JPH01170094A - 基板実装構造 - Google Patents

基板実装構造

Info

Publication number
JPH01170094A
JPH01170094A JP32702287A JP32702287A JPH01170094A JP H01170094 A JPH01170094 A JP H01170094A JP 32702287 A JP32702287 A JP 32702287A JP 32702287 A JP32702287 A JP 32702287A JP H01170094 A JPH01170094 A JP H01170094A
Authority
JP
Japan
Prior art keywords
board
circuit board
guide
fixed
fastener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32702287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543318B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Takeshi Nakagawa
毅 中川
Takaharu Mizukami
水上　隆晴
Susumu Iwai
進 岩井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP32702287A priority Critical patent/JPH01170094A/ja
Publication of JPH01170094A publication Critical patent/JPH01170094A/ja
Publication of JPH0543318B2 publication Critical patent/JPH0543318B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP32702287A 1987-12-25 1987-12-25 基板実装構造 Granted JPH01170094A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32702287A JPH01170094A (ja) 1987-12-25 1987-12-25 基板実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32702287A JPH01170094A (ja) 1987-12-25 1987-12-25 基板実装構造

Publications (2)

Publication Number Publication Date
JPH01170094A true JPH01170094A (ja) 1989-07-05
JPH0543318B2 JPH0543318B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-01

Family

ID=18194433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32702287A Granted JPH01170094A (ja) 1987-12-25 1987-12-25 基板実装構造

Country Status (1)

Country Link
JP (1) JPH01170094A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04208570A (ja) * 1990-11-30 1992-07-30 Nec Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04208570A (ja) * 1990-11-30 1992-07-30 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0543318B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-01

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees