method, but needless to say, considering the purpose of the present invention, it is preferable to select one with as little coloring as possible.

As the polymer [B], any polymer soluble in the solvent [C] can be selected, but in consideration of versatility, polyvinyl chloride, polystyrene, phenol formaldehyde resin before three-dimensionalization, and polyacrylonitrile are selected.

Suitable examples include polyvinyl alcohol, aliphatic polyamide, aromatic polyamide, linear polyester, linear polyurethane, and polyimide.

Next, solvent [C] is cuprous iodide [A] and polymer [B].
], and for this purpose, N-methylpyrrolidone or L3
-dimethyl-2-imidazolidinone is most suitable.

That is, these cyclic amide-based or cyclic urea-based solvents have a large dissolving power for cuprous iodide [A] and are also good solvents for the polymers listed above. In addition, salts such as lithium chloride and calcium chloride may be added to increase the dissolving power of these solvents.
Other organic solvents may also be used in combination.

The polymer composition of the present invention is substantially in the form of a solution, and can be applied or molded (in the form of fibers or films).

In order to obtain good conductivity, moldability, and physical properties of the product, it is necessary to
] and [B] need to be in a weight ratio of 90:10 to 30:70. When the amount of cuprous iodide is less than this range, it tends to lead to insufficient conductivity, and when the amount exceeds this range, the moldability, coating, mechanical properties of the molded product, etc. are significantly deteriorated. The preferred range is 35:65 to 80:2
It is 0.

In addition, the amounts of [A] and [B] in the polymer composition of the present invention are determined based on the required properties, usage, and the type of polymer [B] used.
Although it varies depending on the molecular weight, solubility, etc., the total amount of [A] and [B] is preferably 5 to 50% by weight, more preferably 10 to 40% by weight of the acid.

Furthermore, the addition of polyalkylene oxides such as polyethylene oxide and polypropylene oxide or derivatives thereof, N-aluminated polyethyleneimine, etc. to the polymer composition of the present invention is effective in increasing the electrical conductivity of the resulting molded products. be.

It goes without saying that colorants, flame retardants, heat-resistant agents, light-resistant agents, and the like may be added.

It goes without saying that the polymer composition of the present invention can be obtained by a commonly known dissolution method, and methods such as heating and mixing may be employed.

At this time, cuprous iodide [A] is preferably supplied in the form of granules or powder in order to promote dissolution.

Application examples of the polymer composition of the present invention include (a) after coating or dipping the surface of a non-conductive polymer molded article (including fibers and films) to form a thin film;

The solvent [C] is evaporated to obtain a conductive film consisting of [B] and (,C). (b) The polymer composition is spun into a fiber or film, and a fiber or film consisting of [B] and [C] is prepared in a coagulating liquid (preferably water, ethylene glycol, glycerin, or a mixture thereof). Alternatively, the solvent (C) may be evaporated to obtain the molded article.

In the latter case (b), it may also be used in a composite form with a non-conductive polymer. [This is because the polymer composition of [B] and [C] alone may cause problems in terms of strength. (a) In both cases, the polymer composition of the present invention is a solution, so it has good processability,
The finally obtained conductive composition of [B] and [C] exhibits uniform and good appearance and conductivity.

(Example) The present invention will be explained in more detail with reference to Examples below, where "parts" in each sentence indicate parts by weight.

Example 1 60 parts of cuprous iodide [A] particles (average particle size 1 μ),
10 parts of powder of polyethylene terephthalate [B] and 1,3-dimethyl-2-imidazolidinone CC)
A substantially clear solution was obtained by stirring and mixing 500 parts at 80°C for 10 hours. This solution was applied to a regular polyethylene terephthalate film to a thickness of about 4μ, and then treated in a hot air dryer (atmosphere is nitrogen) at 150"C for 24 hours to evaporate [C], resulting in a homogeneous film. A film having a surface appearance was obtained.The conductive portion of this film had a specific resistance of 2×10′Ω·cm.

Examples 2-4. Comparative example 1. 2 The same operation as in Example 1 was performed except that the weight ratio of [A] and [B] was changed, and the results shown in Table 1 were obtained.

Table 1 In Table 1, Examples 2 to 5 all showed good appearance and conductivity, but Comparative Example 1 had insufficient conductivity, and Comparative Example 2 had an extremely brittle conductive film. It became a thing.

Comparative Example 3 The same operation as in Example 1 was performed except that 500 parts of an equal weight mixture of phenol/tetrachloroethane was used instead of [C], but cuprous iodide [A] did not dissolve during stirring and mixing. The remaining liquid becomes a dispersion liquid.

The conductive film obtained after solvent evaporation (specific resistance 3 x 105
Ωcm) had significant unevenness due to secondary agglomeration of [A].

(Effects of the Invention) The polymer composition of the present invention has a composition that is extremely suitable for expressing the electrical properties of cuprous iodide, and can be used to produce coatings, molded products, etc. with excellent processability, conductivity, and appearance. Patent applicant characterized by Unitika Co., Ltd.

Claims (3)

[Claims] (1) Cuprous iodide [A], polymer [B] and [A]
and a solvent [C] that dissolves both [A] and [B].
] and [B] in a weight ratio of 90:10 to 30:70. (2) [B] is one or two selected from the group of polyvinyl chloride, polystyrene, phenol formaldehyde resin, polyacrylonitrile, polyvinyl alcohol, aliphatic polyamide, aromatic polyamide, linear polyester, linear polyurethane, and polyimide. The polymer composition according to claim 1, which is as follows. (3) [C] is N-methylpyrrolidone or 1,3-
The polymer composition according to claim 1, which is dimethyl-2-imidazolidinone.