JPH01169713A - Thin film magnetic head - Google Patents
Thin film magnetic headInfo
- Publication number
- JPH01169713A JPH01169713A JP32697787A JP32697787A JPH01169713A JP H01169713 A JPH01169713 A JP H01169713A JP 32697787 A JP32697787 A JP 32697787A JP 32697787 A JP32697787 A JP 32697787A JP H01169713 A JPH01169713 A JP H01169713A
- Authority
- JP
- Japan
- Prior art keywords
- gap
- gap depth
- film
- pattern
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 6
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 30
- 238000001514 detection method Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000000151 deposition Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 3
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＶＴＲ等に好適な？Ｖ膜磁気ヘッドに関する。[Detailed description of the invention] [Industrial application field] Is the present invention suitable for VTRs, etc.? This invention relates to a V-film magnetic head.
薄膜磁気ヘッドの磁気ギャップ深さは通常５〜２０μＩ
ｒＬ程度に設定されるため数μｍのずれは記録再生特性
に大きく影響する。従って高い精度で磁気ギャップ深さ
を制御する必要かあり、磁気ギャップ深さ検知用パター
ンが多数提案さ４ている。The magnetic gap depth of thin film magnetic heads is usually 5 to 20 μI.
Since it is set to about rL, a deviation of several μm greatly affects the recording and reproducing characteristics. Therefore, it is necessary to control the magnetic gap depth with high precision, and many patterns for detecting the magnetic gap depth have been proposed4.
−例として＃開開６０−１７７４１６号公報に記載のよ
うな方法がある。第３図にその特徴を示す。- For example, there is a method described in #Kokai No. 60-177416. Figure 3 shows its characteristics.
第３図（α）は１４編磁気ヘッドの平面図（ｂ）はＡ−
Ａ断面図（Ｃ）はＢ−Ｂｉ面図である。１は基板、２は
下部磁気コア、３は非磁性ギャップ材、４は導体、５は
絶縁層、６は上部伝気コア、７α、７６はギャップ深さ
検知用パターン、８はボンデインクパッドである。Ｇｄ
はギャップ深さ、Ｇｏはギャップ深さか０となる位置を
示している。Figure 3 (α) is the 14th magnetic head, and (b) is the plan view of the magnetic head A-
A sectional view (C) is a B-Bi plane view. 1 is a substrate, 2 is a lower magnetic core, 3 is a non-magnetic gap material, 4 is a conductor, 5 is an insulating layer, 6 is an upper conductive core, 7α, 76 is a gap depth detection pattern, 8 is a bond ink pad be. Gd
indicates the gap depth, and Go indicates the position where the gap depth becomes 0.
上記従来例の４換峰気ヘツドの製造方法？：第４図に示
す・第４図（α）〜（ｄ）は磁気ヘッド部分の断面図（
ｔ１５〜（ｄ５はギャップ深さ検知用パターンと磁気ギ
ャップを含む部分の断面図である。第４図（α）（ａ５
基板１上に下部磁気コアとなる憬注膜２と絶縁膜５）導
体４を形成する。（ｂ）（−絶縁膜５を形成する・（０
）（０５絶鰍良χ虜定の形状にパターニングする。こσ
）時にキャップ深さＯとなる位置Ｇｏが決まる。How to manufacture the above-mentioned conventional four-ventilation air head? : Shown in Fig. 4 - Fig. 4 (α) to (d) are cross-sectional views of the magnetic head part (
t15 to (d5 is a cross-sectional view of a portion including the gap depth detection pattern and the magnetic gap. Fig. 4 (α) (a5)
A filler film 2 and an insulating film 5) and a conductor 4, which will become a lower magnetic core, are formed on a substrate 1. (b) (-forming the insulating film 5・(0
) (05Excellent quality χ patterned into a fixed shape.This σ
), the position Go at which the cap depth O is determined is determined.
同時にギャップ深さ検知用パターンとなる凹みも形成す
る。（ｄ）（φギャップ材３と上部磁気コア６を形成し
、同時にギャップ深さ検知用パターン７α、７ｂも形成
する。At the same time, a recess that will become a pattern for detecting the gap depth is also formed. (d) (φ gap material 3 and upper magnetic core 6 are formed, and gap depth detection patterns 7α and 7b are also formed at the same time.
