JPH01173700A - Posture detection of chuck for electronic component in automatic mounting machine - Google Patents

Posture detection of chuck for electronic component in automatic mounting machine

Info

Publication number
JPH01173700A
JPH01173700A JP62329521A JP32952187A JPH01173700A JP H01173700 A JPH01173700 A JP H01173700A JP 62329521 A JP62329521 A JP 62329521A JP 32952187 A JP32952187 A JP 32952187A JP H01173700 A JPH01173700 A JP H01173700A
Authority
JP
Japan
Prior art keywords
electronic component
hand
lead
plate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62329521A
Other languages
Japanese (ja)
Inventor
Ichiro Nakano
一郎 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Priority to JP62329521A priority Critical patent/JPH01173700A/en
Publication of JPH01173700A publication Critical patent/JPH01173700A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To accurately insert an electronic component into a printedcircuit board by a method wherein, before the eIectronic component is inserted into the printed-circuit board, the mutual position of an outer shape and a lead of the electronic component is measured, a reference position of a hand is corrected on the basis of this measured result and the component is inserted. CONSTITUTION:A hand 1 which has gripped an electronic component 3 is set in a prescribed position of a plate 5 of a measuring instrument 50; a lead 7 of the electronic component 3 is inserted into a hole 9 in the plate 5. During this operation, a displaced position and a tilt of a target mark 4 on the plate 5 are measured by using a sensor 11; a reference position of the hand is corrected. Accordingly, the position of an outer shape 6 with reference to the lead 7 of the electronic component 3 can be measured easily; it is possible to correct the position of the hand 1. By this setup, it is possible to mount the electronic component 3 on a printed-circuit board accurately.

Description

【発明の詳細な説明】 (産業上の利用分野) 電子部品をプリント基板に装着する自動実装機の電子部
品チャック姿勢検出方法に関するものでおる。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for detecting the position of an electronic component chuck in an automatic mounting machine that mounts electronic components onto a printed circuit board.

(従来の技術) 電子部品aをプリント基板1)へ挿入する自動実装機に
おいて、電子部品のリードCをあらかじめ指定されたプ
リント基板の穴dへ正確に挿入させる方法として次のも
のがある。
(Prior Art) In an automatic mounting machine for inserting an electronic component a into a printed circuit board 1), there is the following method for accurately inserting the lead C of the electronic component into a prespecified hole d of the printed circuit board.

Φ電子部品のリードを掴むことにより正確にリードの位
置を把握するもの。
ΦA device that accurately determines the lead position by grasping the lead of an electronic component.

■電子部品外形とリードの位置の寸法精度が保証される
という条件下で電子部品の外形を位置ズレなく再現性良
く掴める部品専用ハンドにより、電子部品外形を掴んで
挿入するもの。
■A device that grips and inserts the electronic component outline using a component-specific hand that can grasp the electronic component outline with good reproducibility without positional deviation, provided that the dimensional accuracy of the electronic component outline and the position of the leads is guaranteed.

■TVカメラの基準線に対して正確に位置決めされたと
ころへハンドを移動し、電子部品のリードを映像にとり
画像処理からリードを計測しハンドを補正するもの、が
ある。
(2) There is a method that moves the hand to a position accurately positioned with respect to the reference line of the TV camera, captures the lead of the electronic component as an image, measures the lead through image processing, and corrects the hand.

(発明が解決しようとする問題点) 前記、電子部品のリードをj國む方法では、電子部品の
中にはリードを掴むことがてきないものが多々ある。
(Problems to be Solved by the Invention) In the above-mentioned method of gripping the leads of electronic components, there are many electronic components in which the leads cannot be gripped.

又、電子部品の外形を掴むものは、電子部品の外形とリ
ードの位置の寸法を保証するために選別が必要となり、
保証するための工数及び不良率が上がるという欠点があ
る。又、現状では様々な外形の部品をそれぞれ精度良く
、再現性良く掴む汎用性に富んだハンドはない。
In addition, for those that grasp the external shape of electronic components, screening is required to ensure the external shape of the electronic component and the dimensions of the lead position.
This method has the disadvantage that the number of man-hours required for guaranteeing the guarantee and the defective rate increase. Furthermore, at present, there is no hand that is versatile enough to grip parts of various external shapes with high precision and good reproducibility.

さらに、電子部品のリードをTVカメラで映す場合には
次の問題がある。電子部品のリードをプリント基板の穴
に挿入する場合には、0.05mm以下の精度が必要と
され、−船釣なTVカメラでは、この分解能を確保する
と視野は最大で25mm X 25mmが限度である。
Furthermore, there are the following problems when viewing the leads of electronic components with a TV camera. When inserting the lead of an electronic component into a hole in a printed circuit board, an accuracy of 0.05 mm or less is required; for a TV camera used on a boat, if this resolution is secured, the field of view is limited to a maximum of 25 mm x 25 mm. be.

しかし、電子部品の中にはコネクタのように全長が60
mm程度のものがあり、この視野でリードの位置を一度
に正確に測定することは困難である。又、電子部品のリ
ードの位置は部品が異なれば変わるので、基準となるリ
ードを見つけたり、又、複数のリードから電子部品の外
形の傾きを検出したりする画像処理のソフトウェアも複
雑なものとなる。又、ソフトウェアが複雑となるため測
定時間が大となる欠点がある。
However, some electronic components have a total length of 60 mm, such as connectors.
It is difficult to accurately measure the position of the lead at once with this field of view. In addition, the positions of electronic component leads change depending on the component, so the image processing software used to find a reference lead and detect the inclination of an electronic component's external shape from multiple leads is also complex. Become. Another disadvantage is that the software is complicated and the measurement time is long.

本発明は上記問題に鑑みたもので、電子部品をプリント
基板に装着する場合、ハンドと電子部品の相互の位置間
係を計測し、プリント基板にハンドを移動させる目゛標
を補正することにより、種々の部品を容易に正確にプリ
ント基板に装着することができることを目的としている
The present invention has been developed in view of the above-mentioned problems. When mounting electronic components on a printed circuit board, the present invention measures the mutual positional relationship between the hand and the electronic component and corrects the target for moving the hand onto the printed circuit board. The purpose of this is to allow various components to be easily and accurately mounted on a printed circuit board.

(問題を解決するための手段及び作用)そのために本発
明では、電子部品をプリント基板に挿入する自動実装機
において、基準位置を有するハンドと、ターゲットマー
クと所定の間隔にあけられた孔を有するプレートと、タ
ーゲットマークを計測するるセンサとより成り、電子部
品のリードを孔に挿入した時、プレートのターゲットマ
ークの変位置と傾きをセンサで計測しハンドの基準位置
を補正する構成としてる。
(Means and effects for solving the problem) For this purpose, in the present invention, an automatic mounting machine for inserting electronic components into a printed circuit board has a hand having a reference position and a hole formed at a predetermined distance from a target mark. It consists of a plate and a sensor that measures the target mark. When an electronic component lead is inserted into a hole, the sensor measures the displacement and inclination of the target mark on the plate and corrects the reference position of the hand.

このために、電子部品の外形とリードとの位置を容易に
計測でき、その結果ハンドの位置を修正するようにした
ため精度良く、電子部品をプリント基板に装着すること
ができる。又、様々な電子部品の外形とリードの位置、
及び精度にも対応することができる。
For this reason, the external shape of the electronic component and the position of the lead can be easily measured, and as a result, the position of the hand can be corrected, so that the electronic component can be mounted on the printed circuit board with high precision. In addition, the external shapes and lead positions of various electronic components,
and accuracy.

(実施例) 以下、本発明を第1図〜第3図に示す実施例について説
明する。第1図は本発明の実施例を示す自動実装機の部
品チャック姿勢検出方法の全体構製図であり、第2図(
イ)(0)は同上に用いるプレートの平面図、断面図を
示す。第3図はプレートの変位置を示す図である。第1
図において、ハンド1はチャック2を有し、電子部品3
を掴むためX方向に開閉する。なおハンドlは基準軸A
が決められている。ターゲットマーク4を有するプレー
ト5は電子部品の外形6とリード7の相互位置を測定す
る計測器50のハウジング8に、所定の間隔にあけられ
た孔9(以下孔という)を上面に、ターゲットマーク4
を下面に弾性体10を介して支持されている。プレート
5の下にはセンサ11が設けられ、ターゲットマーク4
の位置を検出している。なお氷室の場合のセンサ11は
、CCD2次元カメラを用いている。又、弾性体10は
発泡ウレタンを用い外力により動き、外力が取り去られ
れば再び元の位置に戻る。プレート5の孔は第2図((
XO)に示すごとく、円錐形に電子部品のリードの間隔
りに合せてLX、LY共1/lOインチ間隔にあけられ
ている。センサは他に複数のストロークセンサを用いて
も良い。
(Example) Hereinafter, the present invention will be described with reference to an example shown in FIGS. 1 to 3. FIG. 1 is an overall structural diagram of a component chuck posture detection method for an automatic mounting machine showing an embodiment of the present invention, and FIG.
b) (0) shows a plan view and a sectional view of the plate used in the above. FIG. 3 is a diagram showing the changing position of the plate. 1st
In the figure, a hand 1 has a chuck 2 and an electronic component 3.
Open and close in the X direction to grab. Note that hand l is the reference axis A.
has been decided. A plate 5 having target marks 4 has holes 9 (hereinafter referred to as holes) formed at predetermined intervals on the top surface of a housing 8 of a measuring device 50 that measures the mutual position of an external shape 6 of an electronic component and a lead 7, and has target marks. 4
is supported on the lower surface via an elastic body 10. A sensor 11 is provided under the plate 5, and the target mark 4
is detecting the position of. Note that the sensor 11 in the case of Himuro uses a CCD two-dimensional camera. Further, the elastic body 10 is made of urethane foam and is moved by an external force, and returns to its original position when the external force is removed. The holes in plate 5 are shown in Figure 2 ((
As shown in (XO), both LX and LY are spaced at 1/10 inch intervals to match the lead spacing of the electronic component in a conical shape. A plurality of other stroke sensors may be used as the sensor.

この構成において動作について説明する。The operation in this configuration will be explained.

電子部品3をハンド1のチャック2により悶みプリント
基板に装着するが、装着前に電子部品の外形6とリード
7の相互位置を計測器50により測定する。このために
、電子部品3を掴んだハンド1を計測器50のプレート
5の所定の位置に定め、電子部品3のリード7をプレー
ト5の孔9に挿入する。この時、リード7と孔9とが一
致すると、プレート5は動かずそのままの位置にある。
The electronic component 3 is mounted on the printed circuit board by the chuck 2 of the hand 1, but before mounting, the external shape 6 of the electronic component and the mutual position of the lead 7 are measured by the measuring device 50. For this purpose, the hand 1 holding the electronic component 3 is positioned at a predetermined position on the plate 5 of the measuring instrument 50, and the lead 7 of the electronic component 3 is inserted into the hole 9 of the plate 5. At this time, when the lead 7 and the hole 9 match, the plate 5 remains in the same position without moving.

リード7と孔9が一致しない場合、例えば第2図(0)
のごとくの場合にはプレート5がX方向にリード7と孔
9が一致するか、横方向の力がバランスするまで動く。
If the lead 7 and the hole 9 do not match, for example, Fig. 2 (0)
In such a case, the plate 5 moves in the X direction until the leads 7 and holes 9 coincide or the lateral forces are balanced.

この時、第3図のごとくもとのターゲットマークの位置
a点から変位置のターゲットマークの位ib点までの変
位量(2:、 #)と傾きθをセンサ11により計測す
る。この計測した変位m<1、?)と傾きθをハンドの
基準位置Aに加減し基準位置を補正する。基準位置を補
正した後、電子部品3をプリント基板に装着する。
At this time, as shown in FIG. 3, the sensor 11 measures the displacement amount (2:, #) and the inclination θ from the original target mark position a point to the displaced target mark position ib point. This measured displacement m<1,? ) and the inclination θ to the reference position A of the hand to correct the reference position. After correcting the reference position, the electronic component 3 is mounted on the printed circuit board.

前記実施例は、電子部品3のリード7を2本挿入して測
定したが、1本を挿入して測定し、変位1It(:c、
/)を補正しても良い。又、リード7を挿入するプレー
ト5の孔の間隔をl/10インチにしたが、電子部品に
合わせ1 mm単位で設けても良い。さらに、孔の間隔
を半分はインチ、半分はミリであけても良い。プレート
5を受ける弾性体lOは発泡ウレタンを用いたがゴム、
複数のスプリング等の弾性体を用い、第4図の構造にし
て横方向のみを弾性体12て変位量を受けるようにして
も良い。
In the above embodiment, two leads 7 of the electronic component 3 were inserted and measured, but one lead was inserted and measured, and the displacement 1It(:c,
/) may be corrected. Furthermore, although the holes in the plate 5 into which the leads 7 are inserted are spaced at 1/10 inches, they may be spaced in 1 mm increments depending on the electronic component. Furthermore, the holes may be spaced half in inches and half in millimeters. The elastic body lO that receives the plate 5 is made of urethane foam, but rubber,
A plurality of elastic bodies such as springs may be used to create the structure shown in FIG. 4, and the displacement amount may be received only in the lateral direction by the elastic body 12.