上記従来例では、ギャップ深さ０の位置が決定する工程
である第４図（Ｃ）（φで同時にギャップ深さ検知用パ
ターンの形状が決まるため、エツチングマスク合わせの
際のずれはなくなる。しかし、絶縁膜５のパターンは、
上部磁気コア６の磁気特性を劣化させないために３０〜
６０度程度の傾斜角を持つように形成される。In the conventional example described above, since the shape of the gap depth detection pattern is determined at the same time in the process of determining the position of the gap depth 0 (FIG. 4C) (φ), there is no misalignment during etching mask alignment. , the pattern of the insulating film 5 is
30~ in order not to deteriorate the magnetic properties of the upper magnetic core 6.
It is formed to have an inclination angle of about 60 degrees.
また膜厚も少なくとも導体４以上の膜厚が必要である。Further, the film thickness must be at least 4 or more than that of the conductor.
従って微細なパターンの形成や高精度にパターン寸法を
制御することが難しいという問題があり、ギャップ深さ
が高精度に制御ができなかったＯ
一方、ギャップ深さ検知用パターンを絶縁膜の下に形成
することも考えられるが、後に形成することになる絶縁
膜のパターンが緩い傾斜角を有しエツチングマスク材と
の寸法差が太き（なり、実際のギャップ深さと検知用パ
ターンから読むギャップ深さが一致しないという問題が
あった＠〔発明が解決しようとする間租点〕
上記従来技術は、丑に導体を多層化したような絶縁層が
厚い薄膜磁気ヘッドにおいて、ギャップ深さ検知用パタ
ーンを高精度に形成することができず、ギャップ深さ精
度が低下するという問題があった。Therefore, there is a problem that it is difficult to form fine patterns and control pattern dimensions with high precision, and the gap depth cannot be controlled with high precision. However, the pattern of the insulating film that will be formed later has a gentle slope angle and the dimensional difference from the etching mask material is large (the actual gap depth and the gap depth read from the detection pattern). There was a problem that the gap depth detection pattern did not match. There was a problem in that the gap depth could not be formed with high accuracy and the gap depth accuracy decreased.
本発明の目的はギャップ深さ検知用パターンを実際のギ
ャップ深さとの誤差が微小となるように形成し、ギャッ
プ深さを高精度に制御できるようにすることにある。An object of the present invention is to form a pattern for detecting gap depth so that the error with the actual gap depth is small, so that the gap depth can be controlled with high precision.
上記目的は、絶縁層形成後に絶縁層より薄い膜でギャッ
プ深さ検知用パターンを形成することにより、達成され
る。The above object is achieved by forming a gap depth detection pattern with a film thinner than the insulating layer after forming the insulating layer.
ギャップ深さ検知用パターンを絶ｇ鳩形成工程から孤立
させることにより、膜厚を小さくてることかでさ、倣細
なパターンを高精度に形成することかできる。また、絶
縁層形成後撫でギャップ深さ０の位すＫが決定している
ため、この位置に合せて、その後キャップ深さ検知用パ
ターンχ形成することで、実際のギャップ深さとギャッ
プ深さ検知用パターンとの差が小さくなり、ギャップ深
さを高精度に制御できる。By isolating the gap depth detection pattern from the gap forming process, it is possible to form a narrow pattern with high accuracy by reducing the film thickness. In addition, since the position K at which the gap depth is 0 has been determined after forming the insulating layer, by forming the cap depth detection pattern χ at this position, the actual gap depth and the gap depth can be detected. The gap depth can be controlled with high precision.
以下、本発明の一実施例を第１図により説明する。１は
非磁性材よりなる基板、２は下部コアを形成する磁性膜
、６は非磁性のギャップ材、４は導体、５は絶縁層、６
は上部コアを形成する磁性膜、７α、７ｂはギャップ深
さ検知用パターン、８はポンディングパッドである。ギ
ヤ、プ深さをＱ ｏ 、 ギャップ深さが０となる位
置をＧＯで図中に示した。第１図（α）は本発明の一実
施例を示す平面図、（ｂ）はＡ−Ａ巌断面図、（０）は
Ｂ−Ｂ線断面図である。第１図（０）に示すように本発
明では？３縁層５の上にギャップ深さ検知用パターン７
ａ、７ｂを形成している。このために、キャップ深さ検
知用パターンのための膜は小さなｇ厚で充分であり。An embodiment of the present invention will be described below with reference to FIG. 1 is a substrate made of a non-magnetic material, 2 is a magnetic film forming a lower core, 6 is a non-magnetic gap material, 4 is a conductor, 5 is an insulating layer, 6
7 is a magnetic film forming the upper core, 7α and 7b are patterns for detecting the gap depth, and 8 is a bonding pad. The gear, gap depth is shown as Q o, and the position where the gap depth is 0 is shown as GO. FIG. 1(α) is a plan view showing one embodiment of the present invention, FIG. 1(b) is a sectional view taken along the line A-A, and FIG. 1(0) is a sectional view taken along the line B-B. In the present invention as shown in FIG. 1 (0)? 3 Gap depth detection pattern 7 on edge layer 5
a and 7b are formed. For this purpose, a small g-thickness of the film for the cap depth sensing pattern is sufficient.
フォトレジスト等のエツチングマスクとほぼ四じパター
ンが形成できる。従って微細パターンを高精度に形成す
ることができる。A nearly four-dimensional pattern can be formed using an etching mask such as photoresist. Therefore, fine patterns can be formed with high precision.
以上のように、本発明によれは絶縁層５を形成した後に
ギャップ深さ検知用パターン７α、７ｂを形成するため
、実際のギャップ深さ０の位置に合わせて小さな膜厚の
ギャップ深さ検知用パターン７α、７ｂ７ａ−形成する
こととなり、実際のキャブ深さとギャップ深さ検知用パ
ターンから読むギャップ深さの差が小さくなる。従って
キャップ深さを高精度に制御できる。As described above, according to the present invention, since the gap depth detection patterns 7α and 7b are formed after forming the insulating layer 5, gap depth detection with a small film thickness is detected in accordance with the position of the actual gap depth 0. Therefore, the difference between the actual cab depth and the gap depth read from the gap depth detection pattern becomes small. Therefore, the cap depth can be controlled with high precision.
本発明による薄膜山気ヘッドの製造方法の一実施例を第
２図に示す、第２図（α）〜（ｅ）は導膜磁気ヘッドの
断面、第２図（場〜（弓はギャップ深さ検知用パターン
とフロントギャップを含む部分の断面を示した図である
。第２図（α）（勾非磁性基板１上にセンダスト、アモ
ルファス合金等の磁性膜２乞スパッタリング、蒸層等で
２０βｍ形成し、５ｉ（Ｊｚ等の絶線膜５′を１μｒＩ
Ｌ＃さに形成する。次にＣｕ等の導体膜３ ｕｒｎをス
パッタリング、蒸漸等で形成し、フォトレジスト等？マ
スクとしてイオンエツチング等で所定の形状にバターニ
ングし導体４を形成する。 （ｂ）（ｂ５５ｉ（Ｊｚ等
のｅｆｓａ 膜５６ μｍ ｆ スバッタリング、蒸涜
等で形成する。（Ｃ）（ψ絶縁膜５をイオンエツチング
等でパターニングし所定の形状を得る。An embodiment of the method for manufacturing a thin film magnetic head according to the present invention is shown in FIG. 2. FIGS. Fig. 2 (α) is a cross-sectional view of a portion including a magnetic field detection pattern and a front gap. 5i (Jz, etc.) with 1μrI
Form into L#. Next, a conductive film 3urn of Cu or the like is formed by sputtering, evaporation, etc., followed by photoresist or the like. The conductor 4 is patterned into a predetermined shape using ion etching or the like as a mask. (b) (b55i (EFSA film 56 μm such as Jz) is formed by sputtering, evaporation, etc. (C) (φ The insulating film 5 is patterned by ion etching etc. to obtain a predetermined shape.
ここでギャップ深さが０となる位置Ｇｏか決まる。Here, the position Go where the gap depth becomes 0 is determined.