(発明の効果) 以上、述べたように本発明では、電子部品をプリント基
板に挿入する前に、電子部品の外形とリードの相互位置
を測定し、その測定結果によりハンドの基準位置を補正
して挿入するようにしたため、プリント基板に正確に挿
入することができる。又、プレートにターゲット位置を
設け、このターゲット位置の移動量を画像処理により算
出するため、TVカメラの視野が狭くても良く、又、画
像処理のソフトウェアの負担が軽くなり、高速でリード
の位置を計測することができるという優れた効果が得ら
れる。
(Effects of the Invention) As described above, in the present invention, before inserting the electronic component into the printed circuit board, the external shape of the electronic component and the mutual position of the leads are measured, and the reference position of the hand is corrected based on the measurement results. This allows for accurate insertion into the printed circuit board. In addition, since a target position is set on the plate and the amount of movement of this target position is calculated by image processing, the field of view of the TV camera does not need to be narrow, and the burden on the image processing software is lightened, allowing the lead position to be determined quickly. The excellent effect of being able to measure the

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例を示す全体構成図、第2図(イ
X11)は本発明のプレートを示す平面図及び断面図、
第3図はプレートの変位量を示す図、第4図は本発明の
プレートの支持部を示す第2実施例図、第5図は電子部
品をプリント基板に挿入する図、である。 1・・・ハンド 2・・・チャック 3・・・電子部品 4・・・ターゲットマーク 5・・・プレート 6・・・電子部品の外形 7・・・リード 9・・・孔 IO・・・弾性体 11・・・センサ
FIG. 1 is an overall configuration diagram showing an embodiment of the present invention, FIG. 2 (IX11) is a plan view and a sectional view showing a plate of the present invention,
FIG. 3 is a diagram showing the amount of displacement of the plate, FIG. 4 is a diagram showing a second embodiment of the plate support portion of the present invention, and FIG. 5 is a diagram showing the insertion of an electronic component into a printed circuit board. 1... Hand 2... Chuck 3... Electronic component 4... Target mark 5... Plate 6... External shape of electronic component 7... Lead 9... Hole IO... Elasticity Body 11...sensor

Claims (1)

【特許請求の範囲】[Claims] 電子部品をプリント基板に挿入する自動実装機において
、基準位置を有するハンドと、ターゲットマークと所定
の間隔にあけられた孔とを有するプレートと、ターゲッ
トマークを計測するセンサと、より成り電子部品のリー
ドを孔に挿入した時、プレートのターゲットマークの変
位量と傾きをセンサで計測し、ハンドの基準位置を補正
することを特徴とする自動実装機の電子部品チャック姿
勢検出方法。
An automatic mounting machine that inserts electronic components onto a printed circuit board is made up of a hand with a reference position, a plate with a target mark and a hole formed at a predetermined interval, and a sensor that measures the target mark. A method for detecting the posture of an electronic component chuck in an automatic mounting machine, which is characterized in that when a lead is inserted into a hole, a sensor measures the amount of displacement and inclination of a target mark on a plate, and corrects the reference position of the hand.
JP62329521A 1987-12-28 1987-12-28 Posture detection of chuck for electronic component in automatic mounting machine Pending JPH01173700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62329521A JPH01173700A (en) 1987-12-28 1987-12-28 Posture detection of chuck for electronic component in automatic mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62329521A JPH01173700A (en) 1987-12-28 1987-12-28 Posture detection of chuck for electronic component in automatic mounting machine

Publications (1)

Publication Number Publication Date
JPH01173700A true JPH01173700A (en) 1989-07-10

Family

ID=18222303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62329521A Pending JPH01173700A (en) 1987-12-28 1987-12-28 Posture detection of chuck for electronic component in automatic mounting machine

Country Status (1)

Country Link
JP (1) JPH01173700A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007181909A (en) * 2006-01-10 2007-07-19 Mitsubishi Heavy Ind Ltd Tip tool guiding device, and method for carrying-in tip tool guiding device
CN111169979A (en) * 2019-12-10 2020-05-19 苏州市创怡盛实业有限公司 Robot transfer method and system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007181909A (en) * 2006-01-10 2007-07-19 Mitsubishi Heavy Ind Ltd Tip tool guiding device, and method for carrying-in tip tool guiding device
CN111169979A (en) * 2019-12-10 2020-05-19 苏州市创怡盛实业有限公司 Robot transfer method and system
CN111169979B (en) * 2019-12-10 2021-06-15 苏州市创怡盛实业有限公司 Robot transfer method and system

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