（ｄ）ｖ）Ｃｒ 等ヲａ、３μｍスパッタリング・蒸看
等によって形成し、絶縁膜５のパターンに合わせてパタ
ーニングしギャップ深さ検知用パターン７α、７ｂを形
成する− （ｅ）（ｅｊ Ｓ’ｉ０ｚ等のギャップ材５
０．５ Ａｍとアモルファス合金等の磁性膜をスパッタ
リング、＃ｅ漸等で２０μｍ厚さに形成し、イオンエツ
チング等で上部磁気コア６を形成する＠第２図（０）で
示す工札で、絶縁膜５のパターンの斜面は上部磁気コア
の磁気特性に悪影響を及はさないように３０〜６０度程
度の傾斜角を持つように形成される。従ってエツチング
マスクパターンと絶縁膜５のパターンのギャップ深さ０
となる位置には差が生じる。(d) v) Cr etc. is formed by sputtering, vaporization, etc. to a thickness of 3 μm, and patterned to match the pattern of the insulating film 5 to form gap depth detection patterns 7α and 7b. Gap material 5 such as i0z
A magnetic film of 0.5 Am and amorphous alloy is formed by sputtering, #e grade, etc. to a thickness of 20 μm, and the upper magnetic core 6 is formed by ion etching, etc. The slope of the pattern of the insulating film 5 is formed to have an inclination angle of about 30 to 60 degrees so as not to adversely affect the magnetic properties of the upper magnetic core. Therefore, the gap depth between the etching mask pattern and the pattern of the insulating film 5 is 0.
There will be a difference in the position.
本発明では絶縁膜５を形成した後にギャップ深さ検知用
パターンを形成するので実際（ギャップ深さが０となる
位置に合わせてギャップ深さ検知用パターンを形成でき
る。またギャップ深さ検知用パターンは、ギャップ深さ
を仕上げる際に認知できれば良いので膜厚を博くするこ
とができ、倣細なパターンを高精度に形成することがで
きる。従って、高精度にギャップ深さを制御）すること
ができる。In the present invention, since the gap depth detection pattern is formed after forming the insulating film 5, the gap depth detection pattern can be formed in accordance with the position where the gap depth is 0. Since it is only necessary to recognize the gap depth during finishing, the film thickness can be increased and a fine pattern can be formed with high precision.Therefore, the gap depth can be controlled with high precision. Can be done.
なお上記実力例に示した薄膜磁気ヘッドやギャップ深さ
検知用パターンの形状は一例であり、任意の形状とする
ことができる。また基板に磁性材料を用いることもでき
、基板を下部磁気コアとする栴造でもよい、磁性膜、尋
体、絶縁膜、ギャップ材、ギャップ深さ検知用パターン
にもｆｌｌ：意の材料を選択することができ、本実施例
に限定されるものではない・各々の膜厚も必要に応じて
任意に設定すれはよい、また上記実施例においては、ギ
ャップ深さ検知用パターンを磁気ヘッドの両側に配置し
たが一方のみでもよく、逆に多数個のパターンを配して
もよい。またはり数の磁気ヘッドを並べて、そのブロッ
クごとにギャップ深さ検知用パターンを配してもよい、
さらに、ギャップ深さ検知用パターン上に形成するキャ
ップ材、上部磁気コア族等は必すしも除去する必要はな
い。Note that the shapes of the thin film magnetic head and the gap depth detection pattern shown in the above practical example are merely examples, and can be made into any shape. In addition, a magnetic material can be used for the substrate, and the substrate can be used as a lower magnetic core.Fll: material can also be selected for the magnetic film, the body, the insulating film, the gap material, and the pattern for detecting the gap depth.・The thickness of each film may be set arbitrarily as necessary. Also, in the above embodiment, the gap depth detection pattern is placed on both sides of the magnetic head. Although only one pattern may be arranged, or conversely, a large number of patterns may be arranged. Alternatively, a similar number of magnetic heads may be arranged and a pattern for detecting the gap depth may be arranged in each block.
Furthermore, it is not necessary to remove the cap material, upper magnetic core group, etc. formed on the gap depth detection pattern.
本発明によｊは、絶縁膜を形成してギャップ深さ０とな
る位置を決めてから、微細なパターンを高精度に形成で
きる小さな膜厚でギャップ深さ検知用のパターンを形成
できるので、実際のギャップ深さとギャップ深さ検知用
パターンから読むギヤ、プ深さの値の差は微小となり、
ギャップ深さを高精度に制御できるようになる。According to the present invention, after forming an insulating film and determining the position where the gap depth is 0, it is possible to form a pattern for detecting the gap depth with a small film thickness that allows formation of a fine pattern with high precision. The difference between the actual gap depth and the gear depth value read from the gap depth detection pattern is minute.
Gap depth can be controlled with high precision.
第１図（α）は本発明の一実施例を示す平面図、（ｂ）
は（α）のＡ−Ａ線断面図、（０）は（α）のＢ−Ｂ線
断面図、第２図は本発明の製造方法の一実施例を示す断
面図、第６図（α）は従来例を示す平面図、（ｂ）は（
α）のＡ−Ａ線断面図、（０）は（α）のＢ−Ｂ線断面
図、第４図は従来の製造方法を示す断面図である。
１・・・基板、２・・・下Ｓ磁気コア、３・・・磁気キ
ャップ。
４・・・４体、５・・・絶縁膜、６・・・上部磁気コア
、７α。
７ｂ・・・キャップ深さ検知用パターン。
代禰人９Ｐ埋士 小 川 勝 男
第２図
晃う
Ａ
ハFIG. 1 (α) is a plan view showing an embodiment of the present invention, (b)
is a cross-sectional view taken along the line A-A of (α), (0) is a cross-sectional view taken along the line B-B of (α), FIG. 2 is a cross-sectional view showing an embodiment of the manufacturing method of the present invention, and FIG. ) is a plan view showing the conventional example, and (b) is (
(0) is a sectional view taken along line BB of (α), and FIG. 4 is a sectional view showing a conventional manufacturing method. 1... Board, 2... Lower S magnetic core, 3... Magnetic cap. 4...4 bodies, 5...insulating film, 6...upper magnetic core, 7α. 7b...Cap depth detection pattern. Dainejin 9P Burial Officer Masaru Ogawa Male 2nd Figure Akira A Ha
Claims (1)
し、磁気ギャップを介して磁路を構成するように上部磁
気コアを形成した薄膜磁気ヘッドにおいて、ギャップ深
さ位置検知パターンをギャップ面以外の膜たい積面上に
形成したことを特徴とする薄膜磁気ヘッド。1. In a thin-film magnetic head in which an insulating film and a coil conductor are sequentially laminated on a lower magnetic core to form an upper magnetic core so as to form a magnetic path through a magnetic gap, the gap depth position detection pattern is placed on the gap surface. A thin film magnetic head characterized in that it is formed on a surface other than a film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32697787A JPH01169713A (en) | 1987-12-25 | 1987-12-25 | Thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32697787A JPH01169713A (en) | 1987-12-25 | 1987-12-25 | Thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169713A true JPH01169713A (en) | 1989-07-05 |
Family
ID=18193919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32697787A Pending JPH01169713A (en) | 1987-12-25 | 1987-12-25 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169713A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7610673B2 (en) | 2004-04-05 | 2009-11-03 | Tdk Corporation | Method of manufacturing a vertical recording magnetic head |
| JP2011060419A (en) * | 2005-08-22 | 2011-03-24 | Headway Technologies Inc | Magnetic head and method of manufacturing the same, and magnetic head substructure |
| US8163186B2 (en) | 2004-12-28 | 2012-04-24 | Headway Technologies, Inc. | Method of manufacturing magnetic head, and magnetic head sub-structure |
-
1987
- 1987-12-25 JP JP32697787A patent/JPH01169713A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7610673B2 (en) | 2004-04-05 | 2009-11-03 | Tdk Corporation | Method of manufacturing a vertical recording magnetic head |
| US8163186B2 (en) | 2004-12-28 | 2012-04-24 | Headway Technologies, Inc. | Method of manufacturing magnetic head, and magnetic head sub-structure |
| JP2011060419A (en) * | 2005-08-22 | 2011-03-24 | Headway Technologies Inc | Magnetic head and method of manufacturing the same, and magnetic head substructure |
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